HP E ProLiant DL120 G9 Maintenance And Service Manual

Page 1

HPE ProLiant DL120 Gen9 Server

Maintenance and Service Guide

Abstract

This guide describes identification and maintenance procedures, diagnostic tools, specifications, and requirements for hardware components and software. This guide is for an experienced service technician. Hewlett Packard Enterprise assumes you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.

Part Number: 781877-003 April 2016 Edition: 3

Page 2

The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. Hewlett Packard Enterprise shall not be liable for technical or editorial errors or omissions contained herein.

Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries.

Microsoft® and Windows® are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.

microSD® is a trademark or a registered trademark of SD-3C in the United States, other countries or both.

Red Hat® is a registered trademark of Red Hat, Inc. in the United States and other countries.

VMware® is a registered trademark or trademark of VMware, Inc. in the United States and/or other jurisdictions.

Intel® and Xeon® are trademarks of Intel Corporation in the U.S. and other countries.

Page 3

Contents

Customer self repair.................................................................................................................................. 6

Parts only warranty service ...................................................................................................................................... 6

Illustrated parts catalog ........................................................................................................................... 16

Mechanical components ......................................................................................................................................... 16

System components ............................................................................................................................................... 18

Removal and replacement procedures ................................................................................................... 27

Required tools ........................................................................................................................................................ 27

Safety considerations ............................................................................................................................................. 27

Preventing electrostatic discharge............................................................................................................... 27

Symbols on equipment ................................................................................................................................ 27

Server warnings and cautions ..................................................................................................................... 28

Rack warnings ............................................................................................................................................. 28

Preparation procedures .......................................................................................................................................... 29

Remove the security bezel (optional) .......................................................................................................... 29

Power down the server ................................................................................................................................ 30

Extend the server from the rack .................................................................................................................. 30

Access the product rear panel ..................................................................................................................... 33

Remove the server from the rack ................................................................................................................ 33

Remove the air baffle .................................................................................................................................. 34

Remove the PCI riser cage ......................................................................................................................... 35

Non-hot-plug drive carrier ....................................................................................................................................... 37

Non-hot-plug drive .................................................................................................................................................. 38

Hot-plug drive blanks .............................................................................................................................................. 39

Hot-plug drive ......................................................................................................................................................... 40

Access panel .......................................................................................................................................................... 40

Four-bay LFF non-hot-plug drive backplane .......................................................................................................... 41

Four-bay LFF hot-plug drive backplane ................................................................................................................. 42

Smart Storage Battery ............................................................................................................................................ 43

FBWC module ........................................................................................................................................................ 44

M.2 SSD enablement kit ......................................................................................................................................... 45

M.2 SSD enablement board ........................................................................................................................ 45

M.2 SSD module ......................................................................................................................................... 46

Optical drive blank .................................................................................................................................................. 47

Optical drive ........................................................................................................................................................... 48

Fan and fan blank ................................................................................................................................................... 50

Fan population guidelines............................................................................................................................ 50

Fan blank ..................................................................................................................................................... 51

Hot-swap fan ............................................................................................................................................... 52

DIMMs .................................................................................................................................................................... 53

Memory-processor information .................................................................................................................... 53

Removing a DIMM ....................................................................................................................................... 54

Heatsink ................................................................................................................................................................. 55

Processor ............................................................................................................................................................... 57

Expansion board .................................................................................................................................................... 61

Primary PCIe riser board ........................................................................................................................................ 62

Full-height half-length PCIe riser board and cage .................................................................................................. 64

FlexibleLOM riser assembly ................................................................................................................................... 65

GPU ........................................................................................................................................................................ 66

System battery ....................................................................................................................................................... 67

Front I/O module .................................................................................................................................................... 69

Thumbscrew rack ear assembly ............................................................................................................................. 70

Quick-release latch rack ear assembly .................................................................................................................. 71

System board ......................................................................................................................................................... 72

Contents 3

Page 4

Redundant power supply components ................................................................................................................... 79

Power input module and RPS backplane characteristics ............................................................................ 79

Hot-plug power input module....................................................................................................................... 79

Redundant power supply backplane ........................................................................................................... 80

HP Trusted Platform Module .................................................................................................................................. 81

Troubleshooting ...................................................................................................................................... 82

Troubleshooting resources ..................................................................................................................................... 82

Diagnostic tools ...................................................................................................................................... 83

Product QuickSpecs ............................................................................................................................................... 83

HPE iLO ................................................................................................................................................................. 83

Active Health System .................................................................................................................................. 83

HPE ProLiant Pre-boot Health Summary .................................................................................................... 84

Integrated Management Log ....................................................................................................................... 85

HPE UEFI System Utilities ..................................................................................................................................... 85

Using UEFI System Utilities ......................................................................................................................... 85

Embedded Diagnostics option ..................................................................................................................... 86

Re-entering the server serial number and product ID ................................................................................. 86

HPE Insight Diagnostics ......................................................................................................................................... 86

HPE Insight Diagnostics survey functionality .............................................................................................. 87

HPE Insight Remote Support ................................................................................................................................. 87

USB support ........................................................................................................................................................... 87

External USB functionality ........................................................................................................................... 88

HPE Smart Storage Administrator .......................................................................................................................... 88

Automatic Server Recovery .................................................................................................................................... 88

Component identification ........................................................................................................................ 89

Front panel components ......................................................................................................................................... 89

Front panel LEDs and buttons ................................................................................................................................ 90

Front panel LED power fault codes ............................................................................................................. 92

Rear panel components ......................................................................................................................................... 92

Rear panel LEDs .................................................................................................................................................... 93

PCIe riser board slot definitions ............................................................................................................................. 93

System board components ..................................................................................................................................... 94

DIMM slot locations ..................................................................................................................................... 95

System maintenance switch ........................................................................................................................ 95

NMI functionality .......................................................................................................................................... 96

Drive numbering ..................................................................................................................................................... 96

Hot-plug drive LED definitions ................................................................................................................................ 97

Fan locations .......................................................................................................................................................... 98

Cabling .................................................................................................................................................... 99

Cabling overview .................................................................................................................................................... 99

Storage cabling ...................................................................................................................................................... 99

Four-bay LFF non-hot-plug drive cabling .................................................................................................... 99

Four-bay LFF hot-plug drive cabling.......................................................................................................... 100

Eight-bay SFF hot-plug drive cabling ........................................................................................................ 102

FBWC cabling ...................................................................................................................................................... 103

M.2 SSD cabling ................................................................................................................................................... 105

Smart Storage Battery cabling ............................................................................................................................. 108

HPE Power supply cabling ................................................................................................................................... 108

Optical drive cabling ............................................................................................................................................. 109

Front I/O cabling ................................................................................................................................................... 110

GPU cabling ......................................................................................................................................................... 111

Specifications ........................................................................................................................................ 112

Environmental specifications ................................................................................................................................ 112

Mechanical specifications ..................................................................................................................................... 112

Power supply specifications ................................................................................................................................. 112

Hot-plug power supply calculations ...................................................................................................................... 113

Acronyms and abbreviations................................................................................................................. 114

Contents 4

Page 5

Documentation feedback ...................................................................................................................... 117

Index ..................................................................................................................................................... 118

Contents 5

Page 6

Customer self repair

Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard Enterprise will ship that part directly to you for replacement. There are two categories of CSR parts:

• Mandatory—Parts for which customer self repair is mandatory. If you request Hewlett Packard

Enterprise to replace these parts, you will be charged for the travel and labor costs of this service.

• Optional—Parts for which customer self repair is optional. These parts are also designed for

customer self repair. If, however, you require that Hewlett Packard Enterprise replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

NOTE: Some Hewlett Packard Enterprise parts are not designed for customer self repair. In order to satisfy the customer warranty, Hewlett Packard Enterprise requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Based on availability and where geography permits, CSR parts will be shipped for next business day delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits. If assistance is required, you can call the Hewlett Packard Enterprise Support Center and a technician will help you over the telephone. Hewlett Packard Enterprise specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to Hewlett Packard Enterprise. In cases where it is required to return the defective part to Hewlett Packard Enterprise, you must ship the defective part back to Hewlett Packard Enterprise within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material. Failure to return the defective part may result in Hewlett Packard Enterprise billing you for the replacement. With a customer self repair, Hewlett Packard Enterprise will pay all shipping and part return costs and determine the courier/carrier to be used.

For more information about the Hewlett Packard Enterprise CSR program, contact your local service provider. For the North American program, go to the Hewlett Packard Enterprise CSR website (http://www.hpe.com/support/selfrepair).

Parts only warranty service

Your Hewlett Packard Enterprise Limited Warranty may include a parts only warranty service. Under the terms of parts only warranty service, Hewlett Packard Enterprise will provide replacement parts free of charge.

For parts only warranty service, CSR part replacement is mandatory. If you request Hewlett Packard Enterprise to replace these parts, you will be charged for the travel and labor costs of this service.

Réparation par le client (CSR)

Les produits Hewlett Packard Enterprise comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la période de diagnostic, Hewlett Packard Enterprise (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être effectuée à l'aide d'une pièce CSR, Hewlett Packard Enterprise vous l'envoie directement. Il existe deux catégories de pièces CSR :

Customer self repair 6

Page 7

• Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à

Hewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

• Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont

également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à Hewlett Packard Enterprise de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.

REMARQUE: Certaines pièces Hewlett Packard Enterprise ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, Hewlett Packard Enterprise exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.

Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour toute assistance, appelez le Centre d’assistance Hewlett Packard Enterprise pour qu’un technicien vous aide au téléphone Dans les documents envoyés avec la pièce de rechange CSR, Hewlett Packard Enterprise précise s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, Hewlett Packard Enterprise se réserve le droit de vous facturer les coûts de remplacement. Dans le cas d'une pièce CSR, Hewlett Packard Enterprise supporte l'ensemble des frais d'expédition et de retour, et détermine la société de courses ou le transporteur à utiliser.

Pour plus d'informations sur le programme CSR de Hewlett Packard Enterprise, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web Hewlett Packard Enterprise (http://www.hpe.com/support/selfrepair).

Service de garantie "pièces seules"

Votre garantie limitée Hewlett Packard Enterprise peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de rechange fournies par Hewlett Packard Enterprise ne sont pas facturées.

Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez à Hewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Riparazione da parte del cliente

Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti Hewlett Packard Enterprise sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica Hewlett Packard Enterprise (o un centro di servizi o di assistenza Hewlett Packard Enterprise) identifica il guasto come riparabile mediante un ricambio CSR, Hewlett Packard Enterprise lo spedirà direttamente al cliente per la sostituzione. Vi sono due categorie di parti CSR:

• Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida

la riparazione ad Hewlett Packard Enterprise, deve sostenere le spese di spedizione e di manodopera per il servizio.

• Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di

componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad Hewlett Packard Enterprise, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.

Customer self repair 7

Page 8

NOTA: alcuni componenti Hewlett Packard Enterprise non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, Hewlett Packard Enterprise richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.

In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico Hewlett Packard Enterprise. Nel materiale fornito con una parte di ricambio CSR, Hewlett Packard Enterprise specifica se il cliente deve restituire dei component. Qualora sia richiesta la resa ad Hewlett Packard Enterprise del componente difettoso, lo si deve spedire ad Hewlett Packard Enterprise entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di Hewlett Packard Enterprise. Nel caso di riparazione da parte del cliente, Hewlett Packard Enterprise sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.

Per ulteriori informazioni sul programma CSR di Hewlett Packard Enterprise, contattare il centro di assistenza di zona. Per il programma in Nord America fare riferimento al sito Web (http://www.hpe.com/support/selfrepair).

Servizio di garanzia per i soli componenti

La garanzia limitata Hewlett Packard Enterprise può includere un servizio di garanzia per i soli componenti. Nei termini di garanzia del servizio per i soli componenti, Hewlett Packard Enterprise fornirà gratuitamente le parti di ricambio.

Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione da parte del cliente. Se il cliente invece richiede la sostituzione ad Hewlett Packard Enterprise dovrà sostenere le spese di spedizione e di manodopera per il servizio.

Customer Self Repair

Hewlett Packard Enterprise Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn Hewlett Packard Enterprise (oder ein Hewlett Packard Enterprise Servicepartner) bei der Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen Hewlett Packard Enterprise dieses Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:

• Zwingend—Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie

den Austausch dieser Teile von Hewlett Packard Enterprise vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet.

• Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für

Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von Hewlett Packard Enterprise vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.

HINWEIS: Einige Hewlett Packard Enterprise Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem Hewlett Packard Enterprise Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.

CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das Hewlett Packard Enterprise

Customer self repair 8

Page 9

Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien von Hewlett Packard Enterprise, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an Hewlett Packard Enterprise zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an Hewlett Packard Enterprise zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das defekte Teil nicht zurückschicken, kann Hewlett Packard Enterprise Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt Hewlett Packard Enterprise für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst.

Weitere Informationen über das Hewlett Packard Enterprise Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der Hewlett Packard Enterprise Website unter (http://www.hpe.com/support/selfrepair).

Parts-only Warranty Service (Garantieservice ausschließlich für Teile)

Ihre Hewlett Packard Enterprise Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice ausschließlich für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt Hewlett Packard Enterprise Ersatzteile kostenlos zur Verfügung.

Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den Austausch dieser Teile von Hewlett Packard Enterprise vornehmen lassen, werden Ihnen die Anfahrtund Arbeitskosten für diesen Service berechnet.

Reparaciones del propio cliente

Los productos de Hewlett Packard Enterprise incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, Hewlett Packard Enterprise (o los proveedores o socios de servicio de Hewlett Packard Enterprise) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, Hewlett Packard Enterprise le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:

• Obligatorio—Componentes cuya reparación por parte del usuario es obligatoria. Si solicita a

Hewlett Packard Enterprise que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

• Opcional—Componentes cuya reparación por parte del usuario es opcional. Estos componentes

también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que Hewlett Packard Enterprise realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.

NOTA: Algunos componentes de Hewlett Packard Enterprise no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, Hewlett Packard Enterprise pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el catálogo ilustrado de componentes.

Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de asistencia técnica de Hewlett Packard Enterprise y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, Hewlett Packard Enterprise especificará si los componentes defectuosos deberán devolverse a Hewlett Packard Enterprise. En aquellos casos en los que sea necesario devolver algún componente a Hewlett Packard Enterprise,

Customer self repair 9

Page 10

deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso requerido, Hewlett Packard Enterprise podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, Hewlett Packard Enterprise se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.

Para obtener más información acerca del programa de Reparaciones del propio cliente de Hewlett Packard Enterprise, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de Hewlett Packard Enterprise CSR (http://www.hpe.com/support/selfrepair).

Servicio de garantía exclusivo de componentes

La garantía limitada de Hewlett Packard Enterprise puede que incluya un servicio de garantía exclusivo de componentes. Según las condiciones de este servicio exclusivo de componentes, Hewlett Packard Enterprise le facilitará los componentes de repuesto sin cargo adicional alguno.

Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes por parte del usuario (CSR). Si solicita a Hewlett Packard Enterprise que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

Customer Self Repair

Veel onderdelen in Hewlett Packard Enterprise producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als Hewlett Packard Enterprise (of een Hewlett Packard Enterprise Service Partner) bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt Hewlett Packard Enterprise dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee categorieën CSR-onderdelen:

• Verplicht—Onderdelen waarvoor reparatie door de klant verplicht is. Als u Hewlett Packard

Enterprise verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.

• Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn

ontworpen voor reparatie door de klant. Als u echter Hewlett Packard Enterprise verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.

OPMERKING: Sommige Hewlett Packard Enterprise onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".

Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie is gewenst, belt u het Hewlett Packard Enterprise Support Center om via de telefoon ondersteuning van een technicus te ontvangen. Hewlett Packard Enterprise vermeldt in de documentatie bij het vervangende CSR-onderdeel of het defecte onderdeel aan Hewlett Packard Enterprise moet worden geretourneerd. Als het defecte onderdeel aan Hewlett Packard Enterprise moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde periode, gewoonlijk vijf (5) werkdagen, retourneren aan Hewlett Packard Enterprise. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan Hewlett Packard

Customer self repair 10

Page 11

Enterprise u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt Hewlett Packard Enterprise alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest Hewlett Packard Enterprise zelf welke koerier/transportonderneming hiervoor wordt gebruikt.

Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van Hewlett Packard Enterprise. Informatie over Service Partners vindt u op de Hewlett Packard Enterprise website (http://www.hpe.com/support/selfrepair).

Garantieservice "Parts Only"

Het is mogelijk dat de Hewlett Packard Enterprise garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal Hewlett Packard Enterprise kosteloos vervangende onderdelen ter beschikking stellen.

Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u Hewlett Packard Enterprise verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht

Reparo feito pelo cliente

Os produtos da Hewlett Packard Enterprise são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se, durante o período de diagnóstico, a Hewlett Packard Enterprise (ou fornecedores/parceiros da Hewlett Packard Enterprise) concluir que o reparo pode ser efetuado pelo uso de uma peça CSR, a Hewlett Packard Enterprise enviará a peça diretamente ao cliente. Há duas categorias de peças CSR:

• Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a Hewlett Packard

Enterprise substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

• Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas

para o reparo feito pelo cliente. No entanto, se desejar que a Hewlett Packard Enterprise as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

OBSERVAÇÃO: Algumas peças da Hewlett Packard Enterprise não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a Hewlett Packard Enterprise exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca "No" (Não), no catálogo de peças ilustrado.

Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico da Hewlett Packard Enterprise para que um técnico o ajude por telefone. A Hewlett Packard Enterprise especifica nos materiais fornecidos com a peça CSR de reposição se a peça com defeito deve ser devolvida à Hewlett Packard Enterprise. Nos casos em que isso for necessário, é preciso enviar a peça com defeito à Hewlett Packard Enterprise, você deverá enviar a peça com defeito de volta para a Hewlett Packard Enterprise dentro do período de tempo definido, normalmente em 5 (cinco) dias úteis. A peça com defeito deve ser enviada com a documentação correspondente no material de transporte fornecido. Caso não o faça, a Hewlett Packard Enterprise poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a Hewlett Packard Enterprise paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço postal a ser utilizado.

Customer self repair 11

Page 12

Para obter mais informações sobre o programa de reparo feito pelo cliente da Hewlett Packard Enterprise, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da Hewlett Packard Enterprise (http://www.hpe.com/support/selfrepair).

Serviço de garantia apenas para peças

A garantia limitada da Hewlett Packard Enterprise pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a Hewlett Packard Enterprise fornece as peças de reposição sem cobrar nenhuma taxa.

No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a Hewlett Packard Enterprise substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

Customer self repair 12

Page 13

Customer self repair 13

Page 14

Customer self repair 14

Page 15

Customer self repair 15

Page 16

Illustrated parts catalog

Access panel

790493-001

Mandatory1

Optical drive blank

790495-001

Mandatory1

Thumbscrew ear assembly

790551-001

Mandatory1

Fan blank

790499-001

Mandatory1

Full-height, half-length PCI riser cage

790500-001

Mandatory1

FlexibleLOM riser cage

792118-001

Mandatory1

PCI blank

790515-001

Mandatory1

Mechanical components

Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer).

Item Description

Spare part number

Customer self repair (on page

Mandatory—Parts for which customer self repair is mandatory. If you request Hewlett Packard Enterprise to replace

these parts, you will be charged for the travel and labor costs of this service.

Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that Hewlett Packard Enterprise replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

No—Some Hewlett Packard Enterprise parts are not designed for customer self repair. In order to satisfy the customer warranty, Hewlett Packard Enterprise requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Illustrated parts catalog 16

Page 17

Obligatoire—Pièces pour lesquelles le client doit procéder lui-même aux réparations. Si vous demandez à Hewlett Packard Enterprise de procéder au remplacement de ces pièces, les frais de transport et de main d’œuvre pour ce service vous seront facturés.

Facultatif—Pièces pour lesquelles une réparation par le client est facultative. Ces pièces sont également conçues pour que le client puisse procéder lui-même aux réparations. Cependant, les frais supplémentaires engendrés par le remplacement de ces pièces par Hewlett Packard Enterprise dépendent du type de service de garantie désigné pour votre produit.

Non—Certaines pièces Hewlett Packard Enterprise ne sont pas conçues pour être remplacées par le client. Afin de se conformer aux exigences de la garantie la garantie du client, Hewlett Packard Enterprise demande à un fournisseur de services agréé de procéder au remplacement de la pièce. Ces pièces sont signaléespar le mot « Non » dans le Catalogue de pièces illustré.

Obbligatorio—Parti per le quali il cliente è tenuto a effettuare autonomamente la riparazione. Se si richiede l'intervento di Hewlett Packard Enterprise per la sostituzione di queste parti, al cliente verranno addebitate le spese di viaggio e manodopera dell'operazione.

Facoltativo—Parti per le quali la riparazione in autonomia da parte del cliente è facoltativa. Queste parti sono progettate per consentire anche la riparazione da parte del cliente. Tuttavia, se il cliente richiedel'intervento di Hewlett Packard Enterprise per la sostituzione, potrebbero essere addebitate spese aggiuntive a seconda del tipo di garanzia in assistenza previsto per il prodotto.

No—Alcune parti Hewlett Packard Enterprise non sono progettate la riparazione in autonomia da parte del cliente. In base a quanto previsto dalla garanzia per il cliente, Hewlett Packard Enterprise richiede l'intervento di un tecnico autorizzato per la sostituzione della parte. Queste parti sono contrassegnate con"No"nel catalogo parti illustrato.

Zwingend—Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den Austausch dieser Teile von Hewlett Packard Enterprisevornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet.

Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von Hewlett Packard Enterprisevornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.

Nein—Einige Hewlett Packard Enterprise Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem Hewlett Packard Enterprise Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.

Obligatorio—Componentes cuya reparación por parte del usuario es obligatoria. Si solicita a Hewlett Packard Enterprise que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

Opcional—Componentes cuya reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que Hewlett Packard Enterprise realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.

No—Algunos componentes de Hewlett Packard Enterprise no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, Hewlett Packard Enterprise pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el catálogo ilustrado de componentes.

Verplicht—Onderdelen die de klant zelf moet vervangen. Als u Hewlett Packard Enterprise vraagt deze onderdelen te vervangen, worden er reis- en arbeidskosten voor deze service in rekening gebracht.

Optioneel—Onderdelen die de klant zelf kan vervangen. Deze onderdelen zijn ook ontworpen om door de klant zelf te worden vervangen. Als u Hewlett Packard Enterprise verzoekt om deze te vervangen, kan het zijn dat hiervoor extra kosten in rekening worden gebracht, afhankelijk van het soort garantie dat op uw product van toepassing is.

Geen—Sommige onderdelen van Hewlett Packard Enterprise zijn niet ontworpen om door de klant zelf te worden vervangen. Om te voldoen aan de garantievoorwaarden eist Hewlett Packard Enterprise dat een geautoriseerde serviceverlener het onderdeel vervangt. Deze onderdelen worden aangeduid met 'Geen' in de geïllustreerde onderdelencatalogus.

Obrigatório—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a Hewlett Packard Enterprise substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a Hewlett Packard Enterprise as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

Não—Algumas peças da Hewlett Packard Enterprise não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a Hewlett Packard Enterprise exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca "No" (Não), no catálogo de peças ilustrado.

