The information contained in this document is subject to change without notice.
Hewlett-Packardmakes no warranty of any kind with regard to this material, including,
but not limited to, the implied warranties of merchantability and fitness for a particular
purpose.
Hewlett-Packard shall not be liable for errors contained herein or for incidental or
consequential damages in connection with the furnishing, performance, or use of this
material.
Hewlett-Packard assumes no responsibility for the use or reliability of its software on
equipment that is not furnished by Hewlett-Packard.
This document contains proprietary information that is protected by copyright. All
rights are reserved. No part of this document may be photocopied, reproduced, or
translated to another language without the prior written consent of Hewlett-Packard.
Adaptec® is a registered trademark of Adaptec, Inc.
Adobe and Acrobat are trademarks of Adobe Systems Incorporated.
nVIDIA™, GeForce2 GTS™, Quadro2 PRO™, Quadro2 EX™and Quadro2 MXR™ are
registered trademarks or trademarks of nVIDIA Corporation.
FireGL™ is a registered trademark of ATI Corporation.
Matrox® is a registered trademark of Matrox Electronic Systems Ltd.
Microsoft®, Windows®, MS-DOS® and Windows NT® are registered trademarks of the
Microsoft Corporation.
Pentium® and AGPset™ are trademarks of Intel Corporation.
WOL™ (Wake on LAN) is a trademark of IBM.
Rambus, RDRAM, Direct Rambus, Direct RDRAM and RIMM are trademarks of
Rambus, Inc.
HEWLETT-PACKARD COMPANY
3000 Hanover Street
Palo Alto, California 94304 U.S.A.
Printing History
The manual printing date and part number indicate its current edition. The printing
date will change when a new edition is printed. Minor changes may be made at reprint
without changing the printing date. The manual part number will change when
extensive changes are made.
Manual updates may be issued between editions to correct errors or document product
changes. To ensure that you receive the updated or new editions, you should subscribe to
the appropriate product support service. See your HP Sales Representative for details.
Second Edition: May 2002
Printing Division:
Hewlett-Packard Co.
Technical Computer Division
3404 E. Harmony Rd.
Fort Collins, CO 80525
This chapter provides detailed system specifications for the HP Workstation x2100:
•Introduces the system’s internal and external features
•Lists the system’s specifications and characteristic data
•Provides a summary of the available documentation
Chapter 1
13
System Overview
Workstation Description
Workstation Description
The HP Workstation x2100 is based on the ATX form factor.Thefollowing table provides
an overview of the system.
System BoardDimensions: 12 in. X 9.6 in. in an Extended-ATX (E-ATX) package
ProcessorIntel Pentium 4 processor
FeatureDescription
Socket 423
Cache Memory
(integratedin processor
package)
Internal Processor
Clock Speed
ChipsetIntel I850 chipset, including Memory Controller Hub (MCH) Host Bridge,
Super I/O ChipNS 87364
Basic I/O System
(BIOS)
•Level 1: 16KB code, 16KB data
•Level 2: 256KB
1.7GHz, 1.9GHz, 2.2 GHz and higher speeds with a quad-pumped
100MHz Front Side Bus
Input/Output Controller Hub (ICH) for I/O subsystem
Based on Phoenix core, including:
•4 megabits of flash memory
•Support for PCI 2.2 specification
•Support for RIMM memory modules
Firmware - BIOSFlash EEPROM: Intel’s firmware hub concept
HP MaxiLife UtilityHardware-monitoring utility that monitors system components via the
SMBus and an LCD status panel
Operating SystemAll models come preloaded with a Windows OS.
Main MemoryTwo pairs of RIMM sockets, supporting two or four PC800 RDRAM
memory modules
Each pair of memory sockets must contain identical memory modules
(identical in size, speed, and type). That is, sockets A1 and B1 must
contain identical modules, and sockets A2 and B2 must contain identical
modules (or continuity modules).
14
If only twoRDRAM modules are installed, use the socketsmarked A1 and
B1. The other two sockets (A2 and B2) must contain continuity modules.
Models are supplied with non-ECC RDRAM modules.
Both ECC and non-ECC modules are available.
The HP PC Accessories Web site, at
•Two front-access, third-height 3 1/2-inch drives (one for the floppy
disk drive and one free) (1-inch height)
•Three front-access, half-height, 5 1/4-inch drives (1-inch height); you
can use an adapter tray (available as an accessory) to install two 3
1/2-inch hard disk drives in one of the 5 1/4-inch shelves.
