HP ProLiant DX190r G10 Maintenance And Service Manual

HPE ProLiant DX190r Gen10 Server Maintenance and Service Guide

Abstract

This guide describes identification and maintenance procedures, diagnostic tools,
specifications, and requirements for hardware components and software. This guide is for an
experienced service technician. Hewlett Packard Enterprise assumes you are qualified in the
servicing of computer equipment, trained in recognizing hazards in products, and are familiar
with weight and stability precautions.

Part Number: P19002-001
Published: July 2019
Edition: 1

©

Copyright 2019 Hewlett Packard Enterprise Development LP

Notices

The information contained herein is subject to change without notice. The only warranties for Hewlett
Packard Enterprise products and services are set forth in the express warranty statements accompanying
such products and services. Nothing herein should be construed as constituting an additional warranty.
Hewlett Packard Enterprise shall not be liable for technical or editorial errors or omissions contained
herein.

Confidential computer software. Valid license from Hewlett Packard Enterprise required for possession,
use, or copying. Consistent with FAR 12.211 and 12.212, Commercial Computer Software, Computer
Software Documentation, and Technical Data for Commercial Items are licensed to the U.S. Government
under vendor's standard commercial license.

Links to third-party websites take you outside the Hewlett Packard Enterprise website. Hewlett Packard
Enterprise has no control over and is not responsible for information outside the Hewlett Packard
Enterprise website.

Acknowledgments

Intel® and Xeon® are trademarks of Intel Corporation in the U.S. and other countries.

Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries.

Microsoft®, Windows®, and Windows Server® are either registered trademarks or trademarks of Microsoft
Corporation in the United States and/or other countries.

microSD is a trademark or a registered trademark of SD-3D in the United States, other countries of both.

NVIDIA® is the trademark or registered trademark of NVIDIA Corporation in U.S. and other countries.

Red Hat® Enterprise Linux® are a registered trademark of Red Hat, Inc. in the United States and other
countries.

VMware® ESX™ and VMware vSphere® are registered trademarks or trademarks of VMware, Inc. in the
United States and/or other jurisdictions.

Contents

Illustrated parts catalog..........................................................................6

System components......................................................................................................................6

Bayonet board spare parts.................................................................................................6

First-generation Intel Xeon Scalable Processor spare parts..............................................6

Second-generation Intel Xeon Scalable Processor spare parts.........................................8

Heatsink spare parts.......................................................................................................... 8

System battery spare part.................................................................................................. 9

System board assembly spare parts..................................................................................9

DIMM spare parts...............................................................................................................9

System cable spare parts...................................................................................................9

Server options.............................................................................................................................10

Secondary riser board spare parts................................................................................... 11

Secondary riser slot 3 transfer board spare part.............................................................. 11

Accelerator spare parts.................................................................................................... 11

Omni-Path adapter spare part..........................................................................................12

Smart Array controller spare parts................................................................................... 12

Primary riser board spare part..........................................................................................12

Media Module adapter spare parts.................................................................................. 13

M.2 SSD riser board spare part....................................................................................... 13

Ethernet adapter spare part............................................................................................. 13

InfiniBand adapter spare parts......................................................................................... 13

HPE Trusted Platform Module 2.0 spare part.................................................................. 13

SUV cable spare part....................................................................................................... 13

OPA adapter cable spare kit.............................................................................................14

Accelerator auxiliary power cable spare parts................................................................. 14

Smart Array controller cable spare parts..........................................................................14

Customer self repair............................................................................. 15

Removal and replacement procedures...............................................24

Required tools.............................................................................................................................24

Safety considerations..................................................................................................................24

Electrostatic discharge..................................................................................................... 24

Symbols on equipment.....................................................................................................24

Server warnings and cautions..........................................................................................25

Preparation procedures.............................................................................................................. 27

Power down the server.................................................................................................... 27

Remove the server from the chassis................................................................................27

Remove the bayonet board..............................................................................................28

Remove the secondary riser cage................................................................................... 30

Remove the secondary riser cage thermal brackets........................................................31

Remove the primary riser cage........................................................................................ 32

Remove the primary riser blank....................................................................................... 33

Install the secondary riser cage....................................................................................... 34

Installing drive blanks and thermal bezel blanks for components with thermal

limitations......................................................................................................................... 35

Install the bayonet board..................................................................................................38

Install the server into the chassis..................................................................................... 40

3

Power up the server......................................................................................................... 41

Disconnecting and replacing the SUV cable...............................................................................41

Removing and replacing a bayonet board.................................................................................. 42

Removing and replacing an expansion board in the primary riser cage..................................... 43

Removing and replacing an expansion board in the secondary riser cage................................ 44

Removing and replacing the secondary riser slot 3 transfer board.............................................49

Removing and replacing the primary riser board........................................................................ 50

Removing and replacing the secondary riser board................................................................... 51

Removing and replacing the M.2 SSD riser board......................................................................53

Removing and replacing a Media Module adapter..................................................................... 55

DIMM-processor compatibility.....................................................................................................57

Removing and replacing a DIMM.....................................................................................57

Removing and replacing the system board.................................................................................58

Removing the system board............................................................................................ 58

Replacing the system board.............................................................................................60

Re-entering the server serial number and product ID and selecting an advanced fan

cooling method.................................................................................................................62

System battery replacement....................................................................................................... 63

System battery information...............................................................................................63

Removing and replacing the system battery.................................................................... 63

HPE Trusted Platform Module 2.0 Gen10 Option.......................................................................64

Troubleshooting....................................................................................66

NMI functionality..........................................................................................................................66

Troubleshooting resources..........................................................................................................66

Diagnostic tools.................................................................................... 67

Product QuickSpecs................................................................................................................... 67

UEFI System Utilities.................................................................................................................. 67

Selecting the boot mode ................................................................................................. 67

Secure Boot......................................................................................................................68

Launching the Embedded UEFI Shell ............................................................................. 68

Intelligent Provisioning................................................................................................................ 69

Intelligent Provisioning operation..................................................................................... 70

HPE Insight Remote Support......................................................................................................70

USB support................................................................................................................................71

External USB functionality................................................................................................71

HPE Smart Storage Administrator.............................................................................................. 71

HPE MR Storage Administrator.................................................................................................. 71

HPE InfoSight for servers .......................................................................................................... 72

StorCLI........................................................................................................................................72

Component identification.....................................................................73

Rear panel components..............................................................................................................73

Serial number/iLO information pull tab.............................................................................73

Rear panel LEDs and buttons.....................................................................................................74

Server UID LED................................................................................................................75

UID button functionality.................................................................................................... 75

Front panel LED power fault codes..................................................................................76

System board components......................................................................................................... 76

System maintenance switch descriptions........................................................................ 77

DIMM label identification.................................................................................................. 78

HPE Persistent Memory module label identification........................................................ 79

4

Processor, heatsink, and socket components..................................................................80

Bayonet board components........................................................................................................ 81

PCIe riser board components..................................................................................................... 81

Primary riser board components...................................................................................... 81

Secondary riser board components................................................................................. 82

Accelerator numbering................................................................................................................85

HPE Smart Array P824i-p MR Gen10 Controller........................................................................ 86

Cabling...................................................................................................87

Cabling guidelines.......................................................................................................................87

Smart Array cabling.....................................................................................................................88

Onboard S100i SR Gen10 controller cabling (SATA only)............................................... 88

Smart Array type-p controller cabling...............................................................................89

Storage controller backup power cabling......................................................................... 90

Three-slot secondary riser cabling..............................................................................................91

FlexibleLOM riser cabling............................................................................................................92

OPA adapter cabling................................................................................................................... 92

Accelerator auxiliary power cabling............................................................................................ 93

Specifications........................................................................................94

Environmental specifications...................................................................................................... 94

Mechanical specifications........................................................................................................... 94

Temperature requirements..........................................................................................................94

List of components with temperature requirements.................................................................... 95

Thermal limitations for components in systems with the Enhanced Processor

Performance feature enabled...........................................................................................95

Thermal limitations for components in systems with the Enhanced Processor

Performance feature disabled.........................................................................................111

Websites.............................................................................................. 127

Support and other resources.............................................................128

Accessing Hewlett Packard Enterprise Support....................................................................... 128

Accessing updates....................................................................................................................128

Remote support........................................................................................................................ 129

Warranty information.................................................................................................................129

Regulatory information..............................................................................................................129

Documentation feedback.......................................................................................................... 130

5

Illustrated parts catalog

System components

Hewlett Packard Enterprise continually improves and changes product parts. For complete and current
supported parts information, see the

Item Description

Hewlett Packard Enterprise PartSurfer website.

1 Small bayonet board spare part

2 Large bayonet board spare part

3

4 Heatsink spare parts on page 8

5 System battery spare part on page 9

6 System board assembly spare parts on page 9

7 DIMM spare parts on page 9

8 System cable spare parts on page 9*

*Not shown

First-generation Intel Xeon Scalable Processor spare parts on page 6

Second-generation Intel Xeon Scalable Processor spare parts on page 8

Bayonet board spare parts

Customer self repair on page 15: Optional

Description Spare part number

Large bayonet board 879862-001

Small bayonet board 879845-001

First-generation Intel Xeon Scalable Processor spare parts

Customer self repair on page 15: No

6 Illustrated parts catalog

Description Spare part number

Intel Xeon Bronze series processor —

1.70 GHz Intel Xeon Bronze 3106, 8C, 85 W 875710-001

Intel Xeon Silver series processor —

1.8 GHz Intel Xeon Silver 4108, 8C, 85 W 875712-001

2.0 GHz Intel Xeon Silver 4109T, 8C, 70 W 880185-001

2.1 GHz Intel Xeon Silver 4110, 8C, 85 W 875711-001

2.1 GHz Intel Xeon Silver 4116, 12C, 85 W 875716-001

2.2 GHz Intel Xeon Silver 4114, 10C, 85 W 875713-001

Intel Xeon Gold series processor —

2.0 GHz Intel Xeon Gold 6138, 20C, 125 W 874735-001

2.0 GHz Intel Xeon Gold 6138F, 20C, 135 W

1

878095-001

2.1 GHz Intel Xeon Gold 6130, 16C, 125 W 874736-001

2.1 GHz Intel Xeon Gold 6130F, 16C, 135 W

1

878096-001

2.1 GHz Intel Xeon Gold 6152, 22C, 140 W 874730-001

2.2 GHz Intel Xeon Gold 5120, 14C, 105W 875718-001

2.3 GHz Intel Xeon Gold 5118, 12C, 105 W 875717-001

2.3 GHz Intel Xeon Gold 6140, 18C, 140 W 874734-001

2.4 GHz Intel Xeon Gold 5115, 10C, 85 W 875715-001

2.4 GHz Intel Xeon Gold 6148, 20C,150 W 874732-001

2.6 GHz Intel Xeon Gold 6126, 12C, 125 W 875720-001

2.6 GHz Intel Xeon Gold 6126F, 12C, 135 W

1

878097-001

2.6 GHz Intel Xeon Gold 6132, 14C, 140 W 875722-001

2.6 GHz Intel Xeon Gold 6142, 16C, 150 W 874733-001

3.0 GHz Intel Xeon Gold 6136, 12C, 150 W 875724-001

3.2 GHz Intel Xeon Gold 6134, 8C, 130 W 875723-001

3.4 GHz Intel Xeon Gold 6128, 6C, 115 W 875721-001

3.6 GHz Intel Xeon Gold 5122, 4C, 105 W 875719-001

Intel Xeon Platinum series processor —

2.0 GHz Intel Xeon Platinum 8153, 16C, 125 W 875728-001

2.0 GHz Intel Xeon Platinum 8164, 26C, 150 W 875729-001

2.1 GHz Intel Xeon Platinum 8160, 24C, 150 W 874729-001

3.0 GHz Intel Xeon Platinum 8158, 12C, 150 W 875733-001

3.6 GHz Intel Xeon Platinum 8156, 4C, 105 W 875732-001

1

Install this processor in the processor socket 1 only.

