HP HFBR-5107T, HFBR-5106T, HFBR-5106 Datasheet

100VG-AnyLAN Multimode
Fiber Transceivers in Low Cost
1x9 Package Style

Technical Data

Features

• Full Compliance with the
Optical Performance
Requirements of the IEEE

802.12

• Multisourced 1x9 Package
Style with Choice of Duplex
SC or ST® Receptacles

• Wave Solder and Aqueous
Wash Process Compatible

• Manufactured in an ISO
9002 Certified Facility

• 820 nm and 1300 nm LED
Based Transceivers

Applications

• Multimode Fiber Backbone
Links

• Multimode Fiber Wiring
Closet to Desktop Links

Description

The HFBR-5106 and HFBR-5107
series transceivers from Hewlett­Packard provide system designers
with products to implement a
range of multimode fiber
100VG-AnyLAN physical layer
solutions. The transceivers are all
supplied in the new industry
standard 1x9 SIP package style
with a choice of duplex SC or
ST® connector interface.

100VG-AnyLAN Backbone Links

The HFBR-5106/-5106T are 1300
nm products with optical
performance compliant with the
100VG-AnyLAN PMD developed
by IEEE 802.12. These
transceivers are suitable for link
lengths up to 2 km.

Alternative 800 nm, Lower Cost 500 m Desktop Links

The HFBR-5107 is a lower cost
800 nm alternative to the HFBR­5106 for 100VG-AnyLAN links
from the wiring closet to the
desktop. It complies with the
performance requirements of

802.12 as implemented by
Hewlett-Packard at 800 nm
wavelength. This transceiver will
transfer the full range of
100VG-AnyLan Signals at the
required 1x10–8 Bit Error Rate
over distances up to 500 meters
using 62.5/125 µm multimode
fiber cables. This product is
intended for use in cost sensitive
applications where the benefits of
fiber optic links are important.

Transmitter Sections

The transmitter sections of the
HFBR-5106 utilize 1300 nm

HFBR-5106/5106T

1300 nm

HFBR-5107/5107T

820 nm

Surface Emitting InGaAsP LEDs
and the HFBR-5107 uses a low
cost 820 nm AlGaAs LED. These
LEDs are packaged in the optical
subassembly portion of the
transmitter section. They are
driven by a custom silicon IC
which converts differential PECL
logic signals, ECL referenced
(shifted) to a +5 Volt supply, into
an analog LED drive current.

Receiver Sections

The receiver section of the
HFBR-5106 utilizes InGaAs PIN
photodiodes coupled to a custom
silicon transimpedance preampli­fier IC. The HFBR-5107 series
uses the same preamplifier IC in
conjunction with an inexpensive
silicon PIN photodiode. These are
packaged in the optical
subassembly portion of the
receiver.

150

5965-7785E (4/97)

These PlN/preamplifier combina­tions are coupled to a custom
quantizer IC which provides the
final pulse shaping for the logic
output and Signal Detect
function. The data output is
differential. The signal detect
output is single-ended. Both data
and signal detect outputs are
PECL compatible, ECL
referenced (shifted) to a +5 Volt
power supply.

Package

The overall package concept for
the HP transceivers consists of
the following basic elements; two
optical subassemblies, an
electrical subassembly, and the
housing with integral duplex SC
connector receptacles. This is
illustrated in Figure 1.

The package outline and pinout
are shown in Figures 2 and 3.
The details of this package
outline and pinout are compliant
with the multisource definition of
the 1x9 SIP. The low profile of
the Hewlett- Packard transceiver
design complies with the maxi­mum height allowed for the
duplex SC connector over the
entire length of the package.

The optical subassemblies utilize
a high volume process together

DIFFERENTIAL
DATA OUT
SINGLE-ENDED
SIGNAL

DETECT OUT

DIFFERENTIAL
DATA IN

Figure 1. Block Diagram.

ELECTRICAL SUBASSEMBLY

QUANTIZER IC

DRIVER IC

PREAMP

TOP VIEW

with low cost lens elements which
result in a cost effective
transceiver.

The electrical subassembly con­sists of a high volume multi-layer
printed circuit board on which
the IC chips and various surface
mount passive circuit elements
are attached.

The package includes internal
shields for the electrical and
optical subassemblies to ensure
low EMI and high immunity to
electromagnetic fields.

The outer housing, including the
duplex SC connector receptacle,
is molded of filled non-conductive
plastic to provide mechanical
strength and electrical isolation.
The solder posts of the Hewlett­Packard design are isolated from
the circuit design of the
transceiver and do not require
connection to a ground plane on
the circuit board.