•Two internal 3 1/2-inch hard disk drives (1-inch height)
SCSI ControllerAdaptec Ultra 160 SCSI PCI card (optional).
IDE ControllerAll models include an integrated Ultra ATA-100 controller that supports
as many as four IDE devices.
Graphics Controllers
•nVIDIA Quadro2 MXR with TwinView or nVIDIA Quadro Pro
nVIDIA Quadro2 Ex
ATI FireGL 8800
•Matrox Millennium G450-DualmonitorAGP graphics controller with
16MB SGRAM graphics memory (maximum configuration)
•ATI FireGL2 or GL4 3D Graphics Card
Accessory Card SlotsOne AGP Pro Universal 4X 32-bit slot supporting:
•1.5V AGP cards (£25W)
•1.5V AGP Pro Cards (£50W)
The system doesn’t support high-power (i.e., greater than 50W) AGP Pro
and 3.3V AGP cards.
Five 32-bit 33MHz Peripheral Component Interconnect (PCI) slots,
supporting all bridges and multifunction PCI devices. All five PCI slots
comply with PCI Specification 2.2.
•PCI slot 5 contains a LAN interface board.
•PCI slot 4 is for a SCSI interface board (some models only).
LAN CardLan is now integrated onto the system board. All x2100 models come with
an HP 10/100BT PCI Ethernet Adapter LAN card supporting Wake-On
LAN 9WOL) and PCI Specification 2.2.
Optical DrivesModels include one or two of the following IDE drives: CD-ROM, CD-RW,
or DVD-ROM.
Chapter 1
AudioCrystalClear CS4299 Audio Codec 97 version 2.1 is integrated on the
system board.
15
System Overview
Workstation Description
FeatureDescription
System Board
Connectors
Rear Connectors
(color coded)
•One flexible disk drive connector
•Two ATA-100 IDE connectors (for as many as four IDE devices)
•One CD-IN audio connector
•Internal speaker connector
•WOL connector
•Battery socket
•Status panel connector
•Main power supply connector and ATX 12V power connector
•Auxiliary power connector (MT models only)
•Main chassis fan connector
•Processor fan connector
•PCI card fan connector
•Chassis intrusion connector
•Thermal sensor connector
•Keyboard/Mouse
— HP enhanced keyboard with mini-DIN connector
— HP enhanced scrolling mouse with mini-DIN connector
•25-pin parallel
— Mode: Centronics or bidirectional modes (ECP/EPP)
— Parallel port: 1 (378h, IRQ 7), 2 (278h, IRQ 5), or Off
•9-pin serial (two, buffered)
— Standard: Two UART 16550 buffered serial ports
(both RS-232-C).
— Serial Ports A and B: 2F8h (IRQ 3), 2E8h (IRQ 3),
3F8h (IRQ 4), 3E8h (IRQ 4), or Off
(if one port uses 2xxh, the other port must use 3xxh).
•Dual USB connectors
•Audio
— LINE IN jack (3.5mm)
— LINE OUT jack (3.5mm)
— MIC IN jack (3.5mm)
16
Chapter 1
Internal And External Components
Figure 1-1 and Figure 1-2 show the front and rear views of the HP Workstation x2100.
Figure 1-1Front and Side Views
Power Supply
Main Fan
Spare mounting rails:
- Wide green rails for
5.25-inch devices (for
example, Zip drive)
- Narrow green rails for
3.5-inch devices
- Blue rails for 3.5-inch
hard disk drives
System Overview
Internal And External Components
Front access
shelves:
- three 5 1/4-inch
drive shelves (can
be used for optical
drives or a 3
1/2-inch tray kit–
available as
accessory)
- two 3 1/2-inch
shelves, including
a 1.44MB floppy
disk drive
Secondary Hard Disk
Drive Shelf
Primary Hard Disk
Drive Shelf
Figure 1-2Rear View
Line Out (headphone) connector
Line In connector
Microphone connector
Keyboard
connector
Serial port A
Serial port B
Dual USB connectors
MaxiLife
Status Panel
HP MasterKey
Lock
Mouse
connector
Parallel port
Chapter 1
Display connector
17
System Overview
Internal Features
Internal Features
The core architecture of the HP Workstation x2100 consists of:
•Memory Controller Hub (MCH)
•Input/Output Controller Hub (ICH)
•Host bus
The HP Workstation x2100 supports a Pentium 4 processor. For information about this
processor, see page 58.