Illustrated parts catalog 7

Second-generation Intel Xeon Scalable Processor spare parts

Customer self repair on page 15: No

Description Spare part number

Intel Xeon Bronze series processor —

1.90 GHz Intel Xeon Bronze 3204, 6C, 85 W P11604-001

Intel Xeon Silver series processors —

2.10 GHz Intel Xeon Silver 4208, 8C, 85 W P11605-001

2.10 GHz Intel Xeon Silver 4216, 16C, 100 W P11609-001

2.20 GHz Intel Xeon Silver 4210, 10C, 85 W P11606-001

2.20 GHz Intel Xeon Silver 4214, 12C, 85 W P11607-001

2.50 GHz Intel Xeon Silver 4215, 8C, 85 W P11608-001

Intel Xeon Gold series processors —

2.10 GHz Intel Xeon Gold 6230, 20C, 125 W P11614-001

2.10 GHz Intel Xeon Gold 6238, 22C, 140 W P12010-001

2.10 GHz Intel Xeon Gold 6252, 24C, 150 W P11619-001

2.20 GHz Intel Xeon Gold 5220, 18C, 125 W P11613-001

2.30 GHz Intel Xeon Gold 5218, 16C, 125 W P11612-001

2.50 GHz Intel Xeon Gold 5215, 10C, 85 W P11610-001

2.50 GHz Intel Xeon Gold 6248, 20C, 150 W P11618-001

2.60 GHz Intel Xeon Gold 6240, 18C, 150 W P11615-001

2.70 GHz Intel Xeon Gold 6226, 12C, 125 W P12008-001

2.80 GHz Intel Xeon Gold 6242, 16C, 150 W P11616-001

3.00 GHz Intel Xeon Gold 5217, 8C, 125 W P11611-001

3.30 GHz Intel Xeon Gold 6234, 8C, 130 W P12009-001

3.60 GHz Intel Xeon Gold 6244, 8C, 150 W P11617-001

3.80 GHz Intel Xeon Gold 5222, 4C, 105 W P11632-001

Intel Xeon Platinum series processors —

2.20 GHz Intel Xeon Platinum 8253, 16C, 125 W P12011-001

Heatsink spare parts

Customer self repair on page 15: No

Description Spare part number

Heatsink for processor 1 879851-001

Heatsink for processor 2 879852-001

8 Illustrated parts catalog

System battery spare part

Customer self repair on page 15: Mandatory

Description Spare part number

System battery 319603-001

System board assembly spare parts

Customer self repair on page 15: Optional

Description Spare part number

System board assembly for the first-generation Intel Xeon Scalable
processors

System board assembly for the second-generation Intel Xeon Scalable
processors

DIMM spare parts

Customer self repair on page 15: Mandatory

Description Spare part number

PC4-2666V DIMM spares —

8 GB, single-rank x8 PC4-2666V-R 850879-001

16 GB, single-rank x8 PC4-2666V-R 868846-001

16 GB, dual-rank x4 PC4-2666V-R 850880-001

64 GB, dual-rank x4 PC4-2666V-L 850881-001

8 GB, dual-rank x8 PC4-2666V-R 878490-001

PC4-2933Y DIMM spares —

8 GB, single-rank x8 PC4-2933Y-R P06186-001

879847-001

P11391-001

16 GB, single-rank x4 PC4-2933Y-R P06187-001

16 GB, dual-rank x8 PC4-2933Y-R P06188-001

32 GB, dual-rank x4 PC4-2933Y-R P06189-001

64 GB, dual-rank x4 PC4-2933Y-R P06192-001

64 GB, quad-rank x4 PC4-2933Y-L P06190-001

System cable spare parts

Customer self repair on page 15: Optional

Illustrated parts catalog 9

Description Spare part number

Apollo DX2600 Gen10 Chassis/Apollo DX2800 Gen10 Chassis 2U
server PCIe riser Slimline cable for processor 2

Apollo DX2600 Gen10 Chassis/Apollo DX2800 Gen10 Chassis
Gen10 for server PCIe riser Slimline cable kit includes:

• 1U Slimline cable for processor 1

• 1U Short Slimline cable for processor 2

• 2U Short Slimline x-cable for FlexibleLOM riser board

Apollo DX2600 Gen10 Chassis/Apollo DX2800 Gen10 Chassis
power cable and server NVMe cable kit includes:

• Power cable for servers 1 and 2 in the Apollo DX2600 Gen10
Chassis/Apollo DX2800 Gen10 Chassis

• 1U server NVMe cable

• 2U server NVMe cable

Server options

879833-001

879838-001

879840-001

Hewlett Packard Enterprise continually improves and changes product parts. For complete and current
supported parts information, see the Hewlett Packard Enterprise PartSurfer website

10 Illustrated parts catalog

Item Description

1 Secondary riser board spare parts on page 11

2 Secondary riser slot 3 transfer board spare part on page 11

3 Accelerator spare parts on page 11

4 Omni-Path adapter spare part on page 12

5 Smart Array controller spare parts on page 12

6 Primary riser board spare part on page 12

7 Media Module adapter spare parts on page 13

8 M.2 SSD riser board spare part on page 13

9 HPE Trusted Platform Module 2.0 spare part on page 13*

10

11 SUV cable spare part on page 13*

12 OPA adapter cable spare kit on page 14*

13 Accelerator auxiliary power cable spare parts on page 14*

14 Smart Array controller cable spare parts on page 14*

*Not shown

Ethernet adapter spare part on page 13*

InfiniBand adapter spare parts on page 13*

Secondary riser board spare parts

Customer self repair on page 15: Optional

Description Spare part number

Three-slot secondary riser board 879863-001

FlexibleLOM riser board 879861-001

Enhanced FlexibleLOM riser board P04287-001

Secondary riser slot 3 transfer board spare part

Customer self repair on page 15: Optional

Description Spare part number

Secondary riser slot 3 transfer board 879864-001

Accelerator spare parts

Customer self repair on page 15: Optional

Illustrated parts catalog 11

Description Spare part number

Computational accelerator spare parts —

NVIDIA Tesla P40 24 GB GPU 872323-001

NVIDIA Tesla V100 16 GB GPU 876908-001

NVIDIA Tesla V100 32 GB GPU P05913-001

NVIDIA Tesla P100 16 GB GPU 868585-001

NVIDIA Tesla P100 12 GB GPU 877646-001

NVIDIA Tesla P4 8 GB 872321-001

Graphics accelerator (GPU) spare parts —

NVIDIA Tesla M10 Quad GPU 870046-001

NVIDIA Quadro P4000 GPU 871970-001

PCIe workload accelerator spare part —

750 GB PCIe x4 WI, HH, DS P03580-001

1.6 TB PCIe x8 MU, HH, DS 879772-001

3.2 TB PCIe x8 MU, HH, DS 879773-001

Omni-Path adapter spare part

Customer self repair on page 15: Optional

Description Spare part number

HPE 100Gb Intel Omni-Path Adapter 879850-001

HPE 100Gb 1P OP101 QSFP28 x16 OPA Adapter 841703-001

HPE 100Gb 1P OP101 QSFP28 x8 OPA Adapter 841702-001

Smart Array controller spare parts

Customer self repair on page 15: Optional

Description Spare part number

HPE Smart Array E208i-p Controller 836266-001

HPE Smart Array E208e-p Controller 836267-001

HPE Smart Array P408i-p Controller 836269-001

HPE Smart Array P408e-p Controller 836270-001

HPE Smart Array P824i-p Controller 871043-001

Primary riser board spare part

Customer self repair on page 15: Optional

Description Spare part number

Primary riser board 879846-001

12 Illustrated parts catalog

Media Module adapter spare parts

Customer self repair on page 15: Optional

Description Spare part number

Media Module Ethernet 10Gb 2P 568FLR-MMT Adapter 879848-001

Media Module Ethernet 1Gb 2P 368FLR-MMT Adapter 872161-001

Media Module Ethernet 10Gb 2P 568FLR-MMSFP+ Adapter 872162-001

M.2 SSD riser board spare part

Customer self repair on page 15: Optional

Description Spare part number

M.2 SSD riser board 879849-001

Ethernet adapter spare part

Customer self repair on page 15: Optional

Description Spare part number

HPE Ethernet 100Gb 1P 842QSFP28 Adapter 877697-001

InfiniBand adapter spare parts

Customer self repair on page 15: Optional

Description Spare part number

HPE IB FDR/EN 40Gb 2P 544+QSFP Adapter 764736-001

HPE IB FDR/EN 40Gb 2P 544+FLR-QSFP Adapter 779132-001

HPE IB EDR 100Gb 1P 841QSFP28 Adapter 878578-001

HPE IB EDR/EN 100Gb 2P 841QSFP28 Adapter 878579-001

HPE IB FDR/EN 40/50Gb 547FLR 2QSFP Adapter 879667-001

HPE IB EDR/EN 100Gb 1P 840QSFP28 Adapter 828107-001

HPE IB EDR/EN 100Gb 2P 840QSFP28 Adapter 828108-001

HPE Trusted Platform Module 2.0 spare part

Customer self repair on page 15: No

Description Spare part number

HPE Trusted Platform Module Gen 10, TAA 872159-001

SUV cable spare part

Customer self repair on page 15: Mandatory

Description Spare part number

36-pin SUV cable 416003-001

Illustrated parts catalog 13

For more information on the removal and replacement procedures, see Disconnecting and replacing

the SUV cable on page 41.

OPA adapter cable spare kit

Customer self repair on page 15: Optional

Description Spare part number

• OPA adapter sideband cable

• OPA adapter IFP cable

Accelerator auxiliary power cable spare parts

Customer self repair on page 15: Optional

Description Spare part number

• 8-pin auxiliary power cable for Tesla M10 Quad

• 8-pin auxiliary power cable for Tesla P40/P100/V100

6- and 8-pin auxiliary power cable for NVIDIA Quadro P4000 P00453-001

Smart Array controller cable spare parts

Customer self repair on page 15: Optional

Description Spare part number

• Onboard S100i SR Gen10 controller SATA cable

P01290-001

879859-001

879860-001

• Type-p controller Mini-SAS cable for the primary riser slot 1

• Type-p controller Mini-SAS cable for the secondary riser slot 2

P824i-p MR Gen10 controller Mini-SAS cable

882171-001

14 Illustrated parts catalog

Customer self repair

Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to
minimize repair time and allow for greater flexibility in performing defective parts replacement. If during
the diagnosis period Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or
service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett
Packard Enterprise will ship that part directly to you for replacement. There are two categories of CSR
parts:

• Mandatory—Parts for which customer self repair is mandatory. If you request Hewlett Packard

Enterprise to replace these parts, you will be charged for the travel and labor costs of this service.

• Optional—Parts for which customer self repair is optional. These parts are also designed for customer

self repair. If, however, you require that Hewlett Packard Enterprise replace them for you, there may or
may not be additional charges, depending on the type of warranty service designated for your product.

NOTE: Some Hewlett Packard Enterprise parts are not designed for customer self repair. In order to
satisfy the customer warranty, Hewlett Packard Enterprise requires that an authorized service provider
replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Based on availability and where geography permits, CSR parts will be shipped for next business day
delivery. Same day or four-hour delivery may be offered at an additional charge where geography
permits. If assistance is required, you can call the Hewlett Packard Enterprise Support Center and a
technician will help you over the telephone. Hewlett Packard Enterprise specifies in the materials shipped
with a replacement CSR part whether a defective part must be returned to Hewlett Packard Enterprise. In
cases where it is required to return the defective part to Hewlett Packard Enterprise, you must ship the
defective part back to Hewlett Packard Enterprise within a defined period of time, normally five (5)
business days. The defective part must be returned with the associated documentation in the provided
shipping material. Failure to return the defective part may result in Hewlett Packard Enterprise billing you
for the replacement. With a customer self repair, Hewlett Packard Enterprise will pay all shipping and part
return costs and determine the courier/carrier to be used.

For more information about the Hewlett Packard Enterprise CSR program, contact your local service
provider. For the North American program, go to the Hewlett Packard Enterprise CSR website.

Parts only warranty service

Your Hewlett Packard Enterprise Limited Warranty may include a parts only warranty service. Under the
terms of parts only warranty service, Hewlett Packard Enterprise will provide replacement parts free of
charge.

For parts only warranty service, CSR part replacement is mandatory. If you request Hewlett Packard
Enterprise to replace these parts, you will be charged for the travel and labor costs of this service.

Réparation par le client (CSR)

Les produits Hewlett Packard Enterprise comportent de nombreuses pièces CSR (Customer Self Repair
= réparation par le client) afin de minimiser les délais de réparation et faciliter le remplacement des
pièces défectueuses. Si pendant la période de diagnostic, Hewlett Packard Enterprise (ou ses
partenaires ou mainteneurs agréés) détermine que la réparation peut être effectuée à l'aide d'une pièce
CSR, Hewlett Packard Enterprise vous l'envoie directement. Il existe deux catégories de pièces CSR :

Customer self repair 15

• Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à

Hewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du
service vous seront facturés.

• Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont

également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous
demandez à Hewlett Packard Enterprise de remplacer ces pièces, l'intervention peut ou non vous être
facturée, selon le type de garantie applicable à votre produit.

REMARQUE: Certaines pièces Hewlett Packard Enterprise ne sont pas conçues pour permettre au client
d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, Hewlett Packard Enterprise
exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées
par la mention "Non" dans le Catalogue illustré.

Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre
situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le
jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour toute assistance, appelez le Centre
d’assistance Hewlett Packard Enterprise pour qu’un technicien vous aide au téléphone Dans les
documents envoyés avec la pièce de rechange CSR, Hewlett Packard Enterprise précise s'il est
nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai indiqué,
généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans
l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, Hewlett Packard Enterprise se réserve
le droit de vous facturer les coûts de remplacement. Dans le cas d'une pièce CSR, Hewlett Packard
Enterprise supporte l'ensemble des frais d'expédition et de retour, et détermine la société de courses ou
le transporteur à utiliser.

