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200 G4
QuickSpecs
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HP 200 G4 QuickSpecs

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QuickSpecs
HP 200 G4 22 All-in-One PC
Overview
Not all configuration components are available in all regions/countries.
c06521008 — DA-16604 — Worldwide — Version 6 — December 3, 2020
Page 1
Front
1.
Pull-up webcam and microphone
3.
SD media card reader
2.
Speakers
QuickSpecs
HP 200 G4 22 All-in-One PC
Overview
Not all configuration components are available in all regions/countries.
c06521008 — DA-16604 — Worldwide — Version 6 — December 3, 2020
Page 2
HP 200 G4 22 All-in-One PC
Rear
1.
Optical disc drive (optional)
6.
HDMI 1.4 out connector
2.
Power button
7.
Power connector
3.
Pull-up webcam
8.
Two (2) Type-A Hi-Speed USB 480Mbps signaling rate ports
4.
Microphone/Headphone Combo Jack
9.
Two (2) Type-A SuperSpeed USB 5Gbps signaling rate port
5.
RJ-45 (network) jack
10.
Standard cable lock slot
QuickSpecs
HP 200 G4 22 All-in-One PC
Features
Not all configuration components are available in all regions/countries.
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• Choice of Windows 10 Pro, Windows 10 Home, and FreeDOS
• Integrated All-in-One form factor
• 21.5-inch diagonal widescreen Full HD anti-glare display
• Intel® 10
th
generation processors, featuring integrated Intel® UHD Graphics
• Up to 32GB of DDR4 Synchronous Dynamic Random-Access Memory (SDRAM)
• Integrated 10/100/1000 Gigabit LAN Ethernet Controller
• Optional Wi-Fi 5 (802.11ac) wireless connectivity
• Integrated HD audio card and stereo speakers
• Integrated 5MP pull-up camera to ensure no accidental recording to safeguard user's privacy
• Expandable storage options with up to 512GB SSD and 2TB HDD
• Optional HP Slim Tray DVD Writer 8X Optical Drive
• 3-in-1 Media Card Reader
• TPM 2.0 support
• Low halogen
1
materials,
• Protected by HP Services. Terms and conditions vary by country. Certain restrictions and exclusions apply.
1. External power supplies, power cords, cables and peripherals are not low halogen. Service parts obtained after purchase may not be low halogen.
NOTE: See important legal disclosures for all listed specs in their respective features sections.
QuickSpecs
HP 200 G4 22 All-in-One PC
Features
Not all configuration components are available in all regions/countries.
c06521008 — DA-16604 — Worldwide — Version 6 — December 3, 2020
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Preinstalled
Windows 10 Pro 641 Windows 10 Home 641 Windows 10 Pro 64 (National Academic License)
1,2
Pre-installed (other)
FreeDOS
1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for updates. See http://www.windows.com.
2. Some devices for academic use will automatically be updated to Windows 10 Pro Education with the Windows 10 Anniversary Update. Features vary; see https://aka.ms/ProEducation for Windows 10 Pro Education feature information.
Intel® 10th Generation Core™ Processors
Intel® Core™ i5-10210U Processor
1.6 GHz base frequency Up to 4.2 GHz max. turbo frequency with Intel® Turbo Boost** 6 MB cache, 4 cores, 8 threads Intel® UHD Graphics Supports DDR4 memory up to 2666 MT/s data rate
Intel® Core™ i3-10110U Processor
2.1 GHz base frequency Up to 4.1 GHz max. turbo frequency with Intel® Turbo Boost** 4 MB cache, 2 cores, 4 threads Intel® UHD Graphics Supports DDR4 memory up to 2666 MT/s data rate
Intel® Pentium® Processors Intel® Pentium® Silver J5040 Processor
2.0 GHz base frequency Up to 3.2 GHz max. turbo frequency with Intel® Turbo Boost** 4 MB cache, 4 cores, 4 threads Intel® UHD Graphics 605 Supports DDR4 memory up to 2400 MT/s data rate
*Multicore is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and software configurations. Intel’s numbering, branding and/or naming is not a measurement of higher performance. **Intel® Turbo Boost performance varies depending on hardware, software and overall system configuration. See
http://www.intel.com/technology/turboboost for more information.
NOTE: In accordance with Microsoft’s support policy, HP does not support the Windows 8 or Windows 7 operating system on products
configured with Intel and AMD 7th generation and forward processors or provide any Windows 8 or Windows 7 drivers on
http://www.support.hp.com.
QuickSpecs
HP 200 G4 22 All-in-One PC
Features
Not all configuration components are available in all regions/countries.