Illustrated parts catalog 17

Page 18

System components

Illustrated parts catalog 18

Page 19

System board assembly (includes alcohol pad and thermal compound)

—

— a) System board for Intel Xeon E5-2600 v3 processors

790549-001

Optional2

b) System board for Intel Xeon E5-2600 v3 and v4 processors*

847394-001

Optional2 9

Primary PCIe riser board

790488-001

Optional2

System battery

234556-001

Optional2

GPU riser board

790550-001

Optional2

Full-height half-length riser board

790490-001

Optional2

FlexibleLOM riser board

790489-001

Optional2

M.2 SSD single module enablement kit

797907-001

Optional2

a) M.2 SSD enablement board

—

— b) M.2 SSD module

—

— c) SATA cable*

—

— 15

M.2 SSD dual module enablement kit

797908-001

Optional2

a) M.2 SSD enablement board

—

b) M.2 SSD modules (2)

—

c) SATA cables (2)*

—

— 16

Heatsinks

—

a) Standard heatsink

790498-001

Mandatory1

b) High efficiency heatsink (for processors rated over 105W)*

802695-001

Mandatory1 17

Processors (includes alcohol pad and thermal compound)

—

Intel Xeon E5 v3 processors

Standard processors (for use with standard heatsink)

—

a) 1.6-GHz Intel Xeon E5-2603 v3, 6C, 85 W

762441-001

Optional2

b) 1.8-GHz Intel Xeon E5-2650L v3, 12C, 65 W*

762461-001

Optional2

c) 1.8-GHz Intel Xeon E5-2630L v3, 8C, 55 W*

762459-001

Optional2

d) 1.9-GHz Intel Xeon E5-2609 v3, 6C, 85 W*

762443-001

Optional2

e) 2.3-GHz Intel Xeon E5-2650 v3, 10C, 105 W*

762448-001

Optional2

f) 2.4-GHz Intel Xeon E5-2620 v3, 6C, 85 W*

762445-001

Optional2

g) 2.4-GHz Intel Xeon E5-2630 v3, 8C, 85 W*

762446-001

Optional2

h) 2.6-GHz Intel Xeon E5-2640 v3, 8C, 90 W*

762447-001

Optional2

i) 2.6-GHz Intel Xeon E5-2660 v3, 10C, 105 W*

762449-001

Optional2

j) 3.0-GHz Intel Xeon E5-2623 v3, 4C, 105 W*

780762-001

Optional2

High efficiency processors (for use with the high efficiency heatsink)

