HP S2032a Disassembly Instructions Manual
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
1.0 Items Requiring Selective Treatment
Quantity
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
3
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
2
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
1
External electrical cables and cords
2
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Product End-of-Life Disassembly Instructions
HP S2032a LCD Monitor
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
of items
included
EL-MF877-00 Page 1
Template Revision A
Components, parts and materials containing
0
2.0 Tools Required
Tool Description
Tool Size (if
applicable)
Description #1 SCREW DRIVER(PHILLIPS HEAD)
#2
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. External Electric Cables Dissecting Process
2. Remove Stand Base From Display Head
3. Remove Rear Cover From Display Head
4. Remove Front Cover From Display Head
5. Remove Key Board Off From Front Cover
6. Take Screw(x9)Off From Chassis Cover
7. Remove Interface BD and Power BD From Chassis
8. Explode Stand Base
9. Take Screw(x3) Off From P.C.B
10. LCD PANEL EXPLODE
11. Electrolytic Capacitors Over 25mm High& Diameter Dissecting Process
12. Electrolytic Capacitors Process Drawing
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision A
HP S2032a Disassembly Process
Jan-19-2010
External Electric Cables Dissecting Process
1.Remove Cable From Display Head.
VGA Cable
2.Dissecting To Complete.
Power Cord
Remove Stand Base From Display Head
1. Take screw(x3) off from display head
2. Remove Stand Base From Display Head.
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