HP Compaq dc7800 Quick Reference Guide
Technical Reference Guide
HP Compaq dc7800 Series
Business Desktop Computers
Document Part Number: 461444-001
October 2007
This document provides information on the design, architecture, function,
and capabilities of the HP Compaq dc7800 Series Business Desktop
Computers. This information may be used by engineers, technicians,
administrators, or anyone needing detailed information on the products
covered.
© Copyright 2007 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice.
Microsoft, MS-DOS, Windows, and Windows NT are trademarks of Microsoft Corporation in the U.S. and other
countries.
Intel, Intel Core 2 Duo, Intel Core 2 Quad, Pentium Dual-Core, Intel Inside, and Celeron are trademarks of Intel
Corporation in the U.S. and other countries.
Adobe, Acrobat, and Acrobat Reader are trademarks or registered trademarks of Adobe Systems Incorporated.
The only warranties for HP products and services are set forth in the express warranty statements accompanying
such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall
not be liable for technical or editorial errors or omissions contained herein.
This document contains proprietary information that is protected by copyright. No part of this document may be
photocopied, reproduced, or translated to another language without the prior written consent of Hewlett-Packard
Company.
Technical Reference Guide
HP Compaq dc7800 Series Business Desktop Computers
First Edition (October 2007)
Document Part Number: 461444-001
Contents
1Introduction
1.1 About this Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.1.1 Online Viewing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.1.2 Hardcopy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.2 Additional Information Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.3 Model Numbering Convention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.4 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
1.5 Notational Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
1.5.1 Special Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
1.5.2 Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
1.5.2 Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
1.6 Common Acronyms and Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4
2 System Overview
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1
2.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2
2.3 System Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
2.3.1 Intel Processor Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6
2.3.2 Chipset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7
2.3.3 Support Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8
2.3.4 System Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8
2.3.5 Mass Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9
2.3.6 Serial and Parallel Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9
2.3.7 Universal Serial Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9
2.3.8 Network Interface Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9
2.3.9 Graphics Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–10
2.3.10Audio Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–10
2.4 Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–11
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Contents
3 Processor/Memory Subsystem
3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1
3.2 Intel Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2
3.2.1 Intel Processor Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2
3.2.2 Processor Changing/Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–3
3.3 Memory Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–4
3.3.1 Memory Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
3.3.2 Memory Mapping and Pre-allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
4 System Support
4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
4.2 PCI Bus Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
4.2.1 PCI 2.3 Bus Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
4.2.2 PCI Express Bus Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–3
4.2.3 Option ROM Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4
4.2.4 PCI Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4
4.2.5 PCI Power Management Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4
4.2.6 PCI Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–5
4.3 System Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–7
4.3.1 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–7
4.3.2 Direct Memory Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–8
4.4 Real-Time Clock and Configuration Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9
4.4.1 Clearing CMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9
4.4.2 Standard CMOS Locations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–10
4.5 System Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–10
4.5.1 Security Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–10
4.5.2 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–12
4.5.3 System Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–12
4.5.4 Thermal Sensing and Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–13
4.6 Register Map and Miscellaneous Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–14
4.6.1 System I/O Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–14
4.6.2 GPIO Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–15
5 Input/Output Interfaces
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
5.2 SATA Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2
5.3 PATA Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–3
5.4 Diskette Drive Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4
5.5 Serial Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6
5.6 Parallel Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7
5.6.1 Standard Parallel Port Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7
5.6.2 Enhanced Parallel Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7
5.6.3 Extended Capabilities Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7
5.6.4 Parallel Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8
5.7 Keyboard/Pointing Device Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9
5.7.1 Keyboard Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9
5.7.2 Pointing Device Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–10
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5.7.3 Keyboard/Pointing Device Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–10
5.8 Universal Serial Bus Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11
5.8.1 USB Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12
5.8.2 USB Cable Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12
5.9 Audio Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–13
5.9.1 HD Audio Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–14
5.9.2 HD Audio Link Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–14
5.9.3 Audio Multistreaming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–14
5.9.4 Audio Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–15
5.10Network Interface Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–16
5.10.1Wake-On-LAN Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–17
5.10.2Alert Standard Format Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–17
5.10.3Power Management Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–17
5.10.4 NIC Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–18
5.10.5NIC Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–18
6 Integrated Graphics Subsystem
6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1
6.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–2
6.3 Display Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–4
6.4 Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–5
6.5 Monitor Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–6
6.5.1 Analog Monitor Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–6
6.5.2 Digital Monitor Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–7
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7 Power and Signal Distribution
7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1
7.2 Power Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1
7.2.1 USDT Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1
7.2.2 SFF Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–2
7.2.3 CMT Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–4
7.2.4 Energy Star Compliancy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–5
7.3 Power Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–6
7.3.1 Power Button . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–6
7.3.2 Wake Up Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–8
7.3.3 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–9
7.4 Signal Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–10
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8SYSTEM BIOS
8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–1
8.2 ROM Flashing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2
8.2.1 Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2
8.2.2 Changeable Splash Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2
8.3 Boot Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3
8.3.1 Boot Device Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3
8.3.2 Network Boot (F12) Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3
8.3.3 Memory Detection and Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3
8.3.4 Boot Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–4
8.4 Client Management Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–5
8.4.1 System ID and ROM Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–6
8.4.2 Temperature Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–6
8.4.3 Drive Fault Prediction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–6
8.5 SMBIOS support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–7
8.6 USB Legacy Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8
8.7 Management Engine Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8
A Error Messages and Codes
Index
vi www.hp.com Technical Reference Guide
1.1 A b o u t t h i s G u i d e
This guide provides technical information about HP Compaq dc7800 Business PC personal
computers that feature Intel processors and the Intel Q35 Express chipset. This document
describes in detail the system's design and operation for programmers, engineers, technicians,
and system administrators, as well as end-users wanting detailed information.