Pour plus d'informations sur le programme CSR de Hewlett Packard Enterprise, contactez votre
Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le
site Web Hewlett Packard Enterprise.

Service de garantie "pièces seules"

Votre garantie limitée Hewlett Packard Enterprise peut inclure un service de garantie "pièces seules".
Dans ce cas, les pièces de rechange fournies par Hewlett Packard Enterprise ne sont pas facturées.

Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez
à Hewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du
service vous seront facturés.

Riparazione da parte del cliente

Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti
difettose, i prodotti Hewlett Packard Enterprise sono realizzati con numerosi componenti che possono
essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica Hewlett
Packard Enterprise (o un centro di servizi o di assistenza Hewlett Packard Enterprise) identifica il guasto
come riparabile mediante un ricambio CSR, Hewlett Packard Enterprise lo spedirà direttamente al cliente
per la sostituzione. Vi sono due categorie di parti CSR:

• Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la

riparazione ad Hewlett Packard Enterprise, deve sostenere le spese di spedizione e di manodopera
per il servizio.

• Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti

progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad Hewlett Packard
Enterprise, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il
prodotto.

NOTA: alcuni componenti Hewlett Packard Enterprise non sono progettati per la riparazione da parte del
cliente. Per rispettare la garanzia, Hewlett Packard Enterprise richiede che queste parti siano sostituite da

16 Customer self repair

un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei
componenti.

In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un
supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di
un addetto del centro di supporto tecnico Hewlett Packard Enterprise. Nel materiale fornito con una parte
di ricambio CSR, Hewlett Packard Enterprise specifica se il cliente deve restituire dei component. Qualora
sia richiesta la resa ad Hewlett Packard Enterprise del componente difettoso, lo si deve spedire ad
Hewlett Packard Enterprise entro un determinato periodo di tempo, generalmente cinque (5) giorni
lavorativi. Il componente difettoso deve essere restituito con la documentazione associata nell'imballo di
spedizione fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio
da parte di Hewlett Packard Enterprise. Nel caso di riparazione da parte del cliente, Hewlett Packard
Enterprise sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.

Per ulteriori informazioni sul programma CSR di Hewlett Packard Enterprise, contattare il centro di
assistenza di zona. Per il programma in Nord America fare riferimento al sito Web.

Servizio di garanzia per i soli componenti

La garanzia limitata Hewlett Packard Enterprise può includere un servizio di garanzia per i soli
componenti. Nei termini di garanzia del servizio per i soli componenti, Hewlett Packard Enterprise fornirà
gratuitamente le parti di ricambio.

Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione
da parte del cliente. Se il cliente invece richiede la sostituzione ad Hewlett Packard Enterprise dovrà
sostenere le spese di spedizione e di manodopera per il servizio.

Customer Self Repair

Hewlett Packard Enterprise Produkte enthalten viele CSR-Teile (Customer Self Repair), um
Reparaturzeiten zu minimieren und höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen.
Wenn Hewlett Packard Enterprise (oder ein Hewlett Packard Enterprise Servicepartner) bei der Diagnose
feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen Hewlett Packard
Enterprise dieses Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:

• Zwingend—Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie

den Austausch dieser Teile von Hewlett Packard Enterprise vornehmen lassen, werden Ihnen die
Anfahrt- und Arbeitskosten für diesen Service berechnet.

• Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für

Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von Hewlett Packard
Enterprise vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt
vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.

HINWEIS: Einige Hewlett Packard Enterprise Teile sind nicht für Customer Self Repair ausgelegt. Um den
Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem Hewlett Packard Enterprise
Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.
„Nein“ gekennzeichnet.

CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag
geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden
gegen einen Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das Hewlett Packard Enterprise
Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien von
Hewlett Packard Enterprise, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob
das defekte Teil an Hewlett Packard Enterprise zurückgeschickt werden muss. Wenn es erforderlich ist,
das defekte Teil an Hewlett Packard Enterprise zurückzuschicken, müssen Sie dies innerhalb eines
vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss
mit der zugehörigen Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang
enthalten ist. Wenn Sie das defekte Teil nicht zurückschicken, kann Hewlett Packard Enterprise Ihnen das

Customer self repair 17

Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt Hewlett Packard Enterprise für
alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst.

Weitere Informationen über das Hewlett Packard Enterprise Customer Self Repair Programm erhalten Sie
von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf
der Hewlett Packard Enterprise Website unter.

Parts-only Warranty Service (Garantieservice ausschließlich für Teile)

Ihre Hewlett Packard Enterprise Garantie umfasst möglicherweise einen Parts-only Warranty Service
(Garantieservice ausschließlich für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service
stellt Hewlett Packard Enterprise Ersatzteile kostenlos zur Verfügung.

Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den
Austausch dieser Teile von Hewlett Packard Enterprise vornehmen lassen, werden Ihnen die Anfahrt- und
Arbeitskosten für diesen Service berechnet.

Reparaciones del propio cliente

Los productos de Hewlett Packard Enterprise incluyen muchos componentes que el propio usuario puede
reemplazar (Customer Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor
flexibilidad a la hora de realizar sustituciones de componentes defectuosos. Si, durante la fase de
diagnóstico, Hewlett Packard Enterprise (o los proveedores o socios de servicio de Hewlett Packard
Enterprise) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR,
Hewlett Packard Enterprise le enviará dicho componente directamente para que realice su sustitución.
Los componentes CSR se clasifican en dos categorías:

• Obligatorio—Componentes cuya reparación por parte del usuario es obligatoria. Si solicita a Hewlett

Packard Enterprise que realice la sustitución de estos componentes, tendrá que hacerse cargo de los
gastos de desplazamiento y de mano de obra de dicho servicio.

• Opcional—Componentes cuya reparación por parte del usuario es opcional. Estos componentes

también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que
Hewlett Packard Enterprise realice su sustitución, puede o no conllevar costes adicionales,
dependiendo del tipo de servicio de garantía correspondiente al producto.

NOTA: Algunos componentes de Hewlett Packard Enterprise no están diseñados para que puedan ser
reparados por el usuario. Para que el usuario haga valer su garantía, Hewlett Packard Enterprise pone
como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes.
Dichos componentes se identifican con la palabra "No" en el catálogo ilustrado de componentes.

Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a
su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en
el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al
Centro de asistencia técnica de Hewlett Packard Enterprise y recibirá ayuda telefónica por parte de un
técnico. Con el envío de materiales para la sustitución de componentes CSR, Hewlett Packard Enterprise
especificará si los componentes defectuosos deberán devolverse a Hewlett Packard Enterprise. En
aquellos casos en los que sea necesario devolver algún componente a Hewlett Packard Enterprise,
deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los
componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje
de envío. Si no enviara el componente defectuoso requerido, Hewlett Packard Enterprise podrá cobrarle
por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, Hewlett Packard
Enterprise se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la
empresa de transporte que se utilice para dicho servicio.

Para obtener más información acerca del programa de Reparaciones del propio cliente de Hewlett
Packard Enterprise, póngase en contacto con su proveedor de servicios local. Si está interesado en el
programa para Norteamérica, visite la página web de Hewlett Packard Enterprise CSR.

18 Customer self repair

Servicio de garantía exclusivo de componentes

La garantía limitada de Hewlett Packard Enterprise puede que incluya un servicio de garantía exclusivo
de componentes. Según las condiciones de este servicio exclusivo de componentes, Hewlett Packard
Enterprise le facilitará los componentes de repuesto sin cargo adicional alguno.

Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes
por parte del usuario (CSR). Si solicita a Hewlett Packard Enterprise que realice la sustitución de estos
componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho
servicio.

Customer Self Repair

Veel onderdelen in Hewlett Packard Enterprise producten zijn door de klant zelf te repareren, waardoor
de reparatieduur tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte
onderdelen groter is. Deze onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als
Hewlett Packard Enterprise (of een Hewlett Packard Enterprise Service Partner) bij de diagnose vaststelt
dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt Hewlett Packard Enterprise
dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee
categorieën CSR-onderdelen:

• Verplicht—Onderdelen waarvoor reparatie door de klant verplicht is. Als u Hewlett Packard Enterprise

verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon
in rekening gebracht.

• Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn

ontworpen voor reparatie door de klant. Als u echter Hewlett Packard Enterprise verzoekt deze
onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht,
afhankelijk van het type garantieservice voor het product.

OPMERKING: Sommige Hewlett Packard Enterprise onderdelen zijn niet ontwikkeld voor reparatie door
de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service
Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus
aangemerkt met "Nee".

Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie is gewenst, belt u het Hewlett
Packard Enterprise Support Center om via de telefoon ondersteuning van een technicus te ontvangen.
Hewlett Packard Enterprise vermeldt in de documentatie bij het vervangende CSR-onderdeel of het
defecte onderdeel aan Hewlett Packard Enterprise moet worden geretourneerd. Als het defecte
onderdeel aan Hewlett Packard Enterprise moet worden teruggezonden, moet u het defecte onderdeel
binnen een bepaalde periode, gewoonlijk vijf (5) werkdagen, retourneren aan Hewlett Packard Enterprise.
Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het
meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan Hewlett Packard
Enterprise u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant
betaalt Hewlett Packard Enterprise alle verzendkosten voor het vervangende en geretourneerde
onderdeel en kiest Hewlett Packard Enterprise zelf welke koerier/transportonderneming hiervoor wordt
gebruikt.

Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair
programma van Hewlett Packard Enterprise. Informatie over Service Partners vindt u op de Hewlett

Packard Enterprise website.

Garantieservice "Parts Only"

Het is mogelijk dat de Hewlett Packard Enterprise garantie alleen de garantieservice "Parts Only" omvat.
Volgens de bepalingen van de Parts Only garantieservice zal Hewlett Packard Enterprise kosteloos
vervangende onderdelen ter beschikking stellen.

Customer self repair 19

Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u Hewlett Packard
Enterprise verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en
arbeidsloon in rekening gebracht

Reparo feito pelo cliente

Os produtos da Hewlett Packard Enterprise são projetados com muitas peças para reparo feito pelo
cliente (CSR) de modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituição de
peças com defeito. Se, durante o período de diagnóstico, a Hewlett Packard Enterprise (ou fornecedores/
parceiros da Hewlett Packard Enterprise) concluir que o reparo pode ser efetuado pelo uso de uma peça
CSR, a Hewlett Packard Enterprise enviará a peça diretamente ao cliente. Há duas categorias de peças
CSR:

• Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a Hewlett Packard

Enterprise substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do
serviço.

• Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para

o reparo feito pelo cliente. No entanto, se desejar que a Hewlett Packard Enterprise as substitua,
pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia
destinado ao produto.

OBSERVAÇÃO: Algumas peças da Hewlett Packard Enterprise não são projetadas para o reparo feito
pelo cliente. A fim de cumprir a garantia do cliente, a Hewlett Packard Enterprise exige que um técnico
autorizado substitua a peça. Essas peças estão identificadas com a marca "No" (Não), no catálogo de
peças ilustrado.

Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após
o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode
ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte
técnico da Hewlett Packard Enterprise para que um técnico o ajude por telefone. A Hewlett Packard
Enterprise especifica nos materiais fornecidos com a peça CSR de reposição se a peça com defeito deve
ser devolvida à Hewlett Packard Enterprise. Nos casos em que isso for necessário, é preciso enviar a
peça com defeito à Hewlett Packard Enterprise, você deverá enviar a peça com defeito de volta para a
Hewlett Packard Enterprise dentro do período de tempo definido, normalmente em 5 (cinco) dias úteis. A
peça com defeito deve ser enviada com a documentação correspondente no material de transporte
fornecido. Caso não o faça, a Hewlett Packard Enterprise poderá cobrar a reposição. Para as peças de
reparo feito pelo cliente, a Hewlett Packard Enterprise paga todas as despesas de transporte e de
devolução da peça e determina a transportadora/serviço postal a ser utilizado.

Para obter mais informações sobre o programa de reparo feito pelo cliente da Hewlett Packard
Enterprise, entre em contato com o fornecedor de serviços local. Para o programa norte-americano,

visite o site da Hewlett Packard Enterprise.

Serviço de garantia apenas para peças

A garantia limitada da Hewlett Packard Enterprise pode incluir um serviço de garantia apenas para
peças. Segundo os termos do serviço de garantia apenas para peças, a Hewlett Packard Enterprise
fornece as peças de reposição sem cobrar nenhuma taxa.

No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a Hewlett Packard
Enterprise substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

20 Customer self repair

Customer self repair 21

22 Customer self repair

Customer self repair 23

Removal and replacement procedures

Required tools

The following tools might be required to perform some procedures:

• T-10 Torx screwdriver

• T-15 Torx screwdriver

• T-30 Torx screwdriver

• Phillips No. 1 screwdriver

Safety considerations

Before performing service procedures, review all the safety information.

Electrostatic discharge

Be aware of the precautions you must follow when setting up the system or handling components. A
discharge of static electricity from a finger or other conductor may damage system boards or other static­sensitive devices. This type of damage may reduce the life expectancy of the system or component.

