Honor 8X Schematics

1 2 3 4 5 6

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MODEM Schematic

Baseband Schematic

1. Contents

31. RF Interface

32. RF PMU

A

B

2. Block Diagramm

3. SOC PWR1

4. SOC PWR2

5. SOC PWR3

6. SOC HS Interface

7. SOC GPIO Interface

8. SOC RF Interface

9. SOC GND

10. PMU LDO

11. PMU BUCK & HI6422-1

12. PMU MISC & BUCKBOOST

13. HI6422-2

14. UFS and LPDDR

33. RF Transceiver

34. RF FRONT END HB

35. RF FRONT END B42

36. RF FRONT END MB

37. RF Front End LB

38. RF Front End Switch /Main ANT

39. RF Front End Diversity

40. RF Front End Diversity

41. Reserved for CDMA Modem

42. Reserved for CDMA Modem

43. Reserved for CDMA Modem

44. Reserved for CDMA Modem

45. Reserved for CDMA Modem

46. Reserved for CDMA Modem

47. Reserved for CDMA Modem

A

B

C

15. Battery & Fuel guage

16. USB/Scharger V300/Switch

17. LCD Interface

18. Reserved

19. Flash LED

20. Camera Interface

21. ISP Reserved

22. Codec HI6403

23. Audio/SPK/VIB

24. Headphone

25. Audio

26. X-Sensor1

48. Reserved for CDMA Modem

49. RESERVED

50. RESERVED

51. RF Front End M1

52. Hi1102 POWER

53. Hi1102 Interface

54. Hi1102_RF_FrontEnd_2G

55. Hi1102_RF_FrontEnd_5GHz

56. RF_FRONT_END_Diversity_M1

57. NFC

58. RF Transceiver2

59. RFIC2 PA+PMU

60. ANT Tuner

The type and specification of the components refer to the BOM

C

D

27. X-Sensor2

28. SIM/uSD Card

29. FPC Interface

DESIGNED

REVIEWED

CHENZHENBIN 00264464

HL1JSNM

MABO 00278126

VER PART_NUMBER

30. Test Point/Shielding

03025GKME

1

2 3 4 5 6

2018-07-06

DATEECA NO

03025GKM_SCH1ZH

SHEET OF

HUAWEI TECH CO.,LTD.

601_Contents

D

A

www.DeviceDB.xyz

Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

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1 2 3 4 5 6

2.Block Diagramm

A

B

C

B

C

The type and specification of the components refer to the BOM

D

DESIGNED

REVIEWED

CHENZHENBIN 00264464

MABO 00278126

HL1JSNM

VER PART_NUMBER

E

03025GKM

1

2 3 4 5 6

2018-07-06

DATEECA NO

03025GKM_SCH1ZH

SHEET OF

HUAWEI TECH CO.,LTD.

2_Block Diagramm

60

D

A

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Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

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1 2 3 4 5 6

3.SOC PWR1

A

VDD_CPU_B

B

C301

C310

C311

C312

C313

C321

C322

C304

2

C307

2

13

C305

4

4

2

3 1

13

C308

4

4

2

3 1

13

3 1

13

3 1

4

4

C306

4

C309

4

2

2

2

2

13

2

2

3 1

13

2

2

3 1

VOUT5_1V8

U300

4

4

4

4

TP302
TP301

VDD_CPU_B_T
VSS_CPU_B_T

C314

SG307

S

S

G

R18
R19
R20
R21
R22
R23
U19
U20
U21
U22
U23
W19
W20
W21
W22

W23
AA18
AA19
AA20
AA21
AA22
AA23

W18

Y17

U18

V18

CPU BIG

VDD_CPU_B_1
VDD_CPU_B_2
VDD_CPU_B_3
VDD_CPU_B_4
VDD_CPU_B_5
VDD_CPU_B_6
VDD_CPU_B_7
VDD_CPU_B_8
VDD_CPU_B_9
VDD_CPU_B_10
VDD_CPU_B_11
VDD_CPU_B_12
VDD_CPU_B_13
VDD_CPU_B_14
VDD_CPU_B_15
VDD_CPU_B_16
VDD_CPU_B_17
VDD_CPU_B_18
VDD_CPU_B_19
VDD_CPU_B_20
VDD_CPU_B_21
VDD_CPU_B_22