The chapters of this guide primarily describe the hardware and firmware elements and primarily
deal with the system board and the power supply assembly. The appendices contain general data
such as error codes and information about standard peripheral devices such as keyboards,
graphics cards, and communications adapters.
This guide can be used either as an online document or in hardcopy form.
1.1.1 O n l in e V i e w i ng
Online viewing allows for quick navigating and convenient searching through the document. A
color monitor will also allow the user to view the color shading used to highlight differential
data. A softcopy of the latest edition of this guide is available for downloading in .pdf file format
at the following URL:
www.hp.com
1
Introduction
Viewing the file requires a copy of Adobe Acrobat Reader available at no charge from Adobe
Systems, Inc. at the following URL:
www.adobe.com
1.1. 2 H a r d c o p y
A hardcopy of this guide may be obtained by printing from the .pdf file. The document is
designed for printing in an 8 ½ x 11-inch format.
1.2 Additional Information Sources
For more information on components mentioned in this guide refer to the indicated
manufacturers' documentation, which may be available at the following online sources:
■ HP Corporation: www.hp.com
■
Intel Corporation: www.intel.com
■
Standard Microsystems Corporation: www.smsc.com
■
Serial ATA International Organization (SATA-IO): www.serialATA.org.
■
USB user group: www.usb.org
1. 3 M od e l N u m b e r i n g Co nv e n ti o n
The current model numbering convention for HP systems is shown as follows:
Technical Reference Guide www.hp.com 1-1
Introduction
1-2 www.hp.com Technical Reference Guide
1. 4 S er i a l N u mb e r
The serial number is located on a sticker placed on the exterior cabinet. The serial number is also
written into firmware and may be read with HP Diagnostics or Insight Manager utilities.
1.5 Notational Conventions
The notational guidelines used in this guide are described in the following subsections.
1. 5 .1 S p e c i a l N o t i c e s
The usage of warnings, cautions, and notes is described as follows:
WARNING: Text set off in this manner indicates that failure to follow directions could result in bodily
!
harm or loss of life.
CAUTION: Text set off in this manner indicates that failure to follow directions could result in damage to
equipment or loss of information.
Text set off in this manner provides information that may be helpful.
✎
Introduction
1. 5 . 2 Va l ue s
Differences between bytes and bits are indicated as follows:
MB = megabytes
Mb = megabits
1. 5 . 3 R an g es
Ranges or limits for a parameter are shown using the following methods:
Example A: Bits <7..4> = bits 7, 6, 5, and 4.
Example B: IRQ3-7, 9 = IRQ signals 3 through 7, and IRQ signal 9
Technical Reference Guide www.hp.com 1-3
Introduction
1.6 Common Acronyms and Abbreviations
Table 1-1 lists the acronyms and abbreviations used in this guide.