To prevent electrostatic damage:

• Avoid hand contact by transporting and storing products in static-safe containers.

• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.

• Place parts on a grounded surface before removing them from their containers.

• Avoid touching pins, leads, or circuitry.

• Always be properly grounded when touching a static-sensitive component or assembly. Use one or
more of the following methods when handling or installing electrostatic-sensitive parts:

◦ Use a wrist strap connected by a ground cord to a grounded workstation or computer chassis. Wrist

straps are flexible straps with a minimum of 1 megohm ±10 percent resistance in the ground cords.
To provide proper ground, wear the strap snug against the skin.

◦ Use heel straps, toe straps, or boot straps at standing workstations. Wear the straps on both feet

when standing on conductive floors or dissipating floor mats.

◦ Use conductive field service tools.

◦ Use a portable field service kit with a folding static-dissipating work mat.

If you do not have any of the suggested equipment for proper grounding, have an authorized reseller
install the part.

For more information on static electricity or assistance with product installation, contact an authorized
reseller.

Symbols on equipment

The following symbols might be found on the equipment to indicate the presence of potentially hazardous
conditions.

24 Removal and replacement procedures

This symbol indicates the presence of hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified personnel.

WARNING: To reduce the risk of injury from electric shock hazards, do not open this
enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.

This symbol indicates the presence of electric shock hazards. The area contains no
user or field serviceable parts. Do not open for any reason.

WARNING: To reduce the risk of injury from electric shock hazards, do not open this
enclosure.

This symbol on an RJ-45 receptacle indicates a network interface connection.

WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do
not plug telephone or telecommunications connectors into this receptacle.

This symbol indicates the presence of a hot surface or hot component. If this surface is
contacted, the potential for injury exists.

WARNING: To reduce the risk of injury from a hot component, allow the surface to cool
before touching.

This symbol indicates that the component exceeds the recommended weight for one
individual to handle safely.

WARNING: To reduce the risk of personal injury or damage to the equipment,
observe local occupational health and safety requirements and guidelines for manual
material handling.

These symbols, on power supplies or systems, indicate that the equipment is supplied
by multiple sources of power.

WARNING: To reduce the risk of injury from electric shock, remove all power cords to
disconnect power from the system completely.

Server warnings and cautions

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,

disconnect the power cord to remove power from the server. Pressing the Power On/Standby button
does not shut off system power completely. Portions of the power supply and some internal circuitry
remain active until AC power is removed.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal
system components to cool before touching them.

Removal and replacement procedures 25

WARNING: To reduce the risk of electric shock or damage to the equipment:

• Never reach inside the chassis while the system is powered up.

• Perform service on system components only as instructed in the user documentation.

WARNING: To reduce the risk of fire or burns after removing the energy pack:

• Do not disassemble, crush, or puncture the energy pack.

• Do not short external contacts.

• Do not dispose of the energy pack in fire or water.

After power is disconnected, battery voltage might still be present for 1s to 160s.

AVERTISSEMENT: Pour réduire les risques d'incendie ou de brûlures après le retrait du module
batterie :

• N'essayez pas de démonter, d'écraser ou de percer le module batterie.

• Ne court-circuitez pas ses contacts externes.

• Ne jetez pas le module batterie dans le feu ou dans l'eau.

Après avoir déconnecté l'alimentation, une tension peut subsister dans la batterie durant 1 à 160
secondes.

CAUTION: Protect the server from power fluctuations and temporary interruptions with a regulating
UPS. This device protects the hardware from damage caused by power surges and voltage spikes
and keeps the server in operation during a power failure.

CAUTION: To prevent damage to electrical components, properly ground the server before
beginning any installation procedure. Improper grounding can cause electrostatic discharge. For
more information, refer to "Electrostatic discharge on page 24."

CAUTION: To avoid data loss, Hewlett Packard Enterprise recommends that you back up all server
data before installing or removing a hardware option, or performing a server maintenance or
troubleshooting procedure.

CAUTION: To prevent improper airflow and insufficient cooling that can lead to thermal damage,
observe the following:

• Do not operate the chassis without the access panel, baffles, or blanks installed.

• Do not operate the server without the baffles, expansion slot covers, or blanks installed.

CAUTION: When performing non-hot-plug operations, you must power down the server and/or the
system. However, it may be necessary to leave the server powered up when performing other
operations, such as hot-plug installations or troubleshooting.

CAUTION: Do not operate the server for long periods with the access panel open or removed.
Operating the server in this manner results in improper airflow and improper cooling that can lead to
thermal damage.

26 Removal and replacement procedures

Preparation procedures

To access some components and perform certain service procedures, you must perform one or more of
the following procedures:

• Power down the server on page 27.

• Remove the server from the chassis on page 27.

• Remove the bayonet board on page 28.

• Remove the secondary riser cage on page 30.

• Remove the secondary riser cage thermal brackets on page 31.

• Remove the primary riser cage on page 32.

• Remove the primary riser blank on page 33.

• Power up the server on page 41.

Power down the server

Before powering down the server for any upgrade or maintenance procedures, perform a backup of
critical server data and programs.

IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the
system.

To power down the server, use one of the following methods:

• Press and release the Power On/Standby button.

This method initiates a controlled shutdown of applications and the OS before the server enters
standby mode.

• Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter
standby mode.

This method forces the server to enter standby mode without properly exiting applications and the OS.
If an application stops responding, you can use this method to force a shutdown.

• Use a virtual power button selection through iLO 5.

This method initiates a controlled remote shutdown of applications and the OS before the server
enters standby mode.

Before proceeding, verify that the server is in standby mode by observing that the system power LED is
amber.

Remove the server from the chassis

CAUTION: To prevent improper cooling and thermal damage, do not operate the chassis unless all

bays are populated with a component or a blank.

Removal and replacement procedures 27

CAUTION: To avoid damage to the server or server blank:

• Always support the bottom of the server or server blank when removing it from the chassis.

• Do not use the release lever to carry the server or server blank.

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

3. Remove the server from the chassis:

a. Loosen the thumbscrew.

b. Open the release lever.

c. Use the release lever to pull the server out of the chassis.

Remove the bayonet board

Prerequisites

Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

3. Remove the server from the chassis on page 27.

4. Remove the bayonet board:

a. Remove the screws securing the cover to the bayonet board.

28 Removal and replacement procedures

b. Remove the screws securing the cover to the server tray, and then remove the cover.

c. Disconnect the bayonet board cables, and then remove the bayonet board.

Removal and replacement procedures 29

Remove the secondary riser cage

Prerequisites

Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

3. Remove the server from the chassis on page 27.

4. Remove the bayonet board on page 28.

5. Remove the secondary riser cage.

30 Removal and replacement procedures

Remove the secondary riser cage thermal brackets

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless the

correct thermal brackets are installed.

Prerequisites

Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.

Procedure

1. Remove the rear thermal bracket.

2. Remove the middle thermal bracket.

3. Remove the riser slot 4 thermal bracket.

Removal and replacement procedures 31

4. Remove the side bracket.

Remove the primary riser cage

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

either riser blank or the riser cage is installed.

Prerequisites

Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

3. Remove the server from the chassis on page 27.

32 Removal and replacement procedures

4. Remove the bayonet board on page 28.

5. Remove the secondary riser cage on page 30.

6. If an expansion board with internal cabling is installed on the riser cage, disconnect these internal

cables from the expansion board.

7. Remove the primary riser cage.

Remove the primary riser blank

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

either riser blank or the riser cage is installed.

Prerequisites

Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

3. Remove the server from the chassis on page 27.

4. Remove the bayonet board on page 28.

5. Remove the secondary riser cage on page 30.

6. Remove the primary riser blank.

Removal and replacement procedures 33

Install the secondary riser cage

Prerequisites

Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.

Procedure

1. Install the secondary riser cage. Make sure that the riser board is firmly seated in its system board

connectors.

2. Install the bayonet board on page 38.

3. Install the server into the chassis on page 40.

4. Connect all peripheral cables to the server.

5. Power up the server on page 41.

34 Removal and replacement procedures

Installing drive blanks and thermal bezel blanks for components with thermal limitations

Depending on the chassis model and the system fan mode, some components might be subject to
thermal limitations. In these cases, it is necessary to remove some installed drives and replace them with
thermal bezel blanks or drive blanks.

Prerequisites

See the Locations of drive blanks and thermal bezel blanks for components with thermal
limitations on page 36 to:

1. Identify the chassis model and system fan mode of the system you plan to install the component in.

2. Determine if the accelerator is subject to thermal limitations in the identified system setup.

3. Note the required drive bay action for the component installation.

Procedure

1. Perform a backup of all critical server data and programs.

2. If installed, remove the front bezel.

3. Remove the drives and/or drives blanks from the bays noted in step 3 of the Prerequisites.

4. Do one of the following:

• Install the LFF thermal bezel blanks.

• Install the LFF drive blank

• Install the SFF thermal bezel blanks.

Removal and replacement procedures 35

• Install the SFF drive blanks.

Locations of drive blanks and thermal bezel blanks for components with thermal
limitations

Apollo DX2200 Gen10 Chassis in nonredundant/redundant fan mode

The illustration callouts:

• outside the front panel image refer to the server numbering.

• on the drive bays refer to the drive numbering.

36 Removal and replacement procedures

Accelerator model Required drive bay action

Tesla P100 12 GB

Tesla P100 16 GB

Tesla V100 16 GB

Tesla V100 32 GB

Tesla P40 24 GB

Tesla M10 Quad

Apollo DX2600 Gen10 Chassis with 24 drives in nonredundant/redundant fan mode

The illustration callouts:

• outside the front panel image refer to the server numbering.

• on the drive bays refer to the drive numbering.

Thermal bezel blanks in bays:

1-9, 1-10, 1-11

3-9, 3-10, 3-11

LFF drive blanks in bays:

1-2, 1-10

3-2, 3-10

Accelerator model Required drive bay action

Tesla P100 12 GB

Tesla P100 16 GB

Tesla V100 16 GB

Tesla V100 32 GB

Apollo DX2800 Gen10 Chassis with 16 NVMe drives

In the illustration callouts:

• The first digit refers to the server numbering.

• The second digit refers to the drive numbering.

Thermal bezel blanks in bays:

1-9, 1-10, 1-11, 1-12, 1-13, 1-14

3-9, 3-10, 3-11, 3-12, 3-13, 3-14

Removal and replacement procedures 37

Accelerator model Required drive bay action

Tesla V100 16 GB, nonredundant
fan mode

Tesla V100 32 GB, nonredundant
or redundant fan mode

Install the bayonet board

Prerequisites

Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.

Procedure

1. Install the bayonet board:

a. Connect all the bayonet board cables.

b. Install the bayonet board. Make sure that the board is firmly seated in the connector.

SFF drive blanks in bays:

2-1, 2-2, 2-3, 2-4

4-1, 4-2, 4-3, 4-4

SFF thermal bezel blanks in bays:

2-1, 2-2, 2-3, 2-4, 1-3, 1-4

4-1, 4-2, 4-3, 4-4, 3-3, 3-4

38 Removal and replacement procedures

c. Install the bayonet board cover, and then and install the screws to secure it to the server tray.

d. Install the screws to secure the cover to the bayonet board.

Removal and replacement procedures 39

2. Install the server into the chassis on page 40.

3. Connect all peripheral cables to the server.

4. Power up the server on page 41.

Install the server into the chassis

CAUTION: To avoid damage to the server or server blank:

• Always support the bottom of the server or server blank when removing it from the chassis.

• Do not use the release lever to carry the server or server blank.

Procedure

1. Slide the server into the chassis.

2. Close the release lever.

3. Tighten the release lever thumbscrew.

40 Removal and replacement procedures

4. Connect all peripheral cables to the server.

5. Power up the server on page 41.

Power up the server

The DX chassis firmware initiates an automatic power-up sequence when the servers are installed. If the
default setting is changed, use one of the following methods to power up each server:

• Use a virtual power button selection through iLO 5.

• Press and release the Power On/Standby button.

When the server goes from standby mode to full power mode, the server power LED changes from amber
to green.

Disconnecting and replacing the SUV cable

Procedure

1. Disconnect the peripheral devices connected to the SUV cable.

2. Disconnect the SUV cable:

a. Press and hold both sides of the SUV connector.

b. Disconnect the cable from the SUV port.

Removal and replacement procedures 41

To replace the component, reverse the removal procedure.

Removing and replacing a bayonet board

CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a

perceived hardware error, make sure first that the component is firmly seated in the slot. Do not
bend or flex circuit boards when reseating components.

Prerequisites

Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available.

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

3. Remove the server from the chassis on page 27.

4. Remove the bayonet board on page 28.

5. Separate the small bayonet boards from the large bayonet board.

To replace the component, reverse the removal procedure.

42 Removal and replacement procedures

Removing and replacing an expansion board in the primary riser cage

CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a

perceived hardware error, make sure first that the component is firmly seated in the slot. Do not
bend or flex circuit boards when reseating components.

Prerequisites

Before you perform this procedure, make sure that you have a T-15 Torx screwdriver available.