For information about...Refer to...
System board componentsChapter 2
HP BIOS routinesChapter 3
Tests and error messages including Power On Self Test
(POST) routines
Graphics, network and SCSI devices, and mass storage
devices
Accessories Installation and Parts ReplacementChapter 6
Use or configuration problemsChapter 7
Troubleshooting and RecoveryChapter 7
Contacting supportChapter 7
Chapter 4
Chapter 5
18
Chapter 1
Front Panel
The HP Workstation x2100’s front panel has the following features:
•Liquid Crystal Display (LCD). For information about LCD error messages and
available menus, see page 77.
•On/Off LED. The LED displays four states:
— Blank: Indicates that the computer is turned off.
— Green: Indicates that the computer is turned on and running correctly.
— Red (fixed or flashing): Indicates a preboot or a POST error that is preventing
the system from booting.
— Amber: Displayed during system reset, system lock.
•Hard disk drive activity LED. Activated during POST and during hard disk drive
access.
Figure 1-3Front Panel
System Overview
Front Panel
Reset
Button
Hard Disk
Activity Light
LCD Control
Buttons
Power On/Off
Button
Chapter 1
19
System Overview
Specifications And Characteristics
Specifications And Characteristics
Physical Characteristics
System Processing Unit
Weight: (Standard
configuration as shipped,
excluding keyboard and
display)
Dimensions47.0cm max. (D) X 21.0cm (W) X 49.0cm (H)
Footprint0.09 square meters (1.06 square feet)
Electrical Specifications
14.4 kilograms (31.68 pounds)
(18.50 inches X 8.26 inches X 19.29 inches)
Maximum
Peak
ParameterTotal Rating
Input voltage
(Switch select)
Input current
(max)
Input frequency50 to 60 Hz—————
Available power492 W—100W for PCI slots and AGP Pro slot
Max current at
+12 V
Max current at
-12 V
Max current at
+3.3V
b
Vddq
Max current at
+5V
Max current at
-5V
Max current at
+5V stdby
combined with
3.3V stdby
100-127
V VAC
5.5 A2.5 A—————
15 A15 A0.5 A1 A4.2 A5.2 A
0.8 A—0.1 A———
28 A—7.6 A6 A7.6 A13.6 A
———2 A
30 A—5 A2 A
0.0 A—————
2 A—1.875 A total on 3.3V stdby
200-250
V VAC
(15
secs.)
——— ——
per PCI
Slots
32-bit
33MHz
Maximum for AGP Slot
Standard
Connector
ExtensionTotal
a
20
a. The system can draw a maximum of 50W from the AGP Pro slot. The standard part
of the AGP Pro connector supplies 25W (max.), plus 25W from the connector
extension (25W + 25W = 50W). For information about the AGP Pro Universal slot,
see page 33.
b. Only for I/O buffers.
Chapter 1
System Overview
Specifications And Characteristics
If an overload triggers the power supply’s overload protection, all power is immediately
cut. To reset the power supply unit:
1. Disconnect the power cord.
2. Determine what caused the overload, and fix the problem.
3. Reconnect the power cord, and reboot the workstation.
If an overload occurs twice, then there is an undetected short circuit somewhere.
When you use the front panel's power button to turn off the workstation, power
consumption falls below the low power consumption (refer to the table on page 21), but
doesn't reach zero. This on/off feature extends the power supply's lifetime. To reach zero
power consumption in “off” mode, either unplug the workstation or use a power block
with a switch.
Power Consumption And Cooling
The power consumption and acoustics listed in the following table are valid for a
standard configuration as shipped (one processor, 256MB of memory, 492 W power
supply, one hard disk drive, graphics card, LAN card).
All information in this section is based on primary power consumptions.
Power consumption (approximate
values)
•Typical operating mode
•Suspend mode (Windows 2000
models only)
230V/50Hz and 115V/60Hz
70W
<4W
a. 1W = 3.4121Btu/h
Additional Component
•Processor
50W
- 170.6Btu/h
•SCSI harddisk drive with I/O
access
23W
- 78.4Btu/h
•SCSI hard disk without I/O
access (idle)
•PCI card
16W
10W to
36W
- 54.5Btu/h
- 64.1Btu/h to
122.8Btu/h
- 238.8Btu/h
- 13.6Btu/h
a
Chapter 1
21
System Overview
Specifications And Characteristics
Environmental Specifications
Environmental Specifications (System Processing Unit with Hard Disk)
Operating Temperature+10 ˚C to +35 ˚C (+40 ˚F to +95 ˚F).
