Datasheet HCPL4503, HCPL4502, HCPL0501, HCPL0500, HCPL0453 Datasheet (HP)

1-16

H

Single Channel, High Speed
Optocouplers

Technical Data

Features

• 15 kV/µs Minimum Common

Mode Transient Immunity at
VCM = 1500 V (4503/0453)

• High Speed: 1 Mb/s

• TTL Compatible

• Available in 8-Pin DIP, SO-8,
Widebody Packages

• Open Collector Output

• Guaranteed Performance
from Temperature: 0°C
to 70°C

• Safety Approval

UL Recognized – 2500 V rms

for 1 minute (5000 V rms for
1 minute for HCNW and
Option 020 devices) per

UL1577
CSA Approved
VDE 0884 Approved

–V

IORM

= 630 V peak for

HCPL-4503#060

–V

IORM

= 1414 V peak for

HCNW devices
BSI Certified
(HCNW devices only)

• Dual Channel Version
Available (253X/4534/053X/

0534)

• MIL-STD-1772 Version
Available (55XX/65XX/4N55)

Applications

• High Voltage Insulation

• Video Signal Isolation

• Power Transistor Isolation
in Motor Drives

• Line Receivers

• Feedback Element in
Switched Mode Power
Supplies

• High Speed Logic Ground
Isolation – TTL/TTL, TTL/
CMOS, TTL/LSTTL

• Replaces Pulse Transformers

• Replaces Slow
Phototransistor Isolators

• Analog Signal Ground
Isolation

Description

These diode-transistor optocoup­lers use an insulating layer
between a LED and an integrated
photodetector to provide elec­trical insulation between input
and output. Separate connections
for the photodiode bias and
output-transistor collector
increase the speed up to a
hundred times that of a conven­tional phototransistor coupler by
reducing the base-collector
capacitance.

Functional Diagram

6N135/6
HCNW135/6
HCNW4502/3
HCPL-0452/3
HCPL-0500/1
HCPL-4502/3

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.

A 0.1 µF bypass capacitor must be connected between pins 5 and 8.

7

1

2

3

4

5

6

8

NC

ANODE

CATHODE

NC

V

CC

V

B

V

O

GND

*

* NOTE: FOR 4502/3, 0452/3,
PIN 7 IS NOT CONNECTED.

TRUTH TABLE

(POSITIVE LOGIC)

LED



ON

OFF

V

O


LOW
HIGH

5965-3605E

1-17

Selection Guide

Widebody

Minimum CMR 8-Pin DIP (300 Mil) Small-Outline SO-8 (400 Mil) Hermetic

Current Single Dual Single Dual Single Single and

dV/dt V

CM

Transfer Channel Channel Channel Channel Channel Dual Channel

(V/

µs) (V) Ratio (%) Package Package* Package Package* Package Packages*

1,000 10 7 6N135 HCPL-2530 HCPL-0500 HCPL-0530 HCNW135

19 6N136 HCPL-2531 HCPL-0501 HCPL-0531 HCNW136

HCPL-4502† HCPL-0452† HCNW4502†

15,000 1500 19 HCPL-4503† HCPL-4534 HCPL-0453† HCPL-0534 HCNW4503†

1,000 10 9 HCPL-55XX

HCPL-65XX

4N55

*Technical data for these products are on separate HP publications.
†Pin 7, transistor base, is not connected.

The 6N136, HCPL-0501, and
HCNW136 are designed for high
speed TTL/TTL applications. A
standard 16 mA TTL sink current
through the input LED will
provide enough output current
for 1 TTL load and a 5.6 kΩ pull­up resistor. CTR for these devices
is 19% minimum at IF= 16 mA.

The HCPL-4502, HCPL-0452,
and HCNW4502 provide the
electrical and switching
performance of the 6N136,
HCPL-0501, and HCNW136 with
increased ESD protection.

These single channel optocoup­lers are available in 8-Pin DIP,
SO-8 and Widebody package
configurations.

The 6N135, HCPL-0500, and
HCNW135 are for use in TTL/
CMOS, TTL/LSTTL or wide
bandwidth analog applications.
Current transfer ratio (CTR) for
these devices is 7% minimum at
IF= 16 mA.

The HCPL-4503, HCPL-0453,
and HCNW4503 are similar to the
HCPL-4502, HCPL-0452, and
HCNW4502 optocouplers but
have increased common mode
transient immunity of 15 kV/µs
minimum at VCM= 1500 V
guaranteed.