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

3. Remove the server from the chassis on page 27.

4. Remove the bayonet board on page 28.

Remove the primary riser cage on page 32.

5.

6. If the expansion board has internal cabling, disconnect these internal cables from the expansion

board.

7. Removing an expansion board.

8. If you do not intend to replace the expansion board, install the riser slot blank.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 43

Removing and replacing an expansion board in the secondary riser cage

CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a

perceived hardware error, make sure first that the component is firmly seated in the slot. Do not
bend or flex circuit boards when reseating components.

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless the
correct thermal brackets are installed in the secondary riser cage.

Prerequisites

Before you perform this procedure, make sure that you have a T-15 Torx screwdriver available.

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

Remove the server from the chassis on page 27.

3.

4. Remove the bayonet board on page 28.

5. Remove the secondary riser cage on page 30.

6. If the expansion board for removal is installed in the riser slot 2, lay the riser cage on its side with the

riser slots facing up to access the riser slot 2.

7. If the expansion board for removal is installed in the riser slot 3 or 4, remove the following brackets:

• Rear thermal bracket

• Middle thermal bracket

• Side bracket

8. If the expansion board for removal is installed in the riser slot 4, do the following:

a. Rear the riser slot 4 side bracket.

b. If the cable clamp is securing the expansion board, slide it outward.

44 Removal and replacement procedures

9. Disconnect all cables from the expansion board.

10. Remove the expansion board.

• Expansion board removal from the secondary riser slot 2

• Expansion board removal from the secondary riser slot 3 transfer board

Removal and replacement procedures 45

• Expansion board removal from the secondary riser slot 4

• Adapter removal from the FlexibleLOM riser slot 2

46 Removal and replacement procedures

11. If you do not intend to replace the expansion board in the riser slot 2 or 3, install the riser slot blank.

• Riser slot 2 blank installation

• Riser slot 3 blank installation

Removal and replacement procedures 47

• FlexibleLOM slot blank installation

12. If you do not intend to replace the expansion board in the riser slot 4, install the air blocker on the

middle and rear thermal brackets.

• Air blocker installation on the middle thermal bracket

48 Removal and replacement procedures

• Air blocker installation on the rear thermal bracket

To replace the component, reverse the removal procedure.

Removing and replacing the secondary riser slot 3 transfer board

CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a

perceived hardware error, make sure first that the component is firmly seated in the slot. Do not
bend or flex circuit boards when reseating components.

Prerequisites

Before you perform this procedure, make sure that you have thea T-10 and T-15 Torx screwdrivers
available.

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

3. Remove the server from the chassis on page 27.

4. Remove the bayonet board on page 28.

5. Remove the secondary riser cage on page 30.

6. If an expansion board is installed, do the following:

Removal and replacement procedures 49

a. Remove the side bracket.

b. Disconnect all cables from the expansion board.

c. Remove the expansion board.

7. Remove the secondary riser slot 3 transfer board.

To replace the component, reverse the removal procedure.

Removing and replacing the primary riser board

CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a

perceived hardware error, make sure first that the component is firmly seated in the slot. Do not
bend or flex circuit boards when reseating components.

50 Removal and replacement procedures

Prerequisites

Before you perform this procedure, make sure that you have a T-15 Torx screwdriver available.

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

3. Remove the server from the chassis on page 27.

4. Remove the bayonet board on page 28.

5. Remove the secondary riser cage on page 30.

6. Remove the primary riser cage on page 32.

7. If installed, remove the expansion board from the riser board.

8. If present, disconnect the storage controller backup power cable from the riser board.

9. Remove the primary riser board.

To replace the component, reverse the removal procedure.

Removing and replacing the secondary riser board

CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a

perceived hardware error, make sure first that the component is firmly seated in the slot. Do not
bend or flex circuit boards when reseating components.

Prerequisites

Before you perform this procedure, make sure that you have a T-10 and T-15 Torx screwdrivers available.

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

Removal and replacement procedures 51

3. Remove the server from the chassis on page 27.

4. Remove the bayonet board on page 28.

5. Remove the secondary riser cage on page 30.

6. Remove the following brackets:

• Rear thermal bracket

• Middle thermal bracket

• Side bracket

7. If installed, remove all expansion boards from the riser board.

8. If present, disconnect the storage controller backup power cables from the riser board.

9. Disconnect all cables from the secondary riser board.

10. Remove the secondary riser slot 3 transfer board.

11. Remove the square bracket from the secondary riser cage.

12. Remove the secondary riser board screws.

52 Removal and replacement procedures

13. Remove the secondary riser board.

To replace the component, reverse the removal procedure.

Removing and replacing the M.2 SSD riser board

CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a

perceived hardware error, make sure first that the component is firmly seated in the slot. Do not
bend or flex circuit boards when reseating components.

Prerequisites

Before you perform this procedure, make sure that you have a T-15 Torx and Phillips No.1 screwdrivers
available.

Removal and replacement procedures 53

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

3. Remove the server from the chassis on page 27.

4. Remove the bayonet board on page 28.

5. Remove the secondary riser cage on page 30.

6. Remove the M.2 SSD riser board:

a. Remove the riser board screw.

b. Carefully disengage the latch from the riser board post.

c. Remove the M.2 SSD riser board.

7. Remove all installed M.2 SSDs from the riser board.

8. If you do not intend to replace the M.2 SSD riser board, install the DIMM guard.

54 Removal and replacement procedures

To replace the component, reverse the removal procedure.

Removing and replacing a Media Module adapter

CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a

perceived hardware error, make sure first that the component is firmly seated in the slot. Do not
bend or flex circuit boards when reseating components.

Prerequisites

Before you perform this procedure, make sure that you have a T-15 Torx screwdriver available.

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

3. Remove the server from the chassis on page 27.

4. Remove the bayonet board on page 28.

5. Remove the secondary riser cage on page 30.

6. Do one of the following:

• Remove the primary riser blank on page 33.

• Remove the primary riser cage on page 32.

7. Remove the Media Module screws.

Removal and replacement procedures 55

8. Remove the Media Module adapter.

9. If you do not intend to replace the adapter, install the Media Module blank.

56 Removal and replacement procedures

To replace the component, reverse the removal procedure.

DIMM-processor compatibility

The installed processor determines the type of DIMM that is supported in the server:

• First-generation Intel Xeon Scalable processors support DDR4-2666 DIMMs.

• Second-generation Intel Xeon Scalable processors support DDR4-2666 DIMMs or DDR4-2933
DIMMs.

Mixing DIMM types is not supported. Install either all DDR4-2666 DIMMs or all DDR4-2933 DIMMs in the
server.

Removing and replacing a DIMM

CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a

perceived hardware error, make sure first that the component is firmly seated in the slot. Do not
bend or flex circuit boards when reseating components.

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

3. Remove the server from the chassis on page 27.

4. Remove the bayonet board on page 28.

5. Remove the secondary riser cage on page 30.

6. Remove the DIMM.

Removal and replacement procedures 57

To replace the component, reverse the removal procedure.

For DIMM configuration information, see the Hewlett Packard Enterprise website (http://www.hpe.com/

docs/arm-population-rules).

Removing and replacing the system board

Removing the system board

Prerequisites

• Take note of the following:

◦ The slot locations in which each memory module is installed. These components must be installed

in the same locations on the new system board.

◦ The port numbers and cable connections between the system board and the secondary riser

board.

• Before you perform this procedure, make sure that you have a T-15 and T-30 Torx screwdrivers
available.

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

3. Remove the server from the chassis on page 27.

4. Remove the bayonet board on page 28.

5. Remove the secondary riser cage on page 30.

6. Do one of the following:

• Remove the primary riser blank on page 33.

• Remove the primary riser cage on page 32.

7. If installed, remove the Media Module adapter.

58 Removal and replacement procedures

8. If installed, remove the M.2 SSD riser board.

9. If present, disconnect the S100i SR Gen10 controller SATA X-cable.

10. Remove the DIMMs from the system board.

11. Remove the processor heatsink assembly:

a. Allow the heatsink to cool.

b. Loosen the heatsink nuts in the order specified by the label on the heatsink.

c. Lift the processor heatsink assembly and move it away from the system board.

d. Turn the assembly over and place it on a work surface with the processor facing up.

e. Install the dust cover.

12. Remove the system board.

Removal and replacement procedures 59

Replacing the system board

Prerequisites

Before you perform this procedure, make sure that you have a T-15 and T-30 Torx screwdrivers available.

Procedure

1. Install the system board.

2. Install the processor heatsink assembly:

a. Locate and align the Pin 1 indicator on the processor frame and the socket.

b. Align the processor heatsink assembly with the heatsink alignment posts and gently lower it down

until it sits evenly on the socket.

The heatsink alignment posts are keyed. The processor will only install one way.

A standard heatsink is shown, your heatsink might look different.

60 Removal and replacement procedures

CAUTION: Be sure to tighten each heatsink nut fully in the order indicated. Otherwise, boot

failure or intermittent shutdowns might occur.

c. Using a T-30 Torx screwdriver, tighten the nuts until they stop.

3. Install all components removed from the failed system board.

Be sure to install the DIMMs in the same DIMM slots as the failed system board.

4. Do the following:

Removal and replacement procedures 61

a. Install the primary PCIe riser cage.

b. Install the primary PCIe riser blank.

5. Install the secondary PCIe riser cage

6. Install the bayonet board

7. Install the server from the chassis

8. Connect all peripheral cables to the server.

9. Power up the server on page 41.

10. Access System Utilities and:

• Re-enter the server serial number and product ID.

• If the server is using Intel Xeon Gold 6244 processors, select an advanced fan cooling

method.

11. Ensure all firmware, including option cards and embedded devices, is updated to the same versions

to ensure that the latest drivers are being used.

Re-entering the server serial number and product ID and selecting an advanced fan cooling method

After you replace the system board, the server serial number and the product ID must be configured:

Procedure

1. Access System Utilities. During POST, press F9.

2. On the System Utilities home screen, select System Configuration > BIOS/Platform

Configuration (RBSU) > Advanced Options > Advanced Service Options.

3. Select the Serial Number field and press Enter.

The following alert appears:

The serial number is modified by qualified service personnel and must
match the serial number located on the chassis.

4. Click OK.

5. Type the serial number and press Enter.

6. Select the Product ID field and press Enter.

The following alert appears:

Product ID is modified only by qualified personnel. This value must match
the product ID located on the chassis.

7. Type the product ID and press Enter.

8. Press F10 to save the configuration.

9. If the server is using Intel Xeon Gold 6244 processors, do the following:

62 Removal and replacement procedures

a. Select System Configuration > BIOS/Platform Configuration (RBSU) > Advanced Options >

Fan and Thermal Options > Thermal Configuration.

b. Select one of the following advanced fan cooling method:

• Enhanced CPU Cooling

• Maximum Cooling

10. Save your setting.

The procedure is complete.

System battery replacement

System battery information

The server contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery
that provides power to the real-time clock. If this battery is not properly handled, a risk of the fire and
burns exists. To reduce the risk of personal injury:

• Do not attempt to recharge the battery.

• Do not expose the battery to temperatures higher than 60°C (140°F).

• Do not disassemble, crush, puncture, short external contacts, or dispose the battery in fire or water.

• If the server no longer automatically displays the correct date and time, then replace the battery that
provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.

Removing and replacing the system battery

Procedure

1. Power down the server on page 27.

2. Disconnect all peripheral cables from the server.

3. Remove the server from the chassis on page 27.

4. Remove the bayonet board on page 28.

5. Remove the secondary riser cage on page 30.

6. If installed, remove the primary PCI riser cage.

7. Locate the battery on the system board.

8. Slightly push the metal tab, and then remove the system battery from the socket.

Removal and replacement procedures 63

9. Slightly push the metal tab, and then install the new system battery in the socket.

10. Install the secondary riser cage on page 34

11. Install the bayonet board on page 38.

12. Install the server into the chassis on page 40.

13. Connect all peripheral cables to the server.

14. Power up the server on page 41.

15. Properly dispose of the old battery. For more information about proper battery disposal, contact an

authorized reseller or an authorized service provider.

HPE Trusted Platform Module 2.0 Gen10 Option

The HPE Trusted Platform Module 2.0 Gen10 Option is not a customer-removable part.

64 Removal and replacement procedures

CAUTION: If the TPM is removed from the original server and powered up on a different server,

data stored in the TPM including keys will be erased.

If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact a
Hewlett Packard Enterprise authorized service provider for a replacement system board and TPM board.

Removal and replacement procedures 65

Troubleshooting

NMI functionality

An NMI crash dump enables administrators to create crash dump files when a system is hung and not
responding to traditional debugging methods.

An analysis of the crash dump log is an essential part of diagnosing reliability problems, such as hanging
operating systems, device drivers, and applications. Many crashes freeze a system, and the only
available action for administrators is to cycle the system power. Resetting the system erases any
information that could support problem analysis, but the NMI feature preserves that information by
performing a memory dump before a hard reset.

To force the OS to invoke the NMI handler and generate a crash dump log, the administrator can use the
iLO Virtual NMI feature.