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Integrated
Intel® UHD Graphics Intel® UHD Graphics 605
NOTE: Intel® integrated UHD Graphics varies by processor
Non-Touch
21.5" diagonal FHD IPS anti-glare WLED-backlit (1920 x 1080)
21.5" diagonal FHD VA anti-glare WLED-backlit (1920 x 1080)
M.2 PCIe NMVe Solid State Drives (SSD)
256GB 2280 PCIe NVMe Solid State Drive 512GB 2280 PCIe NVMe Solid State Drive 128GB 2280 PCIe NVMe TLC Solid State Drive 256GB 2280 PCIe NVMe TLC Solid State Drive 512GB 2280 PCIe NVMe TLC Solid State Drive
3.5 inch 7200RPM SATA Hard Disk Drives (HDD)
500GB 7200RPM 3.5in HDD 1TB 7200RPM 3.5in HDD 2TB 7200RPM 3.5in HDD
Optical Disc Drives
9.5mm Ultra Slim DVD-Writer
Media Card Reader
SD Card Reader with 3-in1 Interface (Supports SD, SDHC, SDXC)
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows 10) is reserved for system recovery software.
Maximum
DDR4 SODIMM up to 2666MT/s
Memory Slots
2 SODIMM
Available Configurations
4GB (4GB x1) 8GB (4GB x2) 8GB (8GB x1) 16GB (8GB x2) 16GB (16GB x1) 32GB (16GB x2)
NOTE: Actual data rate is determined by both the system's configured processor and memory module installed.
QuickSpecs
HP 200 G4 22 All-in-One PC
Features
Not all configuration components are available in all regions/countries.
c06521008 — DA-16604 — Worldwide — Version 6 — December 3, 2020
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Wireless LAN*
Realtek® RTL8822CE Wi-Fi 51 (802.11ac) 2x2 Wi-Fi M.2 Card2 Realtek® RTL8821CE Wi-Fi 51 (802.11ac) 1x1 Wi-Fi M.2 Card
2
Ethernet (RJ-45) Integrated
Realtek® RTL8111HSH-CG Gigabit Ethernet Controller
*Wireless access point and internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi 5 is backwards compatible with prior 802.11 specs.
1. Wireless access point and Internet service required and sold separately. Availability of public wireless access points limited.
2. Must be configured at time of purchase.
High Definition Audio
Integrated Realtek ALC3247 Audio Codec High performance integrated stereo speakers
3.5mm combo (microphone/headphone) jack
Webcams & Mic
Integrated 5MP webcam, Up to 30 frames/sec, dual array microphone included
Keyboards
HP Universal USB Wired Keyboard
Mice
HP USB Optical Mouse HP USB Hardened Optical Mouse HP USB Universal Mouse
NOTE: Availability may vary by country
QuickSpecs
HP 200 G4 22 All-in-One PC
Features
Not all configuration components are available in all regions/countries.
c06521008 — DA-16604 — Worldwide — Version 6 — December 3, 2020
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HP Support
HP PC Hardware Diagnostics HP Cloud Recovery HP Support Assistant
Internet Security and Antivirus
McAfee LiveSafe (30-day subscription)1
Product Setup
HP JumpStarts
Security Features
Trusted Platform Module (TPM) 2.0 (firmware)
2,3
Productivity
Xerox® DocuShare® (90 days free trial offer)4
1. 30 day trial period. Internet access required to receive updates. First update included. Subscription required for updates thereafter
2. TPM feature will not be supported on machines pre-configured with FreeDOS and Linux
3. In selected countries, machines pre-configured with Windows OS will be shipped with TPM disabled.
4. Simply sign up and start using Xerox® DocuShare® Go. No credit card. No obligation. Data will become unavailable unless a subscription
is entered before the end of the 90 day free trial period. See visit https://xerox.com/docusharego for details.
Power Supply
HP Smart 65W External AC power adapter
Rear I/O Ports
Two (2) Type-A Hi-Speed USB 480Mbps signaling rate ports Two (2) Type-A SuperSpeed USB 5Gbps signaling rate ports One (1) RJ-45 (network) jack One (1) HDMI 1.4 out connector One (1) Microphone/Headphone Combo Jack One (1) DC in power
Bottom I/O Ports
One (1) 3 in 1 Card reader (SD, SDHC, SDXC)
Internal I/O Ports
One (1) M.2 PCIe x1 2230 (for WLAN) One (1) M.2 PCIe x4 2280 for Intel® Core™ / One (1) M.2 PCIe x1 2280 for Intel® Pentium® configurations One (1) SATA storage connector
Bays
One (1) 3.5” internal storage drive
QuickSpecs
HP 200 G4 22 All-in-One PC
Features
Not all configuration components are available in all regions/countries.
