The information contained in this docuement is subject to change without notice.
Hewlett-Packard makes no warranty of any kind with regard to this material, including, but
not limited to, the implied warranties of merchantability and fitness for a particular purpose.
Hewlett-Packard shall not be liable for errors contained herein or for incidental or
consequential damages in connection with the furnishing, performance, or use of this material.
Hewlett-Packard assumes no responsibility for the use or reliability of its software on
equipment that is not furnished by Hewlett- Packard.
This document contains proprietary information, which is protected by copyright. All rights
are reserved. No part of this document may be photocopied, reproduced or translated to
another language without the prior written consent of Hewlett-Packard Company. The
information contained in this document is subject to change without notice.
Hewlett-Packard Company
Medical Products Group (Europe)
Schickardstrasse 4
7030 Boeblingen
Federal Republic of Germany
@ Copyright Hewlett-Packard Company, 1991. All rights reserved.
Printing History
New editions are complete revisions of the manual. Update packages, which are issued
between editions, contain additional and replacement pages to be merged into the manual by
the customer. The dates on the title page change only when a new edition or a new update is
published.
The contents of this manual (Volume One) apply to HP Models 78352A/C, 78353A, 78353B,
78354A and 78354C series, 78832A, 78833A, 78833B, 78834AfC series, and 78356A with the
following serial numbers prefixed:
MODELS PREFIX
78352A 2640G
78352C
78353A
78353B 2612G
78354A 2613G
78354C
78356A 2717G
First
2348G
First Issue
Issue
MODEL
78832A
78833A
78833B
788348
78834C
PREFIX
2412G
24136
2610G
2611G
First Issue
Instruments with higher serial numbers may contain production changes. In such cases refer
to the Manual Change sheets and Publication Change Notices enclosed with this manual.
Hewlett-Packard reserves the right to make changes in its products without notice in order to
improve design or performance characteristics. Hewlett-Packard products are sold on the basis
of the specifications valid on the day of purchase. Hewlett-Packard is not obliged to update
instruments which have already been retailed.
CONTENTS OVERVIEW
This manual contains service information for the Hewlett-Packard 78352/3/4, 78832/3/4 and
78356A monitors. The information is divided into two sections:
w Chapter 1 - Service
n
Chapter 2 - Schematics
n
Chapter 3 - Replaceable Parts
Further sections covering Theory of Operation and Maintenance Checks are contained in
Volume 1 of the manual (part number 78354-9000A).
78352A
78352C ) monitors are and 78832A 1 monitors are
78353~ 1 referred to 78833A ) referred to
78353~ 1 in text as
783548 ) 783Xx
78354C ) 78334C )
>
Operating Guide 78834-92001
Installation Guide 78834-90011
Operating Guide 78356-90001
Installation Guide 78356-90011
Series
78833~ ) in text as
788348 ) 788Xx Series
iv
Special Notation
Notes, cautions, and/or warnings may accompany the instructions in this manual. They are
defined below:
Note
3
Caution
0
Warning
Notes provide emphasis to information or additional information “off line”
from a procedure.
Cautions highlight procedures that must be followed to avoid damage to the
recorder.
Warnings highlight procedures that must be followed to avoid hazards to human
life or safety.
V
Contents
1.
Service
Introduction
Disassembly and General Service Precautions
Cleaning
Extender Boards
Display uP Board Exchange
.............................
..............................
..........................
.....................
..............
1-1
1-2
1-3
1-3
1-3
la. Disassembly Procedures
3/4 and Full Modules
Top cover removal
Board Removal (display uP, interpolation or parameter)
Power Supply Assembly Removal
Power Supply Disassembly
Audio Module Removal
Front Panel Removal
Front Panel Disassembly
NIBP Board and Pump Removal
Mother Board Removal
lb. Reassembly Procedures
3/4 and Full Modules
Mother Board Installation
Board Installation
Front Panel Reassembly
Front Panel Installation
Power Supply Reassembly
Power Supply Assembly Installation
NIBP Pump and Board Reassembly (78352A/C and 78354A/C)
Cover Installation
..........................
..........................
.........................
.........................
...................
......................
.......................
........................
.......................
...................
.......................
.........................
......................
.......................
.......................
......................
..................
.........
.....