Troubleshooting resources

Troubleshooting resources are available for HPE Gen10 server products in the following documents:

• Troubleshooting Guide for HPE ProLiant Gen10 servers provides procedures for resolving common
problems and comprehensive courses of action for fault isolation and identification, issue resolution,
and software maintenance.

• Error Message Guide for HPE ProLiant Gen10 servers and HPE Synergy provides a list of error
messages and information to assist with interpreting and resolving error messages.

• Integrated Management Log Messages and Troubleshooting Guide for HPE ProLiant Gen10 and HPE
Synergy provides IML messages and associated troubleshooting information to resolve critical and
cautionary IML events.

To access the troubleshooting resources, see the Hewlett Packard Enterprise Information Library (http://

www.hpe.com/info/gen10-troubleshooting).

66 Troubleshooting

Diagnostic tools

Product QuickSpecs

For more information about product features, specifications, options, configurations, and compatibility, see
the product QuickSpecs on the Hewlett Packard Enterprise website (

UEFI System Utilities

The UEFI System Utilities is embedded in the system ROM. Its features enable you to perform a wide
range of configuration activities, including:

• Configuring system devices and installed options.

• Enabling and disabling system features.

• Displaying system information.

• Selecting the primary boot controller or partition.

• Configuring memory options.

• Launching other preboot environments.

HPE servers with UEFI can provide:

http://www.hpe.com/info/qs).

• Support for boot partitions larger than 2.2 TB. Such configurations could previously only be used for
boot drives when using RAID solutions.

• Secure Boot that enables the system firmware, option card firmware, operating systems, and software
collaborate to enhance platform security.

• UEFI Graphical User Interface (GUI)

• An Embedded UEFI Shell that provides a preboot environment for running scripts and tools.

• Boot support for option cards that only support a UEFI option ROM.

Selecting the boot mode

This server provides two Boot Mode configurations: UEFI Mode and Legacy BIOS Mode. Certain boot
options require that you select a specific boot mode. By default, the boot mode is set to UEFI Mode. The
system must boot in UEFI Mode to use certain options, including:

• Secure Boot, UEFI Optimized Boot, Generic USB Boot, IPv6 PXE Boot, iSCSI Boot, and Boot from
URL

• Fibre Channel/FCoE Scan Policy

NOTE: The boot mode you use must match the operating system installation. If not, changing the boot
mode can impact the ability of the server to boot to the installed operating system.

Prerequisite

When booting to UEFI Mode, leave UEFI Optimized Boot enabled.

Diagnostic tools 67

Procedure

1. From the System Utilities screen, select System Configuration > BIOS/Platform Configuration
(RBSU) > Boot Options > Boot Mode.

2. Select a setting.

• UEFI Mode (default)—Configures the system to boot to a UEFI compatible operating system.

• Legacy BIOS Mode—Configures the system to boot to a traditional operating system in Legacy

BIOS compatibility mode.

3. Save your setting.

4. Reboot the server.

Secure Boot

Secure Boot is a server security feature that is implemented in the BIOS and does not require special
hardware. Secure Boot ensures that each component launched during the boot process is digitally signed
and that the signature is validated against a set of trusted certificates embedded in the UEFI BIOS.
Secure Boot validates the software identity of the following components in the boot process:

• UEFI drivers loaded from PCIe cards

• UEFI drivers loaded from mass storage devices

• Preboot UEFI Shell applications

• OS UEFI boot loaders

When Secure Boot is enabled:

• Firmware components and operating systems with boot loaders must have an appropriate digital
signature to execute during the boot process.

• Operating systems must support Secure Boot and have an EFI boot loader signed with one of the
authorized keys to boot. For more information about supported operating systems, see http://
www.hpe.com/servers/ossupport.

You can customize the certificates embedded in the UEFI BIOS by adding or removing your own
certificates, either from a management console directly attached to the server, or by remotely connecting
to the server using the iLO Remote Console.

You can configure Secure Boot:

• Using the System Utilities options described in the following sections.

• Using the iLO RESTful API to clear and restore certificates. For more information, see the Hewlett
Packard Enterprise website (http://www.hpe.com/info/redfish).

• Using the secboot command in the Embedded UEFI Shell to display Secure Boot databases, keys,
and security reports.

Launching the Embedded UEFI Shell

Use the Embedded UEFI Shell option to launch the Embedded UEFI Shell. The Embedded UEFI Shell is
a preboot command-line environment for scripting and running UEFI applications, including UEFI boot

68 Diagnostic tools

loaders. The Shell also provides CLI-based commands you can use to obtain system information, and to
configure and update the system BIOS.

Prerequisites

Embedded UEFI Shell is set to Enabled.

Procedure

1. From the System Utilities screen, select Embedded Applications > Embedded UEFI Shell.

The Embedded UEFI Shell screen appears.

2. Press any key to acknowledge that you are physically present.

This step ensures that certain features, such as disabling Secure Boot or managing the Secure Boot
certificates using third-party UEFI tools, are not restricted.

3. If an administrator password is set, enter it at the prompt and press Enter.

The Shell> prompt appears.

4. Enter the commands required to complete your task.

5. Enter the exit command to exit the Shell.

Intelligent Provisioning

Intelligent Provisioning is a single-server deployment tool embedded in ProLiant servers and HPE
Synergy compute modules. Intelligent Provisioning simplifies server setup, providing a reliable and
consistent way to deploy servers.

Intelligent Provisioning 3.30 and later includes HPE Rapid Setup Software. When you launch F10 mode
from the POST screen, you are prompted to select whether you want to enter the Intelligent Provisioning
or HPE Rapid Setup Software mode.

NOTE: After you have selected a mode, you must reprovision the server to change the mode that
launches when you boot to F10.

Intelligent Provisioning prepares the system for installing original, licensed vendor media and Hewlett
Packard Enterprise-branded versions of OS software. Intelligent Provisioning also prepares the system to
integrate optimized server support software from the Service Pack for ProLiant (SPP). SPP is a
comprehensive systems software and firmware solution for ProLiant servers, server blades, their
enclosures, and HPE Synergy compute modules. These components are preloaded with a basic set of
firmware and OS components that are installed along with Intelligent Provisioning.

IMPORTANT: HPE ProLiant DX/XL servers do not support operating system installation with
Intelligent Provisioning, but they do support the maintenance features. For more information, see
"Performing Maintenance" in the Intelligent Provisioning user guide and online help.

After the server is running, you can update the firmware to install additional components. You can also
update any components that have been outdated since the server was manufactured.

To access Intelligent Provisioning:

Diagnostic tools 69

• Press F10 from the POST screen and enter either Intelligent Provisioning or HPE Rapid Setup
Software.

• From the iLO web interface using Always On. Always On allows you to access Intelligent
Provisioning without rebooting your server.

Intelligent Provisioning operation

Intelligent Provisioning includes the following components:

• Critical boot drivers

• Active Health System (AHS)

• Erase Utility

• Deployment Settings

IMPORTANT:

• Although your server is preloaded with firmware and drivers, Hewlett Packard Enterprise
recommends updating the firmware upon initial setup. Also, downloading and updating the latest
version of Intelligent Provisioning ensures the latest supported features are available.

• For ProLiant servers, firmware is updated using the Intelligent Provisioning Firmware Update
utility.

• Do not update firmware if the version you are currently running is required for compatibility.

NOTE: Intelligent Provisioning does not function within multihomed configurations. A multihomed host is
one that is connected to two or more networks or has two or more IP addresses.

Intelligent Provisioning provides installation help for the following operating systems:

• Microsoft Windows Server

• Red Hat Enterprise Linux

• SUSE Linux Enterprise Server

• VMware ESXi/vSphere Custom Image

• ClearOS

Not all versions of an OS are supported. For information about specific versions of a supported operating
system, see the OS Support Matrix on the Hewlett Packard Enterprise website (http://www.hpe.com/

info/ossupport).

HPE Insight Remote Support

Hewlett Packard Enterprise strongly recommends that you register your device for remote support to
enable enhanced delivery of your Hewlett Packard Enterprise warranty, HPE support services, or Hewlett
Packard Enterprise contractual support agreement. Insight Remote Support supplements your monitoring
continuously to ensure maximum system availability by providing intelligent event diagnosis, and
automatic, secure submission of hardware event notifications to Hewlett Packard Enterprise, which will
initiate a fast and accurate resolution, based on your product’s service level. Notifications can be sent to

70 Diagnostic tools

your authorized Hewlett Packard Enterprise Channel Partner for onsite service, if configured and
available in your country.

For more information, see Insight Remote Support and Insight Online Setup Guide for ProLiant Servers
and BladeSystem c-Class Enclosures on the Hewlett Packard Enterprise website. Insight Remote
Support is available as part of Hewlett Packard Enterprise Warranty, HPE support services, or Hewlett
Packard Enterprise contractual support agreement.

USB support

Hewlett Packard Enterprise Gen10 servers support all USB operating speeds depending on the device
that is connected to the server.

External USB functionality

Hewlett Packard Enterprise provides external USB support to enable local connection of USB devices for
server administration, configuration, and diagnostic procedures.

For additional security, external USB functionality can be disabled through USB options in UEFI System
Utilities.

HPE Smart Storage Administrator

HPE SSA is the main tool for configuring arrays on HPE Smart Array SR controllers. It exists in three
interface formats: the HPE SSA GUI, the HPE SSA CLI, and HPE SSA Scripting. All formats provide
support for configuration tasks. Some of the advanced tasks are available in only one format.

The diagnostic features in HPE SSA are also available in the standalone software HPE Smart Storage
Administrator Diagnostics Utility CLI.

During the initial provisioning of the server or compute module, an array is required to be configured
before the operating system can be installed. You can configure the array using SSA.

HPE SSA is accessible both offline (either through HPE Intelligent Provisioning or as a standalone
bootable ISO image) and online:

• Accessing HPE SSA in the offline environment

IMPORTANT: If you are updating an existing server in an offline environment, obtain the latest
version of HPE SSA through Service Pack for ProLiant before performing configuration
procedures.

Using one of multiple methods, you can run HPE SSA before launching the host operating system. In
offline mode, users can configure or maintain detected and supported devices, such as optional Smart
Array controllers and integrated Smart Array controllers. Some HPE SSA features are only available in
the offline environment, such as setting the boot controller and boot volume.

• Accessing HPE SSA in the online environment

This method requires an administrator to download the HPE SSA executables and install them. You
can run HPE SSA online after launching the host operating system.

For more information, see HPE Smart Array SR Gen10 Configuration Guide at the Hewlett Packard

Enterprise website.

HPE MR Storage Administrator

HPE MR Storage Administrator is a web-based application that enables you to monitor, maintain,
troubleshoot, and configure the HPE Smart Array MR controller. MR Storage Administrator helps you to
view, create, and manage storage configurations.

Diagnostic tools 71

• Monitoring and Configuring: MR Storage Administrator enables you to monitor the controllers and

configure the drives on the controller. It displays the status of the controller cards, logical drives, and
drives on the controller. The device status icons notify you if there are drive failures and other events
that require your immediate attention. Email notifications about the status of the server are sent based
on your alert settings. The system errors and events are recorded and displayed in an event log file.
You can also import or clear foreign configurations.

• Maintaining: Using MR Storage Administrator, you can perform system maintenance tasks, such as

updating the controller firmware.

• Troubleshooting: MR Storage Administrator displays information related to drive failures, device

failures, and other issues. It also provides recommendations and displays contextual links, helping you
to locate the drives/devices that have issues and troubleshoot them. You can also download a report
of the devices and their configurations, properties, and settings and send it to Hewlett Packard
Enterprise Support for further troubleshooting.

Obtain MR Storage Administrator installation files through the Service Pack for ProLiant, or SPP, which
you can download from http://www.hpe.com/servers/spp/download. Be sure to use the latest SPP
version for the server.

For more information about the MR Storage Administrator, see MR Storage Administrator User Guide on
the Hewlett Packard Enterprise website http://www.hpe.com/info/P824i-pdocs.

HPE InfoSight for servers

The HPE InfoSight portal is a secure web interface hosted by HPE that allows you to monitor supported
devices through a graphical interface.

HPE InfoSight for servers:

• Combines the machine learning and predictive analytics of HPE InfoSight with the health and
performance monitoring of Active Health System (AHS) and HPE iLO to optimize performance and
predict and prevent problems

• Provides automatic collection and analysis of the sensor and telemetry data from AHS to derive
insights from the behaviors of the install base to provide recommendations to resolve problems and
improve performance

For more information on getting started and using HPE InfoSight for servers, go to: http://www.hpe.com/

info/infosight-servers-docs.

StorCLI

The Storage Command Line Interface (StorCLI) tool is the command line management software designed
for the HPE Smart Array MR controller. StorCLI is a command line interface that is designed to be easy to
use, consistent, and easy to script.

Obtain StorCLI through the Service Pack for ProLiant, or SPP, which you can download from http://
www.hpe.com/servers/spp/download. Be sure to use the latest SPP version for the server.