c06521008 — DA-16604 — Worldwide — Version 6 — December 3, 2020
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Weight
21.5 Non-Touch Product Weight (Unboxed)
Without Stand
5.15 kg, 11.35 lbs
Basic Stand
5.7 kg, 12.57 lbs
21.5 Shipping Weight (Boxed)
8.16 kg, 17.99 lbs
21.5 Shipping Weight (Pallet)
167.61 kg, 369.52 lbs
Dimension
21.5 System Dimensions
Without Stand
490.3 x 322.0 x 58.1 mm
19.3 x 12.68 x 2.29 in
Basic Stand
490.3 x 380.74 x 204.51 mm
19.3 x 14.99 x 8.05 in
21.5 Shipping Dimensions (Boxed)
593 x 478 x 243 mm, 23.35 x 18.82 x 9.57 in
21.5 Shipping Dimensions (Pallet)
1186 x 972 x 1569 mm, 46.69 x 38.27 x 61.77 in
21.5 Pallet Quantity (including Touch, Non-Touch)
24
QuickSpecs
HP 200 G4 22 All-in-One PC
Features
Not all configuration components are available in all regions/countries.
c06521008 — DA-16604 — Worldwide — Version 6 — December 3, 2020
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• Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit is
operated within the specified operating range.
• Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow.
• Never restrict airflow into the computer by blocking any vents or air intakes.
• Do not stack computers on top of each other or place computers so near each other that they are subject to each other's re-
circulated or preheated air.
• Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign matter can block the vents and limit the airflow.
• If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the
enclosure, and the same operating guidelines listed above will still apply.
Temperature Range
Operating: 50° to 95° F (10° to 35° C)* Non-operating: -22° to 140° F(-30° to 60° C)
Relative Humidity
Operating: 10% to 90% (non-condensing at ambient) Non-operating: 5% to 95% (non-condensing at ambient)
Maximum Altitude (unpressurized)
Operating: 5000m Non-operating: 50000ft (15240 m)
NOTE:. Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.
QuickSpecs
HP 200 G4 22 All-in-One PC
Technical Specifications – Display
Not all configuration components are available in all regions/countries.
c06521008 — DA-16604 — Worldwide — Version 6 — December 3, 2020
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21.5" diagonal FHD IPS anti-glare WLED-backlit (1920 x 1080)
Non-touch
Type
IPS WLED Backlit LCD
Active area (mm)
476.064 x 267.786
Native resolution (HxV)
1920 x 1080
Refresh rate
60 Hz @ 1920 x 1080
Aspect ratio
16:9
Pixel pitch (HxV)(mm)
0.24795 x 0.24795
Contrast ratio (typical)
1000:1
Brightness (typical)
250nits
Viewing angle (typical) (HxV)
178 ° x 178 °
Backlight lamp life (to half brightness)
30,000 hours minimum
Color support
Up to 16.7 million colors with the use of FRC technology
Color gamut (typical)
NTSC 72%
Anti-glare
Yes Response time (typical)
14ms
Default color temperature
Warm (6500K)
NOTE: All performance specifications represent the typical specifications provided by HP's component manufacturers; actual performance may vary either higher or lower.
21.5" diagonal FHD VA anti-glare WLED-backlit (1920 x 1080) Non-touch
Type
VA WLED Backlit LCD
Active area (mm)
476.064 x 267.786
Native resolution (HxV)
1920 x 1080
Refresh rate
60 Hz @ 1920 x 1080
Aspect ratio
16:9
Pixel pitch (HxV)(mm)
0.24795 x 0.24795
Contrast ratio (typical)
3000:1
Brightness (typical)
250nits
Viewing angle (typical) (HxV)
178° x 178°
Backlight lamp life (to half brightness)
30,000 hours minimum
Color support
Up to 16.7 million colors with the use of FRC technology
Color gamut (typical)
NTSC 72%
Anti-glare
Yes
Response time (typical)
18ms
Default color temperature
Warm (6500K)
NOTE: All performance specifications represent the typical specifications provided by HP's component manufacturers; actual performance may vary either higher or lower.
QuickSpecs
HP 200 G4 22 All-in-One PC
Technical Specifications – Stand
Not all configuration components are available in all regions/countries.
