HP N220b Disassembly Instructions Manual

Product End-of-Life Disassembly Instructions

Product Category: Monitors and Displays

Marketing Name / Model
[List multiple models if applicable.]

HP N220b Display

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as
defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.

Quantity

Item Description Notes

Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)

Batteries All types including standard alkaline and lithium

Mercury-containing components For example, mercury in lamps, display

Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm

Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 6
Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height
External electrical cables and cords 2
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or
PCAs already listed as a separate item above)

Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner

Components and waste containing asbestos 0

With a surface greater than 10 sq cm

coin or button style batteries

backlights, scanner lamps, switches, batteries

Includes background illuminated displays with gas
discharge lamps

0

0

Include the cartridges, print heads, tubes, vent
chambers, and service stations.

of items
included
in product

2

0

0

1

0

EL-MF877-00 Page 1
Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

0

refractory ceramic fibers
Components, parts and materials containing

0

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
Description #3
Description #4
Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requi ring selective
treatment:

1. Lay the monitor on a flat, soft and clean surface.

2. Remove the Stand and Base ASSY.

3. Remove the screws.

4. Remove the rear cover.

5. Remove the hinge

6. Remove the screws and deco bezel

7. Remove the Pins and tape

8. Remove the Mainframe and panel

9. Remove the the screws and the pin.

10. Remove the boards..

11. Remove the mainboard connect pin and the USB board connect pin

12.

13.

14.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 2
Template Revision B

PSG instructions for this template are available at EL-MF877-01