For more information about StorCLI, see StorCLI User Guide on the Hewlett Packard Enterprise website

http://www.hpe.com/info/P824i-pdocs.

72 Diagnostic tools

Component identification

Rear panel components

Item Description

1 Slot 3 PCIe3 x16 (16, 8, 4, 1)

2 Slot 1 PCIe3 x16 (16, 8, 4, 1)

3 Slot 2 PCIe3 x16 (16, 8, 4, 1) or FlexibleLOM

4 SUV port

5 iLO Management Port

6 iLO Service Port

7 Serial number/iLO information pull tab on page 73

8 USB 3.0 port

9

10

1

2

Media Module NIC port 1

Media Module NIC port 2

If the RCM module is installed on the chassis, the iLO Management Port is automatically disabled.
The Media Module adapter is a hardware option.

1

2

2

Serial number/iLO information pull tab

The serial number/iLO information pull tab is double-sided. One side shows the server serial number and
the customer asset tag label. The other side shows the default iLO account information and QR code
label.

Use a mobile device to scan the QR code label to display the server mobile product page (http://
www.hpe.com/qref/dx190rgen10). This page contains links to server setup information, spare part
numbers, QuickSpecs, troubleshooting resources, and other useful product links.

Component identification 73

Rear panel LEDs and buttons

Item LED Status Definition

1

NIC link LED

1

Green Linked to network

Off No network link

2

NIC status LED

1

Flashing green Network active

Off No network activity

3

Power On/Standby button
and system power LED

1

Solid green System on and normal operation

Flashing green Performing power-on sequence

Solid amber System in standby

Off No power present

2

Table Continued

74 Component identification

Item LED Status Definition

4

UID button/LED

1

Solid blue Activated

• 1 flash per second = Remote
management or firmware
upgrade in progress

• 4 flashes per second = iLO
manual soft reboot sequence
initiated

• 8 flashes per second = iLO
manual hard reboot sequence
in progress

Off Deactivated

5

Do not remove LED Flashing white Do not remove the server.

Removing the server might
terminate the current operation and
cause data loss.

Off The server can be removed.

6

Health LED

1

Solid green Normal

1

When the LEDs described in this table flash simultaneously, a power fault has occurred. For more information, see
Front panel LED power fault codes on page 76.

2

Facility power is not present, power cord is not attached, no power supplies are installed, power supply failure has
occurred, or the front I/O cable is disconnected.

3

If the health LED indicates a degraded or critical state, review the system IML or use iLO to review the system health
status.

Server UID LED

The UID LED is used to locate a particular server when it is deployed in a dense chassis with other
equipment. Activating the UID LED helps an onsite technician to quickly identify a server for maintenance
tasks.

UID button functionality

The UID button can be used to display the Server Health Summary when the server will not power on.
For more information, see the latest HPE iLO 5 User Guide on the Hewlett Packard Enterprise website.

Flashing green iLO is rebooting

Flashing amber System degraded

Flashing red System critical

3

Component identification 75

Front panel LED power fault codes

The following table provides a list of power fault codes, and the subsystems that are affected. Not all
power faults are used by all servers.

Subsystem LED behavior

System board 1 flash

Processor 2 flashes

Memory 3 flashes

Riser board PCIe slots 4 flashes

FlexibleLOM 5 flashes

Removable HPE Smart Array SR Gen10 controller 6 flashes

System board PCIe slots 7 flashes

Power backplane or storage backplane 8 flashes

Power supply 9 flashes

System board components

Item Description

1 Primary PCIe x16 riser connector 1

2 Media Module connector

3 System battery

4 OPA adapter sideband cable connector

5 M.2 SSD riser connector

6 Processor 1

7 DIMM slots for processor 1

76 Component identification

Table Continued

Item Description

8 Processor 2

9 DIMM slots for processor 2

10 Bayonet board connector

11 Secondary PCIe x24 riser connector 4

12 Secondary PCIe x24 riser connector 3

13 x4 SATA port

14 System maintenance switch

15 x8 SATA port

16 Secondary PCIe x24 riser connector 2

17 TPM connector

18 microSD slot

System maintenance switch descriptions

Position Default Function

1

S1

Off

Off = iLO 5 security is enabled.

On = iLO 5 security is disabled.

S2 Off Reserved

S3 Off Reserved

S4 Off Reserved

1

S5

Off

Off = Power-on password is enabled.

On = Power-on password is disabled.

S61, 2,

3

Off

Off = No function

On = Restore default manufacturing settings

S7 Off Reserved

S8 — Reserved

S9 — Reserved

S10 — Reserved

S11 — Reserved

S12 — Reserved

1

To access the redundant ROM, set S1, S5, and S6 to On.

2

When the system maintenance switch position 6 is set to the On position, the system is prepared to restore all
configuration settings to their manufacturing defaults.

Component identification 77

3

When the system maintenance switch position 6 is set to the On position and Secure Boot is enabled, some
configurations cannot be restored. For more information, see Secure Boot on page 68.

DIMM label identification

To determine DIMM characteristics, see the label attached to the DIMM. The information in this section
helps you to use the label to locate specific information about the DIMM.

Item Description Example

1 Capacity

2 Rank

3 Data width on DRAM

4 Memory generation

8 GB

16 GB

32 GB

64 GB

128 GB

1R = Single rank

2R = Dual rank

4R = Quad rank

8R = Octal rank

x4 = 4-bit

x8 = 8-bit

x16 = 16-bit

PC4 = DDR4

78 Component identification

Table Continued

Item Description Example

5 Maximum memory speed

6 CAS latency

7 DIMM type

2133 MT/s

2400 MT/s

2666 MT/s

2933 MT/s

P = CAS 15-15-15

T = CAS 17-17-17

U = CAS 20-18-18

V = CAS 19-19-19 (for RDIMM, LRDIMM)

V = CAS 22-19-19 (for 3DS TSV LRDIMM)

Y = CAS 21-21-21 (for RDIMM, LRDIMM)

Y = CAS 24-21-21 (for 3DS TSV LRDIMM)

R = RDIMM (registered)

L = LRDIMM (load reduced)

E = Unbuffered ECC (UDIMM)

For more information about product features, specifications, options, configurations, and compatibility, see
the HPE DDR4 SmartMemory QuickSpecs on the Hewlett Packard Enterprise website (http://

www.hpe.com/support/DDR4SmartMemoryQS).

HPE Persistent Memory module label identification

Item Description Example

1 Unique ID number 8089-A2-1802-1234567

2 Model number NMA1XBD512G2S

Table Continued

Component identification 79

Item Description Example

3 Capacity

128 GB

256 GB

512 GB

4 QR code Includes part number and serial number

For more information about product features, specifications, options, configurations, and compatibility, see
the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/support/

persistentmemoryQS).

Processor, heatsink, and socket components

Item Description

1 Heatsink nuts

2 Processor carrier

3 Pin 1 indicator

1

4 Heatsink latch

5 Alignment post

1

Symbol also on the processor and frame.

80 Component identification

Bayonet board components

Item Description

1 Bayonet port 1

2 Bayonet port 2

3 Bayonet port 3

4 Bayonet port 4

5 GPU auxiliary power cable connector

PCIe riser board components

This section identifies the riser slots compatible with specific types of expansion options supported by the
server. The following riser options are supported:

• Primary riser

• Secondary risers

• M.2 SSD riser

Primary riser board components

The primary riser function is linked to processor 1. This riser only supports low-profile expansion boards.

Component identification 81

Item Slot number Description Supported options

1 1 PCIe3 x16 (16, 8, 4, 1) • Smart Array type-p controller

• Network adapter

• OPA adapter

1

2 — Storage controller backup power

connector

1

Intel Omni-Path Architecture

Secondary riser board components

The server supports multiple riser options in the secondary position. Processor 2 is required to support
these secondary riser options.

Three-slot secondary riser board components

Three-slot secondary riser slots

—

Item Slot number Description Supported options

1 4 PCIe3 x16 (16, 8, 4, 1) • PCIe workload accelerator

2 — Storage controller backup power

3 2 PCIe3 x16 (16, 8, 4, 1) • Smart Array type-p

82 Component identification

• Computation and graphics
accelerator

—

connector

controller

• Network adapter

Table Continued

Item Slot number Description Supported options

4 3 PCIe3 x16 (16, 8, 4, 1) —

5 — Secondary riser slot 3 transfer board

1

• Smart Array type-p
controller

• PCIe workload accelerator

• Computation and graphics
accelerator

• Network adapter

1

The transfer board is, by default, installed on the secondary riser slot 3.

Three-slot secondary riser port numbering

FlexibleLOM riser board components

FlexibleLOM riser slots

Component identification 83

Item Slot number Description Supported options

1 4 PCIe3 x16 (16, 8, 4, 1) • PCIe workload accelerator

• Computation and graphics
accelerator

2 3 PCIe3 x16 (16, 8, 4, 1) —

3 FlexibleLOM slot PCIe3 x16 (16, 8, 4, 1) FlexibleLOM adapter

4 — Secondary riser slot 3 transfer

1

board

1

The transfer board is, by default, installed on the secondary riser slot 3.

FlexibleLOM riser port numbering

• PCIe workload accelerator

• Computation and graphics
accelerator

• Network adapter

84 Component identification

M.2 SSD riser bay numbering

The arrow points toward the server release lever.

Item Description

1 Bay 7

2 Bay 8

Accelerator numbering

Component identification 85

HPE Smart Array P824i-p MR Gen10 Controller

Components

Item Description

1 Internal SAS port 1i

2 Internal SAS port 2i

3 Internal SAS port 3i

4 Internal SAS port 4i

5 Controller backup power cable connector

6 Internal SAS port 5i

7 Internal SAS port 6i

86 Component identification

Cabling

Cabling guidelines

The cable colors in the cabling diagrams used in this chapter are for illustration purposes only. Most of the
server cables are black.

Observe the following guidelines when working with server cables.

Before connecting cables

• Note the port labels on the PCA components. Not all of these components are used by all servers:

◦ System board ports

◦ Drive and power supply backplane ports

◦ Expansion board ports (controllers, adapters, expanders, risers, and similar boards)

• Note the label near each cable connector. This label indicates the destination port for the cable
connector.

• Some data cables are pre-bent. Do not unbend or manipulate the cables.

• To prevent mechanical damage or depositing oil that is present on your hands, and other
contamination, do not touch the ends of the connectors.

When connecting cables

• Before connecting a cable to a port, lay the cable in place to verify the length of the cable.

• Use the internal cable management features to properly route and secure the cables.

• When routing cables, be sure that the cables are not in a position where they can be pinched or
crimped.

• Avoid tight bend radii to prevent damaging the internal wires of a power cord or a server cable. Never
bend power cords and server cables tight enough to cause a crease in the sheathing.

• Make sure that the excess length of cables are properly secured to avoid excess bends, interference
issues, and airflow restriction.

• To prevent component damage and potential signal interference, make sure that all cables are in their
appropriate routing position before installing a new component and before closing up the server after
hardware installation/maintenance.

When disconnecting cables

• Grip the body of the cable connector. Do not pull on the cable itself because this action can damage
the internal wires of the cable or the pins on the port.

• If a cable does not disconnect easily, check for any release latch that must be pressed to disconnect
the cable.

Cabling 87

• Remove cables that are no longer being used. Retaining them inside the server can restrict airflow. If
you intend to use the removed cables later, label and store them for future use.

Smart Array cabling

Onboard S100i SR Gen10 controller cabling (SATA only)

Cable color Description

Blue

Orange

88 Cabling

x8 SATA cable to bayonet port 1

x4 SATA cable to bayonet port 2

Smart Array type-p controller cabling

Smart Array type-p controller cabling in the primary riser slot 1

Cable color Description

Blue

Orange

Smart Array type-p controller cabling in the secondary riser slot 2

Cable color Description

Blue

Orange

Controller port 2 to bayonet port 2

Controller port 1 to bayonet port 1

Controller port 1 to bayonet port 1

Controller port 2 to bayonet port 2

Smart Array type-p controller cabling in the secondary riser slot 3 transfer board

Cabling 89

Cable color Description

Blue

Orange

Controller ports 1 and 2 to bayonet port 1

Controller ports 3 and 4 to bayonet port 2

Storage controller backup power cabling

Storage controller backup power cabling in the primary riser slot 1

Storage controller backup power cabling in the secondary riser slot 2

90 Cabling

Storage controller backup power cabling in the secondary riser slot 3

Three-slot secondary riser cabling

Cable color Description

Blue

Orange

Secondary PCIe riser port 1 to bayonet port 3

Secondary PCIe riser port 2 to bayonet port 4

Cabling 91

FlexibleLOM riser cabling

Cable color Description

Blue

Orange

Yellow

OPA adapter cabling

FlexibleLOM riser port 3 to bayonet port 3

FlexibleLOM riser port 4 to bayonet port 4

FlexibleLOM riser port 2 to bayonet port 2

FlexibleLOM riser port 1 to bayonet port 1

92 Cabling

Cable color Description

Blue

Orange

OPA adapter sideband cable

OPA adapter IFP cable

Accelerator auxiliary power cabling

GPU accelerator 1

GPU accelerator 2

Cable color Description

Orange Accelerator 1 auxiliary power cable

Blue Accelerator 2 auxiliary power cable

Cabling 93

Specifications

Environmental specifications

Specification Value

Temperature range

Operating 10°C to 35°C (50°F to 95°F)

Non-operating -30°C to 60°C (-22°F to 140°F)

Relative humidity (noncondensing) —

Operating 8% to 90%

1

—

28°C (82.4°F), maximum wet bulb temperature

Non-operating

1

All temperature ratings shown are for sea level. An altitude derating of 1.0°C per 305 m (1.8°F per 1000 ft) to 3050 m
(10,000 ft) is applicable. No direct sunlight allowed. Maximum rate of change is 20°C per hour (36°F per hour). The
upper limit and rate of change might be limited by the type and number of options installed.