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Articulating Stand
Tilt Angle
-5° to +20°
Rotation (Swivel)
None
Pivot
None
QuickSpecs
HP 200 G4 22 All-in-One PC
Technical Specifications – Storage
Not all configuration components are available in all regions/countries.
c06521008 — DA-16604 — Worldwide — Version 6 — December 3, 2020
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500 GB 7200RPM 3.5in SATA HDD
Capacity
500 GB
Rotational Speed
7,200 rpm
Interface
SATA 6.0 Gb/s
Buffer Size
32 MB
Logical Blocks
976,773,168
Seek Time
11 ms (Average)
Height
1 in/2.54 cm
Width
Media diameter: 3.5 in/8.89 cm Physical size: 4 in/10.2 cm
Operating Temperature
41° to 131° F (5° to 55° C)
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows 10) of system disk is reserved for the system recovery software.
1 TB 7200RPM 3.5in SATA HDD
Capacity
1 TB
Rotational Speed
7,200 rpm
Interface
SATA 6 Gb/s
Buffer Size
64 MB
Logical Blocks
1,953,525,168
Seek Time
11 ms (Average)
Height
1 in/2.54 cm
Width (nominal)
Media diameter: 3.5 in/8.89 cm Physical size: 4 in/10.2 cm
Operating Temperature
41° to 131° F (5° to 55° C)
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows 10) of system disk is reserved for the system recovery software.
2 TB 7200RPM 3.5in SATA HDD
Capacity
2 TB
Rotational Speed
7,200 rpm
Interface
SATA 6 Gb/s
Buffer Size
64 MB
Logical Blocks
3,907,029,168
Seek Time
11 ms (Average)
Height
1.028 in/26.11 mm
Width (nominal)
4.0 in/101.6 mm
Operating Temperature
41° to 131° F (5° to 55° C)
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows 10) of system disk is reserved for the system recovery software.
QuickSpecs
HP 200 G4 22 All-in-One PC
Technical Specifications – Storage
Not all configuration components are available in all regions/countries.
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256 GB M.2 2280 PCIe NVMe SSD
Drive Weight
< 10g
Capacity
256 GB
Height
2.38mm
Length
80mm
Width
22mm
Interface
PCIE Gen3
Maximum Sequential Read
Up to 1600MB/s
Maximum Sequential Write
Up to 780MB/s
Logical Blocks
500,118,192
Operating Temperature
0° to 70°C (32° to 158°F) [ambient temp]
Features
APST; ASPM L1.2; NVME spec 1.2
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows 10) of system disk is reserved for the system recovery software.
512 GB M.2 2280 PCIe NVMe SSD
Drive Weight
< 10g
Capacity
512 GB
Height
2.38mm
Length
80mm
Width
22mm
Interface
PCIE Gen3
Maximum Sequential Read
Up to 1600MB/s
Maximum Sequential Write
Up to 860MB/s
Logical Blocks
1,000,215,216
Operating Temperature
0° to 70°C (32° to 158°F) [ambient temp]
Features
APST; ASPM L1.2; NVME spec 1.2
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows 10) of system disk is reserved for the system recovery software.
128 GB M.2 2280 PCIe NVMe Three Layer Cell SSD
Drive Weight
< 10g
Capacity
128 GB
Height
2.38mm
Length
80mm
Width
22mm
Interface
PCIE Gen3
Maximum Sequential Read
Up to 2800MB/s
Maximum Sequential Write
Up to 600MB/s
Logical Blocks
250,069,680
Operating Temperature
0° to 70°C (32° to 158°F) [ambient temp]
Features
APST; ASPM L1.2; NVME spec 1.2
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows 10) of system disk is reserved for the system recovery software.
QuickSpecs
HP 200 G4 22 All-in-One PC
Technical Specifications – Storage
Not all configuration components are available in all regions/countries.
c06521008 — DA-16604 — Worldwide — Version 6 — December 3, 2020
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256 GB M.2 2280 PCIe NVMe Three Layer Cell SSD
Drive Weight
< 10g
Capacity
256GB
Height
2.38mm
Length
80mm
Width
22mm
Interface
PCIE Gen3
Maximum Sequential Read
Up to 2700MB/s
Maximum Sequential Write
Up to 1000MB/s
Logical Blocks
500,118,192
Operating Temperature
0° to 70°C (32° to 158°F) [ambient temp]
Features
APST; ASPM L1.2; NVME spec 1.2
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows 10) of system disk is reserved for the system recovery software.
512 GB M.2 2280 PCIe NVMe Three Layer Cell SSD
Drive Weight
< 10g
Capacity
512 GB
Height
2.38mm
Length
80mm
Width
22mm
Interface
PCIE Gen3
Maximum Sequential Read
Up to 2900MB/s
Maximum Sequential Write
Up to 1100MB/s
Logical Blocks
1,000,215,216
Operating Temperature
0° to 70°C (32° to 158°F) [ambient temp]
Features
APST; ASPM L1.2; NVME spec 1.2
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows 10) of system disk is reserved for the system recovery software.