VDD_CPU_B_T

VSS_CPU_B_T

CPU_B PLL

AVDD18_PLL_CPU

AVSS_PLL_CPU

GPU

VDD_GPU_1
VDD_GPU_2
VDD_GPU_3
VDD_GPU_4
VDD_GPU_5
VDD_GPU_6
VDD_GPU_7
VDD_GPU_8

VDD_GPU_9
VDD_GPU_10
VDD_GPU_11
VDD_GPU_12

VDD_GPU_T

VSS_GPU_T

CPU LITTLE

VDD_CPU_L_1
VDD_CPU_L_2
VDD_CPU_L_3
VDD_CPU_L_4
VDD_CPU_L_5
VDD_CPU_L_6
VDD_CPU_L_7
VDD_CPU_L_8

VDD_CPU_L_9
VDD_CPU_L_10
VDD_CPU_L_11

PWR1 interface 1 of 10

VDD_CPU_L_12

AC17
AC18
AC19
AC20
AC21
AC22
AC23
AE17
AE18
AE19
AE21
AE23

AB16

AA17

N10
N11
N12
N13
R10
R11
R12
R13
U10
U11
U12
U13

VDD_GPU_T
VSS_GPU_T

C387

TP305
TP306

C395

2

13

2

4

2

3 1

4

4

2

3 1 1
3

C386

4

2

2

C373

13

C342

4

4

3 1

VDD_CPU_L

C302

C359

2

4

4

2

3 1 1
3

C357

C341

C343

VDD_GPU

B

C

D

AP Temperature DET

VOUT27_1V8

1%

R301RT301

HKADC_IN7_AP_TEMP

T

VDD_CPU_B
GND

VDD_CPU_L
GND

VDD_GPU
GND

SG301
SG302

SG303

SG304

SG305

SG306

S

S

G

S

S

S

G

S

S

S

G

S

VDD_CPU_B_REMOTE

G

VSS_CPU_B_REMOTE

S

VDD_CPU_L_REMOTE

G

VSS_CPU_L_REMOTE

S

VDD_GPU_REMOTE

G

VSS_GPU_REMOTE

S

The type and specification of the components refer to the BOM

DESIGNED

REVIEWED

CHENZHENBIN 00264464

MABO 00278126

VER PART_NUMBER

E 03025GKM

1

2 3 4 5 6

2018-07-06

DATEECA NO

03025GKM_SCH1ZHHL1JSNM

SHEET OF

3_SOC PWR1

60

HUAWEI TECH CO.,LTD.