For certain approved hardware configurations, the supported system inlet temperature range is extended:

• 5°C to 10°C (41°F to 50°F) and 35°C to 40°C (95°F to 104°F) at sea level with an altitude derating of

1.0°C per every 175 m (1.8°F per every 574 ft) above 900 m (2953 ft) to a maximum of 3050 m
(10,000 ft).

• 40°C to 45°C (104°F to 113°F) at sea level with an altitude derating of 1.0°C per every 125 m (1.8°F
per every 410 ft) above 900 m (2953 ft) to a maximum of 3050 m (10,000 ft).

Mechanical specifications

Specifications Value

Dimensions —

Height 8.43 cm (3.32 in)

5% to 95%

38.7°C (101.7°F), maximum wet bulb temperature

Depth 69.47 cm (27.36 in)

Width 18.45 cm (7.27 in)

Weight (approximate values) —

Weight (maximum) 8.00 kg (17.64 lb)

Weight (minimum) 5.10 kg (11.24 lb)

Temperature requirements

To ensure continued safe and reliable equipment operation, install or position the rack in a well-ventilated,
climate-controlled environment.

94 Specifications

The operating temperature inside the rack is always higher than the room temperature and is dependent
on the configuration of equipment in the rack. Check the TMRA for each piece of equipment before
installation.

CAUTION: To reduce the risk of damage to the equipment when installing third-party options:

• Do not permit optional equipment to impede airflow around the server or to increase the internal
rack temperature beyond the maximum allowable limits.

• Do not exceed the TMRA of manufacturer.

• The maximum inlet ambient temperature for most components installed in the server is 35°C (95°F).
Some components, however, have thermal limitations depending on the chassis model and the fan
configuration. If two or more components with temperature limitations are installed in the server,
observe the lowest maximum inlet ambient temperature.

• In most cases, the removable drive blanks are installed in empty drive bays. However, when
components that have thermal limitations are installed, it might be necessary to limit the number of
drives installed in the chassis. In which case, a combination of drive blanks and/or thermal bezel
blanks is installed in the empty drive bays.

• For list of components with thermal limitations, see to the following topics:

◦ Thermal limitations for components in systems with the Enhanced Processor Performance

feature enabled on page 95

◦ Thermal limitations for components in systems with the Enhanced Processor Performance

feature disabled on page 111

• The following drive options have drive capacities greater than or equal to 10 TB, but their thermal
requirements are the same as drives with capacities of less than 10 TB.

◦ 857646-B21

◦ 857650-B21

◦ 878562-B21

◦ 878566-B21

List of components with temperature requirements

The maximum inlet ambient temperature for most components installed in the server is 35°C (95°F).
Some components, however, are subject to thermal limitations depending on the chassis model and the
fan configuration. If two or more components with temperature requirements are installed in the server,
observe the lowest maximum inlet ambient temperature.

Thermal limitations for components in systems with the Enhanced Processor Performance feature enabled

The Enhanced Processor Performance feature adjusts the processor settings to a more aggressive setup
that can result in increased performance, but might result in higher power consumption.

To configure this feature, from the System Utilities screen, select System Configuration > BIOS/

Platform Configuration (RBSU) > Power and Performance Options > Advanced Performance
Tuning Options.

Specifications 95

Processors

The following limitations are for the Intel Xeon Gold 6244 (G6244) processor:

• The processor does not support enhanced processor performance

• LFF drives with drive capacities greater than or equal to 10 TB are not supported for the Apollo
DX2200 Gen10 Chassis series with three drives per node.

Description Chassis Fan configuration Number of drives

supported by the
server

Processor with a
TDP of 135 W or
more, except
G6244

Apollo DX2200
Gen10 Chassis

(12 LFF
backplane)

Apollo DX2600
Gen10 Chassis

Redundant and
nonredundant

Redundant and
nonredundant

5 to 6 drives

5 to 6 drives

0 to 4 drives

0 to 10 drives

1

2

3

(24 SFF or 16
SFF + 8 NVMe
backplane)

Apollo DX2800
Gen10 Chassis

Redundant and
nonredundant

0 to 24 drives

(24 SFF
backplane with
SAS expander)

Apollo DX2800
Gen10 Chassis

Redundant and
nonredundant

0 to 8 drives

Maximum inlet
ambient
temperature

25°C (77°F)

Not supported

30°C (86°F)

30°C (86°F)

30°C (86°F)

30°C (86°F)

Intel Xeon Gold
6244 (G6244)
processor

96 Specifications

(16 NVMe
backplane)

Apollo DX2200
Gen10 Chassis

(12 LFF
backplane)

Apollo DX2600
Gen10 Chassis

(24 SFF or 16
SFF + 8 NVMe
backplane)

Redundant and
nonredundant

Redundant and
nonredundant

5 to 6 drives

5 to 6 drives

0 to 4 drives

0 to 10 drives

1

Not supported

2

Not supported

3

Not supported

Not supported

Table Continued

Description Chassis Fan configuration Number of drives

supported by the
server

Maximum inlet
ambient
temperature

Processor with a
TDP of between
125 W and 130 W

Apollo DX2800
Gen10 Chassis

(24 SFF
backplane with
SAS expander)

Apollo DX2800
Gen10 Chassis

(16 NVMe
backplane)

Apollo DX2200
Gen10 Chassis

(12 LFF
backplane)

Apollo DX2600
Gen10 Chassis

(24 SFF or 16
SFF + 8 NVMe
backplane)

Redundant and
nonredundant

Redundant and
nonredundant

Redundant and
nonredundant

Redundant and
nonredundant

0 to 24 drives

0 to 8 drives

5 to 6 drives

5 to 6 drives

0 to 4 drives

0 to 10 drives

Not supported

Not supported

1

25°C (77°F)

2

Not supported

3

30°C (86°F)

30°C (86°F)

Processor with a
TDP of between
100 W and 115 W

Apollo DX2800
Gen10 Chassis

(24 SFF
backplane with
SAS expander)

Apollo DX2800
Gen10 Chassis

(16 NVMe
backplane)

Apollo DX2200
Gen10 Chassis

(12 LFF
backplane)

Apollo DX2600
Gen10 Chassis

(24 SFF or 16
SFF + 8 NVMe
backplane)

Redundant and
nonredundant

Redundant and
nonredundant

Redundant and
nonredundant

Redundant and
nonredundant

0 to 24 drives

0 to 8 drives

5 to 6 drives

5 to 6 drives

0 to 4 drives

0 to 10 drives

30°C (86°F)

30°C (86°F)

1

30°C (86°F)

2

Not supported

3

35°C (95°F)

35°C (95°F)

Table Continued

Specifications 97

Description Chassis Fan configuration Number of drives

supported by the
server

Maximum inlet
ambient
temperature

Apollo DX2800
Gen10 Chassis

(24 SFF
backplane with
SAS expander)

Apollo DX2800
Gen10 Chassis

(16 NVMe
backplane)

1

The drive capacity must be less than 10 TB.

2

The drive capacity must be greater than or equal to 10 TB.

3

If the component is installed in server 1, and the server is installed in the Apollo DX2200 Gen10 Chassis, drive blanks
must be installed in drive bays 1-2 and 2-2. Similarly, if the component is installed in server 3, and the server is
installed in the Apollo DX2200 Gen10 Chassis, drive blanks must be installed in drive bays 3-2 and 4-2. For more
information, see Installing drive blanks and thermal bezel blanks for components with thermal limitations on
page 35.

HPE Smart Array controllers

Description Chassis Fan configuration Number of drives

P824i-p
controller

1

Apollo DX2200
Gen10 Chassis

(12 LFF
backplane)

Redundant and
nonredundant

Redundant and
nonredundant

Redundant and
nonredundant

0 to 24 drives

0 to 8 drives

supported by the server

5 to 6 drives

5 to 6 drives

3

4

35°C (95°F)

35°C (95°F)

Maximum inlet
ambient
temperature

35°C (95°F)

35°C (95°F)

98 Specifications

Apollo DX2600
Gen10 Chassis

(24 SFF or 16
SFF + 8 NVMe
backplane)

Apollo DX2800
Gen10 Chassis

(24 SFF
backplane with
SAS expander)

Apollo DX2800
Gen10 Chassis

(16 NVMe
backplane)

Redundant and
nonredundant

Redundant and
nonredundant

Redundant and
nonredundant

0 to 10 drives

0 to 24 drives

0 to 8 drives

35°C (95°F)

35°C (95°F)

35°C (95°F)

Table Continued

Description Chassis Fan configuration Number of drives

supported by the server

P408i-p
controller

2

Gen10 Chassis

(12 LFF
backplane)

Apollo DX2200

Redundant and
nonredundant

5 to 6 drives

5 to 6 drives

0 to 4 drives

3

4

5

Maximum inlet
ambient
temperature

Not supported

Not supported

30°C (86°F)

P408e-p
controller

Apollo DX2600
Gen10 Chassis

Redundant and
nonredundant

0 to 10 drives 25°C (77°F)

(24 SFF or 16
SFF + 8 NVMe
backplane)

Apollo DX2800
Gen10 Chassis

Redundant and
nonredundant

0 to 24 drives 25°C (77°F)

(24 SFF
backplane with
SAS expander)

Apollo DX2800
Gen10 Chassis

Redundant and
nonredundant

0 to 8 drives Not supported

(16 NVMe
backplane)

2

Gen10 Chassis

(12 LFF
backplane)

Apollo DX2200

Redundant and
nonredundant

5 to 6 drives

5 to 6 drives

0 to 4 drives

3

4

5

22°C (71.6°F)

Not supported

30°C (86°F)

E208i-p
controller

Apollo DX2600
Gen10 Chassis

(24 SFF or 16
SFF + 8 NVMe
backplane)

Apollo DX2800
Gen10 Chassis

(24 SFF
backplane with
SAS expander)

Apollo DX2800
Gen10 Chassis

(16 NVMe
backplane)

Apollo DX2200
Gen10 Chassis

Redundant and
nonredundant

Redundant and
nonredundant

Redundant and
nonredundant

Redundant and
nonredundant

0 to 10 drives 25°C (77°F)

0 to 24 drives 25°C (77°F)

0 to 8 drives 25°C (77°F)

5 to 6 drives

3

30°C (86°F)

Table Continued

Specifications 99

Description Chassis Fan configuration Number of drives

supported by the server

(12 LFF
backplane)

5 to 6 drives

0 to 4 drives

4

5

Maximum inlet
ambient
temperature

Not supported

35°C (95°F)

E208e-p
controller

Apollo DX2600
Gen10 Chassis

(24 SFF or 16
SFF + 8 NVMe
backplane)

Apollo DX2800
Gen10 Chassis

(24 SFF
backplane with
SAS expander)

Apollo DX2800
Gen10 Chassis

(16 NVMe
backplane)

Apollo DX2200
Gen10 Chassis

(12 LFF
backplane)

Redundant and
nonredundant

Redundant and
nonredundant

Redundant and
nonredundant

Redundant and
nonredundant

0 to 10 drives 30°C (86°F)

0 to 24 drives 30°C (86°F)

0 to 8 drives Not supported

5 to 6 drives

5 to 6 drives

0 to 4 drives

3

4

5

25°C (77°F)

Not supported

30°C (86°F)

Apollo DX2600
Gen10 Chassis

Redundant and
nonredundant

0 to 10 drives 28°C (82.4°F)

(24 SFF or 16
SFF + 8 NVMe
backplane)

Apollo DX2800
Gen10 Chassis

Redundant and
nonredundant

0 to 24 drives 28°C (82.4°F)

(24 SFF
backplane with
SAS expander)

Apollo DX2800
Gen10 Chassis

Redundant and
nonredundant

0 to 8 drives 28°C (82.4°F)

(16 NVMe
backplane)

1

When the P824i-p controller is installed, the components installed in the Apollo DX2600 Gen10 Chassis chassis will
support up to 12 drives

2

The energy pack is supported only with Smart Array type-p controllers. Due to thermal concerns, it is recommended
to remove the energy pack if these controller types are not installed in the chassis.

3

The drive capacity must be less than 10 TB.

100 Specifications