HP 9.5mm Slim DVD Writer Drive
Height
9.5 mm height
Orientation
Either horizontal or vertical
Interface type
SATA/ATAPI
Disc recording capacity
Up to 8.5 GB DL or 4.7 GB standard
Dimensions (W x H x D)
5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel
Weight (max)
0.31 lb (140 g)
Write Speeds
DVD-R DL - Up to 6X DVD+R - Up to 8X DVD+RW - Up to 8X DVD+R DL - Up to 6X DVD-R - Up to 8X DVD-RW - Up to 6X CD-R - Up to 24X CD-RW - Up to 10X
Read Speeds
DVD-RW, DVD+RW - Up to 8X
QuickSpecs
HP 200 G4 22 All-in-One PC
Technical Specifications – Storage
Not all configuration components are available in all regions/countries.
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DVD-R DL, DVD+R DL - Up to 8X DVD+R, DVD-R - Up to 8X DVD-ROM DL, DVD-ROM - Up to 8X CD-ROM, CD-R - Up to 24X CD-RW - Up to 24X
Access time (typical reads, including settling)
Random DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical) Full Stroke DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical) Stop Time 6 seconds (typical)
Power
Source Slimline SATA DC power receptacle DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental conditions (operating - non-condensing)
Temperature 41° to 122° F (5° to 50° C) Relative Humidity 10% to 80% Maximum Wet Bulb Temperature 84° F (29° C)
QuickSpecs
HP 200 G4 22 All-in-One PC
Technical Specifications - Audio
Not all configuration components are available in all regions/countries.
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Type
Integrated
HD Audio Codec
Realtek ALC3247 Audio Codec
Audio I/O Ports
Rear 3.5mm combo (microphone/headphone) jack (32 Ohm) supporting CTIA and OMTP style headset Microphone(2K Ohm)
Analog Audio
Yes Internal Speaker Amplifier
2W per channel stereo amplifier for the internal speakers only
Internal Speaker
Yes - Stereo Speaker
DAC Sampling Rates
44.1 kHz/48 kHz/96 kHz/192 kHz
ADC Sampling Rates
44.1 kHz/48 kHz/96 kHz/192 kHz
QuickSpecs
HP 200 G4 22 All-in-One PC
Technical Specifications – Input/Output
Not all configuration components are available in all regions/countries.
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HP Universal USB Wired Keyboard
Physical Characteristics
Keys
104, 105 layout (depending upon country)
Dimensions (L x W x H)
18.15 x 6.02 x 1.08 in (461 x 153 x 27.4 mm) Weight
1.32 lb (600g) min
Electrical
Operating voltage
5 VDC, +/-5%
Power consumption
50mA Max (All LED on)
System interface
USB Type A plug connector
ESD
Contact Discharge: 8 KV Air Discharge: 15 KV
EMI - RFI
Conforms to FCC rules for a Class B computing device
Mechanical
Keycaps
Mid-profile design
Switch actuation
60±10g nominal peak force with tactile feedback
Switch life
10 million keystrokes (Life tester)
Switch type
Contamination-resistant switch membrane
Key-leveling mechanisms
For all double-wide and greater-length keys
Cable length
6 ft (1.8 m)
Environmental
Acoustics
43-dBA maximum sound pressure level
Operating temperature
50° to 122° F (10° to 50° C)
Non-operating temperature
-22° to 140° F (-30° to 60° C)
Operating humidity
10% to 90% (non-condensing at ambient)
Non-operating humidity
20% to 80% (non-condensing at ambient)
Operating shock
40 g, six surfaces
Non-operating shock
80 g, six surfaces
Operating vibration
2-g peak acceleration
Non-operating vibration
4-g peak acceleration
Drop (out of box)
26 in (66 cm) on carpet, six-drop sequence
Drop (in box)
30 in (76.2 cm) on concrete, 16-drop sequence
QuickSpecs
HP 200 G4 22 All-in-One PC
Technical Specifications – Input/Output
Not all configuration components are available in all regions/countries.