1-18

I

F

SHIELD

HCPL-4503/0453

HCNW4503

8

6

5

GND

V

CC

2

3

V

O

I

CC

V

F

I

O

ANODE

CATHODE

+

–

7

V

B

I

B

*

* NOTE: FOR HCPL-4502/-3, HCPL-0452/3,
HCNW4502/3, PIN 7 IS NOT CONNECTED.

Ordering Information

Specify Part Number followed by Option Number (if desired).

Example:
HCPL-4503#XXX

020 = UL 5000 V rms/1 Minute Option*
060 = VDE 0884 V

IORM

= 630 V peak Option**
300 = Gull Wing Surface Mount Option†
500 = Tape and Reel Packaging Option

Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.

*For 6N135/6 and HCPL-4502/3 only.
**For HCPL-4503 only. Combination of Option 020 and Option 060 is not available.
†Gull wing surface mount option applies to through hole parts only.

Schematic

1-19

Package Outline Drawings

8-Pin DIP Package (6N135/6, HCPL-4502/3)

8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N135/6, HCPL-4502/3)

0.635 ± 0.25

(0.025 ± 0.010)

12° NOM.

9.65 ± 0.25

(0.380 ± 0.010)

0.635 ± 0.130

(0.025 ± 0.005)

7.62 ± 0.25

(0.300 ± 0.010)

5

6

7

8

4

3

2

1

9.65 ± 0.25

(0.380 ± 0.010)

6.350 ± 0.25

(0.250 ± 0.010)

1.016 (0.040)

1.194 (0.047)

1.194 (0.047)

1.778 (0.070)

9.398 (0.370)

9.906 (0.390)

4.826

(0.190)



TYP.

0.381 (0.015)

0.635 (0.025)

PAD LOCATION (FOR REFERENCE ONLY)

1.080 ± 0.320

(0.043 ± 0.013)

4.19

(0.165)

MAX.

1.780

(0.070)

MAX.

1.19

(0.047)

MAX.

2.54

(0.100)

BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

0.254

+ 0.076

- 0.051

(0.010

+ 0.003)

- 0.002)

9.65 ± 0.25

(0.380 ± 0.010)

1.78 (0.070) MAX.

1.19 (0.047) MAX.

HP XXXXZ

YYWW

DATE CODE

1.080 ± 0.320

(0.043 ± 0.013)

2.54 ± 0.25

(0.100 ± 0.010)

0.51 (0.020) MIN.

0.65 (0.025) MAX.

4.70 (0.185) MAX.

2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).

5678

4321

5° TYP.

OPTION CODE*

UL
RECOGNITION

UR

0.254

+ 0.076

- 0.051

(0.010

+ 0.003)

- 0.002)

7.62 ± 0.25

(0.300 ± 0.010)

6.35 ± 0.25

(0.250 ± 0.010)

TYPE NUMBER

* MARKING CODE LETTER FOR OPTION NUMBERS.
"L" = OPTION 020
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.

1-20

Small Outline SO-8 Package (HCPL-0500/1, HCPL-0452/3)

8-Pin Widebody DIP Package (HCNW135/6, HCNW4502/3)

XXX

YWW

8765

4321

5.842 ± 0.203

(0.236 ± 0.008)

3.937 ± 0.127

(0.155 ± 0.005)

0.381 ± 0.076

(0.016 ± 0.003)

1.270

(0.050)

BSG

5.080 ± 0.127

(0.200 ± 0.005)

3.175 ± 0.127

(0.125 ± 0.005)

1.524

(0.060)

45° X

0.432

(0.017)

0.228 ± 0.025

(0.009 ± 0.001)

TYPE NUMBER
(LAST 3 DIGITS)

DATE CODE

0.305

(0.012)

MIN.

DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

0.152 ± 0.051

(0.006 ± 0.002)

7°

5

6

7

8

4

3

2

1

11.15 ± 0.15

(0.442 ± 0.006)

1.78 ± 0.15

(0.070 ± 0.006)

5.10

(0.201)

MAX.

1.55

(0.061)

MAX.

2.54 (0.100)
TYP.

DIMENSIONS IN MILLIMETERS (INCHES).

7° TYP.