The transceiver is attached to a
printed circuit board with the
nine signal pins and the two
solder posts which exit the
bottom of the housing. The two
solder posts provide the primary
mechanical strength to withstand
the loads imposed on the duplex

DUPLEX SC
RECEPTACLE

PIN
PHOTODIODE

IC

OPTICAL
SUBASSEMBLIES

LED

or simplex SC connectored fiber
cables.

Application Information

The Application Engineering
group in the Hewlett-Packard
Optical Communications Division
is available to assist you with the
technical understanding and
design trade-offs associated with
these transceivers. You can
contact them through your
Hewlett-Packard sales
representative.

The following information is
provided to answer some of the
most common questions about
the use of these parts.

Transceiver Optical Power

Budget versus Link Length

Optical Power Budget (OPB) is
the available optical power for a
fiber optic link to accommodate
fiber cable losses plus losses due
to inline connectors, splices,
optical switches, and to provide
margin for link aging and
unplanned losses due to cable
plant reconfiguration or repair.

Figure 4 illustrates the predicted
OPB associated with the two
transceivers specified in this data
sheet at the Beginning of Life
(BOL). These curves represent
the attenuation and chromatic
plus modal dispersion losses
associated with the 62.5/125 µm
and 50/125 µm fiber cables only.
The area under the curve repre­sents the remaining OPB at any
link length, which is available for
overcoming non-fiber cable
related losses.

Hewlett-Packard LED technology
has produced 800 nm LED and
1300 nm LED devices with lower
aging characteristics than

151

DIFFERENTIAL
DATA OUT

SINGLE-ENDED
SIGNAL

DETECT OUT

ELECTRICAL SUBASSEMBLY

QUANTIZER IC

PREAMP

DUPLEX ST
RECEPTACLE

PIN PHOTODIODE

IC

OPTICAL
SUBASSEMBLIES

DIFFERENTIAL
DATA IN

DRIVER IC

TOP VIEW

Figure 1a. ST Block Diagram.

HFBR-510X
DATE CODE (YYWW)
COUNTRY OF ORIGIN

+ 0.08

0.75

3.30 ± 0.38

(0.130 ± 0.015)

(

0.030

- 0.05

+ 0.003

- 0.002

)

25.40

(1.000)

10.35

(0.407)

MAX.

MAX.

LED

39.12

(1.540)

MAX.

AREA
RESERVED
FOR
PROCESS
PLUG

12.70

(0.500)

12.70

(0.500)

2.92

(0.115)

0.46
(9x)ø

(0.018)

NOTE 1

23.55

(0.927)

NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING.
DIMENSIONS ARE IN MILLIMETERS (INCHES).

20.32

(0.800)

[8x(2.54/.100)]

16.70

(0.657)

0.87

(0.034)

23.24

(0.915)

18.52

(0.729)

4.14

(0.163)

15.88

(0.625)

(

0.050

1.27
+ 0.010

- 0.002

NOTE 1

(0.682)

+ 0.25

- 0.05

17.32

)

20.32

(0.800)

23.32

(0.918)

Figure 2. Package Outline Drawing.

152

24.8

(0.976)

42

(1.654)

MAX.

5.99

(0.236)

HFBR-5106T

HFBR-510XT
DATE CODE (YYWW)

DATE CODE (YYWW)

COUNTRY OF ORIGIN

SINGAPORE

20.32

(0.800)

22.86

(0.900)

25.4
MAX.

(1.000)

+ 0.08

0.5

- 0.05

(0.020)

+ 0.003

(

(

12.0
MAX.

(0.471)

3.2

(0.126)

± 0.38

20.32

0.46

φ

(0.022)

NOTE 1

[(8x (2.54/0.100)]

3.6

(0.142)

NOTE 1: PHOSPHOR BRONZE IS THE BASE MATERIAL FOR THE POSTS & PINS
WITH TIN LEAD OVER NICKEL PLATING.

DIMENSIONS IN MILLIMETERS (INCHES).

21.4

(0.843)

(0.051)

17.4

(0.685)

1.3

(± 0.015)

2.6

φ

(0.102)

23.38

(0.921)

18.62

(0.733)

- 0.002

3.3 ± 0.38

(0.130) (± 0.015)

(

20.32

(0.800)

+ 0.25

- 0.05

+ 0.010

- 0.002

(

12.7

(0.500)

Figure 2a. ST Package Outline Drawing.