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HP USB Universal Wired Mouse
Dimensions (H x L x W)
4.21 x 2.64 x 1.52 in (107 x 67 x 38.7 mmm)
Weight
0.19lb (90g)
Environmental
Operating temperature
50° to 122° F (10° to 50° C)
Non-operating temperature
-22° to 140° F (-30° to 60° C)
Operating humidity
10% to 90% (non-condensing at ambient)
Non-operating humidity
20% to 80% (non-condensing at ambient)
Operating shock
50 g, 6 surfaces
Non-operating shock
80 g, 6 surfaces
Operating vibration
2-g peak acceleration
Non-operating vibration
4-g peak acceleration
Electrical
Operating voltage
5 VDC, +/-5%
Power consumption
50mA Max
Resolution
800, 1200, 1600 DPI
Tracking speed
31 inch/sec (max)
Tracking acceleration
8G(max), 1G=9.8m/s3
Mechanical
Connector
USB 2.0
Cable length
6 ft (1.8 m)
QuickSpecs
HP 200 G4 22 All-in-One PC
Technical Specifications – Input/Output
Not all configuration components are available in all regions/countries.
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HP USB Optical Mouse
Dimensions (H x L x W)
4.53 x 2.50 x 1.40 in (115 x 63.46 x 35.48 mmm)
Weight
0.18lb (80g)
Environmental
Operating temperature
50° to 122° F (10° to 50° C)
Non-operating temperature
-22° to 140° F (-30° to 60° C)
Operating humidity
10% to 90% (non-condensing at ambient)
Non-operating humidity
20% to 80% (non-condensing at ambient)
Operating shock
40 g, six surfaces
Non-operating shock
80 g, six surfaces
Operating vibration
2-g peak acceleration
Non-operating vibration
4-g peak acceleration
Electrical
Operating voltage
5 VDC, +/-5%
Power consumption
50mA Max
Resolution
1,000 DPI
Sensor
Pixart PAN3606DL
Tracking speed
30 inch/sec (max)
Tracking acceleration
9G(max), 1G=9.8m/s2
Mechanical
Connector
USB 2.0
Cable length
6 ft (1.8 m)
QuickSpecs
HP 200 G4 22 All-in-One PC
Technical Specifications - Networking
Not all configuration components are available in all regions/countries.
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Realtek® RTL8111HSH-CG Gigabit Ethernet Controller
Ethernet Features
10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14) 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30) 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40) Auto-Negotiation (Automatic Speed Selection) Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s IEEE 802.1p QoS (Quality of Service) Support IEEE 802.1q VLAN support IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable) IEEE 802.3az EEE (Energy Efficient Ethernet) Jumbo Frame 9K Auto MDI/MDIX Crossover cable detection
Power Management
ACPI compliant – multiple power modes Situation-sensitive features reduce power consumption Advanced link down power saving for reducing link down power consumption
Performance Features
TCP/IP/UDP Checksum Offload (configurable) Protocol Offload (ARP & NS) Large send offload and Giant send offload Receiving Side Scaling
Manageability
Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only) PXE 2.1 Remote Boot Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30)) Comprehensive diagnostic and configuration software suite Virtual Cable Doctor for Ethernet cable status
Interface
PCI Express 1.1 x1 to fully support ASPM L0s/L1 and CLKREQ
NIC Device Driver Name
PCIe GBE Ethernet Family Controller
Realtek RTL8822CE Wi-Fi 51 (802.11ac) 2x2 with Bluetooth® M.2
Wireless LAN Standards
IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac IEEE 802.11d IEEE 802.11e IEEE 802.11h IEEE 802.11i IEEE 802.11k IEEE 802.11r IEEE 802.11v
*NOTE: Wireless access point and internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi 5 is backwards compatible with prior 802.11 specs.
Interoperability
Wi-Fi® certified
Frequency Band
802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
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• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates
• 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz & 80MHz)
Modulation
Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security2
• IEEE 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• WAPI
Network Architecture Models
Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power3
• 802.11b : +18.5dBm minimum
• 802.11g : +17.5dBm minimum
• 802.11a : +18.5dBm minimum
• 802.11n HT20(2.4GHz) : +15.5dBm minimum
• 802.11n HT40(2.4GHz) : +14.5dBm minimum
• 802.11n HT20(5GHz) : +15.5dBm minimum
• 802.11n HT40(5GHz) : +14.5dBm minimum
• 802.11ac VHT80(5GHz) : +11.5dBm minimum
• 802.11ac VHT160(5GHz) : +11.5dBm minimum
Power Consumption
• Transmit mode :2.0 W
• Receive mode :1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode :50 mW (WLAN unassociated)
• Connected Standby/Modern Standby: 10mW
• Radio disabled: 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity4
802.11b, 1Mbps : -93.5dBm maximum
802.11b, 11Mbps : -84dBm maximum
802.11a/g, 6Mbps : -86dBm maximum
802.11a/g, 54Mbps : -72dBm maximum
802.11n, MCS07 : -67dBm maximum
802.11n, MCS15 : -64dBm maximum
802.11ac, MCS0 : -84dBm maximum
802.11ac, MCS9 : -59dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230: 2.3 x 22.0 x 30.0 mm
Weight
Type 2230: 2.8g
Operating Voltage
3.3v +/- 9%
Temperature
Operating Non-operating
14° to 158° F (–10° to 70° C) –40° to 176° F (–40° to 80° C)
Humidity
Operating Non-operating
10% to 90% (non-condensing) 5% to 95% (non-condensing)
Altitude
Operating Non-operating
0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
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LED Activity
LED Amber – Radio OFF; LED White – Radio ON
1. Wireless access point and Internet service required and sold separately. Availability of public wireless access points limited. 2. Must be configured at time of purchase.
2. Check latest software/driver release for updates on supported security features.
3. Maximum output power may vary by country according to local regulations.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0 Wireless Technology
Bluetooth Specification
4.0/4.1/4.2/5.0 Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy : 0~79 (1 MHz/CH) BLE : 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps
BLE : 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice channels. Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of + 4 dBm for BR and EDR.
Power Consumption
Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW
Bluetooth Software Supported Link Topology
Microsoft Windows Bluetooth Software Power Management
Microsoft Windows ACPI, and USB Bus Support
Certifications
FCC (47 CFR) Part 15C, Section 15.247 & 15.249 ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark
Bluetooth Profiles Supported
BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 –Link Layer Privacy LE Privacy 1.2 –Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP)
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Realtek RTL8821CE Wi-Fi 51 (802.11ac) 1x1 with Bluetooth® M.2
Wireless LAN Standards
IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac
Interoperability
Wi-Fi® certified
Frequency Band
802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates
• 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)
Modulation
Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security2
• IEEE 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
Network Architecture Models
Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power3
• 802.11b : +14dBm minimum
• 802.11g : +12dBm minimum
• 802.11a : +12dBm minimum
• 802.11n HT20(2.4GHz) : +12dBm minimum
• 802.11n HT40(2.4GHz) : +12dBm minimum
• 802.11n HT20(5GHz) : +10dBm minimum
• 802.11n HT40(5GHz) : +10dBm minimum
• 802.11ac VHT80(5GHz) : +10dBm minimum
Power Consumption
• Transmit mode2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity4
802.11b, 1Mbps : -93.5dBm maximum
802.11b, 11Mbps : -84dBm maximum
802.11a/g, 6Mbps : -86dBm maximum
802.11a/g, 54Mbps : -72dBm maximum
802.11n, MCS07 : -67dBm maximum
802.11n, MCS15 : -64dBm maximum
802.11ac, MCS0 : -84dBm maximum
802.11ac, MCS9 : -59dBm maximum
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Antenna type
High efficiency antenna. One embedded dual band 2.4/5 GHz antenna is provided to the card to support WLAN communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230 : 2.3 x 22.0 x 30.0 mm
Weight
Type 2230 : 2.8g
Operating Voltage
3.3v +/- 9%
Temperature
Operating Non-operating
14° to 158° F (–10° to 70° C) –40° to 176° F (–40° to 80° C)
Humidity
Operating Non-operating
10% to 90% (non-condensing) 5% to 95% (non-condensing)
Altitude
Operating Non-operating
0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF; LED White – Radio ON
1. Wireless access point and Internet service required and sold separately. Availability of public wireless access points limited. 2. Must be configured at time of purchase.
2. Check latest software/driver release for updates on supported security features.
3. Maximum output power may vary by country according to local regulations.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology
Bluetooth Specification
4.0/4.1/4.2 Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy : 0~79 (1 MHz/CH) BLE : 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps
BLE : 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR.
Power Consumption
Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW
Bluetooth Software Supported Link Topology
Microsoft Windows Bluetooth Software Power Management
Microsoft Windows ACPI, and USB Bus Support
Certifications
ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark
Bluetooth Profiles Supported
BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 –Link Layer Privacy LE Privacy 1.2 –Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX)
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Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP)
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Efficiency
65W EPS, 88% average efficiency at 115V & 89% at 230Vac
Operating Voltage Range
90Vac~264Vac
Rated Voltage Range
100Vac~240Vac
Rated Line Frequency
50Hz~60Hz
Operating Line Frequency
47Hz~63Hz
Rated Input Current
≦1.6A
Rated Input Current with Energy Efficient* Power Supply
≦1.6A
DC Output
+19.5V
Current Leakage (NFPA 99: 2102)
Less than 500 microamps of leakage current at 120 Vac with the ground wire disconnected, as required for Non-Patient Electrical Appliances and Equipment used in a patient care facility or that contact patients in normal use. Per section 10.3.5.1. Less than 100 microamps of leakage current at 120 Vac with the ground wire intact with normal polarity, as required for Non-Patient Electrical Appliances and Equipment used in a patient care facility or that contact patients in normal use. Per section 10.3.5.1.