0.254

+ 0.076

- 0.0051

(0.010

+ 0.003)

- 0.002)

11.00

(0.433)

9.00 ± 0.15

(0.354 ± 0.006)

MAX.

10.16 (0.400)
TYP.

HP 

HCNWXXXX



YYWW

DATE CODE

TYPE NUMBER

0.51 (0.021) MIN.

0.40 (0.016)

0.56 (0.022)

3.10 (0.122)

3.90 (0.154)

1-21

8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW135/6,
HCNW4502/3)

Note: Use of Non-Chlorine Activated Fluxes is Recommended.

240

∆T = 115°C, 0.3°C/SEC

0

∆T = 100°C, 1.5°C/SEC

∆T = 145°C, 1°C/SEC

TIME – MINUTES

TEMPERATURE – °C

220
200
180
160
140
120
100

80
60
40
20

0

260

123456789101112

Solder Reflow Temperature Profile (HCPL-0500/1, HCPL-0452/3, and Gull Wing
Surface Mount Option Parts)

1.00 ± 0.15

(0.039 ± 0.006)

7° NOM.

12.30 ± 0.30

(0.484 ± 0.012)

0.75 ± 0.25

(0.030 ± 0.010)

11.00

(0.433)

5

6

7

8

4

3

2

1

11.15 ± 0.15

(0.442 ± 0.006)

9.00 ± 0.15

(0.354 ± 0.006)

1.3

(0.051)

12.30 ± 0.30

(0.484 ± 0.012)

6.15

(0.242)



TYP.

0.9

(0.035)

PAD LOCATION (FOR REFERENCE ONLY)

1.78 ± 0.15

(0.070 ± 0.006)

4.00

(0.158)

MAX.

1.55

(0.061)

MAX.

2.54

(0.100)

BSC

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

0.254

+ 0.076

- 0.0051

(0.010

+ 0.003)

- 0.002)

MAX.

1-22

Regulatory Information

The devices contained in this data
sheet have been approved by the
following organizations:

UL

Recognized under UL 1577,
Component Recognition
Program, File E55361.

CSA

Approved under CSA Component
Acceptance Notice #5, File CA

88324.

VDE

Approved according to VDE
0884/06.92 (HCNW and Option
060 devices only).

BSI

Certification according to
BS451:1994,
(BS EN60065:1994);
BS EN60950:1992
(BS7002:1992) and
EN41003:1993 for Class II
applications (HCNW devices
only).

Insulation and Safety Related Specifications

8-Pin DIP Widebody
(300 Mil) SO-8 (400 Mil)

Parameter Symbol Value Value Value Units Conditions

Minimum External L(101) 7.1 4.9 9.6 mm Measured from input terminals
Air Gap (External to output terminals, shortest
Clearance) distance through air.

Minimum External L(102) 7.4 4.8 10.0 mm Measured from input terminals
Tracking (External to output terminals, shortest
Creepage) distance path along body.

Minimum Internal 0.08 0.08 1.0 mm Through insulation distance,
Plastic Gap conductor to conductor, usually
(Internal Clearance) the direct distance between the

photoemitter and photodetector
inside the optocoupler cavity.

Minimum Internal NA NA 4.0 mm Measured from input terminals
Tracking (Internal to output terminals, along
Creepage) internal cavity.

Tracking Resistance CTI 200 200 200 Volts DIN IEC 112/VDE 0303 Part 1
(Comparative
Tracking Index)

Isolation Group IIIa IIIa IIIa Material Group

(DIN VDE 0110, 1/89, Table 1)

Option 300 - surface mount classification is Class A in accordance with CECC 00802.

1-23

VDE 0884 Insulation Related Characteristics
(HCPL-4503 OPTION 060 ONLY)

Description Symbol Characteristic Units

Installation classification per DIN VDE 0110/1.89, Table 1

for rated mains voltage ≤ 300 V rms I-IV
for rated mains voltage ≤ 450 V rms I-III

Climatic Classification 55/100/21
Pollution Degree (DIN VDE 0110/1.89) 2
Maximum Working Insulation Voltage V

IORM

630 V peak

Input to Output Test Voltage, Method b*

V

IORM

x 1.875 = VPR, 100% Production Test with tm = 1 sec, V

PR

1181 V peak

Partial Discharge < 5 pC

Input to Output Test Voltage, Method a*

V

IORM

x 1.5 = VPR, Type and sample test, V

PR

945 V peak

tm = 60 sec, Partial Discharge < 5 pC

Highest Allowable Overvoltage*
(Transient Overvoltage, t

ini

= 10 sec) V

IOTM

6000 V peak

Safety Limiting Values

(Maximum values allowed in the event of a failure,
also see Figure 9, Thermal Derating curve.)