1a-1
1a-1
1a-1
1a-2
1a-3
1a-5
1a-6
1a-7
1a-9
1a-14
1b-1
1b-1
1b-2
1b-3
1b-5
1b-6
1b-9
1b-10
1b-10
1c. Adjustments
Introduction
CRT Adjustments
Interpolation Board Adjustments
Gain and Offset Adjustments
Baseline Width Adjustment
ECG Adjustments
Offset Adjustment
Notch Filter Adjustment
Power Supply Adjustments
System 780 Annotating Analog Interface (Opt. J11)
System 780 Configuration Adjustments
.............................
..........................
.........................
........................
......................
......................
...................
....................
....................
................
...........
1c-1
1c-2
1c-4
1c-4
1c-4
1c-7
1c-7
1c-7
1c-8
1c-9
1c-9
Contents-1
Offset Adjustment ........................
SDN Configuration Adjustments
Instrument Identity ........................
Instrument Data Transmission Errors
Instrument Status Word
Binary to Hex Conversion Table
1d. Jumpers & Switch Programming
Jumpers & Switch Programming for all Boards
Mother Board: 78353-66501t and 78354-66501
Programming Switch S1
Conditions when switch closed
Programming Switch S2
Condition when switch closed
Programming Switch S3
Programming Switch S4
Summary of S1 and S2 switch positions for 78354-66501 Mother Board:
Display uP Board 78353/4-66502, 78354-66602 and 78354-66702
3-1. Overall Assembly for Revison A,B and C
3-2. Power Supply Assembly
.......................
3-3. Rear Panel Mechanical Parts/Chasis
............... 3-125
................. 3-127
3-4. General Internal Parts for Non-Invasive Pressure
3-126
............ 3-129
Contents-9
Tables
1c-1. System Output Configurations
1e-1. Error Code Key - Fault Diagnosis
2a-1. Index of Schematics contained in Chapter II
2a-2. Board Compatibility Chart
3-1. List of Abbreviations
3-2. Rear Panel Mechanical Parts / Chasis ................. 3-127
3-3. General Internal Parts for Non-Invasive Pressure
........................
.................... 1c-12
................... 1e-2
.............. 2a-2
......................
............
2a-4
3-129
3-3
Contents-10
Service
Introduction
Chapters la, lb, lc, Id and le provide all the Service information required for the 78XxX
Series Patient and Neonatal Monitors. The Service Chapters cover the following:
n
Chapter la Disassembly Procedures
q
Top cover removal
o Board removal
(Display UP, Interpolation, Parameter)
q
Power supply assembly removal
q
Power supply disassembly
q
Audio module removal
q
Front panel removal
q
Front panel disassembly
q
NIBP Board and Pump removal
78354A/C monitor..78352A/C monitor
q
Mother Board removal
n
Chapter lb Reassembly Procedures
q
Mother Board installation
q
Board installation
o Front panel reassembly
q
Front panel installation
q
Power supply reassembly
o Power supply assembly installation
o NIBP reassembly
0 Cover installation
1
n
Chapter lc Adjustments
H Chapter Id Jumpers and Switch Programming
n
Chapter le Error Codes and Messages
Service l-1
Disassembly and General Service Precautions
Caution
Read the following precautions thoroughly before performing any of the
disassembly procedures. Serious damage to the instrument can result if the
precautions are not strictly followed.
Y
n
The front panel is vulnerable to scratching. Avoid rough handling of the panel.
n
When the chassis is removed from the case, bare metal edges are exposed which can scratch
the work surface. Be careful that the sharp edges and corners of the chassis do not scratch
the work area surface.
n
The input amplifiers have a floating ground section which is isolated from the remainder of
the board.
Never handle this section of the board - oil, dirt, dust, etc., deposited on this section can
cause leakage paths which can degrade floating circuit isolation and performance.
n
Handle all circuit boards by the edges; CMOS circuits operate with currents in the
nanoampere range and leakage paths caused by skin oils, dirt, dust, etc., can cause
inaccurate circuit performance.
w As all of the screws in the Monitor have been treated with a special varnish they should not
be screwed in and out more than about ten times. After this, replace with new screws.
n
Generally, the insulation resistance of the oxide layer in MOS IC structures is very high, and
the oxide layer is very thin. Because of this, it is possible that the static voltages usually
present on clothes and the human body will be enough to generate a potential difference
across the insulator, high enough to cause a breakdown of the insulating layer.