C

D

1 2 3 4 5 6

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4.SOC PWR2

Ifnear22ufofPMU,C478DNI

A

B

C

VBUCK1_1V12

VOUT37_0V6

VOUT5_1V8

VOUT2_1V8

C478

C480

C410

C402

2

2

C420

C424

C403

C404

C405

4

4

3 1 1
3

C421

C425

C426

C427

VOUT9_SD_IO

VOUT11_USIM0
VOUT12_USIM1

VOUT30_0V8
VOUT5_1V8
VOUT23_3V2

C406

C428

C407

C411

C429

VOUT2_1V8

C437

C438

C439

C440

C441

U300

2

4

4

2

3 1 1
3

G10
G14
H12
G16
G20
H18

G11
G12
G13
G17
G18
G19

J12
J18

G23
P24

AA25

AF9
AF12
AF19
AF22
AF24

G7

N5

P6

R6

R7

T7

T6

DDRPHY

VDD11_DDR4A_1
VDD11_DDR4A_2
VDD11_DDR4A_3
VDD11_DDR4B_1
VDD11_DDR4B_2
VDD11_DDR4B_3

VDD06_DDR4A_1
VDD06_DDR4A_2
VDD06_DDR4A_3
VDD06_DDR4B_1
VDD06_DDR4B_2
VDD06_DDR4B_3

DDRPHY PLL

AVDD18_PLL_DDR4A
AVDD18_PLL_DDR4B

IO POWER

VDD18_IO_1
VDD18_IO_2
VDD18_IO_3
VDD18_IO_4
VDD18_IO_5
VDD18_IO_6
VDD18_IO_7
VDD18_IO_8
VDD18_IO_9

SDCARD IO

VDD1830_SD

USIM IO

VDD1830_USIM0

VDD1830_USIM1

USB

VDD08_USB

AVDD18_USB

AVDD33_USB

DDR MEMORY CORE

PWR2 interface 2 of 10

VDD1_M_1
VDD1_M_2
VDD1_M_3
VDD1_M_4
VDD1_M_5
VDD1_M_6
VDD1_M_7

VDD2_M_1
VDD2_M_2
VDD2_M_3
VDD2_M_4
VDD2_M_5
VDD2_M_6
VDD2_M_7
VDD2_M_8

VDD2_M_9
VDD2_M_10
VDD2_M_11

DDR MEMORY IO

VDDQ_M_1

VDDQ_M_2

VDDQ_M_3

VDDQ_M_4

VDDQ_M_5

VDDQ_M_6

UFS

AVDD08_UFS_1
AVDD08_UFS_2

AVDD18_VPH_UFS_1
AVDD18_VPH_UFS_2

VDD1812_UFS
EMMC

AVDD18_EMMC_1
AVDD18_EMMC_2

MIPI

AVDD18_CSI_1
AVDD18_CSI_2
AVDD18_CSI_3

AVDD18_DSI

A6
A8
A22
A25
B15
J1
J29

A3
A7
A12
A15
A18
A23
A26
E1
E29
K1
K29

A11
A19
C1
C29
G1
G29

L22
M23

L23
M24

N24

H24
J24

J7
K7
L7

AD16

C444

C467

C445

C456

C446

C457

C473

C447

C474

C448

C458

C475

C449

C459

C476

C450

C408

C451

C460

VOUT0_0V8

VBUCK1_1V12

C401

VOUT37_0V6

C472

VOUT29_1V8

VOUT2_1V8

VOUT5_1V8

A

B

C

C432

C433

C434

C435

C436

C469

The type and specification of the components refer to the BOM

D

DESIGNED

CHENZHENBIN 00264464

HL1JSNM

REVIEWED

MABO 00278126

VER PART_NUMBER

E

03025GKM

1

2 3 4 5 6

2018-07-06

DATEECA NO

03025GKM_SCH1ZH

SHEET OF

4_SOC PWR2

60

HUAWEI TECH CO.,LTD.

D

1 2 3 4 5 6

www.DeviceDB.xyz

Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

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5.SOC PWR3

VBUCK4_0V8

A

B

VBUCK0_0V8

C531

C544

C508

C507

C504

C501

C541

VOUT30_0V8

VBUCK0_0V8

VOUT5_1V8

C532

C536

C523

U300

PERI CORE

H8

VDD08_PERI_1

H23

VDD08_PERI_2

J9

VDD08_PERI_3

J21

VDD08_PERI_4

J23

VDD08_PERI_5

L9

2

4

4

2

3 1 1
3

C543

2

4

4

2

3 1 1
3

TP502
TP501

VDD08_PERI_6

L11

VDD08_PERI_7

L13

VDD08_PERI_8

L15

VDD08_PERI_9

L17

VDD08_PERI_10

L19

VDD08_PERI_11

N7

VDD08_PERI_12

N9

VDD08_PERI_13

N15

VDD08_PERI_14

R15

VDD08_PERI_15

R17

VDD08_PERI_16

U15

VDD08_PERI_17

U17

VDD08_PERI_18

AE9

VDD08_PERI_19

AE11

VDD08_PERI_20

AE13

VDD08_PERI_21

H10

VDD08_PERI_22

H15

VDD08_PERI_23

H20

VDD08_PERI_24

J11

VDD08_PERI_25

J13

VDD08_PERI_26

J15

VDD08_PERI_27

J17

VDD08_PERI_28

J19

VDD08_PERI_29
PERI(FIXED CORE)

H6

VDD08_PERI_FIX_1

P7

VDD08_PERI_FIX_2

N17

AVDD08_PLL_PERI

M18

AVDD18_PLL_PERI

F22

SWP_VREF

G22

OSC_VREF

H22

AVDD18_OTP

DDR PHY CORE

PERI PLL

SWP

MODEM

VDD08_MODEM_1
VDD08_MODEM_2
VDD08_MODEM_3
VDD08_MODEM_4
VDD08_MODEM_5
VDD08_MODEM_6
VDD08_MODEM_7
VDD08_MODEM_8

VDD08_MODEM_9
VDD08_MODEM_10
VDD08_MODEM_11
VDD08_MODEM_12
VDD08_MODEM_13
VDD08_MODEM_14
VDD08_MODEM_15
VDD08_MODEM_16
VDD08_MODEM_17
VDD08_MODEM_18

SYS CORE

VDD08_SYS_1
VDD08_SYS_2
VDD08_SYS_3
VDD08_SYS_4
VDD08_SYS_5
VDD08_SYS_6
VDD08_SYS_7
VDD08_SYS_8
VDD08_SYS_9

VDD08_SYS_10

SYS PLL

AVDD08_PLL_SYS

AVDD18_PLL_SYS

ABB

AVDD09_ABB_1

PWR3 interface 3 of 10

AVDD09_ABB_2

AVDD18_ABB_1
AVDD18_ABB_2

AVDD18_REF_ABB

EFUSE

VDD18_EFUSE_SYS

R9
U9
W9
W11
W13
W15
W17
AA9
AA11
AA13
AA15
AC9
AC11
AC13
AC15
AD8
AD12
AE7

K22
L21
M20
N20
N21
P14
U25
AC25
AF20
AF21

P19

N19

W7
AC7

Y6
AB6
V6

G8

2

C566

4

4

2

3 1 1
3

2

4

4

2

3 1 1
3

C524

2

4

4

2

3 1 1
3

VOUT0_0V8

C539

VOUT0_0V8
VOUT29_1V8

VOUT6_0V9

VOUT5_1V8
VOUT5_1V8

VOUT33_1V8VOUT33_1V8

VOUT5:ｴﾓPMUｵﾄﾊ莎ｶﾋｿｪﾊｼﾐﾇﾐﾎﾗﾟﾏﾟ

C568

A

B

C

D

C519

C518

C521

C520

C506

C505

C503

C513

C515

C574

C575

C542

C502

The type and specification of the components refer to the BOM

DESIGNED

CHENZHENBIN 00264464

HL1JSNM

REVIEWED

MABO 00278126

VER PART_NUMBER

03025GKM_SCH1ZH

SHEET OF

2018-07-06

5_SOC PWR3

C

DATEECA NO

60

D

03025GKME

1

2 3 4 5 6

HUAWEI TECH CO.,LTD.