Case Temperature T

S

175 °C

Input Current I

S,INPUT

230 mA

Output Power P

S,OUTPUT

600 mW

Insulation Resistance at TS, VIO = 500 V R

S

≥ 10

9

Ω

VDE 0884 Insulation Related Characteristics (HCNW135/6, HCNW4502/3 ONLY)

Description Symbol Characteristic Units

Installation classification per DIN VDE 0110/1.89, Table 1

for rated mains voltage ≤ 600 V rms I-IV
for rated mains voltage ≤ 1000 V rms I-III

Climatic Classification 55/85/21
Pollution Degree (DIN VDE 0110/1.89) 2
Maximum Working Insulation Voltage V

IORM

1414 V peak

Input to Output Test Voltage, Method b*

V

IORM

x 1.875 = VPR, 100% Production Test with tm = 1 sec, V

PR

2652 V peak

Partial Discharge < 5 pC

Input to Output Test Voltage, Method a*

V

IORM

x 1.5 = VPR, Type and sample test, V

PR

2121 V peak

tm = 60 sec, Partial Discharge < 5 pC

Highest Allowable Overvoltage*
(Transient Overvoltage, t

ini

= 10 sec) V

IOTM

8000 V peak

Safety Limiting Values

(Maximum values allowed in the event of a failure,
also see Figure 9, Thermal Derating curve.)

Case Temperature T

S

150 °C

Input Current I

S,INPUT

400 mA

Output Power P

S,OUTPUT

700 mW

Insulation Resistance at TS, VIO = 500 V R

S

≥ 10

9

Ω

*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section (VDE 0884), for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in
application.

1-24

Absolute Maximum Ratings

Parameter Symbol Device Min. Max. Units Note

Storage Temperature* T

S

-55 125 °C

Operating Temperature* T

A

8-Pin DIP -55 100 °C

SO-8

Widebody -55 85

Average Forward Input Current* I

F(AVG)

25 mA 1

Peak Forward Input Current* I

F(PEAK)

8-Pin DIP 2

(50% duty cycle, 1 ms pulse width) SO-8 50 mA
(50% duty cycle, 1 ms pulse width) Widebody 40

Peak Transient Input Current* I

F(TRANS)

8-Pin DIP 1 A

(≤ 1 µs pulse width, 300 pps) SO-8

Widebody 0.1

Reverse LED Input Voltage* (Pin 3-2) V

R

8-Pin DIP 5 V

SO-8

Widebody 3

Input Power Dissipation* P

IN

8-Pin DIP 45 mW 3

SO-8

Widebody 40

Average Output Current* (Pin 6) I

O(AVG)

8mA

Peak Output Current* I

O(PEAK)

16 mA

Emitter-Base Reverse Voltage* V

EBR

5V

(Pin 5-7, except 4502/3, 0452/3)

Supply Voltage (Pin 8-5) V

CC

-0.5 30 V

Output Voltage (Pin 6-5) V

O

-0.5 20 V

Supply Voltage* (Pin 8-5) V

CC

-0.5 15 V

Output Voltage* (Pin 6-5) V

O

-0.5 15 V

Base Current* (Pin 7, except 4502/3, 0452/3) I

B

5mA

Output Power Dissipation* P

O

100 mW 4

Lead Solder Temperature*
(Through-Hole Parts Only)

1.6 mm below seating plane, 10 seconds T

LS

8-Pin DIP 260 °C

up to seating plane, 10 seconds Widebody 260 °C

Reflow Temperature Profile T

RP

SO-8 and

Option 300

*Data has been registered with JEDEC for the 6N135/6N136.

