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Power button (with integrated power indicator light)
RJ45 connector (GbE network interface)
Flash memory activity indicator light
(2) Hi-Speed USB 2.0 ports
PS/2 ports for keyboard and mouse
Security lock slot (cable lock sold separately)

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• Intel® Celeron® Processor J1900; 2.0 GHz (base), 2.42 GHz (burst), 4 cores, 2M cache
• Intel® HD Graphics (integrated in processor)
• DDR3L SDRAM system memory; single SODIMM slot; up to 8 GB supported
1
• Supports dual displays via (1) DVI-D video output (max. resolution of 1920 x 1080) and (1) VGA video output (max.
resolution of 2560 x 1600)
• Solid-state NAND flash memory storage; M.2 form factor modules
• Optional 2.5” SATA hard disk drive (HDD)
• Active thermal management technology monitors component operating temperatures, throttles SOC operation if
appropriate, and prevents unit thermal shutdown
• Realtek GbE network interface connection through an RJ45 port on the rear panel
• Optional Wi-Fi adapter including antennas integrated internally in the chassis
2
• (1) SuperSpeed USB 3.0 and (1) Hi-Speed USB 2.0 on front, (2) Hi-Speed USB 2.0 on rear.
• Legacy ports include PS/2 keyboard and mouse, (4) serial ports and (1) parallel port
• Integrated PC speaker for basic audio playback; 3.5 mm headset port on front
• BIOS designed to address NIST SP 800-147 guidelines, cable lock slot, and power cord retention clip to prevent accidental
disconnects
• Post-consumer recycled plastics content greater than 25% total unit plastics (by weight)
• Low halogen
3
material content
1
If configured with a Windows Embedded 32-bit operating system, memory above 3.2 GB may not be available due to operating system limitations
2
Wireless access point and Internet access is required; availability of public wireless access points is limited
3
This product is low halogen except for power cords, cables and peripherals, as well as the optional Fiber Optic NIC module; service parts obtained aftermarket
may not be low halogen
HP Customer Support: limited three-year hardware limited warranty in most regions; HP Care Packs are extended service contracts
that go beyond your standard limited warranties; for more details visit http://www.hp.com/go/cpc

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HP Smart Zero Core
HP ThinPro
Windows Embedded Standard 7E
Windows 10 IoT Enterprise
2 GB (1 x 2 GB)
4 GB (1 x 4 GB)
8 GB (1 x 8 GB)
256 MB, 512 MB (default) or 1 GB
NOTE: The system’s Graphics Processing Unit (GPU) uses part of the total system memory. System memory dedicated to graphics perform ance is not available
for use by other programs
NAND flash memory; non-volatile
8 GB, 16 GB, 32 GB, 64 GB
Solid-state flash-based memory modules are the primary operating system storage media for thin clients supporting highly virtualized
operating environments. Thin clients display a hosted session from a data center through standard IP networks which minimizes the required
size of local flash-based storage. In a traditional thin client environment, data and application files are stored securely in the remote data
center and not on the local storage device.
The HP t628 Thin Client uses two types of flash memory: MLC (2-bits per cell) and Ultra MLC (2-bits per cell, but only 1 is utilized). Because the
classic thin client use cases seldom require writing to flash memory storage, a relatively low capacity MLC flash memory module is typically
used to provide the best cost and performance. However, when the use case calls for writing to the local flash memory storage module careful
consideration should be given to the selection of the proper storage module. A larger capacity and/or the use of Ultra MLC technology could be
required to adequately support the usage being planned or expected from the thin client.
Flash Memory Specification
Terabytes Written (TBW) *
5 TBW* – 8GB
10 TBW* – 16GB
20 TBW* – 32GB
50 TBW* – 16GB
100 TBW* – 32GB
* Terabytes Written (TBW) calculated based on JESD-219 SSD Client workload