1 2 3 4 5 6

www.DeviceDB.xyz

Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

Updates, additions, comments - look, add here https://devicedb.xyz/device/554-smartfon-honor-8x.html

6.SOC HS INTERFACE

A

B

VOUT37_0V6

CSI0_CLK_N
CSI0_CLK_P
CSI0_DATA0_N
CSI0_DATA0_P
CSI0_DATA1_N
CSI0_DATA1_P
CSI0_DATA2_N
CSI0_DATA2_P
CSI0_DATA3_N
CSI0_DATA3_P

CSI1_CLK_N
CSI1_CLK_P
CSI1_DATA0_N
CSI1_DATA0_P
CSI1_DATA1_N
CSI1_DATA1_P
CSI1_DATA2_N
CSI1_DATA2_P
CSI1_DATA3_N
CSI1_DATA3_P

CSI2_CLK_N
CSI2_CLK_P
CSI2_DATA0_N
CSI2_DATA0_P

SOC_USB_DN
SOC_USB_DP

R604

1%

R601

USB_REXT

1%

U300

C4

CSI0_CLK_N

C3

CSI0_CLK_P

B3

CSI0_DATA0_N

B2

CSI0_DATA0_P

B5

CSI0_DATA1_N

C5

CSI0_DATA1_P

C2

CSI0_DATA2_N

D2

CSI0_DATA2_P

C6

CSI0_DATA3_N

B6

CSI0_DATA3_P

M3

CSI1_CLK_N

M2

CSI1_CLK_P

N3

CSI1_DATA0_N

N2

CSI1_DATA0_P

L1

CSI1_DATA1_N

L2

CSI1_DATA1_P

N1

CSI1_DATA2_N

P1

CSI1_DATA2_P

L4

CSI1_DATA3_N

L5

CSI1_DATA3_P

F2

CSI2_CLK_N

G2

CSI2_CLK_P

H2

CSI2_DATA0_N

J2

CSI2_DATA0_P

H4

CSI2_DATA1_N

H3

CSI2_DATA1_P

K4

CSI2_DATA2_N

K3

CSI2_DATA2_P

J5

CSI2_DATA3_N

J4

CSI2_DATA3_P

W3

USB_ID

W1

USB_DM

W2

USB_DP

V2

USB_REXT

B17

DDR4_ZQ_SOC

CSI

USB2.0

DDRPHY

DSI

DSI0_CLK_N

DSI0_CLK_P
DSI0_DATA0_N
DSI0_DATA0_P
DSI0_DATA1_N
DSI0_DATA1_P
DSI0_DATA2_N
DSI0_DATA2_P
DSI0_DATA3_N
DSI0_DATA3_P

UFS

UFS_REF_CLK/GPIO_153

EMMC_STRB/EMMC_GPIO_08

EMMC_CMD/EMMC_GPIO_09
EMMC_DATA0/EMMC_GPIO_00
EMMC_DATA1/EMMC_GPIO_01
EMMC_DATA2/EMMC_GPIO_02
EMMC_DATA3/EMMC_GPIO_03
EMMC_DATA4/EMMC_GPIO_04

HS interface 4 of 10

EMMC_DATA5/EMMC_GPIO_05
EMMC_DATA6/EMMC_GPIO_06
EMMC_DATA7/EMMC_GPIO_07

UFS_RESREF

UFS_RST_N/GPIO_154

DDR MEMORY

EMMC

EMMC_CALIO

DDR_ZQ0_MEM
DDR_ZQ1_MEM

UFS_RX0_M
UFS_RX0_P
UFS_RX1_M
UFS_RX1_P
UFS_TX0_M
UFS_TX0_P
UFS_TX1_M
UFS_TX1_P

EMMC_CLK

AJ21
AJ20
AK22
AL22
AK20
AL20
AK19
AL19
AL23
AK23

F28
K25
L25
J28
J27
J26
J25
H27
H28
H25
H26

B24
B27
C24
D24
C27
C26
D28
D27
D26
D25
C25
B25

B16
A16

DSI0_CLK_N
DSI0_CLK_P
DSI0_DATA0_N
DSI0_DATA0_P
DSI0_DATA1_N
DSI0_DATA1_P
DSI0_DATA2_N
DSI0_DATA2_P
DSI0_DATA3_N
DSI0_DATA3_P