—

— k) 2.3 GHz Intel Xeon E5-2695v3, 14C, 120 W*

762454-001

Optional2

l) 2.3 GHz Intel Xeon E5-2698v3, 16C, 135 W*

780760-001

Optional2

m) 2.3 GHz Intel Xeon E5-2699v3, 18C, 145 W*

780761-001

Optional2

Item Description

Spare part number

Customer self repair (on page

Illustrated parts catalog 19

Page 20

n) 2.8 GHz Intel Xeon E5-1603v3, 4C, 140 W*

799505-001

Optional2

o) 3.1 GHz Intel Xeon E5-1607v3, 4C, 140 W*

801579-001

Optional2

p) 3.5 GHz Intel Xeon E5-1620v3, 4C, 140 W*

799506-001

Optional2

q) 3.5 GHz Intel Xeon E5-1650v3, 6C, 140 W*

801578-001

Optional2

Intel Xeon E5 v4 processors

—

a) 1.70 GHz Intel Xeon E5-2603 v4, 6C, 85 W* **

835599-001

Optional2

b) 1.70 GHz Intel Xeon E5-2609 v4, 8C, 85 W* **

835600-001

Optional2

c) 1.70 GHz Intel Xeon E5-2650L v4, 14C, 65 W* **

835609-001

Optional2

d) 1.80 GHz Intel Xeon E5-2630L v4, 10C, 55 W* **

835608-001

Optional2

e) 2.00 GHz Intel Xeon E5-2660 v4, 14C, 105 W* **

835605-001

Optional2

f) 2.10 GHz Intel Xeon E5-2620 v4, 8C, 85 W* **

835601-001

Optional2

g) 2.10 GHz Intel Xeon E5-2695 v4, 18C, 120 W* **

835615-001

Optional2

h) 2.20 GHz Intel Xeon E5-2630 v4, 10C, 85 W* **

835602-001

Optional2

i) 2.20 GHz Intel Xeon E5-2650 v4, 12C, 105 W* **

835604-001

Optional2

j) 2.20 GHz Intel Xeon E5-2698 v4, 20C, 135 W* **

835617-001

Optional2

k) 2.20 GHz Intel Xeon E5-2699 v4, 22C, 145 W* **

835618-001

Optional2

l) 2.40 GHz Intel Xeon E5-2640 v4, 10C, 90 W* **

835603-001

Optional2

m) 2.60 GHz Intel Xeon E5-2623 v4, 4C, 85 W* **

835610-001

Optional2 18

DIMMs

—

DIMMs optimized for Intel Xeon E5-2600 v3 processors

—

a) 4 GB, single-rank 1Rx8 PC4-2133R-15

774169-001

Mandatory1

b) 4 GB single-rank 1Rx8 PC4-2133P-R*

804842-001

Mandatory1

c) 8 GB single-rank 1Rx4 PC4-2133P-R*

804843-001

Mandatory1

d) 8 GB single-rank 1Rx4 PC4-2133R-15*

774170-001

Mandatory1

e) 8 GB dual-rank 2Rx8 PC4-2133R-15*

774171-001

Mandatory1

f) 16 GB dual-rank 2Rx4 PC4-2133R-15*

774172-001

Mandatory1

g) 16 GB dual-rank 2Rx4 PC4-2133L-15*

774173-001

Mandatory1

h) 32 GB dual-rank x4 PC4-2133P-R*

774175-001

Mandatory1

i) 32 GB quad-rank 4Rx4 PC4-2133L-15*

774174-001

Mandatory1

DIMMs optimized for Intel Xeon E5-2600 v4 processors

—

a) 8 GB, single-rank x8 PC4-2400T-R standard memory*

852545-001

Mandatory1

b) 8 GB, single-rank x8 PC4-2400T-R*

819410-001

Mandatory1

c) 16 GB, single-rank x8 PC4-2400T-R*

819411-001

Mandatory1

d) 16 GB, dual-rank x4 PC4-2400T-R*

846740-001

Mandatory1

e) 32 GB, dual-rank x4 PC4-2400T-R*

819412-001

Mandatory1

Item Description

Spare part number

Customer self repair (on page

Illustrated parts catalog 20

Page 21

f) 32 GB, dual-rank x4 PC4-2400T-L*

819414-001

Mandatory1 19

Fan module

790514-001

Mandatory1

Front I/O module for SFF configuration

790553-001

Optional2

Front I/O module for LFF configuration

790496-001

Mandatory1

Right quick-release latch rack ear assembly

790522-001

Mandatory1

Left quick-release latch rack ear assembly

790557-001

Mandatory1

4-bay LFF hot plug drive backplane

790487-001

Optional2

4-bay LFF non-hot-plug drive backplane

790486-001

Optional2

Smart Storage Battery

750450-001

Mandatory1

550-W Power Supply

766879-001

Optional2

RPS backplane assemblies

—

a) AC RPS backplane assembly

784636-001

Optional2

b) AC/240 V DC RPS backplane assembly*

830022-001

Optional2 29

Hot-plug power input modules

—

a) HPE 800 W/900 W Gold AC Power Input Module

754376-001

Mandatory1

b) HPE 900 W AC/240 V DC Gold Power Input Module*

830219-001

Mandatory1 30

Cables

—

a) 4-bay LFF hot-plug power cable*

790516-001

Mandatory1

b) 8-bay SFF hot-plug power cable*

790556-001

Mandatory1

c) 4-bay LFF non-hot-plug Mini-SAS cable*

790517-001

Mandatory1

d) 4-bay LFF hot-plug Mini-SAS cable*

790518-001

Mandatory1

e) 4-bay LFF Smart Array P-series Mini-SAS cable*

790520-001

Mandatory1

f) 4-bay LFF host bus adapter Mini-SAS cable*

790521-001

Mandatory1

g) 8-bay SFF Smart Array P-series Mini-SAS cable*

790558-001

Mandatory1

h) 8-bay LFF host bus adapter Mini-SAS cable*

790559-001

Mandatory1

i) 8-bay SFF hot-plug cable*

790562-001

Mandatory1

j) GPU power cable*

790561-001

Mandatory1

k) M.2 SSD SATA right angle cable*

809065-001

Mandatory1 29

Hard drives

—

SATA

—

a) 100GB hot-plug SATA, SSD, LFF, 6G*

692160-001

Mandatory1

b) 200GB hot-plug SATA, SSD, LFF, 6G*

692161-001

Mandatory1

c) 400GB hot-plug SATA, SSD, LFF, 6G*

692162-001

Mandatory1

d) 800GB hot-plug SATA, SSD, LFF, 6G*

692163-001

Mandatory1

e) 100GB hot-plug SATA, SSD, SFF, 6G*

692164-001

Mandatory1

f) 200GB hot-plug SATA, SSD, SFF, 6G*

692165-001

Mandatory1

g) 400GB hot-plug SATA, SSD, SFF, 6G*

692166-001

Mandatory1

Item Description

Spare part number

Customer self repair (on page

Illustrated parts catalog 21

Page 22

h) 800GB hot-plug SATA, SSD, SFF, 6G*

692167-001

Mandatory1

i) 120GB hot-plug SATA, SSD, SFF, 6G*

718136-001

Mandatory1

j) 120GB hot-plug SATA, SSD, LFF, 6G*

718300-001

Mandatory1

k) 80GB hot-plug SATA, SSD, SFF, 6G*

734562-001

Mandatory1

l) 80GB hot-plug SATA, SSD, LFF, 6G*

734563-001

Mandatory1

m) 240GB hot-plug SATA, SSD, SFF, 6G*

718137-001

Mandatory1

n) 800GB hot-plug SATA, SSD, SFF, 6G*

718139-001

Mandatory1

o) 240GB hot-plug SATA, SSD, LFF, 6G*

718294-001

Mandatory1

p) 480GB hot-plug SATA, SSD, LFF, 6G*

718296-001

Mandatory1

q) 800GB hot-plug SATA, SSD, LFF, 6G*

718298-001

Mandatory1

r) 300GB hot-plug SATA, SSD, SFF, 6G*

739954-001

Mandatory1

s) 300GB hot-plug SATA, SSD, LFF, 6G*

739955-001

Mandatory1

t) 600GB hot-plug SATA, SSD, SFF, 6G*

739959-001

Mandatory1

u) 600GB hot-plug SATA, SSD, LFF, 6G*

739960-001

Mandatory1

v) 120GB hot-plug SATA, SSD, SFF, 6G*

757361-001

Mandatory1

w) 120GB hot-plug SATA, SSD, LFF, 6G*

757362-001

Mandatory1

y) 240GB hot-plug SATA, SSD, SFF, 6G*

757366-001

Mandatory1

z) 240GB hot-plug SATA, SSD, LFF, 6G*

757367-001

Mandatory1

aa) 480GB hot-plug SATA, SSD, SFF, 6G*

757371-001

Mandatory1

ab) 480GB hot-plug SATA, SSD, LFF, 6G*

757372-001

Mandatory1

ac) 480GB SATA, SSD, SFF, 6G*

735501-001

Mandatory1

ad) 3TB hot-plug SATA, LFF, 7,200 RPM, 6G*

628182-001

Mandatory1

ae) 3TB non-hot-plug SATA, LFF, 7,200 RPM, 6G*

628183-001

Mandatory1

af) 500GB hot-plug SATA, SFF, 7,200 RPM, 6G*

656107-001

Mandatory1

ag) 1TB hot-plug SATA, SFF, 7,200 RPM, 6G*

656108-001

Mandatory1

ah) 1TB hot-plug SATA, SFF, 7,200 RPM, 6G*

657739-001

Mandatory1

ai) 500GB hot-plug SATA, LFF, 7,200 RPM, 6G*

658103-001

Mandatory1

aj) 2TB hot-plug SATA, LFF, 7,200 RPM, 6G*

658102-001

Mandatory1

ak) 1TB non-hot-plug SATA, LFF, 7,200 RPM, 6G*

659569-001

Mandatory1

al) 2TB non-hot-plug SATA, LFF, 7,200 RPM, 6G*

659570-001

Mandatory1

am) 500GB non-hot-plug SATA, LFF, 7,200 RPM, 6G*

659571-001

Mandatory1

an) 960GB SATA, SSD, SFF, 6G*

757231-001

Mandatory1

ao) 960GB hot-plug SATA, SSD, LFF, 6G*

757232-001

Mandatory1

ap) 4TB hot-plug SATA, LFF, 7,200 RPM, 6G*

693720-001

Mandatory1

Item Description

Spare part number

Customer self repair (on page

Illustrated parts catalog 22

Page 23

aq) 6TB hot-plug SATA, LFF, 7,200 RPM, 6G*

761496-001

Mandatory1

ar) 1.6TB SATA, SSD, SFF, 6G*

757381-001

Mandatory1

as) 1.6TB SATA, SSD, LFF, 6G*

757382-001

Mandatory1

SAS

—

— a) 800GB hot-plug SSD, SAS, SFF, 12G*

762749-001

Mandatory1

b) 1.6TB hot-plug SSD, SAS, SFF, 12G*

762751-001

Mandatory1

c) 800GB hot-plug SSD, SAS, LFF, 12G*

762750-001

Mandatory1

d) 1.6TB hot-plug SSD, SAS, LFF, 12G*

762752-001

Mandatory1

e) 300GB hot-plug SAS, LFF, 15,000 RPM*

737298-001

Mandatory1

f) 450GB hot-plug dual port SAS, LFF, 15,000 RPM*

737573-001

Mandatory1

g) 300 GB hot-plug SAS, SFF, 15,000 RPM*

759546-001

Mandatory1

h) 450GB hot-plug SAS, SFF, 15,000 RPM*

759547-001

Mandatory1

i) 600GB hot-plug SAS, SFF, 15,000 RPM*

759548-001

Mandatory1

j) 600GB hot-plug SAS, LFF, 15,000 RPM*

765867-001

Mandatory1

k) 200GB SSD, SAS, SFF, 12G*

780430-001

Mandatory1

l) 800GB SSD, SAS, SFF, 12G*

780434-001

Mandatory1

m) 1.6TB SSD, SAS, SFF, 12G*

780436-001

Mandatory1

n) 1.2TB hot-plug dual-port SAS, SFF, 6G*

718292-001

Mandatory1

o) 200GB hot-plug SAS, SSD, SFF, 12G*

741224-001

Mandatory1

p) 400GB hot-plug SAS, SSD, SFF, 12G*

741226-001

Mandatory1

q) 800GB hot-plug SAS, SSD, SFF, 12G*

741228-001

Mandatory1

r) 200GB hot-plug SAS, SSD, SFF, 12G*

741230-001

Mandatory1

s) 400GB hot-plug SAS, SSD, LFF, 12G*

741232-001

Mandatory1

t) 800GB hot-plug SAS, SSD, SFF, 12G*

741234-001

Mandatory1

u) 300GB hot-plug dual-port SAS, SFF, 10,000 RPM, 6G*

653955-001

Mandatory1

v) 450GB hot-plug dual-port SAS, SFF, 10,000 RPM, 6G*

653956-001

Mandatory1

w) 600GB hot-plug dual-port SAS, SFF, 10,000 RPM, 6G*

653957-001

Mandatory1

x) 900GB hot-plug dual-port SAS, SFF, 10,000 RPM, 6G*

653971-001

Mandatory1

y) 146GB hot-plug dual-port SAS, SFF, 15,000 RPM, 6G*

653950-001

Mandatory1

z) 500GB hot-plug dual-port SAS, SFF, 7,200 RPM, 6G*

653953-001

Mandatory1

aa) 1TB hot-plug dual-port SAS, SFF, 7,200 RPM, 6G*

653954-001

Mandatory1

ab) 1TB hot-plug dual-port SAS, LFF, 7,200 RPM, 6G*

653947-001

Mandatory1

ac) 2TB hot-plug dual-port SAS, LFF, 7,200 RPM, 6G*

653948-001

Mandatory1

ad) 3TB hot-plug dual-port SAS, LFF, 7,200 RPM, 6G*

653959-001

Mandatory1

Item Description

Spare part number

Customer self repair (on page

Illustrated parts catalog 23

Page 24

ae) 4TB hot-plug SAS, LFF, 7,200 RPM, 6G*

695842-001

Mandatory1

af) 6TB hot-plug SAS, LFF, 7,200 RPM, 6G*

761497-001

Mandatory1 30

Network adapters

—

a) Ethernet 10GB, 2P, 530SFP+ adapter*

656244-001

Mandatory1

b) FlexFabric 10Gb 2P 534FLR-SFP+ adapter*

701531-001

Mandatory1

c) 1Gb Ethernet 4P 331FLR adapter*

789897-001

Mandatory1

d) FlexFabric 10Gb 2P 533FLR-T adapter*

701534-001

Mandatory1

e) FlexFabric 10Gb 2P 556FLR-SFP+ adapter*

764460-001

Mandatory1

f) Ethernet 10Gb 2P 560SFP+ adapter*

669279-001

Mandatory1

g) Ethernet 10Gb 2P 561T adapter*

717708-001

Mandatory1

h) Ethernet 1Gb 4-port 366FLR adapter*

669280-001

Mandatory1

i) Ethernet 10Gb 2P 560FLR-SFP+ adapter*

669281-001

Mandatory1

j) Ethernet 10Gb 2P 546FLR-SFP+ adapter*

701525-001

Mandatory1

k) Ethernet 1Gb 4-port 331T adapter*

649871-001

Mandatory1

l) Ethernet 10Gb 2P 530T adapter*

657128-001

Mandatory1

m) Ethernet 1Gb 2P 361T adapter*

656241-001

Mandatory1

n) Ethernet 1Gb 2P 332T adapter*

616012-001

Mandatory1 31

Other boards

—

a) H240 host bus adapter*

779134-001

Mandatory1

b) Smart Array P441 controller with 4GB FBWC*

749798-001

Mandatory1

c) 4GB Flash Backed Write Cache memory module*

750003-001

Mandatory1

d) Smart Array P440 controller*

749797-001

Mandatory1

e) NVIDIA Quadro K2200 graphics accelerator board*

783874-001

Mandatory1

f) NVIDIA Quadro K4200 graphics accelerator board*

783875-001

Mandatory1

g) GPU riser kit*

790555-001

Mandatory1 32

Trusted Platform Module

—

a) TPM 1.2*

505836-001

No3 b) TPM 2.0*

812119-001

No3

Item Description

Spare part number

Customer self repair (on page

*Not shown **All processors in this HPE ProLiant server must have the same cache size, speed, number of cores, and rated maximum power consumption.

Mandatory—Parts for which customer self repair is mandatory. If you request Hewlett Packard Enterprise to replace these parts, you will be charged for the travel and labor costs of this service.

Illustrated parts catalog 24

Page 25

Verplicht—Onderdelen die de klant zelf moet vervangen. Als u Hewlett Packard Enterprise vraagt deze onderdelen te vervangen, worden er reis- en arbeidskosten voor deze service in rekening gebracht.

Illustrated parts catalog 25

Page 26

Illustrated parts catalog 26

Page 27

Removal and replacement procedures

To reduce the risk of injury from electric shock hazards, do not open this

reduce the risk of electric shock, fire, or damage to the equipment, do

Required tools

You need the following items for some procedures:

• T-25 Torx screwdriver (for screws located inside the front panel quick-release levers)

• T-10/T-15 Torx screwdriver

• Flathead screwdriver (for replacing the system battery)

• HPE Insight Diagnostics (on page 86)

Safety considerations

Preventing electrostatic discharge

Symbols on equipment

Before performing service procedures, review all the safety information.

To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.

To prevent electrostatic damage:

• Avoid hand contact by transporting and storing products in static-safe containers.

• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.

• Place parts on a grounded surface before removing them from their containers.

• Avoid touching pins, leads, or circuitry.

• Always be properly grounded when touching a static-sensitive component or assembly.

The following symbols may be placed on equipment to indicate the presence of potentially hazardous conditions.

This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel. WARNING: enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.

This symbol indicates the presence of electric shock hazards. The area contains no user or field serviceable parts. Do not open for any reason. WARNING: enclosure.

This symbol on an RJ-45 receptacle indicates a network interface connection.

WARNING: To not plug telephone or telecommunications connectors into this receptacle.

Removal and replacement procedures 27

Page 28

This symbol indicates the presence of a hot surface or hot component. If this surface

This symbol indicates that the component exceeds the recommended weight for one

observe local occupational health and safety requirements and guidelines for manual

To reduce the risk of injury from electric shock, remove all power cords

This server is very heavy. To reduce the risk of personal injury or damage to the

Use caution when installing the server in or removing the server from the rack; it is unstable

To reduce the risk of personal injury, electric shock, or damage to the equipment,

removed. Operating the server in this manner results in improper airflow and improper cooling

17.00

37.44

is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching.

individual to handle safely. WARNING: To reduce the risk of personal injury or damage to the equipment,

material handling.

These symbols, on power supplies or systems, indicate that the equipment is supplied by multiple sources of power. WARNING:

Server warnings and cautions

WARNING:

to completely disconnect power from the system.

equipment:

• Observe local occupational health and safety requirements and guidelines for manual material handling.

• Get help to lift and stabilize the product during installation or removal, especially when the product is not fastened to the rails. Hewlett Packard Enterprise recommends that a minimum of two people are required for all rack server installations. A third person may be required to help align the server if the server is installed higher than chest level.

• when not fastened to the rails.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

WARNING: remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.

CAUTION: Protect the server from power fluctuations and temporary interruptions with a regulating uninterruptible power supply. This device protects the hardware from damage caused by power surges and voltage spikes and keeps the system in operation during a powe failure.

CAUTION: Do not operate the server for long periods with the access panel open or

Rack warnings

that can lead to thermal damage.

Removal and replacement procedures 28

Page 29

At least two people are needed to safely unload the rack from the pallet. An empty 42U rack

stabilize the rack before extending a component outside the rack. Extend only one component

When installing a server in a telco rack, be sure that the rack frame is adequately

WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:

• The leveling jacks are extended to the floor.

• The full weight of the rack rests on the leveling jacks.

• The stabilizing feet are attached to the rack if it is a single-rack installation.

• The racks are coupled together in multiple-rack installations.

• Only one component is extended at a time. A rack may become unstable if more than one

component is extended for any reason.

WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack:

• can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and might become unstable when being moved on its casters.

• Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle the rack from both sides.

WARNING: To reduce the risk of personal injury or damage to the equipment, adequately

at a time. A rack may become unstable if more than one component is extended.

WARNING: secured at the top and bottom to the building structure.

Preparation procedures

To access some components and perform certain service procedures, you must perform one or more of the following procedures:

• Access the product front panel ("Remove the security bezel (optional)" on page 29).

• Power down the server (on page 30).

If you must remove a server from a rack or a non-hot-plug component from a server, power down the server.

• Extend the server from the rack (on page 30).

If you are performing service procedures in an Hewlett Packard Enterprise, Compaq branded, Telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components.

For more information about Telco rack solutions, see the RackSolutions website (http://www.racksolutions.com/hp).

• Access the product rear panel (on page 33).

• Remove the server from the rack (on page 33).

If the rack environment, cabling configuration, or the server location in the rack creates awkward conditions, remove the server from the rack.

• Remove the access panel ("Access panel" on page 40).

• Remove the air baffle (on page 34).

• Remove the PCIe riser cage ("Remove the PCI riser cage" on page 35).

Remove the security bezel (optional)

The security bezel is only supported in servers using the quick-release latch rack ears.

Removal and replacement procedures 29

Page 30

To access the front panel components, unlock and then remove the security bezel.

To reduce the risk of personal injury, electric shock, or damage to the equipment,

Power down the server

Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs.

WARNING: remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some

To power down the server, use one of the following methods:

• Press and release the Power On/Standby button.

• Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter

internal circuitry remain active until AC/DC power is removed.

IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the system.

This method initiates a controlled shutdown of applications and the OS before the server enters standby mode.

standby mode.

This method forces the server to enter standby mode without properly exiting applications and the OS. If an application stops responding, you can use this method to force a shutdown.

• Use a virtual power button selection through Dedicated iLO management.

This method initiates a controlled remote shutdown of applications and the OS before the server enters standby mode.

Before proceeding, verify the server is in standby mode by observing that the system power LED is amber.

Extend the server from the rack

To extend the server from a Hewlett Packard Enterprise, Compaq-branded, Telco, or third-party rack:

Removal and replacement procedures 30

Page 31

WARNING:

To reduce the risk of personal injury or equipment damage, be sure that the rack

is adequately stabilized before extending a component from the rack.

WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release latches and sliding the server into the rack. The sliding rails could pinch your

1. If the rear panel cables are not secured by a cable management arm, do the following:

2. Do one of the following:

fingers.

a. Power down the server (on page 30). b. Disconnect all peripheral cables from the server. c. Disconnect each power cord from the server.

o In a server that uses thumbscrew rack ears, loosen the captive thumbscrews that secure the

server faceplate to the front of the enclosure, and then slide the server out of the enclosure.

o In a server that uses quick-release latch rack ears:

i. Open the latches on both sides of the server. ii. If necessary, use a T-25 Torx screwdriver to loosen the shipping screws.

Removal and replacement procedures 31

Page 32

iii.

Slide the server out of the enclosure.

3. After performing the installation or maintenance procedure, slide the server back into the enclosure,

and then press the server firmly into the enclosure to secure it in place.

4. Do one of the following:

o In a server that uses thumbscrew rack ears, tighten the captive thumbscrews.

o In a server that uses quick-release latch rack ears, if necessary, tighten the shipping screws.

5. If the rear panel cables were disconnected because a cable management arm is not in use, do the

following:

a. Connect each power cord to the server. b. Connect all peripheral cables to the server. c. Power up the server.

Removal and replacement procedures 32

Page 33

Access the product rear panel

Opening the cable management arm

To access the server rear panel:

1. Release the cable management arm.

2. Open the cable management arm. The cable management arm can be right-mounted or

left-mounted.

Remove the server from the rack

Removal and replacement procedures 33

Page 34

This server is very heavy. To reduce the risk of personal injury or damage to the

Use caution when installing the server in or removing the server from the rack; it is unstable

WARNING: equipment:

• Observe local occupational health and safety requirements and guidelines for manual material handling.

• when not fastened to the rails.

To remove the server from a Hewlett Packard Enterprise, Compaq-branded, Telco, or a third-party enclosure:

1. Power down the server (on page 30).

2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Disconnect all peripheral cables from the server.