Storage Temperature-40 ˚C to +70˚C (-40 ˚F to +158 ˚F).
Over-Temperature Shutdown+50˚C (+122˚F)
Operating Humidity
Storage Humidity8% to 85% (relative).1
Acoustic noise emission(asdefined in ISO
7779):
•Operating
•Operating with hard disk access
15% to 80% (relative).
Sound Power
LwA <= 40.5dB
LwA <= 41.4dB
a
Sound Pressure
LpA <= 25.7dB
LpA <= 26.5dB
•Operating with floppy disk access
Operating Altitude10,000ft (3100m) max
Storage Altitude15,000ft (4600m) max
LwA <= 43.2dB
LpA <= 30.0dB
a. noncondensing conditions.
Operating temperature and humidity ranges may vary depending on the installed mass
storage devices. High humidity levels can cause improper disk operation. Low humidity
levels can aggravate static electricity problems and cause excessive wear of the disk
surface.
22
Chapter 1
System Overview
Power Saving And Ergonometry
Power Saving And Ergonometry
Depending on the operating system, the following power-management types are
available:
•No sleeping state: Windows NT 4.0 (Full On and Off).
•ACPI: Windows 2000 or XP (Full On, Standby, Hibernate, Off).
Windows
2000/XP
Full On
A
SuspendNot Supported by
P
M
OffSupported
Standby (S1
or S3)
A
C
P
I
Hibernate
(S4)
Off (S5)Supported
Not Supported
by Windows 2000
Supported
(implemented as
S3, Suspend to
RAM)
Supported
Windows NT 4.0
Supported
Windows NT 4.0
APM
only
Operating
System
Power Saving And Ergonometry For APM Systems
Full On
ProcessorNormal speedHaltedHalted
DisplayOnBlanked, <5W (typ)Blanked, <5W (typ)
Hard disk driveNormal speedHaltedHalted
Suspend
a
Off
Chapter 1
Power
consumption
Resume eventsKeyboard, network
Resume delayA few secondsBoot delay
Supports up to
320W
<40W (230V, 50Hz)
<21W (115V, 60Hz)
(RWU), modem, USB
(plugged inbut turned
off) <5W (average)
Power button or RPO
a. Not supported by Windows NT 4.0.
Power Saving Modes And Resume Events For ACPI Systems
Full On
(S0)
ProcessorNormal
speed
DisplayOnBlankedOffOffOff
Suspend (S1)Suspend to
RAM (S3)
HaltedOffOffOff
Suspend to
Disk (S4)
Off (S5)
23
System Overview
Power Saving And Ergonometry
Full On
(S0)
Hard Disk
Drive
Active Power
Planes
Power
Consumption
Resume EventsPower button,
Resume DelayInstantaneousInstantaneousBIOS boot
Normal
speed
VCC
VCCAux
Supports
up to 492W
Suspend (S1)Suspend to
RAM (S3)
HaltedOffOffOff
VCC
VCCAux
<40W<10W<10W<10W
LAN, Modem,
USB, Scheduler
Memory
VCCAux
Power button,
LAN, Modem,
Scheduler
Suspend to
Disk (S4)
VCCAuxVCCAux
Power button,
LAN, Modem,
Scheduler
delay
Soft Power Down
When you shut down the operating system, the environment is cleared, and the
computer is powered off. The Soft Power Down utility is available with Windows NT.
Off (S5)
Power
button
Regular
boot delay
24
Chapter 1
System Overview
Documentation
Documentation
The following table lists the documentation available for the HP Workstation x2100.
Only selected publications are in hard-copy format. Most are available as PDF files from
the HP Web site.
Title
HP Workstation x2100
Getting Started Guide
HP Workstation x21000
Technical Reference And
Troubleshooting Guide
Available at
HP Web site
PDF fileA8030-90001
PDF fileNo
Hard-copy?
Access HP World Wide Web Site
Additional online support documentation, BIOS upgrades, and drivers are available
from HP’s Web site at http://www.hp.com/go/workstationsupport.
After accessing the site, select HP Workstation x2100.
Chapter 1
25
System Overview
Documentation
Where To Find The Information
The table below summarizes information provided in the HP Workstation x2100
documentation set.