The following precautions should be taken while handling these ICs. Particular care should be
taken under conditions of low humidity.
1. Store new ICs by inserting them into a urethanepolyester cushion (which is conductive), or
wrapping them in aluminium foil, so that all the pins are at the same potential.
(The ICs should be stored in that manner until mounted on the circuit board.)
2. Check the soldering iron for possible power-line leakage current. To do this, connect an
ohmmeter to the tip of the soldering iron and the plug. If there is a leakage path, use
another soldering iron.
3. Equalize any potential difference between the clothes, the tools in use, the work bench,
the set being worked on, and the packaged IC by touching them all in succession with the
hands or a conductive wire or tool.
4. When it is necessary to handle the IC with the fingers, do not touch any pin, hold the IC
at the ends of its plastic package case.
Warning
AVOID ELECTROSTATIC DISCHARGE !
l-2 Service
The following precautions should be observed prior to beginning disassembly:
1. Turn the instrument off.
2. Remove the power cord and all signal cables from the rear panel.
Warning
In Chapter la the disassembly procedures are arranged from top assembly downwards.
Chapter lb contains information on reassembly.
If the instrument is to be reconnected and the power turned on with the rear
panel removed, low voltage and dangerous high voltage sources would be
exposed. Be careful. Do not power up the chassis on a conductive surface
such as a bare metal table. Place the chassis on a non-conductive material,
such as heavy cardboard.
Cleaning
The instrument should be clean and free of dust and dirt. Clean as required with a lint-free
cloth or sponge dampened with warm soapy water or alcohol. The front panel is more
sensitive to scratching than the other surfaces of the Monitor. Be careful, especially when
cleaning this surface.
Caution
dl
Do not allow any liquid to enter the instrument case. Do not pour liquid on
the instrument while cleaning. Never use any abrasive material such as steel
wool or silver polish, and never use strong solvents as acetone to clean the
monitor.
Extender Boards
Four extender boards and one cable are needed for servicing the Monitor:
lx 5061-5640
1 x 5061-5641 Interpolation Board / Display UP Board
1 x 5060-1805
1 x 78353-66589 Power Supply Extender Board (15 pin connector)
1 x 78353-61607 Power Supply Extender Cable
Parameter Board / Display UP Board
System Board
Display UP Board Exchange
After exchanging the Display UP Board, wait at least 20 seconds before switching the
instrument back on, otherwise an error message will be generated
Service l-3
Disassembly Procedures
314 and Full Modules
Top cover removal
1. Undo and remove the 4 upper screws on the instrument case.
2. Raise the front of the top cover and lift cover off.
Die beiden oberen Fotos von alter Seite l-5 nebeneinander hier einfiigen
la
Board Removal (display UP, interpolation or parameter)
1. Lift out the board stabilizer which holds the boards in place.
2. Undo the colored plastic clips at either end of the board.
Die beiden unteren Fotos von alte Seite l-5 nebeneinander hier einfiigen
Disassembly Procedures 1 a-l
3. Lift the board out.
Note
3
Das erste Foto von alte Seite l-6 hier einfiigen
For Parameter Boards, to remove the plastic cover pull forward. Be careful
with contact spring at reassembly.
Power Supply Assembly Removal
1. Undo the screw holding the power supply assembly in place. This screw has a compression
washer underneath which must be re-fitted. On monitors with NIBP, detatch pressure tube
from input connector and NIBP board, also detatch power supply lead from NIBP board.
2. Lift out the power supply assembly, complete with NIBP pump (if fitted).
Die zweiten und dritten Fotos von alte Seite l-6 hier einfiigen
la-2 Disassembly Procedures
Power Supply Disassembly
1. Remove the power supply cover by undoing the two screws on the top and the three screws
on the side.
Das let&e Foto von alte Seite l-6 hier einfiigen
2. For access to the secondary power supply board A6, unscrew the rear panel assembly
(2 screws).
3. Disconnect the transformer and battery connector (not shown).
Die beiden oberen Fotos von alter Seite l-7 nebeneinander hier einfiigen
4. Loosen the potential equalisation connector with a socket wrench and remove.
5. Slide out rear panel insert. (On later models the label is removed from underneath).
Die beiden unteren Fotos von alter Seite l-7 nebeneinander hier einfiigen
Disassembly Procedures 1 a-3
6. Undo two screws holding the power inlet in position (required only for access to power
inlet).