R602

R605
R607

1%

1%
1%

C601

SOC_EMMC_STRB
SOC_EMMC_CMD
SOC_EMMC_DATA0
SOC_EMMC_DATA1
SOC_EMMC_DATA2
SOC_EMMC_DATA3
SOC_EMMC_DATA4
SOC_EMMC_DATA5
SOC_EMMC_DATA6
SOC_EMMC_DATA7

VOUT37_0V6

A

B

SOC_EMMC_CLK

C

The type and specification of the components refer to the BOM

D

DESIGNED

CHENZHENBIN 00264464

HL1JSNM

REVIEWED

MABO 00278126

VER PART_NUMBER

E

03025GKM

1

2 3 4 5 6

2018-07-06

DATEECA NO

03025GKM_SCH1ZH

SHEET OF

6_SOC HS Interface60

HUAWEI TECH CO.,LTD.

C

D

1 2 3 4 5 6

www.DeviceDB.xyz

Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

Updates, additions, comments - look, add here https://devicedb.xyz/device/554-smartfon-honor-8x.html

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7.SOC GPIO INTERFACE1

A

GPIO_207_ANT_DET_0

B

C

This TP Type Use For BGA Fanout

AH19
AG18

GPIO_209_LCD_BL_EN
GPIO_210_TP_INT_N

GPIO_177_PMU1_EN

GPIO_184_USB_OTG_INT_N

GPIO_185_LCD_CABC_PWM

GPIO_186_LCD_BL_PWM
GPIO_206_SIM_SD_DET

R707
GPIO_211_WIFI_WAKEUP_AP
GPIO_225_PMU0_IRQ_N
GPIO_144_KEY_UP
GPIO_145_FP_INT
GPIO_146_AG_INT
GPIO_147_NFC_INT

GPIO_149_PMU1_IRQ_N
CDMA_GPS_SYNC

GPIO_228_NFC_DWL_REQ
GPIO_229_BFGN_WAKEUP_AP

GPIO_231_KEY_DOWN
FP_SPI2_CLK

FP_SPI2_MISO
FP_SPI2_MOSI

FP_SPI2_CS0

GPIO_218_BST_5V_EN

BTFM_I2S2_MISO

AC29
AA28
AG24
AC27

AD28

AA26
AH22

AJ23

AH24
AG23

AB28
AC28
AB29

AE26
AD25
AK28
AJ27
AG22
AG21

AG20
AE25
AC26

AB26

AB25

AD26

AB27

AG25
AH26

AH27

AG26

BTFM_I2S2_MOSI

BTFM_I2S2_CLK

BTFM_I2S2_SYNC
GPIO_221_CHG_INT_N

AJ28
AJ29
AH28
AF25

U300

GPIO_203/ISP_GPIO03_PRTRB
GPIO_205/ISP_GPIO05_BKPWM
GPIO_208/ISP_GPIO09_ENC
GPIO_209/ISP_GPIO07_ENA
GPIO_210/ISP_GPIO08_ENB
GPIO_219/ISP_GPIO11
SPI2_CS2_N/SPI4_CS2_N
GPIO_220/ISP_GPIO12
SPI2_CS3_N/SPI4_CS3_N

GPIO_177
GPIO_183/CLK_OUT0
I3C_SCL
GPIO_184/CLK_OUT1
I3C_SDA
BLPWM_CABC/GPIO_185
BLPWM_BL/GPIO_186
PWM_OUT0
GPIO_206/CLKIN_AUX
GPIO_207
GPIO_211

U29

GPIO_225
GPIO_144/SPI0_CS1_N
GPIO_145
GPIO_146
GPIO_147/I2C2_SCL
GPIO_148/I2C2_SDA
GPIO_149/PWM_OUT0

U28

GPIO_150/CDMA_GPS_SYNC
LTE_GPS_SYNC

U26

SPI0_CLK/GPIO_228/I3C_SCL

V26

SPI0_DI/GPIO_229/I3C_SDA
SPI0_DO/GPIO_230
SPI0_CS0_N/GPIO_231
SPI2_CLK/GPIO_214
SPI4_CLK
SPI2_DI/GPIO_215
SPI4_DI
SPI2_DO/GPIO_216
SPI4_DO
SPI2_CS0_N/GPIO_217
SPI4_CS0_N
SPI2_CS1_N/GPIO_218
SPI4_CS1_N