Table 1-1
Acronyms and Abbreviations
Acronym or
Abbreviation Description
Aampere
AC alternating current
ACPI Advanced Configuration and Power Interface
A/D analog-to-digital
ADC Analog-to-digital converter
ADD or ADD2 Advanced digital display (card)
AGP Accelerated graphics port
API application programming interface
APIC Advanced Programmable Interrupt Controller
APM advanced power management
AOL Alert-On-LAN™
ASIC application-specific integrated circuit
ASF Alert Standard Format
AT 1. attention (modem commands) 2. 286-based PC architecture
ATA AT attachment (IDE protocol)
ATAPI ATA w/packet interface extensions
AVI audio-video interleaved
AVGA Adva nced VGA
AWG American Wire Gauge (specification)
BAT Basic assurance test
BCD binary-coded decimal
BIOS basic input/output system
bis second/new revision
BNC Bayonet Neill-Concelman (connector type)
bps or b/s bits per second
BSP Bootstrap processor
BTO Built to order
CAS column address strobe
CD compact disk
CD-ROM compact disk read-only memory
CDS compact disk system
CGA color graphics adapter
1-4 www.hp.com Technical Reference Guide
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or
Abbreviation Description
Ch Channel, chapter
cm centimeter
CMC cache/memory controller
CMOS complimentary metal-oxide semiconductor (configuration memory)
Cntlr controller
Cntrl control
codec 1. coder/decoder 2. compressor/decompressor
CPQ Compaq
CPU central processing unit
CRIMM Continuity (blank) RIMM
CRT cathode ray tube
CSM 1. Compaq system management 2. Compaq server management
DAC digital-to-analog converter
Introduction
DC direct current
DCH DOS compatibility hole
DDC Display Data Channel
DDR Double data rate (memory)
DIMM dual inline memory module
DIN Deutche IndustriNorm (connector type)
DIP dual inline package
DMA direct memory access
DMI Desktop management interface
dpi dots per inch
DRAM dynamic random access memory
DRQ data request
DVI Digital video interface
dword Double word (32 bits)
EDID extended display identification data
EDO extended data out (RAM type)
EEPROM electrically erasable PROM
EGA enhanced graphics adapter
EIA Electronic Industry Association
EISA extended ISA
EPP enhanced parallel port
EIDE enhanced IDE
Technical Reference Guide www.hp.com 1-5
Introduction
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or
Abbreviation Description
ESCD Extended System Configuration Data (format)
EV Environmental Variable (data)
ExCA Exchangeable Card Architecture
FIFO first in/first out
FL flag (register)
FM frequency modulation
FPM fast page mode (RAM type)
FPU Floating point unit (numeric or math coprocessor)
FPS Frames per second
ft Foot/feet
GB gigabyte
GMCH Graphics/memory controller hub
GND ground
GPIO general purpose I/O
GPOC general purpose open-collector
GART Graphics address re-mapping table
GUI graphic user interface
hhexadecimal
HW hardware
hex hexadecimal
Hz Hertz (cycles-per-second)
ICH I/O controller hub
IDE integrated drive element
IEEE Institute of Electrical and Electronic Engineers
IF interrupt flag
I/F interface
IGC integrated graphics controller
in inch
INT interrupt
I/O input/output
IPL initial program loader
IrDA Infrared Data Association
IRQ interrupt request
ISA industry standard architecture
1-6 www.hp.com Technical Reference Guide
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or
Abbreviation Description
Kb/KB kilobits/kilobytes (x 1024 bits/x 1024 bytes)
Kb/s kilobits per second
kg kilogram
KHz kilohertz
kV kilovolt
lb pound
LAN local area network
LCD liquid crystal display
LED light-emitting diode
LPC Low pin count
LSI large scale integration
LSb/LSB least significant bit/least significant byte
LUN logical unit (SCSI)
Introduction
m Meter
MCH Memory controller hub
MMX multimedia extensions
MPEG Motion Picture Experts Group
ms millisecond
MSb/MSB most significant bit/most significant byte
mux multiplex
MVA motion video acceleration
MVW motion video window
n variable parameter/value
NIC network interface card/controller
NiMH nickel-metal hydride
NMI non-maskable interrupt
NRZI Non-return-to-zero inverted
ns nanosecond
NT nested task flag
NTSC National Television Standards Committee
NVRAM non-volatile random access memory
OS operating system
PAL 1. programmable array logic 2. phase alternating line
PATA Parallel ATA
Technical Reference Guide www.hp.com 1-7
Introduction
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or
Abbreviation Description
PC Personal computer
PCA Printed circuit assembly
PCI peripheral component interconnect
PCI-E PCI Express
PCM pulse code modulation
PCMCIA Personal Computer Memory Card International Association
PEG PCI express graphics
PFC Power factor correction
PIN personal identification number
PIO Programmed I/O
PN Part number
POST power-on self test