See Package Outline

Drawings section

1-25

Parameter Symbol Device Min. Typ.** Max. Units Test Conditions Fig. Note

Current CTR* 6N135 7 18 50 % TA = 25°CVO = 0.4 V IF = 16 mA, 1, 2, 5, 11
Transfer Ratio HCPL-0500 5 19 VO = 0.5 V VCC = 4.5 V 4

HCNW135

6N136 19 24 50 TA = 25°CVO = 0.4 V

HCPL-4502/3

HCPL-0501

HCPL-0452/3 15 25 VO = 0.5 V

HCNW136

HCNW4502/3

Logic Low V

OL

6N135 0.1 0.4 V TA = 25°CIO = 1.1 mA IF = 16 mA,

Output Voltage HCPL-0500 0.1 0.5 IO = 0.8 mA VCC = 4.5 V

HCNW135

6N136 0.1 0.4 TA = 25°CIO = 3.0 mA

HCPL-4502/3 0.1 0.5 IO = 2.4 mA

HCPL-0501

HCPL-0452/3

HCNW136

HCNW4502/3
Logic High IOH* 0.003 0.5 µATA = 25°CVO = VCC = 5.5 V IF = 0 mA 7
Output Current 0.01 1 TA = 25°CVO = VCC = 15 V

50

Logic Low I

CCL

50 200 µAIF = 16 mA, VO = Open, VCC = 15 V 13

Supply Current
Logic High I

CCH

* 0.02 1 µATA = 25°CIF = 0 mA, VO = Open, 13

Supply Current 2 VCC = 15 V
Input Forward VF* 8-Pin DIP 1.5 1.7 V TA = 25°CIF = 16 mA 3

Voltage SO-8 1.8

Widebody 1.45 1.68 1.85 TA = 25°CIF = 16 mA

1.35 1.95
Input Reverse BVR* 8-Pin DIP 5 V IR = 10 µA
Breakdown SO-8
Voltage Widebody 3 IR = 100 µA
Temperature ∆V

F

8-Pin DIP -1.6 mV/°CIF = 16 mA

Coefficient of ∆T

A

SO-8
Forward Voltage Widebody -1.9
Input C

IN

8-Pin DIP 60 pF f = 1 MHz, VF = 0 V

Capacitance SO-8

Widebody 90

Transistor DC h

FE

8-Pin DIP 150 VO = 5 V, IO = 3 mA
Current SO-8 130 VO = 0.4 V, IB = 20 µA
Gain Widebody 180 VO = 5 V, IO = 3 mA

160 VO = 0.4 V, IB = 20 µA

*For JEDEC registered parts.
**All typicals at TA = 25°C.

Electrical Specifications (DC)

Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified. See note 13.

1-26

Parameter Sym. Device Min. Typ.** Max. Units Test Conditions Fig. Note

Propagation t

PHL

* 6N135 0.2 1.5 µsTA = 25°CRL = 4.1 kΩ 5, 6, 8, 9

HCPL-0500 2.0 11

HCNW135

6N136 0.2 0.8 T

A

= 25°CRL = 1.9 kΩ

HCPL-4502/3

HCPL-0501

HCPL-0452/3 1.0

HCNW136

HCNW4502/3

Propagation t

PLH

* 6N135 1.3 1.5 µsTA = 25°CRL = 4.1 kΩ 5, 6, 8, 9

HCPL-0500 2.0 11

HCNW135

6N136 0.6 0.8 T

A

= 25°CRL = 1.9 kΩ

HCPL-4502/3

HCPL-0501

HCPL-0452/3 1.0

HCNW136

HCNW4502/3

Common Mode |CM

H

| 6N135 1 kV/µsRL = 4.1 kΩ IF = 0 mA, TA = 25°C, 12 7, 8,

HCPL-0500 V

CM

= 10 V

p-p

9

HCNW135 C

L

= 15 pF

6N136 1 R

L

= 1.9 kΩ

HCPL-4502
HCPL-0501
HCPL-0452
HCNW4502

HCPL-4503 15 30 R

L

= 1.9 kΩ IF = 0 mA, TA = 25°C,

HCPL-0453 V

CM

= 1500 V

p-p

,

HCNW4503 C

L

= 15 pF

Common Mode |CM

L

| 6N135 1 kV/µsRL = 4.1 kΩ IF = 16 mA, TA = 25°C, 12 7, 8,

HCPL-0500 V

CM

= 10 V

p-p

9

HCNW135 C

L

= 15 pF

6N136 1 R

L

= 1.9 kΩ

HCPL-4502
HCPL-0501
HCPL-0452
HCNW4502

HCPL-4503 15 30 R

L

= 1.9 kΩ IF = 16 mA, TA = 25°C,

HCPL-0453 V

CM

= 1500 V

p-p

,

HCNW4503 C

L

= 15 pF

Bandwidth BW 6N135/6 9 MHz See Test Circuit 8, 10 10

HCPL-0500/1

HCNW135/6 11

*For JEDEC registered parts.
**All typicals at T

A

= 25°C.