4. Remove the server from the rack.

For instructions on how to extend or remove the server from the rack, see the documentation that ships with the rack rail system.

5. Place the server on a sturdy, level surface.

Remove the air baffle

CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open.

To remove the component:

1. Power down the server (on page 30).

2. If you are performing a non-hot-plug procedure, remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

4. Remove the access panel ("Access panel" on page 40).

5. Remove the air baffle.

Removal and replacement procedures 34

Page 35

Remove the PCI riser cage

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to the server or expansion boards, power down the server, and disconnect all power cords before removing or installing the PCI riser cage.

1. Power down the server (on page 30).

2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

4. Remove the access panel ("Access panel" on page 40).

5. Disconnect all cables connected to existing expansion boards.

6. Remove the secondary PCI riser cage or PCI blank.

Removal and replacement procedures 35

Page 36

Secondary PCI riser cage

o PCI blank

Removal and replacement procedures 36

Page 37

Remove any expansion boards installed in the primary riser cage.

8. Remove the primary PCI riser cage.

Non-hot-plug drive carrier

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1. Power down the server (on page 30).

2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 29).

Removal and replacement procedures 37

Page 38

Remove the drive carrier.

To replace the component, slide the component into the bay until it clicks.

Non-hot-plug drive

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1. Back up all server data.

2. Power down the server (on page 30).

3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

4. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 29).

5. Remove the non-hot-plug drive.

Removal and replacement procedures 38

Page 39

Remove the drive from the carrier.

To replace the component, reverse the removal procedure.

Hot-plug drive blanks

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 29).

2. Remove the drive blank:

o Hot-plug LFF drive blank

To replace the LFF drive blank, slide the component into the bay until it clicks.

o Hot-plug SFF drive blank

To replace the SFF drive blank, while pressing the release latch, slide the component into the

bay until it is fully seated.

Removal and replacement procedures 39

Page 40

removed. Operating the server in this manner results in improper airflow and improper cooling

Hot-plug drive

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1. Back up all server data.

2. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 29).

3. Determine the status of the drive from the drive LED definitions ("Hot-plug drive LED definitions" on

page 97).

4. Remove the hot-plug drive.

To replace the component, reverse the removal procedure.

Access panel

To remove the component:

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: Do not operate the server for long periods with the access panel open or

1. Power down the server (on page 30).

2. Remove all power:

3. Do one of the following:

4. Open the access panel latch, slide the access panel to the rear of the chassis, and then remove the

that can lead to thermal damage.

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

access panel.

Removal and replacement procedures 40

Page 41

If the access panel latch is locked, use a T-15 Torx screwdriver to unlock the latch.

To replace the component, reverse the removal procedure.

Four-bay LFF non-hot-plug drive backplane

To remove the component:

1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 29).

2. Power down the server (on page 30).

3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

4. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

5. Remove the access panel ("Access panel" on page 40).

6. Remove all non-hot-plug drives.

7. Disconnect all cables connected to the drive backplane.

Removal and replacement procedures 41

Page 42

Remove the non-hot-plug drive backplane.

To replace the component, reverse the removal procedure.

Four-bay LFF hot-plug drive backplane

To remove the component:

1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 29).

2. Power down the server (on page 30).

3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

4. Extend or remove ("Remove the server from the rack" on page 33) the server from the rack.

5. Remove the access panel ("Access panel" on page 40).

6. Remove all hot-plug hard drives.

7. Disconnect all cables connected to the drive backplane.

Removal and replacement procedures 42

Page 43

Remove the hot-plug drive backplane.

To replace the component, reverse the removal procedure.

Smart Storage Battery

For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs).

CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the external drives as failed when the server is powered

To remove the component:

1. Power down the server (on page 30).

2. Remove all power:

3. Do one of the following:

4. Remove the access panel ("Access panel" on page 40).

5. Disconnect the Smart Storage Battery cable from the system board.

up.

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

Removal and replacement procedures 43

Page 44

Remove the Smart Storage Battery.

To replace the component, reverse the removal procedure.

FBWC module

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that

To remove the component:

1. Power down the server (on page 30).

2. Remove all power:

3. Do one of the following:

4. Remove the access panel ("Access panel" on page 40).

5. If removing a FBWC module from an expansion board in slot 2, remove the PCI riser assembly first

the system does not erroneously mark the drives as failed when the server is powered up.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

CAUTION: When connecting or disconnecting the cache module cable, the connectors on the cache module and cable are susceptible to damage. Avoid excessive force and use caution to avoid damage to these connectors.

before disconnecting the cache module cable.

For information on FBWC cabling, see "FBWC cabling (on page 103)".

Removal and replacement procedures 44

Page 45

Disconnect the cache module backup power cable from the cache module.

7. Remove the cache module.

To replace the component, reverse the removal procedure.

M.2 SSD enablement kit

M.2 SSD enablement board

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 30).

2. Remove all power:

Removal and replacement procedures 45

Page 46

Disconnect each power cord from the power source.

b. Disconnect each power cord from the server.

3. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

4. Remove the access panel ("Access panel" on page 40).

5. Remove the PCI riser cage (on page 35).

6. Disconnect the SATA cables from the M.2 SSD enablement board.

7. Remove the M.2 SSD enablement board.

o Slot 2

o Slot 3

M.2 SSD module

To replace the component, reverse the removal procedure.

Removal and replacement procedures 46

Page 47

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 30).

2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

4. Remove the access panel ("Access panel" on page 40).

5. If installed, remove any expansion board that blocks access to the SSD module ("Expansion board"

on page 61).

6. Remove the SSD module.

To replace the component, reverse the removal procedure.

Optical drive blank

To remove the component:

1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 29).

2. Power down the server (on page 30).

3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

4. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

Removal and replacement procedures 47

Page 48

Remove the access panel ("Access panel" on page 40).

6. Remove the optical drive blank

o Four-bay LFF drive model

o Eight-bay SFF drive model

To replace the component, reverse the removal procedure.

Optical drive

CAUTION: To prevent improper cooling and thermal damage, do not operate the chassis unless all bays are populated with a component or a blank.

To remove the component:

1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 29).

2. Power down the server (on page 30).

3. Remove all power:

Removal and replacement procedures 48

Page 49

Disconnect each power cord from the power source.

b. Disconnect each power cord from the server.

4. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

5. Remove the access panel ("Access panel" on page 40).

6. Disconnect the optical drive cable from the drive.

7. Remove the optical drive:

o Four-bay LFF drive model

Removal and replacement procedures 49

Page 50

less)

Fan

Blank

Fan

Blank

Redundant*

Fan

rated over 105 W)

Fan

Blank

Eight-bay SFF drive model

To replace the component, reverse the removal procedure.

Fan and fan blank

Fan population guidelines

Configuration

Non-redundant (with processors rated 105 W or

Fan bay 1 Fan bay 2 Fan bay 3 Fan bay 4 Fan bay

Non-redundant (with processors

Removal and replacement procedures 50

Page 51

* Fan redundancy is not supported for processors exceeding 105 W.

• In the redundant fan mode:

o If one fan rotor fails, the system continues to operate without redundancy. This condition is

indicated by a flashing amber Health LED.

o If two fan rotors fail, the operating system shuts down.

Fan blank

To remove the component:

1. Power down the server (on page 30).

2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Disconnect all peripheral cables and power cords from the rear panel.

4. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

5. Remove the access panel ("Access panel" on page 40).

6. Remove the air baffle (on page 34).

7. Remove the fan blank.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation. Improper grounding can cause electrostatic discharge.

CAUTION: To prevent improper cooling and thermal damage, do not operate the chassis unless all bays are populated with a component or a blank.

Removal and replacement procedures 51

Page 52

The fan does not have a fan guard. Special attention is needed when removing or

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To replace the component, reverse the removal procedure.

Hot-swap fan

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure. Improper grounding can cause ESD.

To remove the component:

1. Power down the server (on page 30).

2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

4. Remove the access panel ("Access panel" on page 40).

5. Remove the air baffle (on page 34).

6. Disconnect the fan cable from the system board and remove the fan.

CAUTION:

installing the fan to prevent finger injury.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 52

Page 53

DIMMs

Type

Rank

Capacity (GB)

Native speed (MT/s)

Voltage

RDIMM

Single

2133

STD

RDIMM

Single

2133

STD

RDIMM

Dual

2133

STD

RDIMM

Dual

2133

STD

LRDIMM

Dual

2133

STD

RDIMM

Dual

2133

STD

LRDIMM

Quad

2133

STD

Type

Rank

Capacity (GB)

Native speed (MT/s)

Voltage

RDIMM

Single

2400

STD

RDIMM

Single

2400

STD

RDIMM

Dual

2400

STD

RDIMM

Dual

2400

STD

LRDIMM

Dual

2400

STD

RDIMM

Single

2133

RDIMM

Dual

2133

LRDIMM

Dual

2133

LRDIMM

Quad

2133

Memory-processor information

For the latest memory configuration information, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs).

DIMM type

• Intel Xeon E5-2600 v3 processors are optimized for:

o Single-rank and dual-rank PC4-2133 (DDR4-2133) RDIMMs operating at up to 2133 MT/s

o Dual-rank and quad-rank PC4-2133 (DDR4-2133) LRDIMMs operating at up to 2133 MT/s

• Intel Xeon E5-2600 v4 processors are optimized for:

o Single-rank and dual-rank PC4-2400T (DDR4-2400) RDIMMs operating at up to 2400 MT/s

o Dual-rank PC4-2400T (DDR4-2400) LRDIMMs operating at up to 2400 MT/s

DIMM specifications

DIMM specifications with Intel Xeon E5-2600 v3 processor installed

DIMM specifications with Intel Xeon E5-2600 v4 processor installed

Populated DIMM speed (MT/s)

Operating memory speed is a function of rated DIMM speed, the number of DIMMs installed per channel, processor model, and the speed selected in the BIOS/Platform Configuration (RBSU) of the UEFI System Utilities ("HPE UEFI System Utilities" on page 85).

Populated DIMM speed with Intel Xeon E5-2600 v3 processor installed

Type Rank

1 DIMM per channel (MT/s)

Standard memory RDIMMs are limited to 1866 MT/s in a two DIMM per channel configuration with an E5-2600 v3 processor installed.

2 DIMMs per channel (MT/s)

Removal and replacement procedures 53

Page 54

Populated DIMM speed with Intel Xeon E5-2600 v4 processor installed

(MT/s)

channel (MT/s)

RDIMM

Single

2400

2133

RDIMM

Dual

2400

2133

LRDIMM

Dual

2400

RDIMM

Single-rank

RDIMM

Single-rank

RDIMM

Dual-rank

RDIMM

Dual-rank

128

LRDIMM

Dual-rank

128

RDIMM

Dual-rank

256

LRDIMM

Quad-rank

256

(GB)

RDIMM

Single-rank

RDIMM

Single-rank

128

RDIMM

Dual-rank

128

RDIMM

Dual-rank

256

LRDIMM

Dual-rank

256

Type Rank

1 DIMM per channel

2 DIMMs per

Maximum memory capacity

Maximum memory capacity is a function of DIMM capacity, number of installed DIMMs, memory type, and number of installed processors.

Maximum memory capacity with Intel Xeon E5-2600 v3 processor installed

DIMM type DIMM rank Capacity (GB)

Maximum capacity (GB)

Maximum memory capacity with Intel Xeon E5-2600 v4 processor installed

DIMM type DIMM rank Capacity (GB)

Removing a DIMM

To remove the component:

1. Power down the server (on page 30).

2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

4. Remove the access panel ("Access panel" on page 40).

5. Remove any expansion board installed in slot 1 and 2. ("Expansion board" on page 61)

6. Open the DIMM slot latches.

Maximum capacity

Removal and replacement procedures 54

Page 55

Remove the DIMM.

To replace the component, reverse the removal procedure.

Heatsink

To remove the component:

1. Power down the server (on page 30).

2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

4. Remove the access panel ("Access panel" on page 40).

5. Remove the air baffle (on page 34).

6. Remove the heatsink: a. Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. b. Completely loosen all screws in the same sequence.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

internal system components to cool before touching them.

WARNING: A warning contains information essential to physical safety. The text should point out physical hazards, calling attention to procedures and practices that must be followed to prevent serious injury or death.

Removal and replacement procedures 55

Page 56

Remove the heatsink from the processor backplate.

To replace the component:

1. Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to

evaporate before continuing.

2. Remove the thermal interface protective cover from the heatsink.

3. Install the heatsink: a. Position the heatsink on the processor backplate. b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws.

Removal and replacement procedures 56

Page 57

To avoid damage to the processor and system board, only authorized personnel

Finish the installation by completely tightening the screws in the same sequence.