PROM programmable read-only memory
PTR pointer
RAID Redundant array of inexpensive disks (drives)
RAM random access memory
RAS row address strobe
rcvr receiver
RDRAM (Direct) Rambus DRAM
RGB red/green/blue (monitor input)
RH Relative humidity
RMS root mean square
ROM read-only memory
RPM revolutions per minute
RTC real time clock
R/W Read/Write
SATA Serial ATA
SCSI small computer system interface
SDR Singles data rate (memory)
SDRAM Synchronous Dynamic RAM
SDVO Serial digital video output
SEC Single Edge-Connector
SECAM sequential colour avec memoire (sequential color with memory)
SF sign flag
1-8 www.hp.com Technical Reference Guide
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or
Abbreviation Description
SGRAM Synchronous Graphics RAM
SIMD Single instruction multiple data
SIMM single in-line memory module
SMART Self Monitor Analysis Report Technology
SMI system management interrupt
SMM system management mode
SMRAM system management RAM
SPD serial presence detect
SPDIF Sony/Philips Digital Interface (IEC-958 specification)
SPN Spare part number
SPP standard parallel port
SRAM static RAM
SSE Streaming SIMD extensions
Introduction
STN super twist pneumatic
SVGA super VGA
SW software
TAD telephone answering device
TAFI Temperature-sensing And Fan control Integrated circuit
TCP tape carrier package, transmission control protocol
TF trap flag
TFT thin-film transistor
TIA Telecommunications Information Administration
TPE twisted pair ethernet
TPI track per inch
TTL transistor-transistor logic
TV television
TX transmit
UART universal asynchronous receiver/transmitter
UDMA Ultra DMA
URL Uniform resource locator
us/µs microsecond
USB Universal Serial Bus
UTP unshielded twisted pair
Vvolt
Technical Reference Guide www.hp.com 1-9
Introduction
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or
Abbreviation Description
VAC Volts alternating current
VDC Volts direct current
VESA Video Electronic Standards Association
VGA video graphics adapter
VLSI very large scale integration
VRAM Video RAM
Wwatt
WOL Wake-On-LAN
WRAM Windows RAM
ZF zero flag
ZIF zero insertion force (socket)
1-10 www.hp.com Technical Reference Guide
2.1 Introduction
The HP Compaq dc7800 Business PC personal computers (Figure 2-1) deliver an outstanding
combination of manageability, serviceability, and compatibility for enterprise environments.
Based on the Intel processor with the Intel Q35 Express chipset, these systems emphasize
performance along with industry compatibility. These models feature a similar architecture
incorporating both PCI 2.3 and PCIe buses. All models are easily upgradeable and expandable to
keep pace with the needs of the office enterprise.
2
System Overview
HP dc7800 USDT
Figure 2-1. HP Comapq dc7800 Business PCs
This chapter includes the following topics:
■ Features (2.2)
■ System architecture (2.3)
■ Specifications (2.4)
HP dc7800 SFF
HP dc7800 CMT
Technical Reference Guide www.hp.com 2-1
System Overview
2.2 Features
The following standard features are included on all models unless otherwise indicated:
■ Intel processor in LGA775 (Socket T) package
■ Integrated graphics controller
■ PC2-6400 and PC2-5300 (DDR2) DIMM support
■ Hard drive fault prediction
■ Eight USB 2.0-compliant ports
■ High definition (HD) audio processor with one headphone output, at least one microphone
input, one line output, and one line input
■ Network interface controller providing 10/100/1000Base T support
■ Plug 'n Play compatible (with ESCD support)
■ Intelligent Manageability support
■ Intel vPro Technology using Active Management Technology (AMT) 3.0 on select models
■ Security features including:
❏ Flash ROM Boot Block
❏ Diskette drive disable, boot disable, write protect
❏ Power-on password
❏ Administrator password
❏ Serial/parallel port disable (SFF and CMT form factors only)
❏ Hood (cover) sense
❏ Hoodlock (SFF and CMT form factors only)
❏ USB port disable
■ PS/2 enhanced keyboard
■ PS/2 optical scroll mouse
■ Energy Star 4.0 with 80 Plus compliancy standard on USDT form factors (option available
on SFF and CMT form factors)
2-2 www.hp.com Technical Reference Guide
System Overview
Table 2-1 shows the differences in features between the different PC series based on form factor:
Table 2-1
Feature Difference Matrix by Form Factor
USDT SFF CMT
Memory:
# & type of sockets
Maximum memory
Serial ports 0 1 std., 1 opt. [1] 1 std., 1 opt. [1]
Parallel ports 0 1 1
DVI-D graphics port 1 0 0
Drive bays:
Externally accessible
Internal
PCIe slots:
x16 graphics
x1
2 SODIMM
4GB
1
1
0
1 [2]
4 DIMM
8GB
2
1
1 [3] [4]
2 [3]
4 DIMM
8GB
4
2
1 [5]
2
PCI 2.3 32-bit 5-V slots 0 1 half-height
or
2 full-height [6]
Power Supply Unit:
Module type
Power ra ting
NOTES:
[1] 2nd serial port requires optional cable/bracket assembly.