I2S1_DI/GPIO_195
I2S1_DO/GPIO_196
UART7_RXD
I2S1_XCLK/GPIO_197
UART7_TXD
I2S1_XFS/GPIO_198

R27

I2S2_DI/GPIO_199
UART8_CTS_N

U27

I2S2_DO/GPIO_200
UART8_RTS_N

T28

I2S2_XCLK/GPIO_201
UART8_RXD

T29

I2S2_XFS/GPIO_202
UART8_TXD
I2S3_DI/GPIO_221
I2S3_DO/GPIO_222
I2S3_XCLK/GPIO_223
I2S3_XFS/GPIO_224

ISP AO

IO AO

SPI AO

AO I2S

ISP PERI

ISP_GPIO00_FTRSTN

GPIO_011/UART1_CTS_N

ISP_GPIO01_BKRSTN

GPIO_012/UART1_RTS_N

ISP_GPIO02_MNTRB

GPIO_013/UART1_RXD

ISP_GPIO06_FSYNC

GPIO_014/UART1_TXD

ISP_GPIO10_SBPWM

GPIO_015/LCD_TE0
ISP_CLK0/GPIO_016
ISP_CLK1/GPIO_017
ISP_CLK2/GPIO_018
ISP_SCL0/GPIO_019
ISP_SDA0/GPIO_020
ISP_SCL1/GPIO_021
ISP_SDA1/GPIO_022
ISP_SCL2/GPIO_023
ISP_SDA2/GPIO_024