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500 GB 2.5” SATA Hard Disk Drive (HDD)
Local and/or network printers (RDP, ICA, LPD)
All models support dual displays via 1 x DVI-D digital video output (max. resolution of 1920
x 1080) and 1 x VGA analog video output (max. resolution of 2560 x 1600)
I/O PORTS, EXPANSION SLOTS & CONNECTORS
(3) Hi-Speed USB 2.0 ports (one in front, two in rear)
(1) SuperSpeed USB 3.0 ports (in front)
(1) DVI-D digital video output (max. resolution of 1920 x 1080)
(1) VGA analog video output (max. resolution of 2560 x 1600)
(2) PS/2 keyboard/mouse ports
(4) Serial ports
(1) Parallel port
(1) RJ45 GbE network connector
(1) 3.5 mm headset port (front)
• Internal amplified speaker system for basic audio playback
• 3.5 mm headset socket (front access)
• MP3
• AAC Stereo
• HE AAC
• Includes hardware acceleration support
• MPEG-4 part 2 (DivX, Xvid)
• MPEG-4 part 10 (H.264, AVC)
• WMV 7/8/9 VC-1 & ASF Demuxer
• Includes hardware acceleration support
• Security lock slot (cable lock sold separately)
• Power cord retention clip
• Realtek Gigabit Ethernet(GbE); RJ45 connector access
• Wake on LAN (WOL)
• Preboot Execution Environment (PXE), Remote Program Load (RPL)
• TCP/IP with DNS and DHCP

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*Wireless access point and internet access required. Availability of public wireless access points limited.
Microsoft Windows Embedded
Microsoft Remote
Desktop Services
Microsoft Windows Embedded
Microsoft Remote Desktop Client
VMware™ Horizon View™ Client
Remote Graphics Software (RGS)
HP TeemTalk Terminal Emulator
Microsoft Windows Embedded
Microsoft Windows Embedded
Read only Operating System

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Operating System Write Filter
Microsoft Windows Embedded
HP Smart Zero Client Services
Microsoft Windows Embedded
HP Universal Print Driver
NOTE: Other add-on software available (see: http://www.hp.com/support for latest list of available add-ons). Software performance and support may vary
depending on customer environment and backend.
Microsoft Windows Embedded

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MPEG-4 part 2 (DivX, Xvid, H.263)
MPEG-4 part 10 (H.264, AVC)
WMV 7/8/9/ VC-1 & ASF Demuxer
Recommended TC config for Microsoft Teams media optimization
VMware Teams Optimization
Citrix Teams Optimization
- Not recommended, ✓ recommended
TEXT AND GRAPHICS TERMINAL EMULATIONS
(provided by HP TeemTalk 7 in HP ThinPro & WES 7 operating systems)
70092, 70094, 70096, 2392A, 2622A
3278-2 (24x80), 3278-3 (32x80), 3278-4 (43x80), 3278-5 (27x132), 3278-2-E (24x80),
3278-3-E (32x80), 3278-4-E (43x80), 3278-5-E (27x132), 3279-2 (24x80), 3279-3 (32x80),
3279-4 (43x80), 3279-5 (27x132), 3287-1

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5291-1, 5292-2, 5251-11, 3179-2, 3196-A1, 3180-2, 3477-FC (27x132), 3477-FG (24x80),
3486-BA, 3487-HA, 3487-HC, 3812-1
VT52, VT100, VT100+, VT500 (7or 8-bit)
VT100, VT101, VT102, VT125, VT131, VT132, M2200, VT220, VT240, VT320, VT340, VT420,
VT510, VT520, VT525
VT100, VT101, VT102, VT125, VT220, VT240, VT320, VT340, VT420, VT131, VT132, M2200,
VT510, VT520, VT525
NOTE: Wireless features, performance and support may vary depending on environmental variables such placement, settings and firmwar e of your access
points. Please contact your wireless vendor for support of your wireless environment

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H x W x D:
(vertical orientation)
245mm x 52.3mm x 200mm
9.7in x 2.1in x 7.9in
NOTE: All measurements are approximate; the addition of optional modules will increase the weight
45W external power adapter
Worldwide auto-sensing 100-240 VAC, 50-60 Hz
Rated output current (maximum): 2.31 A
Output voltage: +19.5 V dc
Energy-saving automatic power-down
Surge-tolerant
Operating Temperature Range:
10°C to 40°C
50°F to 104°F
10°C to 35°C
50°F to 95°F
Non-operating Temperature
Range:
-30°C to 60°C
-22°F to 140°F
NOTE: maximum rate of change is 20°C/h or 36°F/h
10% to 90%
NOTE: maximum bulb temperature is 28°C or 84.2°F
5% to 95%
NOTE: maximum bulb temperature is 38.7°C or 101.6°F
NOTE: Specifications are at sea level with altitude derating of 1° C/300m (1.8° F/1000ft) to a maximum of 3 Km (10,000 ft), with no direct, sustained sunlight.
Upper limit may be limited by the type and number of options installed.