[2] PCIe Mini Card slot.
[3] Supports low-profile card in standard configuration. Not accessible if PCI riser card field option
is installed.
[4] Accepts low-profile, reversed-layout ADD2/SDVO PCIe card: height = 2.5 in., length = 6.6 in.
[5] Accepts reversed layout ADD2/SDVO card: height = 4.2 in., length = 10.5 in.
[6] Full-height PCI slots require installation of PCI riser card field option (full-height dimensions: height
= 4.2 in., length = 6.875 in).
external
13 5 - w a t t
internal
240 -watt
3
full-height
internal
365-watt
Technical Reference Guide www.hp.com 2-3
System Overview
2.3 System Architecture
The systems covered in this guide feature an architecture based on the Intel Q35 Express chipset
(Figure 2-13). All systems covered in this guide include the following key components:
■ Intel Pentium Dual-Core, Core 2 Duo, Core 2 Quad, or Celeron processor.
■ Intel Q35 Express chipset - Includes Q35 GMCH north bridge and 82801 ICH9-DO south
bridge
■ SMC SCH5327 super I/O controller supporting PS/2 keyboard and mouse peripherals
■ AD1884 audio controller supporting line in, line out, microphone in, and headphones out
■ Intel 82566DM 10/100/1000 network interface controller
The Q35 chipset provides a major portion of system functionality. Designed to compliment the
latest Intel processors, the Q35 GMCH integrates with the processor through a
800/1066/1333-MHz Front-Side Bus (FSB) and communicates with the ICH9-DO component
through the Direct Media Interface (DMI). The integrated graphics controller of the Q35 on SFF
and CMT systems can be upgraded through a PCI Express (PCIe) x16 graphics slot. All systems
include a serial ATA (SATA) hard drive in the standard configuration. The USDT model supports
a Slimline Optical Drive through a legacy parallel ATA 100 interface.
Table 2-2 lists the differences between models by form factor.
Table 2-2.
Architectural Differences By Form Factor
Function USDT SFF CMT
Memory sockets 2 SODIMMs 4 DIMMs 4 DIMMs
PCIe x16 graphics slot? No Yes [1] Yes
# of PCIe x1 slots 1 [2] 2 [1] 2
# of PCI 2.3 slots 0 1 [3] 3
Serial / parallel ports 0 1 [4] 1 [4]
Parallel ports 0 1 1
SATA interfaces 1 3 4
Notes:
[1] Low-profile slot. Not accessible if PCI riser is installed.
[2] PCIe Mini-Card slot.
[3] Low-profile slot in standard configuration. 2 full-height slots supported with optional PCI riser.
[4] 2nd serial port possible with optional adapter.
2-4 www.hp.com Technical Reference Guide
Intel
Processor
800/1066/1333-MHz FSB
System Overview
Monitor
Monitor [1]
PCI Express
x16 slot (PEG)[2]
Optical
Drive
Analog
Digital
SATA
Hard Drive
SATA-
-to
-PATA
Bridge [1]
AD1884
Audio
Subsystem
RGB
DVI
Q35 Chipset
Integrated
Graphics
Cntlr.
PCIe
PEG I/F [2]
SATA
I/F
Audio I/F
Q35
GMCH
DMI
DMI
82801
ICH9
PCI Cntlr.
SDRAM
Cntlr
USB
I/F
LPC I/F
Ch A DDR2
SDRAM
Ch B DDR2
SDRAM
USB Ports [5]
Serial I/F [2]
SCH5327
I/O Cntlr.
Kybd-Mouse I/F
Parallel I/F [2]
Diskette I/F [2]
Diskette [2]
NIC
I/F
Notes:
[1] USDT only
[2] SFF and CMT only
[3] 0 slots in USDT, 1 or 2 slots in SFF, 3 slots in CMT
[4] 1 MiniCard slot in USDT, 2 slots in SFF, 2 slots in CMT
[5] 8 ports accessible externally, 2 ports accessible internally
PCIe x1 slots [4]
PCI 2.3 slots [3]
Keyboard
Mouse
Power Supply
Figure 2-2. HP Comapq dc7800 Business PC Architecture, Block diagram
Technical Reference Guide www.hp.com 2-5
System Overview
2.3.1 Intel Processor Support
The models covered in this guide are designed to support the following processor types:
■ Intel Celeron: energy-efficient single-core performance
■ Intel Pentium Dual-Core: Dual core performance
■ Intel Core2 Duo: energy-efficient dual-core performance
■ Intel Core2 Quad: energy efficient quad-core design
These processors are backward-compatible with software written for earlier x86 microprocessors
and include streaming SIMD extensions (SSE, SSE2, and SSE3) for enhancing 3D graphics and
speech processing performance.