Switching Specifications (AC)

Over recommended temperature (TA = 0°C to 70°C), VCC = 5 V, IF = 16 mA unless otherwise specified.

Delay Time
to Logic Low
at Output

Delay Time to
Logic High at
Output

Transient
Immunity at
Logic High
Level Output

Transient
Immunity at
Logic Low
Level Output

1-27

Package Characteristics

Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified.

Parameter Sym. Device Min. Typ.* Max. Units Test Conditions Fig. Note

Input-Output V

ISO

8-Pin DIP 2500 V rms RH < 50%, 6, 14
Momentary SO-8 t = 1 min.,
Withstand TA = 25° C
Voltage**

8-Pin DIP 5000 6, 12,

(Option 020) 15

I

I-O

8-Pin DIP 1 µA 45% RH, t = 5 s, 6, 16

V

I-O

= 3 kVdc,

TA = 25° C

Input-Output R

I-O

8-Pin DIP 10

12

Ω V

I-O

= 500 Vdc 6

Resistance SO-8

Widebody 10

12

10

13

TA = 25° C

10

11

TA = 100° C

Input-Output C

I-O

8-Pin DIP 0.6 pF f = 1 MHz 6
Capacitance SO-8

Widebody 0.5 0.6

*All typicals at TA = 25°C.
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output
continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Related Characteristics Table (if
applicable), your equipment level safety specification or HP Application Note 1074 entitled “Optocoupler Input-Output Endurance
Voltage,” publication number 5963-2203E.

Widebody 5000

Notes:

1. Derate linearly above 70°C free-air temperature at a rate of 0.8 mA/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 0.5 mA/°C (SO-8).

2. Derate linearly above 70°C free-air temperature at a rate of 1.6 mA/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 1.0 mA/°C (SO-8).

3. Derate linearly above 70°C free-air temperature at a rate of 0.9 mW/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 1.1 mW/°C (SO-8).

4. Derate linearly above 70°C free-air temperature at a rate of 2.0 mW/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 2.3 mW/°C (SO-8).

5. CURRENT TRANSFER RATIO in percent is defined as the ratio of output collector current, IO, to the forward LED input current, IF,
times 100.

6. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.

7. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt on the leading edge of the
common mode pulse signal, VCM, to assure that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode
transient immunity in a Logic Low level is the maximum tolerable (negative) dVCM/dt on the trailing edge of the common mode pulse
signal, VCM, to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V).

8. The 1.9 kΩ load represents 1 TTL unit load of 1.6 mA and the 5.6 kΩ pull-up resistor.

9. The 4.1 kΩ load represents 1 LSTTL unit load of 0.36 mA and 6.1 kΩ pull-up resistor.

10. The frequency at which the ac output voltage is 3 dB below its mid-frequency value.

11. The JEDEC registration for the 6N136 specifies a minimum CTR of 15%. HP guarantees a minimum CTR of 19%.

12. See Option 020 data sheet for more information.

13. Use of a 0.1 µf bypass capacitor connected between pins 5 and 8 is recommended.

14. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 3000 V rms for 1 second

(leakage detection current limit, I

I-O

≤ 5 µA). This test is performed before the 100% Production test shown in the VDE 0884

Insulation Related Characteristics Table if applicable.

15. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 second

(leakage detection current limit, I

I-O

≤ 5 µA). This test is performed before the 100% Production test shown in the VDE 0884

Insulation Related Characteristics Table if applicable.

16. This rating is equally validated by an equivalent ac proof test.

6, 15

1-28

VF – FORWARD VOLTAGE – VOLTS

1000

100

10

1.0

0.1

0.01

0.001

1.2 1.3 1.4 1.5

T = 25° C

A

I

F

– FORWARD CURRENT – mA

I

F

V

F

+

–

1.81.71.6

WIDEBODY

VF – FORWARD VOLTAGE – VOLTS

100

10

0.1

0.01

1.1 1.2 1.3 1.4

I

F

– FORWARD CURRENT – mA

1.61.5

1.0

0.001

1000

I

F

V

F

+

T = 25°C

A

–

8 PIN DIP, SO-8

Figure 2. Current Transfer Ratio vs. Input Current.