1 = V
2 = RD
3 = RD
4 = SD
5 = V
6 = V
7 = TD
8 = TD
9 = V

EE

CC
CC

EE

N/C

N/C

TOP VIEW

Figure 3. Pin Out Diagram.

153

normally associated with these
technologies in the industry. The
Industry convention is 3 dB aging
for 800 nm and 1.5 dB for 1300
nm LEDs. The HP LEDs will
normally experience less than
1 dB of aging over normal com­mercial equipment mission life
periods. Contact your
Hewlett-Packard sales repre­sentatives for additional details.

Figure 4 was generated with a
Hewlett-Packard fiber optic link
module containing the current
industry conventions for fiber
cable specifications and the
100VG-AnyLAN Optical Param­eters. These parameters are
reflected in the guaranteed
performance of the transceiver
specifications in this data sheet.
This same model has been used
extensively in the ANSI X3T and
IEEE committees, including the
ANSI X3T12 committee, to
establish the optical performance
requirements for various fiber
optic interface standards. The
cable parameters used come from
the ISO/IEC JTCI/SC 25/WG3
Generic Cabling for Customer

Premises per DIS 11801
document and the EIA/TIA568-A
Commercial Building Telecom­munications Cabling Standard per
SP-2840.

Transceiver Signaling Operating Rate Range and BER Performance

For purposes of definition, the
symbol (Baud) rate, also called
signaling rate, is the reciprocal of
the shortest symbol time. Data
rate (bits/sec) is the symbol rate
divided by the encoding factor
used to encode the data
(symbols/bit).

When used in 100VG AnyLAN
100 Mbps applications, the
performance of the 1300 nm
transceiver is guaranteed over the
signaling rate of 10 MBd to
120 MBd to the full conditions
listed in the individual product
specification tables.

The transceivers may be used for
other applications at signaling
rates outside of the 10 MBd to
120 MBd range with some
penalty in the link optical power

budget primarily caused by a
reduction of receiver sensitivity.
Figure 5 gives an indication of
the typical performance of these
1300 nm products at different
rates.

These transceivers can also be
used for applications which
require different Bit Error Rate
(BER) performance. Figure 6
illustrates the typical trade-off
between link BER and the
receivers input optical power
level.

Table 1 lists the hub control
signals defined in IEEE 802.12,
section 18.5.4.1. These signal
rates are below 10 MBd but they
are transported with adequate
accuracy for hub access control.

Transceiver Jitter Performance

The Hewlett-Packard 1300 nm
transceivers are designed to
operate per the system interface
jitter specifications listed in Table
27 of section 18.9. of the IEEE

802.12 (100VG-AnyLAN
standards).

14

12

10

8

6

4

2

OPTICAL POWER BUDGET (dB)

0

FIBER OPTIC CABLE LENGTH (km)

Figure 4. Optical Power Budget at
BOL vs. Fiber Optic Cable Length.

HFBR-5106, 62.5/125 µm

HFBR-5107,

62.5/125 µm

HFBR-5107,
50/125 µm

HFBR-5106,
50/125 µm

1.0 3.00.15

0.5 1.5 2.0 2.5

154

3.5

4.0

3.0

2.5

2.0

1.5

1.0

AT CONSTANT BER (dB)

0.5

0

TRANSCEIVER RELATIVE OPTICAL POWER BUDGET

CONDITIONS:

1. PRBS 2

2. DATA SAMPLED AT CENTER OF
DATA SYMBOL.

3. BER = 10

4. TA = 25° C

5. V

CC

6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.

Figure 5. Transceiver Relative Optical
Power Budget at Constant BER vs.
Signaling Rate.

50 150

0 200

25 75 100 125

SIGNAL RATE (MBd)

7

-1

-6

= 5 V

dc

175

-2

1 x 10

-3

1 x 10

-4

1 x 10

-5

1 x 10

-6

1 x 10

-7

1 x 10

-8

1 x 10

BIT ERROR RATE

-10

2.5 x 10

-11

1 x 10

-12

1 x 10

-6 4

RELATIVE INPUT OPTICAL POWER – dB
CONDITIONS:

1. 125 MBd

2. PRBS 2

3. CENTER OF SYMBOL SAMPLING.

4. T

5. V

6. INPUT OPTICAL RISE/FALL TIMES
= 1.0/2.1 ns.

Figure 6. Bit Error Rate vs. Relative
Receiver Input Optical Power.

= 25° C

A

= 5 V

CC

HFBR-510X

-4 2-2

7

-1

dc

CENTER OF SYMBOL

0