4. Install the air baffle.

5. Install the access panel.

6. Do one of the following:

o Slide the server into the rack.

o Install the server into the rack.

7. Connect each power cord to the server.

8. Connect each power cord to the power source.

9. Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Processor

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: should attempt to replace or install the processor in this server.

NOTE: Replace a failed processor with the same model of replacement processor.

To remove the component:

1. Power down the server (on page 30).

2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

Removal and replacement procedures 57

Page 58

Remove the access panel ("Access panel" on page 40).

5. Remove the air baffle (on page 34).

6. Remove the heatsink: a. Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. b. Completely loosen all screws in the same sequence. c. Remove the heatsink from the processor backplate.

CAUTION: The pins on the processor socket are very fragile. Any damage to them may

require replacing the system board.

7. Open each of the processor locking levers in the order indicated, and then open the processor

retaining bracket.

CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the

processor socket contacts.

Removal and replacement procedures 58

Page 59

Remove the processor from the processor retaining bracket.

CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the

processor socket contacts.

To replace the component:

1. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by

visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.

CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the

processor socket contacts.

Removal and replacement procedures 59

Page 60

CAUTION: Do not press down on the processor. Pressing down on the processor may caus

damage to the processor socket and the system board. Press only in the area indicated on the

2. Close the processor retaining bracket. When the processor is installed properly inside the processor

processor retaining bracket.

retaining bracket, the processor retaining bracket clears the flange on the front of the socket.

3. Press and hold the processor retaining bracket in place, and then close each processor locking

lever. Press only in the area indicated on the processor retaining bracket.

4. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate

before continuing.

5. Apply all the grease to the top of the processor in the following pattern to ensure even distribution.

6. Install the heatsink: a. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws.

Removal and replacement procedures 60

Page 61

Finish the installation by completely tightening the screws in the same sequence.

7. Install the air baffle.

8. Install the access panel.

9. Do one of the following:

o Slide the server into the rack.

o Install the server into the rack.

10. Connect each power cord to the server.

11. Connect each power cord to the power source.

12. Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Expansion board

To remove the component:

1. Power down the server (on page 30).

2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

4. Remove the access panel ("Access panel" on page 40).

5. Disconnect all cables connected to existing expansion boards.

6. Remove the PCI riser cage (on page 35).

7. Remove the expansion board.

Removal and replacement procedures 61

Page 62

Slot 1

o Slot 2

o Slot 3

To replace the component, reverse the removal procedure.

Primary PCIe riser board

Removal and replacement procedures 62

Page 63

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots have either an expansion slot cover or an expansion board installed.

To remove the component:

1. Power down the server (on page 30).

2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

4. Remove the access panel ("Access panel" on page 40).

5. Disconnect all cables connected to existing expansion boards.

6. Remove all expansion boards ("Expansion board" on page 61).

7. Hold the ends of the riser cage and lift up.

8. Remove the screws, then remove the riser board from the cage.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 63

Page 64

Full-height half-length PCIe riser board and cage

To remove the component:

1. Power down the server (on page 30).

2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

4. Remove the access panel ("Access panel" on page 40).

5. Disconnect all cables connected to existing expansion boards.

6. Remove the PCI riser cage (on page 35).

7. Remove any existing expansion board from the riser board ("Expansion board" on page 61).

Removal and replacement procedures 64

Page 65

Remove the riser board from the cage.

To replace the component, reverse the removal procedure.

FlexibleLOM riser assembly

To remove the component:

1. Power down the server (on page 30).

2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

4. Remove the access panel ("Access panel" on page 40).

5. Disconnect all cables connected to existing expansion boards.

Removal and replacement procedures 65

Page 66

Remove the FlexibleLOM riser cage.

7. Remove the FlexibleLOM adapter from the riser cage.

To replace the component, reverse the removal procedure.

GPU

To remove the component:

1. Power down the server (on page 30).

2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

4. Remove the access panel ("Access panel" on page 40).

Removal and replacement procedures 66

Page 67

Disconnect all cables connected to the existing GPU.

6. Remove the GPU riser cage.

7. Remove the GPU from the riser cage.

To replace the component, reverse the removal procedure.

System battery

If the server no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.

WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury:

• Do not attempt to recharge the battery.

• Do not expose the battery to temperatures higher than 60°C (140°F).

• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.

• Replace only with the spare designated for this product.

Removal and replacement procedures 67

Page 68

Do not exert too much force to remove the system battery. The battery could pop

To remove the component:

1. Power down the server (on page 30).

2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

4. Remove the access panel ("Access panel" on page 40).

5. If installed, remove any expansion boards ("Expansion board" on page 61) installed in slot 1 and 2.

6. Locate the battery on the system board ("System board components" on page 94).

7. Remove the battery.

Use a small flat-bladed, nonconductive tool to carefully remove the battery from the socket.

WARNING: out of the socket, or the tool could slip and damage the socket or the system board.

IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, use BIOS/Platform Configuration (RBSU) in the UEFI System Utilities ("HPE UEFI System Utilities" on page 85) to reconfigure the system.

To replace the component:

1. Insert the battery with the "+" side facing up underneath the outer lip of the socket, and then press

the battery down to secure it in place.

2. Install any expansion boards that have been removed.

3. Install the access panel.

Removal and replacement procedures 68

Page 69

Do one of the following:

o Slide the server into the rack.

o Install the server into the rack.

5. Power up the server.

For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.

Front I/O module

To remove the component:

1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 29).

2. Power down the server (on page 30).

3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

4. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

5. Remove the access panel ("Access panel" on page 40).

6. Remove the front I/O module. a. Disconnect the front I/O module from the system board. b. Detach the ambient thermal sensor cable from its clip. c. Remove the screws and disconnect the front I/O module connectors from the front panel.

— Four-bay LFF drive model

Removal and replacement procedures 69

Page 70

— Eight-bay SFF drive model

d. Remove the screw and the front I/O module from the panel.

To replace the component, reverse the removal procedure.

Thumbscrew rack ear assembly

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper

To remove the component:

1. Power down the server (on page 30).

2. Remove all power:

grounding can cause electrostatic discharge.

Removal and replacement procedures 70

Page 71

Disconnect each power cord from the power source.

b. Disconnect each power cord from the server.

3. Do one of the following:

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

4. Remove the thumbscrew rack ear assembly.

To replace the component, reverse the removal procedure.

Quick-release latch rack ear assembly

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper

To remove the component:

1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 29).

2. Power down the server (on page 30).

3. Remove all power:

4. Do one of the following:

grounding can cause electrostatic discharge.

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

Removal and replacement procedures 71

Page 72

Remove the quick-release latch rack ear assembly.

To replace the component, reverse the removal procedure.

System board

CAUTION: To avoid ESD damage, when removing electrostatic-sensitive components from the failed system board, place the components on a static-dissipating work surface or inside

To remove the system board assembly:

1. Power down the server (on page 30).

2. Remove all power:

3. Do one of the following:

4. Remove the access panel ("Access panel" on page 40).

5. Remove the air baffle (on page 34).

6. Remove the fans ("Fan and fan blank" on page 50).

7. Remove the fan blanks ("Fan population guidelines" on page 50, "Fan blank" on page 51).

8. Remove the PCI riser cages ("Remove the PCI riser cage" on page 35).

9. Disconnect all cables connected to the system board.

10. Remove the Smart Storage Battery ("Smart Storage Battery" on page 43).

11. Remove all DIMMs ("Removing a DIMM" on page 54).

12. Remove the heatsink:

separate antistatic bags.

NOTE: Replace a failed system board with the same model of replacement system board. See the label of the failed system board for the spare part number.

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

o Extend the server from the rack (on page 30).

o Remove the server from the rack (on page 33).

a. Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws.

Removal and replacement procedures 72

Page 73

Completely loosen all screws in the same sequence.

c. Remove the heatsink from the processor backplate.

13. Open each of the processor locking levers in the order indicated, and then open the processor

retaining bracket.

CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the

processor socket contacts.

Removal and replacement procedures 73

Page 74

14.

When returning a damaged system board to Hewlett Packard Enterprise, always

Remove the processor from the processor retaining bracket.

CAUTION:

install all processor socket covers to prevent damage to the processor sockets and system

15. Remove the system board:

board.

a. Remove the system board screws. b. Lift the system board out of the chassis.

Removal and replacement procedures 74

Page 75

To replace the system board assembly:

1. Install the system board assembly.

2. Open each of the processor locking levers in the order indicated, and then open the processor

retaining bracket.

Removal and replacement procedures 75

Page 76

Do not press down on the processor. Pressing down on the processor may cause

the system board. Press only in the area indicated on the

Remove the clear processor socket cover. Retain the processor socket cover for future use.

4. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by

visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.

CAUTION:

damage to the processor socket and processor retaining bracket.

CAUTION: Close and hold down the processor cover socket while closing the processor locking levers. The levers should close without resistance. Forcing the levers closed can

5. Close the processor retaining bracket. When the processor is installed properly inside the processor

damage the processor and socket, requiring system board replacement.

retaining bracket, the processor retaining bracket clears the flange on the front of the socket.

Removal and replacement procedures 76

Page 77

Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket.

7. Install the processor socket cover on the failed system board.

8. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab.

Allow the alcohol to evaporate before continuing.

9. Apply all the grease to the top of the processor in the following pattern to ensure even distribution.

10. Install the heatsink: a. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws.

Removal and replacement procedures 77

Page 78

Install all components with the same configuration that was used on the failed

Finish the installation by completely tightening the screws in the same sequence.

11. Install the fans.

12. Install all components removed from the failed system board.

13. Connect all cables disconnected from the failed system board.

14. Install the PCI riser cages.

15. Install the air baffle.

16. Install the access panel.

17. Do one of the following:

o Slide the server into the rack.

o Install the server into the rack.

18. Connect each power cord to the server.

19. Connect each power cord to the power source.

20. Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

IMPORTANT: system board.

After you replace the system board, you must re-enter the server serial number and the product ID.

1. During the server startup sequence, press the F9 key to access UEFI System Utilities.

2. Select the System Configuration > BIOS/Platform Configuration (RBSU) > Advanced Options

> Advanced System ROM Options > Serial Number, and then press the Enter key.

3. Enter the serial number and press the Enter key. The following message appears:

The serial number should only be modified by qualified service personnel. This value should always match the serial number located on the chassis.

4. Press the Enter key to clear the warning.

5. Enter the serial number and press the Enter key.

6. Select Product ID. The following warning appears:

Removal and replacement procedures 78

Page 79

Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis.

7. Enter the product ID and press the Enter key.

8. Press the F10 key to confirm exiting System Utilities. The server automatically reboots.

Redundant power supply components

Power input module and RPS backplane characteristics

• HPE 800 W/900 W Gold AC Power Input Module (744689-B21)

o This module is compatible with the AC RPS backplane (745813-B21).

o The module wattage rating changes depending on whether one or two power input modules are

installed in the server:

— One power input module installed (nonredundant): 900 W

— Two power input modules installed (redundant): 800 W

• HPE 900 W AC/240 V DC Gold Power Input Module (775595-B21)

o This module is compatible with the AC/240 V DC RPS backplane (814835-B21).

o The 240 V DC function of this module only applies to server installations based in China.

For more information about the power supply features, specifications, and compatibility, see the Hewlett Packard Enterprise website (http://www.hpe.com/servers/powersupplies).

Hot-plug power input module

To remove the component:

1. If the server is using a single power input module only, remove all power from the server: a. Back up all server data. b. Power down the server (on page 30). c. Disconnect all peripheral cables from the server. d. Disconnect the power cord from the power input module.

2. Remove the power input module.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 79

Page 80

Redundant power supply backplane

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

To remove the component:

1. Power down the server (on page 30).

2. Access the product rear panel (on page 33).

3. Release the power cord from the hook-and-loop strap.

4. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

5. Remove all installed power input modules ("Hot-plug power input module" on page 79).

6. Remove the server from the rack (on page 33).

7. Place the server on a sturdy, level surface.

8. Remove the access panel ("Access panel" on page 40).

9. If installed, remove the primary PCI riser cage ("Remove the PCI riser cage" on page 35).

Removal and replacement procedures 80

Page 81

10.

TPM, administrators should consider the system compromised and take appropriate measures

Disconnect the RPS backplane cables.

11. Release the RPS backplane cables from the cable clips.

12. Remove the RPS backplane.

To replace the component, reverse the removal procedure.

HP Trusted Platform Module

The TPM is not a customer-removable part.

CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed

If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact a Hewlett Packard Enterprise authorized service provider for a replacement system board and TPM board.

to ensure the integrity of the system data.

