HP N270h Disassembly Instructions Manual
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP N270h Display
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries All types including standard alkaline and lithium
Mercury-containing components For example, mercury in lamps, display backlights,
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 6
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords 2
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos 0
Components, parts and materials containing
refractory ceramic fibers
EL-MF877-00 Page 1
Template Revision B
With a surface greater than 10 sq cm
coin or button style batteries
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Quantity
of items
included
in product
2
0
0
1
0
0
0
0
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 SCREW DRIVER(Plum flower head)
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Dismantle the stand ass’y via quick release bottom.
2. Remove the screw and dismantle the back cover of monitor with tool.
3. Tear out all tapes.
4. Dismantle the screws from Mainframe.
5. Pull out the PIN of cables, separate the mainframe and Panel.
6. Dismantle the PCBA screws and disconnect the connecters.
7. Take off board.
8. Dismantle the bezel of monitor. Remove the main board and power board.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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