7. For access to the primary power supply board A7, undo the three screws holding it into
position.
Die beiden oberen Fotos von alter Seite 1-8 nebeneinander hier einfiigen
8. Power supply board A7 is now fully accessible.
Das letzte Foto von alte Seite l-8 hier einfiigen
1 a-4 Disassembly Procedures
1. Press the button on the top of the audio module cover, and pull the cover off the module.
Later models have a screw in the rear panel to secure the audio cover.
2. Undo the 1 or 2 screws on the inside of the audio module. Later models have only one
screw, remove this and slide the complete audio module out after disconnecting audio
module cable and battery board cable (optional).
Die beiden oberen Fotos von alter Seite l-9 nebeneinander hier einfiigen
3. Pull audio module a little away from the rear of the instrument and disconnect the cable
from the battery board. The battery board can now be removed (optional).
4. Disconnect the ribbon cable from X9 (and X19 if applicable) on the mother board and feed
out through the slot in the rear bracket. The audio module can now be removed.
Die beiden unteren Fotos von alter Seite l-9 nebeneinander hier einfiigen
Disassembly Procedures
1 a-5
Front Panel Removal
1. The parameter boards must be lifted out before the front panel can be removed.
2. Disconnect the CRT socket, the ground wire, the cable to the keyboard assembly, the HV
connection and the choke connection.
Die beiden oberen Fotos von alter Seite l-10 nebeneinander hier einfiigen
3. Undo the screw on the inside of the front panel, next to the CRT, and tilt the front panel
assembly forwards.
4. 788Xx series, 78352C, 78354C
Disconnect the three lamp board wires from the mother board.
Die beiden unteren Fotos von alter Seite l-10 nebeneinander hier einfiigen
la-6 Disassembly Procedures
5. 788Xx Series only
Undo the one screw on the lamp board and remove as shown (push the lamps from the
front of the panel to access the board).
78352C, 78354C and 78834C
The LED lamp board is mounted with two screws to the keyboard assembly and can only
be removed with the complete keyboard assembly.
6. Lift front panel assembly out.
Die beiden oberen Fotos von alter Seite l-11 nebeneinander hier einfiigen
Front Panel Disassembly
1. Unscrew the two CRT holders, one on either side of the tube.
2. Lift out the CRT, the CRT holders, grounding spring (earlier models have a side hook
which needs to be unclipped, it is not necessary on later models and cannot be re-ordered).
Die beiden unteren Fotos von alter Seite l-11 nebeneinander hier einfiigen
Disassembly Procedures la-7
3. Unscrew the parameter connector assemblies (the type and fitting of the connector
assemblies varies depending on parameter configuration).
4. The cover can now be lifted off the assembly
(as
shown) and the connector can also be
removed from the front panel.
Note
Some connector boards have spring contact for shield connection. Be careful
at reassembly to avoid damaging the spring.
Die beiden oberen Fotos von alter Seite 1-12 nebeneinander hier einfiigen
5. Not applicable to the 78352C, 78354C and 78834C monitors:
Undo three screws to remove the keyboard assembly. (The keyboard assembly on the
78352C, 78354C and 78834C monitors is not removable, it is glued to the front panel).
Das letzte Foto von alte Seite 1-12 hier einfiigen
1 a-8 Disassembly Procedures
NIBP Board and Pump Removal
78354A Monitors with old ac pump:
1. Pull out NIBP parameter board until access to the tube connections are possible.
Das erste Foto von alte Seite 1-13 hier einfiigen
2. Disconnect the tubes from the front panel and the T-piece leading to the pump. Leave
tube attached to board.
Das zweite Foto von alte Seite 1-13 hier einfiigen
Disassembly Procedures la-9
3. Disconnect cables from the pump control board to the parameter board. The board can
now be completely removed.
Das letzte Foto von Seite 1-13 hier einfuegen
4. Disconnect power supply to control board and to pump and remove the control board by
tilting towards pump to unclip it and then lift out.
Das erste Foto von Seite 1-14 hier einfuegen
la-10 Disassembly Procedures
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