Removal and replacement procedures 81

Page 82

Troubleshooting

Troubleshooting resources

The HPE ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language:

• English (http://www.hpe.com/support/Gen9_TSG_en)

• French (http://www.hpe.com/support/Gen9_TSG_fr)

• Spanish (http://www.hpe.com/support/Gen9_TSG_es)

• German (http://www.hpe.com/support/Gen9_TSG_de)

• Japanese (http://www.hpe.com/support/Gen9_TSG_ja)

• Simplified Chinese (http://www.hpe.com/support/Gen9_TSG_zh_cn)

The HPE ProLiant Gen9 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages and information to assist with interpreting and resolving error messages on ProLiant servers and server blades. To view the guide, select a language:

• English (http://www.hpe.com/support/Gen9_EMG_en)

• French (http://www.hpe.com/support/Gen9_EMG_fr)

• Spanish (http://www.hpe.com/support/Gen9_EMG_es)

• German (http://www.hpe.com/support/Gen9_EMG_de)

• Japanese (http://www.hpe.com/support/Gen9_EMG_ja)

• Simplified Chinese (http://www.hpe.com/support/Gen9_EMG_zh_cn)

Troubleshooting 82

Page 83

Diagnostic tools

Product QuickSpecs

For more information about product features, specifications, options, configurations, and compatibility,

HPE iLO

see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs).

The Dedicated iLO management subsystem is a standard component of ProLiant servers that simplifies initial server setup, server health monitoring, power and thermal optimization, and remote server administration. The Dedicated iLO management subsystem includes an intelligent microprocessor, secure memory, and a dedicated network interface. This design makes Dedicated iLO management independent of the host server and its operating system.

Dedicated iLO management enables and manages the Active Health System (on page 83) and also features Agentless Management. All key internal subsystems are monitored by Dedicated iLO management. If enabled, SNMP alerts are sent directly by Dedicated iLO management regardless of the host operating system or even if no host operating system is installed.

Using Dedicated iLO management, you can do the following:

• Access a high-performance and secure Integrated Remote Console to the server from anywhere in

the world if you have a network connection to the server.

• Use the shared .NET Integrated Remote Console to collaborate with up to four server administrators.

• Remotely mount high-performance Virtual Media devices to the server.

• Securely and remotely control the power state of the managed server.

• Implement true Agentless Management with SNMP alerts from iLO, regardless of the state of the

host server.

• Download the Active Health System log.

• Register for HPE remote support.

• Use iLO Federation to manage multiple servers from one system running the iLO web interface.

• Use Virtual Power and Virtual Media from the GUI, the CLI, or the iLO scripting toolkit for many tasks,

including the automation of deployment and provisioning.

• Control Dedicated iLO management by using a remote management tool.

For more information about Dedicated iLO management features, see the Dedicated iLO management documentation on the Hewlett Packard Enterprise website (http://www.hpe.com/info/ilo/docs).

The Dedicated iLO management hardware and firmware features and functionality, such as NAND size and embedded user partition, vary depending on the server model. For a complete list of supported features and functionality, see the Dedicated iLO management QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/Quickspecs-iLO).

Active Health System

The HPE Active Health System provides the following features:

• Combined diagnostics tools/scanners

Diagnostic tools 83

Page 84

• Always on, continuous monitoring for increased stability and shorter downtimes

• Rich configuration history

• Health and service alerts

• Easy export and upload to Service and Support

The Active Health System monitors and records changes in the server hardware and system configuration. The Active Health System assists in diagnosing problems and delivering rapid resolution if server failures occur.

The Active Health System collects the following types of data:

• Server model

• Serial number

• Processor model and speed

• Storage capacity and speed

• Memory capacity and speed

• Firmware/BIOS

Active Health System does not collect information about Active Health System users' operations, finances, customers, employees, partners, or data center, such as IP addresses, host names, user names, and passwords. Active Health System does not parse or change operating system data from third-party error event log activities, such as content created or passed through by the operating system.

The data that is collected is managed according to the Hewlett Packard Enterprise Data Privacy policy. For more information see the Hewlett Packard Enterprise website (http://www.hpe.com/info/privacy).

The Active Health System, in conjunction with the system monitoring provided by Agentless Management or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status, and service alerts for various server components.

The Agentless Management Service is available in the SPP, which can be downloaded from the Hewlett Packard Enterprise website (http://www.hpe.com/servers/spp/download). The Active Health System log can be downloaded manually from iLO 4 or HPE Intelligent Provisioning and sent to Hewlett Packard Enterprise.

For more information, see the following documents:

• iLO User Guide on the Hewlett Packard Enterprise website (http://www.hpe.com/info/ilo/docs)

• Intelligent Provisioning User Guide on the Hewlett Packard Enterprise website

(http://www.hpe.com/info/intelligentprovisioning/docs)

HPE ProLiant Pre-boot Health Summary

If the server will not start up, you can use iLO to display diagnostic information on an external monitor. This feature is supported on servers that support external video and have a UID button or an SUV connector. When power is available to the server but the server is not powered on, iLO runs on auxiliary power and can take control of the server video adapter to display the HPE ProLiant Pre-boot Health Summary.

For additional information, see the following documents:

• iLO 4 User Guide — See the Hewlett Packard Enterprise website

(http://www.hpe.com/info/ilo/docs).

• ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting — See "Troubleshooting

Resources (on page 82)."

Diagnostic tools 84

Page 85

Integrated Management Log

Action

Key

Access System Utilities

F9 during server POST

Navigate menus

Up and Down arrows

Select items

Enter

Save selections

F10

option*

The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.

You can view recorded events in the IML in several ways, including the following:

• From within HPE SIM

• From within UEFI System Utilities ("HPE UEFI System Utilities" on page 85)

• From within the Embedded UEFI shell

• From within operating system-specific IML viewers:

o For Windows: IML Viewer

o For Linux: IML Viewer Application

• From within the iLO web interface

• From within Insight Diagnostics ("HPE Insight Diagnostics" on page 86)

HPE UEFI System Utilities

The UEFI System Utilities is embedded in the system ROM. The UEFI System Utilities enable you to perform a wide range of configuration activities, including:

• Configuring system devices and installed options

• Enabling and disabling system features

• Displaying system information

• Selecting the primary boot controller

• Configuring memory options

• Selecting a language

• Launching other pre-boot environments such as the Embedded UEFI Shell and Intelligent

Provisioning

For more information on the UEFI System Utilities, see the HPE UEFI System Utilities User Guide for HPE ProLiant Gen9 Servers on the Hewlett Packard Enterprise website (http://www.hpe.com/info/uefi/docs).

Scan the QR code located at the bottom of the screen to access mobile-ready online help for the UEFI System Utilities and UEFI Shell. For on-screen help, press F1.

Using UEFI System Utilities

To use the UEFI System Utilities, use the following keys.

Access Help for a highlighted configuration

*Scan the QR code on the screen to access online help for the UEFI System Utilities and UEFI Shell.

Default configuration settings are applied to the server at one of the following times:

Diagnostic tools 85

Page 86

• Upon the first system power-up

• After defaults have been restored

Default configuration settings are sufficient for typical server operations; however, you can modify configuration settings as needed. The system prompts you for access to the UEFI System Utilities each time the system is powered up.

Embedded Diagnostics option

The system BIOS in all ProLiant Gen9 servers includes an Embedded Diagnostics option in the ROM. The Embedded Diagnostics option can run comprehensive diagnostics of the server hardware, including processors, memory, drives, and other server components.

For more information on the Embedded Diagnostics option, see the HPE UEFI System Utilities User Guide for HPE ProLiant Gen9 Servers on the Hewlett Packard Enterprise website (http://www.hpe.com/info/uefi/docs).

Re-entering the server serial number and product ID

After you replace the system board, you must re-enter the server serial number and the product ID.

1. During the server startup sequence, press the F9 key to access UEFI System Utilities.

2. Select the System Configuration > BIOS/Platform Configuration (RBSU) > Advanced Options

> Advanced System ROM Options > Serial Number, and then press the Enter key.

3. Enter the serial number and press the Enter key. The following message appears:

The serial number should only be modified by qualified service personnel. This value should always match the serial number located on the chassis.

4. Press the Enter key to clear the warning.

5. Enter the serial number and press the Enter key.

6. Select Product ID. The following warning appears:

Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis.

7. Enter the product ID and press the Enter key.

8. Press the F10 key to confirm exiting System Utilities. The server automatically reboots.

HPE Insight Diagnostics

The Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation.

The Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, boot the server using Intelligent Provisioning.

The Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server management. Available in Microsoft Windows and Linux versions, the utility helps to ensure proper system operation.

For more information or to download the utility, see the Hewlett Packard Enterprise website (http://www.hpe.com/info/InsightDiagnostics). The Insight Diagnostics Online Edition is also available

in the SPP.

Diagnostic tools 86

Page 87

HPE Insight Diagnostics survey functionality

HPE Insight Diagnostics (on page 86) provides survey functionality that gathers critical hardware and software information on ProLiant servers.

This functionality supports operating systems that are supported by the server. For operating systems supported by the server, see the Hewlett Packard Enterprise website (http://www.hpe.com/info/supportos).

If a significant change occurs between data-gathering intervals, the survey function marks the previous information and overwrites the survey data files to reflect the latest changes in the configuration.

Survey functionality is installed with every Intelligent Provisioning-assisted Insight Diagnostics installation, or it can be installed through the SPP.

HPE Insight Remote Support

Hewlett Packard Enterprise strongly recommends that you register your device for remote support to enable enhanced delivery of your Hewlett Packard Enterprise warranty, HPE support services, or Hewlett Packard Enterprise contractual support agreement. Insight Remote Support supplements your monitoring continuously to ensure maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of hardware event notifications to Hewlett Packard Enterprise, which will initiate a fast and accurate resolution, based on your product’s service level. Notifications can be sent to your authorized Hewlett Packard Enterprise Channel Partner for onsite service, if configured and available in your country.

For more information, see Insight Remote Support and Insight Online Setup Guide for ProLiant Servers and BladeSystem c-Class Enclosures on the Hewlett Packard Enterprise website (http://www.hpe.com/info/insightremotesupport/docs). Insight Remote Support is available as part of Hewlett Packard Enterprise Warranty, HPE support services, or Hewlett Packard Enterprise contractual support agreement.

USB support

Hewlett Packard Enterprise servers support both USB 2.0 ports and USB 3.0 ports. Both types of ports support installing all types of USB devices (USB 1.0, USB 2.0, and USB 3.0), but may run at lower speeds in specific situations:

• USB 3.0 capable devices operate at USB 2.0 speeds when installed in a USB 2.0 port.

• When the server is configured for UEFI Boot Mode, Hewlett Packard Enterprise provides legacy

USB support in the pre-boot environment prior to the operating system loading for USB 1.0, USB 2.0, and USB 3.0 speeds.

• When the server is configured for Legacy BIOS Boot Mode, Hewlett Packard Enterprise provides

legacy USB support in the pre-boot environment prior to the operating system loading for USB 1.0 and USB 2.0 speeds. While USB 3.0 ports can be used with all devices in Legacy BIOS Boot Mode, they are not available at USB 3.0 speeds in the pre-boot environment. Standard USB support (USB support from within the operating system) is provided by the OS through the appropriate USB device drivers. Support for USB 3.0 varies by operating system.

For maximum compatibility of USB 3.0 devices with all operating systems, Hewlett Packard Enterprise provides a configuration setting for USB 3.0 Mode. Auto is the default setting. This setting impacts USB

3.0 devices when connected to USB 3.0 ports in the following manner:

• Auto (default)—If configured in Auto Mode, USB 3.0 capable devices operate at USB 2.0 speeds in

the pre-boot environment and during boot. When a USB 3.0 capable OS USB driver loads, USB 3.0 devices transition to USB 3.0 speeds. This mode provides compatibility with operating systems that do not support USB 3.0 while still allowing USB 3.0 devices to operate at USB 3.0 speeds with state-of-the art operating systems.

Diagnostic tools 87

Page 88

• Enabled—If Enabled, USB 3.0 capable devices operate at USB 3.0 speeds at all times (including

the pre-boot environment) when in UEFI Boot Mode. This mode should not be used with operating systems that do not support USB 3.0. If operating in Legacy Boot BIOS Mode, the USB 3.0 ports cannot function in the pre-boot environment and are not bootable.

• Disabled—If configured for Disabled, USB 3.0 capable devices function at USB 2.0 speeds at all

times.

The pre-OS behavior of the USB ports is configurable in the UEFI System Utilities, so that the user can change the default operation of the USB ports. For more information, see the HPE UEFI System Utilities User Guide for HPE ProLiant Gen9 Servers on the Hewlett Packard Enterprise website (http://www.hpe.com/info/uefi/docs).