Dimensions
102 x 55 x 30 mm
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Description
SMART Technology (Self-Monitoring, Analysis and Reporting Technology)
Allows hard drives to monitor their own health and to raise flags if imminent failures were predicted
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Technical Specifications - Environmental
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Eco-Label Certifications & declarations
This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks:
• IT ECO declaration
System Configuration
The configuration used for the Energy Consumption and Declared Noise Emissions data for the Desktop model is based on a “Typically Configured Desktop”.
Energy Consumption (in accordance with US ENERGY STAR® test method)
115VAC, 60Hz
230VAC, 50Hz
100VAC, 50Hz
Normal Operation (Short idle)
Normal Operation (Long idle)
Sleep
Off
NOTE: Energy efficiency data listed is for an ENERGY STAR® certified product if offered within the model family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY STAR® certified configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows® operating system. Search keyword
generator on HP’s 3rd party option store for solar generator accessories at
http://www.hp.com/go/options
Heat Dissipation*
115VAC, 60Hz
230VAC, 50Hz
100VAC, 50Hz
Normal Operation (Short idle)
Normal Operation (Long idle)
Sleep
Off
NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.
Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)
Sound Power
(L
WAd
, bels)
Sound Pressure
(L
pAm
, decibels)
Typically Configured – Idle
Fixed Disk – Random writes
Longevity and Upgrading
This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the product may include:
Spare parts are available throughout the warranty period and or for up to “5” years
after the end of production.
Batteries
This battery(s) in this product comply with EU Directive 2006/66/EC
Batteries used in the product do not contain:
Mercury greater the1ppm by weight Cadmium greater than 20ppm by weight
Battery size: CR2032 (coin cell) Battery type: Lithium
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Additional Information
• This product is in compliance with the Restrictions of Hazardous Substances
(RoHS) directive - 2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and
Electronic Equipment (WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of
California; Safe Drinking Water and Toxic Enforcement Act of 1986).
• Plastics parts weighing over 25 grams used in the product are marked per
ISO11469 and ISO1043.
• This product contains 38.3% post-consumer recycled plastic (by wt.)
• This product is 95.8% recycle-able when properly disposed of at end of life.
Packaging Materials
External:
PAPER/Corrugated
Internal:
PLASTIC/EPE (Expanded Polyethylene)
PLASTIC/Polyethylene low density
The plastic packaging material contains at least 90% recycled content.
The corrugated paper packaging materials contains at least 80% recycled content.
Material Usage
This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame
retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be
frequently handled or carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail
packaging has been voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage
HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and
cadmium in packaging materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging
materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging
materials.
• Use readily recyclable packaging materials such as paper and corrugated
materials.
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• Reduce size and weight of packages to improve transportation fuel
efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN
6120 standards.
End-of-life Management and Recycling
HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to:
http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office.
Products returned to HP will be recycled, recovered or disposed of in a responsible manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at:
http://www.hp.com/go/recyclers. These instructions may be used by recyclers and
other WEEE treatment facilities as well as HP OEM customers who integrate and re­sell HP equipment.
HP, Inc. Corporate Environmental Information
For more information about HP’s commitment to the environment:
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certifications:
http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
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Summary of Changes
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Date of change:
Version History:
Description of change:
March 13, 2020
V1 to V2
Update
First page call out number 1 corrected.
June 16, 2020
V2 to V3
Update
Rear image call outs and rear I/O ports updated
July 20, 2020
V3 to V4
Update
Rear image call out #9 and ports section speed corrected
September 24, 2020
V4 to V5
Addition
Xerox® DocuShare® and footnote to software section.
December 3, 2020
V5 to V6
Removal
Energy Star and EPEAT on Page 3, Page 28
Copyright © 2020 HP Development Company, L.P. The only warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.
Bluetooth is a trademark of its proprietor and used by HP Inc. under license. Intel®, Microsoft and Windows are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or other countries. Core, Celeron and Intel® vPro are registered trademarks or trademarks of Intel Corporation in the U.S. and/or other countries. ENERGY STAR is a registered trademark of the U.S. Environmental Protection Agency.
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