SYS SIGNAL

SPMI_DATA/GPIO_226

PMU_AUXDAC0_SSI/GPIO_046

PMU_CLKOUT/GPIO_002

TEST_MODE/GPIO_001

LTE_INACTIVE/GPIO_047

UART_RXD_BBP/UART_CTS_N_MHS

UART0_RXD/FRAME_SYNC

LTE_RX_ACTIVE/GPIO_048

DS1 interface 5 of 10

UART_RXD_BBP/UART_RXD_MHS

LTE_TX_ACTIVE/GPIO_049

UART_TXD_BBP/UART_TXD_MHS

ISM_PRIORITY/GPIO_050

UART_RTS_N_MHS/UART0_TXD

PWM_OUT1/GPIO_045/ONEWIRE

GPIO_052/ISP_GPIO10_SBPWM

GPIO_093/PWM_OUT1/UART1_RXD

SLIMBUS_CLK/GPIO_193/SIF_CLK
SLIMBUS_DATA/GPIO_194/SIF_DO

GPIO_094/UART1_TXD
AO Codec IF

GPIO_204/CODEC_SSI

SIF_SYNC/ISP_GPIO04_FTPWM

CLK_SLEEP

CLK_SYSTEM

SYSCLK_EN

PMU IF

SPMI_CLK/GPIO_227

PMU0_SSI

PMU_PER_EN

SYS_RSTIN_N

PMU_RSTOUT_N

GPIO_176

PMU1_SSI/GPIO_003
BOOT CTRL

BOOT_MODE

BOOT_UFS

LTE CTRL

PERI IO

GPS_REF/GPIO_004

GPIO_051/ONEWIRE

SIF_DI0/GPIO_151

SIF_DI1/GPIO_152

DFT_EN

C22

GPIO_012_MCAM1_RST_N

B22

B21

B20

AJ16

D11
B11
C11
C13
D14
E9
E10
E14
D13

W26
M25
W25

Y28
W28

AH17
Y27
Y25
Y26
Y29

AK17
AH18

AG17
AL16
AK25
AL17

P27

N27

P26

R26

P25
AK13
C17
B19
N26
M27

T25
T26
V28

V25
W27

GPIO_014_VBUS_MOS_CTRL

GPIO_015_LCD_TE0

MCAM0_ISP_SCL0
MCAM0_ISP_SDA0
SCAM0_ISP_SCL1
SCAM0_ISP_SDA1
MCAM1_ISP_SCL2
MCAM1_ISP_SDA2

R724

PMU1_CLK_19M2
PMU1_SSI_DATA

BOOT_MODE

DFT_EN

LTE_INACTIVE

LTE_TX_ACTIVE

AP_GPS_REF_CLK
GPIO_045_LCD_VSN_EN

GPIO_051_NFC_EN

L702

SIF_DI_0

R722
R723
R716

SIF_DI_1

SYS_CLK_32K
SYS_CLK_19M2

SYS_CLK_EN

SPMI_CLK
SPMI_DATA

PMU_AUXDAC_SSI

PMU_PERI_EN

PMU_RST_OUT_N

SOC_RST_PMU_N

PMU_PWR_HOLD

BOOT_UFS

TP703

SIF_CLK
SIF_DO
SIF_SYNC

C706

MCAM0_ISP_CLK0
SCAM0_ISP_CLK1
MCAM1_ISP_CLK2

C708
C707

C704

C701

TP756

FOR DEBUG

C703

VOUT18_1V8

I2C0_SCL
I2C0_SDA

GPIO_189_CHARGER_EN

I2C6_SCL
I2C6_SDA

I2C3_SCL
I2C3_SDA
I2C4_SCL
I2C4_SDA

GPIO_027_MCAM1_VCM_PWDN

GPIO_030_Hi1102_PWRON

HI1102_UART4_CTS_N
HI1102_UART4_RTS_N
HI1102_UART4_RX
HI1102_UART4_TX
GPIO_037_LCD_ID1

GPIO_038_FP_RST_N

GPIO_039_LCD_RST_N

GPIO_040_TP_RST_N

GPIO_031_SCAM0_RST_N
GPIO_032_MCAM0_RST_N

DBG_UART6_RX

DBG_UART6_TX

GPIO_035_LCD_VSP_EN

GPIO_036_LCD_ID0

R719

R751
R752

I2C0_SCL
I2C0_SDA

I2C3_SCL
I2C3_SDA

U300

AK27

I2C0_SCL/GPIO_187/I3C_SCL

AK26

I2C0_SDA/GPIO_188/I3C_SDA

AJ26

I2C1_SCL/GPIO_189

AJ25

I2C1_SDA/GPIO_190

AF27

I2C2_SCL/GPIO_191
I2C7_SCL

AF26

I2C2_SDA/GPIO_192
I2C7_SDA

AG19

I2C6_SCL/GPIO_213

AJ24

I2C6_SDA/GPIO_212

AG14

I2C3_SCL/GPIO_005

AH14

I2C3_SDA/GPIO_006

AK14

I2C4_SCL/GPIO_025

AL14

I2C4_SDA/GPIO_026

D18

UART2_CTS_N/GPIO_027
UART0_RXD

D21

UART2_RTS_N/GPIO_028
UART0_TXD

D20

UART2_RXD/GPIO_030
UART0_CTS_N

D19

UART2_TXD/GPIO_029
UART0_RTS_N

N29

UART4_CTS_N/GPIO_041
UART3_CTS_N

N28

UART4_RTS_N/GPIO_042
UART3_RTS_N/LCD_TE1

P28

UART4_RXD/GPIO_043
UART3_RXD

R28

UART4_TXD/GPIO_044
UART3_TXD

AJ14

UART5_CTS_N/GPIO_037
UART3_CTS_N

AG16

UART5_RTS_N/GPIO_038
UART3_RTS_N

AH16

UART5_RXD/GPIO_039
UART3_RXD

AG15

UART5_TXD/GPIO_040
UART3_TXD

C18

UART6_CTS_N/GPIO_031
UART0_RXD

B18

UART6_RTS_N/GPIO_032
UART0_TXD

AK15

UART6_RXD/GPIO_033
UART0_RXD_M/UART_RXD_MHS
UART_RXD_UC

AG13

UART6_TXD/GPIO_034
UART0_TXD_M/UART_TXD_MHS
UART_TXD_UC

AJ13

UART_RXD_UC/GPIO_035
UART0_RXD

AH13

UART_TXD_UC/GPIO_036
UART0_TXD

I2C AO

I2C PERI

UART

VOUT18_1V8VOUT18_1V8

R710
R711R718

VOUT2_1V8 I2C6_SCL

R708
R709

SPI PERI

SPI1_CLK/GPIO_007

UART2_CTS_N

SPI1_DI/GPIO_008

UART2_RTS_N

SPI1_DO/GPIO_009

SPI1_CS_N/GPIO_010

SDIO_DATA0/GPIO_130
SDIO_DATA1/GPIO_131
SDIO_DATA2/GPIO_132
SDIO_DATA3/GPIO_133

JTAG_TCK_SWCLK/GPIO_178

JTAG_TMS_SWDIO/GPIO_179

JTAG_TRST_N/GPIO_180

DS2 interface 6 of 10

USIM0_CLK/GPIO_166

USIM0_RST/GPIO_167

USIM0_DATA/GPIO_168

USIM1_CLK/GPIO_169

USIM1_RST/GPIO_170

USIM1_DATA/GPIO_171

UART2_RXD

UART2_TXD

SDIO

SDIO_CLK/GPIO_128
SDIO_CMD/GPIO_129

SD CARD

SD_CLK/GPIO_160
SD_CMD/GPIO_161

JTAG_TMS_SD

SD_DATA0/GPIO_162

JTAG_TCK_SD

SD_DATA1/GPIO_163

JTAG_TDI_SD

SD_DATA2/GPIO_164

JTAG_TDO_SD

SD_DATA3/GPIO_165

JTAG_TRST_N_SD

VDD_ODIO_BIAS_SD
AO JTAG

JTAG_MODE
JTAG_SEL0
JTAG_SEL1

JTAG_TDI/GPIO_181
JTAG_TDO/GPIO_182

USIM

JTAG_TDI_SD

JTAG_TDO_SD

JTAG_TRST_N_SD

JTAG_TCK_SD

JTAG_TMS_SD

NFC IO

SWP_IO

TP_SPI1_CLK

L27

TP_SPI1_MISO

M28

TP_SPI1_MOSI

L28

TP_SPI1_CS

L26

D7
B8
D8
C8
C9
B9

SDC_CLK_R

R3

SDC_CMD_R

T3

SDC_DATA0_R

R2

SDC_DATA1_R

P4

SDC_DATA2_R

R4

SDC_DATA3_R

T4

On CMD and DATA net,22 resistor need nearby SD Socket.