External USB functionality

Hewlett Packard Enterprise provides external USB support to enable local connection of USB devices for server administration, configuration, and diagnostic procedures.

For additional security, external USB functionality can be disabled through USB options in UEFI System Utilities.

HPE Smart Storage Administrator

The HPE SSA is a configuration and management tool for HPE Smart Array controllers. Starting with HPE ProLiant Gen8 servers, HPE SSA replaces ACU with an enhanced GUI and additional configuration features.

The HPE SSA exists in three interface formats: the HPE SSA GUI, the HPE SSA CLI, and HPE SSA Scripting. Although all formats provide support for configuration tasks, some of the advanced tasks are available in only one format.

Some HPE SSA features include the following:

• Supports online array capacity expansion, logical drive extension, assignment of online spares, and

RAID or stripe size migration

• Provides diagnostic and SmartSSD Wear Gauge functionality on the Diagnostics tab

• For supported controllers, provides access to additional features.

For more information about HPE SSA, see the Hewlett Packard Enterprise website (http://www.hpe.com/servers/ssa).

Automatic Server Recovery

ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the system periodically resets the timer. However, when the operating system fails, the timer expires and restarts the server.

ASR increases server availability by restarting the server within a specified time after a system hang. You can disable ASR from the System Management Homepage or through UEFI System Utilities.

Diagnostic tools 88

Page 89

Component identification

Optical drive (optional) 2

Serial label pull tab*

USB 2.0 connector

LFF drives 1

SFF drives

Optical drive (optional)

Serial label pull tab*

USB 2.0 connector

Front panel components

• Four LFF drive model

Item Description

*The serial number/iLO information pull tab is double-sided. The top side shows the server serial number and the customer asset tag label. The reverse side shows the default iLO account information and QR code linking to product documentation resources. The serial number/iLO information is also printed on labels attached to the chassis.

• Eight SFF drive model

Item Description

documentation resources. The serial number/iLO information is also printed on labels attached to the chassis.

Component identification 89

Page 90

Front panel LEDs and buttons

Item

Description

Status

UID button/LED

Solid blue = Activated

•

Health LED

Solid green = Normal

NIC status LED

Solid green = Link to network

Power On/Standby button

Solid green = System on

•

• Four LFF drive model

and system power LED

Flashing blue:

1 flash per second = Remote management or firmware upgrade

in progress

4 flashes per second = iLO manual reboot sequence initiated 8 flashes per second = iLO manual reboot sequence in

progress

Off = Deactivated

Flashing green (1 flash per second) = iLO is rebooting Flashing amber = System degraded Flashing red (1 flash per second) = System critical

If the health LED indicates a degraded or critical state, review the system IML ("Integrated Management Log" on page 85) or use iLO ("HPE iLO" on page 83) to review the system health status.

Flashing green (1 flash per second) = Network active Off = No network activity

Flashing green (1 flash per second) = Performing power on sequence Solid amber = System in standby Off = No power present

If the system power LED is off, verify the following conditions:

Facility power is present. The power supply is installed and is working correctly. The power cord is attached and is connected to a power source.

The front I/O cable is connected.

Component identification 90

Page 91

When all four LEDs described in this table flash simultaneously, a power fault has occurred. For more information,

Power On/Standby button

Solid green = System on

•

Health LED

Solid green = Normal

NIC status LED

Solid green = Link to network

UID button/LED

Solid blue = Activated

•

see "Power fault LEDs ("Front panel LED power fault codes" on page 92)."

• Eight SFF drive model

Item Description Status

and system power LED

Flashing green (1 flash per second) = Performing power on sequence Solid amber = System in standby Off = No power present

If the system power LED is off, verify the following conditions:

Facility power is present. The power supply is installed and is working correctly. The power cord is attached and is connected to a power source. The front I/O cable is connected.

Flashing green (1 flash per second) = iLO is rebooting Flashing amber = System degraded Flashing red (1 flash per second) = System critical

If the health LED indicates a degraded or critical state, review the system IML ("Integrated Management Log" on page 85) or use iLO ("HPE iLO" on page 83) to review the system health status.

Flashing green (1 flash per second) = Network active Off = No network activity

When all four LEDs described in this table flash simultaneously, a power fault has occurred. For more information, see "Power fault LEDs ("Front panel LED power fault codes" on page 92)."

Flashing blue:

1 flash per second = Remote management or firmware upgrade

in progress

4 flashes per second = iLO manual reboot sequence initiated 8 flashes per second = iLO manual reboot sequence in

progress

Off = Deactivated

Component identification 91

Page 92

Front panel LED power fault codes

System board

1 flash

Processor

2 flashes

Memory

3 flashes

Riser board PCIe slots

4 flashes

FlexibleLOM

5 flashes

controller/Smart SAS HBA controller

6 flashes System board PCIe slots

7 flashes

Power backplane or storage backplane

8 flashes

Power supply

9 flashes

Item

Description

Slot 3 PCIe3 x8 (8, 4, 1)*

Slot 2 PCIe3 x8 (8, 4, 1)

Slot 1 PCIe3 x16 (16, 8, 4, 1)

Non-hot-plug power supply

Power supply blank (bay 2 of optional redundant power

Hot-plug power supply (bay 1 of optional redundant 7

NIC connector 2

NIC connector 1/iLO connector

Video connector

USB 3.0 connectors

The following table provides a list of power fault codes, and the subsystems that are affected. Not all power faults are used by all servers.

Subsystem

Removable HPE Flexible Smart Array

Front panel LED behavior

For more information, see "Front panel LEDs and buttons (on page 90)."

Rear panel components

supply module)

power supply module)

* Slot 3 supports PCIe x16 (16, 8, 4, 1) if the GPU riser cage is installed.

Component identification 92

Page 93

Rear panel LEDs

Item

Description

Status

UID LED

Solid blue = Activated

•

NIC link LED

Green = Network link

NIC activity LED

Solid green = Link to network

Power supply LED

Solid green = Normal

•

options

PCIe riser

PCIe 3.0

x16

Low-profile

—

PCIe riser

PCIe 3.0

Low-profile

Unavailable

PCIe riser

PCIe. 3.0

Full-height/Half

FlexibleLOM

—

Flashing blue:

1 flash per second = Remote management

or firmware upgrade in progress

4 flashes per second = iLO manual reboot

sequence initiated

8 flashes per second = iLO manual reboot

sequence in progress

Off = Deactivated

Off = No network link

Flashing green = Network active Off = No network activity

Off = One or more of the following conditions exists:

Power is unavailable Power supply failed Power supply is in standby mode

Power supply error

PCIe riser board slot definitions

Expansion Slots

Riser board

GPU FlexibleLOM

Technology

Bus Width

x16 x8

Connector Width

x16 x8

Form Factor Notes

when a x16 riser is installed in slot 3

-length GPU

Component identification 93

Page 94

System board components

Primary PCIe riser board connector*

TPM connector

System battery

SATA connector

Storage backup power connector for PCIe slots 1-2*

Secondary PCIe riser slot* 7

MicroSD slot

Storage backup power connector for PCIe slot 3*

System maintenance switch

NMI header

Front I/O connector

Fan connector 5

Fan connector 4

Fan connector 3

Fan connector 2

Fan connector 1

Smart Storage Battery connector

6-pin drive backplane power connector

Internal USB 3.0

24-pin power connector

16 pin RPS connector

Mini-SAS connector 1

Mini-SAS connector 2

Item Description

* For more information on the riser board slots supported by the onboard PCIe riser connectors, see

"PCIe riser board slot definitions (on page 93)."

Component identification 94

Page 95

DIMM slot locations

Position

Default

Function

Off

Off = Dedicated iLO management Off

Off = System configuration can be

Off

Reserved

Off

Reserved

Off

Off = Power-on password is enabled.

Off

Off = No function Off

Off = Set default boot mode to UEFI. S8

—

Reserved

—

Reserved

S10

—

Reserved

S11

—

Reserved

S12

—

Reserved

DIMM slots are numbered sequentially (1 through 8). The supported AMP modes use the letter assignments for population guidelines.

System maintenance switch

The arrow points to the front of the server.

security is enabled. On = Dedicated iLO management security is disabled.

changed. On = System configuration is locked.

On = Power-on password is disabled.

On = ROM reads system configuration as invalid.

On = Set default boot mode to legacy.

To access the redundant ROM, set S1, S5, and S6 to On.

When the system maintenance S6 switch is set to the On position, the system will erase all system configuration settings from both CMOS and NVRAM on the next reboot.

Component identification 95

Page 96

CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to properly configure the server or data loss could occur.

Before using the S7 switch to change the boot mode to Legacy BIOS Mode, you must first disable the Dynamic Smart Array B140i Controller.

To disable the Dynamic Smart Array B140i Controller:

1. Reboot the server.

The server restarts and the POST screen appears.

2. Press F9.

The System Utilities screen appears.

3. Select System Configuration → BIOS/Platform Configuration (RBSU) → System Options →

SATA Controller Options → Embedded SATA Configuration, and then press Enter.

4. Select Enable SATA AHCI Support, and then press Enter.

5. Press F10 to save the selection.

6. Press Y to save the changes.

The Change saved confirmation prompt appears.

7. Select Exit and resume system boot, and press Enter.

The server continues the normal boot process.

NMI functionality

An NMI crash dump creates a crash dump log before resetting a system which is not responding.

Crash dump log analysis is an essential part of diagnosing reliability problems, such as failures of operating systems, device drivers, and applications. Many crashes freeze a system, and the only available action for administrators is to restart the system. Resetting the system erases any information which could support problem analysis, but the NMI feature preserves that information by performing a memory dump before a system reset.

To force the system to invoke the NMI handler and generate a crash dump log, do one of the following:

• Use the iLO Virtual NMI feature.

• Short the NMI header ("System board components" on page 94).

For more information, see the Hewlett Packard Enterprise website (http://www.hpe.com/support/NMI-CrashDump).

Drive numbering

• Four-bay LFF drive model

Component identification 96

Page 97

• Eight-bay SFF drive model

Item

LED

Status

Definition

Locate

Solid blue

The drive is being identified by a host application.

Flashing blue

The drive carrier firmware is being updated or requires an 2

Activity ring

Rotating green

Drive activity

Off

No drive activity

Do not remove

Solid white

Do not remove the drive. Removing the drive causes one or Off

Removing the drive does not cause a logical drive to fail. 4

Drive status

Solid green

The drive is a member of one or more logical drives.

Flashing green

The drive is rebuilding or performing a RAID migration, strip size Flashing

The drive is a member of one or more logical drives and predicts Flashing amber

The drive is not configured and predicts the drive will fail.

Solid amber

The drive has failed.

Hot-plug drive LED definitions

update.

more of the logical drives to fail.

amber/green

migration, capacity expansion, or logical drive extension, or is erasing.

the drive will fail.

Component identification 97

Page 98

Item

LED

Status

Definition

Off

The drive is not configured by a RAID controller.

SAS connectors operate in AHCI or Legacy mode.

IMPORTANT: The Dynamic Smart Array B140i Controller is only available in UEFI Boot Mode. It cannot be enabled in Legacy BIOS Boot Mode. If the B140i controller is disabled, drives connected to the system board MiniUnder this condition:

• The drives cannot be a part of a hardware RAID or a logical drive.

• The Locate, Drive status, and Do not remove LEDs of the affected drives are disabled.

Use BIOS/Platform Configuration (RBSU) in the UEFI System Utilities ("HPE UEFI System

Utilities" on page 85) to enable or disable the B140i controller (System Configuration →

BIOS/Platform Configuration (RBSU) → System Options → SATA Controller Options → Embedded SATA Configuration).

Fan locations

Component identification 98

Page 99

Cabling

Item

Description

Drive power cable

Mini-SAS cable

Cabling overview

This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance.

For information on cabling peripheral components, refer to the white paper on high-density deployment at the Hewlett Packard Enterprise website (http://www.hpe.com/info/servers).

CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.

Storage cabling

Depending on the controller option installed, the actual storage controller connectors might look different from what is shown in this section.

Four-bay LFF non-hot-plug drive cabling

• Four-bay LFF non-hot-plug drive backplane connected to the system board

Cabling 99

Page 100

• Four-bay LFF non-hot-plug drive backplane connected to the H240 host-bus adapter

Drive power cable

Mini-SAS cable

Item

Description

Drive power cable

Mini-SAS cable

Item Description

Four-bay LFF hot-plug drive cabling

• Four-bay LFF drive backplane connected to the system board

Cabling 100

HP E ProLiant DL120 G9 Maintenance And Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual