HP 290 G1 PCI Product End-of-life Disassembly Instructions
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
1.0 Items Requiring Selective Treatment
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
PCA, PSU
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries PCA
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
PSU
1
External electrical cables and cords
AC Power Cable
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
System Fan
1
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
HP 290 G1 PCI Microtower Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
Tool Description
Tool Size (if
applicable)
Description #1 Crisscross Screw Driver
PH1
Description #2 Hexagon Screw Driver
T-15
Description #3 Electric Iron
QUICK 310
Description #4
Description #5
3.0 Product Disassembly Process
Step1 Loose thumb screw and remove
access panel.
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel (Step1)
2. Disconnect ODD/ HDD power cable and ODD/ HDD SATA cable from ODD (Step2~Step3)
3. Remove ODD/ HDD from chassis (Step4~Step7)
4. Remove all cables and heat sink from MB (Step8~Step11)
5. Remove the Memory/ CPU/ Battery from MB (Step12~Step14)
6. Remove front panel from chassis (Step15)
7. Remove MB from chassis (Step16)
8. Remove system fan (Step17)
9. PSU from chassis (Step17~Step19)
10. Separate PSU and remove the Electrolytic Capacitors (Step 20~Step23)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Step2 Disconnect ODD power cable and
ODD SATA cable from ODD.
Step3 Disconnect HDD power cable and
HDD SATA cable from HDD.
Step4 Remove the driver cage from
chassis
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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