HP ProDisplay P202va Disassembly Instructions Manual

Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model [List multiple models if applicable.]
1.0 Items Requiring Selective Treatment
Item Description
Notes
Quantity of items included in product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)
With a surface greater than 10 sq cm
IF Board power board and keypad
Batteries
All types including standard alkaline and lithium coin or button style batteries
No battery
Mercury-containing components
For example, mercury in lamps, display backlights, scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm
Includes background illuminated displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent chambers, and service stations.
Components and waste containing asbestos
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
EL-MF877-00 Page 1 Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing refractory ceramic fibers
Components, parts and materials containing radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
Tool Description
Tool Size (if applicable)
Description #1
Crossing Screw Driver M2
Description #2
Crossing Screw Driver M3
Description #3
Crossing Screw Driver M4
Description #4
Six corner sleeve Screw Driver M3
Description #5
3.0 Product Disassembly Process
Below action which may easily damage product .please notice it
Lay the Monitor on the desk, Press the clip button on the Display Head and remove the stand from the Display Head. and then press
N/A
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Lay the Monitor on the desk, Press the clip button on the Display Head and remove the stand from the Display Head. and then press the clip button on the arm separate the base from stand
2. Take out the Vesa cover with hand then Unlock the 8 screws which fix the chassis
3. Take out the back cover with hand
4. Take out the keypad cable and backlight cable then separate the bezel with hand
5. Unlock 2 screws which fix the bezel
6. Take out the LVDS connector from Panel then Separate chassis assembly and panel
7. separate the Mylar with hand
8. UUnlock the 2 screws which fix the IF board to the chassis
9. Unlock the 8 screws which fix the IF & Power PCBA then Separate IF & Power PCBA and chassis assembly
10. Take out the LED lightthe keypad and the LVDS connector from PCBA
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2 Template Revision B
PSG instructions for this template are available at EL-MF877-01
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