HP ProLinant SL2500 G 8 Disassembly Instructions Manual

Product Category: Servers

Marketing Name / Model
[List multiple models if applicable.]

HP ProLinant SL2500 Gen 8

1.0 Items Requiring Selective Treatment

Item Description

Notes

Quantity
of items
included
in product

Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)

With a surface greater than 10 sq cm

14

Batteries

All types including standard alkaline and lithium coin
or button style batteries

1

Mercury-containing components

For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries

0

Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm

Includes background illuminated displays with gas
discharge lamps

0
Cathode Ray Tubes (CRT)

0

Capacitors / condensers (Containing PCB/PCT)

0

Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height

1

External electrical cables and cords

0

Gas Discharge Lamps

0

Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)

0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent
chambers, and service stations.

0
Components and waste containing asbestos

0

Components, parts and materials containing
refractory ceramic fibers

0

Product End-of-Life Disassembly Instructions

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.

EL-MF877-00 Page 1
Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing
radioactive substances

0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

Tool Description

Tool Size (if
applicable)

Torx Driver

T10

Torx Driver

T15

Torx Driver

T20

Philips

#2

Flat head screw driver

Medium

3.0 Product Disassembly Process

Attachment 1~8 Capacitor location by model number of supply
Attachment 9 System Battery Location

and materials requiring selective treatment can be removed.

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Capacitors=>2.5CM - Remove the power supply from the system. With #2 Philips screw driver, remove the screws
securing the top cover, then locate the capacitors and pry from the PCB with a medium flat head screw driver and
dipose of properly

2. System Board Battery - Remove the top cover and locate the battery on the system board. With a medium flat head
screw driver remove the battery and dispose of properly

3.

4.

5.

6.

7.

8.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 2
Template Revision B

PSG instructions for this template are available at EL-MF877-01

Attachment 1

Attachment 2

EL-MF877-00 Page 3
Template Revision B

PSG instructions for this template are available at EL-MF877-01