The system board includes a zero-insertion-force (ZIF) Socket-T designed for mounting an
LGA775-type processor package.
CAUTION: The USDT form factor can support a processor rated up to 65 watts. The SFF and CMT form
factors can support a processor rated up to 95 watts. Exceeding these limits can result in system damage
and lost data.
The processor heatsink/fan assembly mounting differs between form factors. Always use the
✎
same assembly or one of the same type when replacing the processor. Refer to the applicable
Service Reference Guide for detailed removal and replacement procedures of the heatsink/fan
assembly and the processor.
2-6 www.hp.com Technical Reference Guide
2.3.2 Chipset
The Intel Q35 Express chipset consists of a Graphics Memory Controller Hub (GMCH) and an
enhanced I/O controller hub (ICH9-DO). Table 2-3 compares the functions provided by the
chipsets.
Components Function
Q35 GMCH Intel Graphics Media Accelerator 3100 (integrated graphics controller)
82801 ICH9-DO PCI 2.3 bus I/F
System Overview
Table 2-3
Chipset Components and Functionality
PCIe x16 graphics interface (SFF and CMT only)
SDRAM controller supporting unbuffered, non-ECC PC2-6400 DDR2
DIMMs or SODIMMs
800-, 1066-, or 1333-MHz FSB
PCI Express x1
LPC bus I/F
SMBus I/F
SATA I/F
HD audio interface
RTC/CMOS
IRQ controller
Power management logic
USB 1.1/2.0 controllers supporting 12 ports
(these systems provide 8 external, 2 internal)
Gigabit Ethernet controller
The I/O controller hub (ICH9-DO) features Intel vPro, which includes Active Management
Technology (AMT). AMT is a hardware/firmware solution that operates on auxiliary power to
allow 24/7 support of network alerting and management of the unit without regard to the power
state or operating system. AMT capabilities include:
■ System asset recovery (hardware and software configuration data)
■ OS-independent system wellness and healing
■ Software (virus) protection/management
Technical Reference Guide www.hp.com 2-7
System Overview
2.3.3 Support Components
Input/output functions not provided by the chipset are handled by other support components.
Some of these components also provide “housekeeping” and various other functions as well.
Table 2-4 shows the functions provided by the support components.
Support Component Functions
Component Name Function
SCH5327 I/O Controller Keyboard and pointing device I/F
Diskette I/F [1]
Serial I/F (COM1and COM2) [1]
Parallel I/F (LPT1, LPT2, or LPT3) [1]
PCI reset generation
Interrupt (IRQ) serializer
Power button and front panel LED logic
GPIO ports
Processor over temperature monitoring
Fan control and monitoring
Power supply voltage monitoring
SMBus and Low Pin Count (LPC) bus I/F
Table 2-4
Intel 82566DM Network Interface
Controller
AD1884 HD Audio Codec Audio mixer
NOTE:
[1] Not used in USDT form factor.
2.3.4 System Memory
These systems implement a dual-channel Double Data Rate (DDR2) memory architecture. All
models support DDR2 800- and 667-MHz DIMMs.
DDR and DDR2 DIMMs are NOT interchangeable.
✎
The USDT system provides two SODIMM sockets supporting up to four gigabytes of memory
while the SFF and CMT form factors provide four DIMM sockets and support a total of eight
gigabytes of memory.
SODIMM and DIMM components are NOT interchangeable.
✎
10/100/1000 Fast Ethernet network interface controller.
Two digital-to-analog 2-channel converters
Two analog-to-digital 2-channel converters
Analog I/O
Supports two 2-channel (stereo) audio streams
2-8 www.hp.com Technical Reference Guide
2.3.5 Mass Storage
All models support at least two mass storage devices, with one being externally accessible for
removable media. These systems provide the following interfaces for internal storage devices:
USDT: one SATA interface, one SATA-to-PATA bridge/interface for a Slimline optical drive
SFF: three SATA interfaces
CMT: four SATA interfaces
These systems may be preconfigured or upgraded with a SATA hard drive and one removable
media drive such as a CD-ROM drive.