Figure 3. Input Current vs. Forward Voltage.

Figure 1. DC and Pulsed Transfer Characteristics.

F

O
CC
A

0

0 1 10 100

NORMALIZED CURRENT TRANSFER RATIO

IF – INPUT CURRENT – mA

1.5

0.5

1.0

NORMALIZED
I = 16 mA
V = 0.4 V
V = 4.5 V
T = 25 °C

HCNW135/6,
HCNW4502/3

WIDEBODY

10

5

0

01020

V

O

– OUTPUT VOLTAGE – V

40 mA

35 mA

30 mA

25 mA

20 mA

15 mA
10 mA

I = 5 mA

F

T = 25°C
V = 5.0 V

A

CC

I

O

– OUTPUT CURRENT – mA

8 PIN DIP, SO-8

12

8

0

01020

V

O

– OUTPUT VOLTAGE – V

40 mA
35 mA

30 mA
25 mA
20 mA

15 mA
10 mA

I = 5 mA

F

I

O

– OUTPUT CURRENT – mA

4

16

T = 25°C
V = 5.0 V

A

CC

WIDEBODY

NORMALIZED
I = 16 mA
V = 0.4 V
V = 5 V
T = 25°C

F

O
CC

A

6N135, HCPL-0500

1.5

1.0

0.5

0.1
0 1 10 100

NORMALIZED CURRENT TRANSFER RATIO

IF – INPUT CURRENT – mA

6N136, HCPL-4502/3
HCPL-0501/0452/0453

8 PIN DIP, SO-8

1-29

3.0

2.0

1.0

0.1
4

0.6

0.4

321

0.2

8765910

0.8

R

L

– LOAD RESISTANCE – (kΩ)

t

PLH

t

PHL

V = 5.0 V
T = 25 °C

CC

I = 10 mA
I = 16 mA

F

t

P

– PROPAGATION DELAY – µs

F

A

8 PIN DIP, SO-8

RL – LOAD RESISTANCE – (kΩ)

t

P

– PROPAGATION DELAY – µs

10.0

6.0

4.0

1.0

0.1
10 40 100

0.6

0.4

4

V = 5.0 V
T = 25 °C

A

CC

I = 10 mA
I = 16 mA

F

t

21

0.2

PLH

PHL

t

t

WIDEBODY

Figure 6. Propagation Delay Time vs. Load Resistance.

Figure 5. Propagation Delay vs. Temperature.

Figure 4. Current Transfer Ratio vs. Temperature.

1.1

1.0

0.9

0.8

0.7

0.6

-60 -20 0 80

NORMALIZED CURRENT TRANSFER RATIO

TA – TEMPERATURE – °C

F

CC
A

6N135, HCPL-0500
6N136, HCPL-4502/3
HCPL-0501, 0452, 0453

8 PIN DIP, SO-8

-40 20 40 60 100

O

NORMALIZED
I = 16 mA
V = 0.4 V
V = 5 V
T = 25°C

1.1

1.0

0.9

0.8

0.7

0.6

-60 -20

20

60

100

NORMALIZED CURRENT TRANSFER RATIO

TA – TEMPERATURE – °C

0.5

80

40

0

-40

0.4

WIDEBODY

HCNW135/6,
HCNW4502/3

F

CC
A

O

NORMALIZED
I = 16 mA
V = 0.4 V
V = 5 V
T = 25°C

1000

600

400

200

0

-60 -20

20 60 100

T - TEMPERATURE - °C

A

t - PROPAGATION DELAY - ns

P

tt

800

-40

04080

HCNW136 (R = 1.9 kΩ)
HCNW4502/3

I = 16 mA, V = 5.0 V

FCC

HCNW135 (R = 4.1 kΩ)

L
L

PHLPLH

WIDEBODY

6N136, HCPL-0501
HCPL-4502/3 (R = 1.9 kΩ)
HCPL-0452/3

2000

1500

1000

500

0

-60 -20

20 60 100

T – TEMPERATURE – °C

A

t – PROPAGATION DELAY – ns

P

t

PHL

t

PLH

I = 16 mA, V = 5.0 V

F

CC

6N135, HCPL-0500 (R = 4.1 kΩ)

L

L

8 PIN DIP, SO-8

1-30

OUTPUT POWER – P

S

, INPUT CURRENT – I

S

0

0

TS – CASE TEMPERATURE – °C

20050

400

12525 75 100 150

600

800

200
100

300

500

700

PS (mW)
I

S

(mA)