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Eco-Label Certifications
& declarations
This product has received or is in the process of being certified to the following
approvals and may be labeled with one or more of these marks:
• US ENERGY STAR®
• EPEAT® Gold registered in the China. See http://www.epeat.net for
registration status in your country.
Energy Consumption
(in accordance with US
ENERGY STAR® test
method)
Normal Operation (Short
idle)
Normal Operation (Long
idle)
Normal Operation (Short
idle)
Normal Operation (Long
idle)
*NOTE: Heat dissipation is calculated based on the measured watts, assuming
the service level is attained for one hour.
• This product is in compliance with the Restrictions of Hazardous
Substances (RoHS) directive -2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and
Electronic Equipment (WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of
California; Safe Drinking Water and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680 (EPEAT) standard at
the <gold> level, see www.epeat.net
• Plastics parts weighing over 25 grams used in the product are marked
per ISO 11469 and ISO1043.
• This product contains 17.5% post-consumer recycled plastic (by wt.)
• This product is 93.9% recycle-able when properly disposed of at end of
life.
PLASTIC/EPE (Expanded Polyethylene)
HP Inc. is committed to compliance with all applicable environmental laws and
regulations, including the European Union Restriction of Hazardous Substances
(RoHS) Directive. HP’s goal is to exceed compliance obligations by meeting the
requirements of the RoHS Directive on a worldwide basis. By July 1, 2006, RoHS
substances will be virtually eliminated (virtually = to levels below legal limits)
for all HP electronic products subject to the RoHS Directive, except where it is

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widely recognized that there is no technically feasible alternative (as indicated
by an exemption under the EU RoHS Directive).
This product does not contain any of the following substances in excess of
regulatory limits (refer to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_sp
ecifications.html):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame
retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to
be frequently handled or carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail
packaging has been voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
HP follows these guidelines to decrease the environmental impact of product
packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and
cadmium in packaging materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging
materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in
packaging materials.
• Use readily recyclable packaging materials such as paper and
corrugated materials.
• Reduce size and weight of packages to improve transportation fuel
efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN
6120 standards.

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End-of-life Management
and Recycling
HP Inc. offers end-of-life HP product return and recycling programs in many
geographic areas. To recycle your product, please go to:
http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office.
Products returned to HP will be recycled, recovered or disposed of in a
responsible manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide
treatment information for each product type for use by treatment facilities. This
information (product disassembly instructions) is posted on the HP Inc. web site
at: http://www.hp.com/go/recyclers. These instructions may be used by
recyclers and other WEEE treatment facilities as well as HP OEM customers who
integrate and re-sell HP equipment.
HP Inc. Corporate
Environmental
Information
For more information about HP’s commitment to the environment:
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www.hp.com/hpinfo/globalcitizenship/environment/productdesi
gn/ecolabels.html
ISO 14001 certificates:
http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755
842
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

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Max resolution in I/O Ports DVI and VGA connectors
Display support in At a Glance section, Input/output
sections
Page 2 & 4 changed the max resolution DVI-D video output
from 1920x1280 to 1920x1080.

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© 2021 HP Development Company, L.P. The information contained herein is subject to change without notice. The only
warranties for HP products and services are set forth in the express limited warranty statements accompanying such products
and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or
editorial errors or omissions contained herein. Microsoft and Windows are either registered trademarks or trademarks of
Microsoft Corporation in the United States and/or other countries. Intel, Celeron, and the Intel Inside logo are trademarks of Intel
Corporation in the U.S. and other countries. Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries.
Bluetooth is a trademark owned by its proprietor and used by HP Inc. under license. Citrix and XenDesktop are trademarks of
Citrix Systems, Inc. and/or one more of its subsidiaries, and may be registered in the United States Patent and Trademark Office
and in other countries. VMware is a registered trademark or trademark of VMware, Inc. in the United States and/or other
jurisdictions.