2.3.6 Serial and Parallel Interfaces
The SFF and CMT form factors include a serial port and a parallel port, both of which are
accessible at the rear of the chassis. The SFF and CMT form factors may be upgraded with a
second serial port option.
The serial interface is RS-232-C/16550-compatible and supports standard baud rates up to
115,200 as well as two high-speed baud rates of 230K and 460K. The parallel interface is
Enhanced Parallel Port (EPP1.9) and Enhanced Capability Port (ECP) compatible, and supports
bi-directional data transfers.
System Overview
2.3.7 Universal Serial Bus Interface
All models provide ten Universal Serial Bus (USB) ports. Two ports are accessible at the front of
the unit, six ports are accessible on the rear panel, and two ports are accessible on the system
board. The SFF and CMT form factors support a media card reader module that connects to the
two internal ports. These systems support USB 1.1 and 2.0 functionality on all ports.
2.3.8 Network Interface Controller
All models feature an Intel gigabit Network Interface Controller (NIC) integrated on the system
board. The controller provides automatic selection of 10BASE-T, 100BASE-TX, or
1000BASE-T operation with a local area network and includes power-down, wake-up,
Alert-On-LAN (AOL), Alert Standard Format (ASF), and Active Management Technology
(AMT) features. An RJ-45 connector with status LEDs is provided on the rear panel.
Technical Reference Guide www.hp.com 2-9
System Overview
2.3.9 Graphics Subsystem
These systems use the Q35 GMCH component, which includes an integrated graphics controller
that can drive an external VGA monitor. The controller implements Dynamic Video Memory
Technology (DVMT 3.0) for video memory. Table 2-5 lists the key features of the integrated
graphics subsystem.
Integrated Graphics Subsystem Statistics
Recommended for Hi 2D, Entry 3D
Bus Type Int. PCI Express
Memory Amount 8 MB pre-allocated
Memory Type DVMT 3.0
DAC Speed 400 MHz
Table 2-5
Q35 GMCH
Integrated Graphics Controller
Maximum 2D Resolution 2048x1536 @ 85 Hz
Software Compatibility Quick Draw,
Outputs 1 RGB
The IGC supports dual independent display for expanding the desktop viewing area across two
monitors. The USDT form factor includes a DVI-D interface for direct connection with a digital
video monitor. The graphics subsystem of the SFF and CMT systems can be upgraded by
installing an SDVO ADD2 card or PCIe x16 graphics card in the PCIe x16 graphics slot.
2.3.10 Audio Subsystem
These systems use the integrated High Definitions audio controller of the chipset and the ADI
AD1884 High Definition audio codec. HD audio provides improvements over AC’97 audio such
as higher sampling rates, refined signal interfaces, and audio processors with a higher
signal-to-noise ratio. The audio line input jack can be re-configured as a microphone input, and
multi-streaming is supported. These systems include a 1.5-watt output amplifier driving an
internal speaker. All models include front panel-accessible stereo microphone in and headphone
out audio jacks.
DirectX 9.0,
Direct Draw,
Direct Show,
Open GL 1.4,
MPEG 1-2,
Indeo
2-10 www.hp.com Technical Reference Guide
2.4 Specifications
This section includes the environmental, electrical, and physical specifications for the systems
covered in this guide. Where provided, metric statistics are given in parenthesis. Specifications
are subject to change without notice.
Environmental Specifications (Factory Configuration)
Parameter Operating Non-operating
System Overview
Table 2-6
Ambient Air Temperature 50
Shock (w/o damage) 5 Gs [1] 20 Gs [1]
Vibration 0.000215 G
Humidity 10-90% Rh @ 28
Maximum Altitude 10,000 ft (3048 m) [2] 30,000 ft (9144 m) [2]
NOTE:
[1] Peak input acceleration during an 11 ms half-sine shock pulse.
[2] Maximum rate of change: 1500 ft/min.
o
to 95o F (10o to 35o C, max.
rate of change <
wet bulb temperature
10°C/Hr)
2
/Hz, 10-300 Hz 0.0005 G2/Hz, 10-500 Hz
o
C max.
o
-22
to 140o F (-30o to 60o C, max.
rate of change <
5-95% Rh @ 38.7o C max.
wet bulb temperature
Table 2-7
Power Supply Electrical Specifications
Parameter Value
Input Line Voltage:
Nominal:
Maximum
100–240 VAC
90–264 VAC
20°C/Hr)
Input Line Frequency Range:
Nominal
Maximum
Energy Star 4.0 with 80 Plus compliancy
USDT
SFF & CMT
Maximum Continuous Power:
USDT
SFF
CMT
NOTE:
Energy Star 4.0 with 80 Plus compliancy option available for SFF and CMT form factors.