175

HCPL-4503 OPTION 060

OUTPUT POWER – P

S

, INPUT CURRENT – I

S

0

0

TS – CASE TEMPERATURE – °C

175

1000

50

400

12525 75 100 150

600

800

200
100

300

500

700

900

PS (mW)
I

S

(mA)

HCNW135/6, HCNW4502/3

∆

I

F

∆ I

O

– SMALL SIGNAL CURRENT TRANSFER RATIO

0

0.10

0.20

0.30

0

I

F

– QUIESCENT INPUT CURRENT – mA

25

16

4 8 12 20

TA = 25°C, RL = 100 Ω, VCC = 5 V

8 PIN DIP, SO-8

Figure 9. Thermal Derating Curve, Dependence of Safety Limiting Value with Case Temperature per VDE 0884.

Figure 8. Small-Signal Current Transfer Ratio vs. Quiescent Input Current.

Figure 7. Logic High Output Current vs. Temperature.

TA – TEMPERATURE – °C

I = 0
V = V = 5.0 V

CCO

F

-50 -25 0 +25 +50 +75 +100

10

+4

10

-2

10

-1

10

0

10

+1

10

+2

10

+3

I

OH

– LOGIC HIGH OUTPUT CURRENT – nA

-75

8 PIN DIP, SO-8

I

OH

– LOGIC HIGH OUTPUT CURRENT – nA

TA – TEMPERATURE – °C

-60 -20 0 20 40 100

10

0

10

+1

10

+2

10

+3

-40 8060

I = 0
V = V = 15 V

CCO

F

WIDEBODY

0

0.10

0.30

0 4 8 12 16 25

0.20

0.40

20

0.50

∆ IF∆ I

O

– SMALL SIGNAL CURRENT TRANSFER RATIO

IF – QUIESCENT INPUT CURRENT – mA

TA = 25°C, RL = 100 Ω, VCC = 5 V

WIDEBODY

1-31

7

1

2

3

4

5

6

8

+12 V

0.1 µF

V

FF

47 µF

51 Ω

2.1 KΩ

100 Ω

1 KΩ

1N4150

22 Ω

R

T

Q

1

TRIM FOR
UNITY GAIN

1.2 KΩ

15 KΩ

9.1 KΩ

0.1 µF

100 Ω

Q

2

Q

3

470 Ω

+12 V

0.1 µF

(1 MΩ 12 pF
TEST INPUT)

p-p


TYPICAL LINEARITY = ± 3% AT V = 1 V
TYPICAL SNR = 50dB
TYPICAL R = 375 Ω
TYPICAL V dc = 3.8 V
TYPICAL I = 9 mA

IN

T

O

F

12

3

Q , Q , Q : 2N3904

V

O

6N135/6, HCPL-0500/1

Figure 10. Frequency Response.

0.1 1.0 10 100

-20

-15

-10

-5

0

+5

T

A

= 25 °C

f - FREQUENCY - MHz

NORMALIZED RESPONSE - dB

6N135/6, HCPL-0500/1

HCNW135/6

HCNW135/6

1-32

Figure 12. Test Circuit for Transient Immunity and Typical Waveforms.

Figure 11. Switching Test Circuit.

V

O

PULSE

GEN.

Z = 50 Ω

t = 5 ns

O

r

I MONITOR

F

I

F

0.1µF

L

R

C

L

= 1.5 µF

R

M

0

t

PHL

t

PLH

O

V

I

F

OL

V

1.5 V

+5 V

1

2

3

4

8

7

6

5

1.5 V

5 V

10% DUTY CYCLE

1/f < 100 µS

*

* PIN 7 UNCONNECTED IN HCPL-4502/3,
HCPL-0452/3, HCNW4502/3

O

V

5 V

OL

V

O

V

0 V

10%

90% 90%

10%

SWITCH AT A: I = 0 mA

F

SWITCH AT B: I = 16 mA

F

CM

V

t

r

t

f

7

1

2

3

4

5

6

8

V

O

0.1 µF

L

R

+5 V

PULSE GEN.

V

CM

+

–

V

I

F

*

A

B

FF

*PIN 7 UNCONNECTED IN HCPL-4502/3, HCPL-0542/3, HCNW4502/3