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Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
1.0 Items Requiring Selective Treatment
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
IF Board、
power
board and
keypad
All types including standard alkaline and lithium coin
or button style batteries
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
HP ProDisplay P202va 19.53-inch Monitor
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
Tool Size (if
applicable)
Six corner
sleeve Screw
Driver M3
3.0 Product Disassembly Process
Below action which may easily damage product .please notice it
Lay the
Monitor on
the desk,
Press the
clip button
on the
Display
Head and
remove the
stand from
the Display
Head. and
then press
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Lay the Monitor on the desk, Press the clip button on the Display Head and remove the stand from the Display Head.
and then press the clip button on the arm separate the base from stand
2. Take out the Vesa cover with hand ,then Unlock the 8 screws which fix the chassis
3. Take out the back cover with hand
4. Take out the keypad cable and backlight cable then separate the bezel with hand
5. Unlock 2 screws which fix the bezel
6. Take out the LVDS connector from Panel then Separate chassis assembly and panel
7. separate the Mylar with hand
8. UUnlock the 2 screws which fix the IF board to the chassis
9. Unlock the 8 screws which fix the IF & Power PCBA then Separate IF & Power PCBA and chassis assembly
10. Take out the LED light、the keypad and the LVDS connector from PCBA
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01