Technical Reference Guide www.hp.com 2-11
50–60 Hz
47–63 Hz
Standard
Optional
135 wa t t s
240 watts
365 watts
System Overview
Parameter USDT [2] SFF [2] CMT [3]
Table 2-8
Physical Specifications
Height 2.60 in
(6.60 cm)
Width 9.90 in
(25.15 cm)
Depth 10.0 in
(25.40 cm)
Weight [1] 7.0 lb
(3.18 kg)
Load-bearing ability of
chassis [4]
NOTES:
[1] System configured with 1 hard drive, 1 diskette drive (SFF and CMT only), and no PCI
cards.
[2] Desktop (horizontal) configuration.
[3] Minitower configuration. For desktop configuration, swap Height and Width dimensions.
[4] Applicable to unit in desktop orientation only and assumes reasonable type of load such
as a monitor.
77.1 lb
(35 kg)
3.95 in
(10.03 c m)
13. 3 i n
(33.78 cm)
14.9 in
(37.85 cm)
18 . 75 lb
(8.50 kg)
77.1 lb
(35 kg)
17. 6 3 i n
(44.8 cm)
7.0 i n
(16. 8 cm )
17.8 in
(45.21 cm)
26.2 lb
(11. 89 kg )
77.1 lb
(35 kg)
2-12 www.hp.com Technical Reference Guide
Table 2-9
Diskette Drive Specifications
Parameter Measurement
Media Type 3.5 in 1.44 MB/720 KB diskette
Height 1/3 bay (1 in)
Bytes per Sector 512
Sectors per Track:
High Density
Low Density
Tracks per Side:
High Density
Low Density
Read/Write Heads 2
Average Access Time:
Track-to-Track (high/low)
Average (high/low)
Settling Time
Latency Average
18
9
80
80
3 ms/6 ms
94 ms/169 ms
15 ms
100 m s
System Overview
Technical Reference Guide www.hp.com 2-13
System Overview
Table 2-10
Optical Drive Specifications
DVD/CD-RW SuperMulti
Parameter DVD-ROM CD-RW/DVD-ROM Combo
Interface Type SATA [1] SATA [1] SATA [1]
LightScribe Combo
Max. read/write speeds
by media type
Maximum Transfer Rate
(Reads)
Media Capacity (DVD) DL: 8.5 GB, Std: 4.7 GB DL: 8.5 GB, Std: 4.7 GB DL: 8.5 GB, Std: 4.7 GB
Average Access Time:
Random
Full Stroke
Media lable creation? No No Yes [2]
DVD-RAM: 4x/na
DVD+RW: 8x/na
DVD-RW: 8x/na
DVD+R DL: 8x/na
DVD-R DL: 8x/na
DVD-ROM: 16x/na
DVD+R: 8x/na
DVD-R: 8x/na
CD-ROM: 48x/na
CD-RW: 32x/na
CD-R: 48x/na
DVD:, 21.6 KB/s;
CD: 7.2 KB/s
DVD: <140 ms, CD: <125
ms
DVD: <250 ms, CD: <210
ms
DV D- RA M: 12x /12 x
DVD+RW: 8x/8x
DVD-RW: 8x/6x
DVD+R DL: 8x/8x
DVD-R DL: 8x/8x
DVD-ROM: 16x/na
DVD-ROM DL: 8x/na
DV D+ R: 16x /16 x
DV D- R: 16x /16 x
CD-ROM: 48x/na
CD-RW: 32x/32x
CD-R: 48x/48x
DVD:, 21.6 KB/s;
CD: 7.2 KB/s
DVD: <140 ms, CD: <125 ms
DVD: <250 ms, CD: <210 ms
DV D- RA M: 12x /12 x
DVD+RW: 8x/8x
DVD-RW: 8x/6x
DVD+R DL: 8x/8x
DVD-R DL: 8x/8x
DVD-ROM: 16x/na
DVD-ROM DL: 8x/na
DVD+R: 16x/16x
DVD-R: 16x/16x
CD-ROM: 48x/na
CD-RW: 32x/32x
CD-R: 48x/48x
DVD:, 21.6 KB/s;
CD: 7.2 KB/s
DVD: <140 ms, CD: <125 ms
DVD: <250 ms, CD: <210 ms
NOTE
[1] USDT models use “slim” drive that uses an IDE interface through SATA bridge.
[2] Requires special label-etchable media.
2-14 www.hp.com Technical Reference Guide
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