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Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP LD4312 Large Format Display
1.0 Items Requiring Selective Treatment
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Main Board*1,Power Board*1, Key pad Board*1,
TCON Board*1, IR and LED board*1
All types including standard alkaline and lithium coin
or button style batteries
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps panel*1
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Power cord*1, DP Cable*1, HDMI cable*1
All are inside monitor carton box
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Separate base(chassis) and neck by hand, then unlock monitor head and column by releasing button.
2. Separate front bezel and rear cover along the side gap by opening plsatic pick and separate front bezel by hand.
3. Remove all the acetate tapes from LVDS FFC, disassemble the internal wire, LVDS FFC from connector by hand
4. Release I/O port screws on PCBs by hexagon screwdriver, tear Alu tape from chassis then separate LVDS FFC and all
connector on PCBs.
5. Disassemble metal hinge with screwdriver, then release the screws to separate hinge from plastic part of neck, and
release screws to separate hinge top bracket from hinge..
6.
7.
8.
9.
10.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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Model Name: HP LD4312
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1. General Product Information
Product Name: LED Monitor
Model Name: HP LD4312