M6

AL26
AL25
AL27
AE27
AG28
AE28
AF29

GPIO_180_FLASH_STROBE

AF28

T1

T2

U1

U3

U2

V3

F21

I2C4_SCL
I2C4_SDA

I2C6_SDA

R701
R702

R703
R705
R714
R715

C702

JTAG_MODE
JTAG_SEL0

JTAG_SEL1
SOC_JTAG_TCK_SWCLK
SOC_JTAG_TDI
SOC_JTAG_TDO
SOC_JTAG_TMS_SWDIO

SIM0_CLK
SIM0_RST_N
SIM0_DATA
SIM1_CLK
SIM1_RST_N
SIM1_DATA

NFC_SWIO_SE

WL_SDIO_CLK
WL_SDIO_CMD
WL_SDIO_DATA0
WL_SDIO_DATA1
WL_SDIO_DATA2
WL_SDIO_DATA3

TP712
TP705
TP706
TP707
TP733
TP749
TP710
TP711

R731

SDC_CLK
SDC_CMD

SDC_DATA0
SDC_DATA1
SDC_DATA2
SDC_DATA3

A

B

C

The type and specification of the components refer to the BOM

D

DESIGNED

CHENZHENBIN 00264464

HL1JSNM

REVIEWED

MABO 00278126

VER PART_NUMBER

E 03025GKM

1

2 3 4 5 6

2018-07-06

DATEECA NO

03025GKM_SCH1ZH

7_SOC GPIO Interface

SHEET OF

60

HUAWEI TECH CO.,LTD.

D

1 2 3 4 5 6

www.DeviceDB.xyz

Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

Updates, additions, comments - look, add here https://devicedb.xyz/device/554-smartfon-honor-8x.html

8.SOC RF INTERFACE

A

B

ABB_CLK_38M4

C

R802

U300

CH0_MRX_I
CH0_MRX_Q

CH0_RXA_I
CH0_RXA_Q
CH0_RXB_I
CH0_RXB_Q

CH1_RXA_I
CH1_RXA_Q
CH1_RXB_I
CH1_RXB_Q RF_GPIO06_APT_BP

CH0_TX_I_N
CH0_TX_I_P
CH0_TX_Q_N
CH0_TX_Q_P

GMSK_PH0

FE0_MIPI_CLK
FE0_MIPI_DATA
FE1_MIPI_CLK
FE1_MIPI_DATA

RFIC0_MIPI_CLK
RFIC0_MIPI_DATA

+/-1%

R845

ABB_IBIAS

ABB_TEST

ABB_VREF

AF1

ABB_CH0_MRX_I

AE1

ABB_CH0_MRX_Q

AD3

ABB_CH0_RXA_I

AD2

ABB_CH0_RXA_Q

AD4

ABB_CH0_RXB_I

AC4

ABB_CH0_RXB_Q

AB4

ABB_CH1_RXA_I

AB3

ABB_CH1_RXA_Q

AB1

ABB_CH1_RXB_I

AB2

ABB_CH1_RXB_Q

AA3

ABB_CH2_RXA_I

AA4

ABB_CH2_RXA_Q

Y4

ABB_CH2_RXB_I

Y5

ABB_CH2_RXB_Q

AH2

ABB_CH0_TX_I_N

AG2

ABB_CH0_TX_I_P

AH1

ABB_CH0_TX_Q_N

AJ1

ABB_CH0_TX_Q_P

AF4

ABB_CH1_TX_I_N

AG3

ABB_CH1_TX_I_P

AE4

ABB_CH1_TX_Q_N

AE3

ABB_CH1_TX_Q_P

U5

ABB_TCXO_IN

AL10

GMSK_PH0/GPIO_092

AD5

ABB_CH0_ET_N

AE5

ABB_CH0_ET_P

AJ11

FE0_MIPI_CLK/GPIO_084

AK11

FE0_MIPI_DATA/GPIO_085

AL11

FE1_MIPI_CLK/GPIO_086

AK12

FE1_MIPI_DATA/GPIO_087

AG12

FE2_MIPI_CLK/GPIO_088

AH12

FE2_MIPI_DATA/GPIO_089

AG10

RFIC0_MIPI_CLK/GPIO_090

AG11

RFIC0_MIPI_DATA/GPIO_091

AE2

ABB_IBIAS_EXT

AC2

ABB_TEST

AC1

ABB_VREF

RF IQ

RF CTRL

ET

FE4_MIPI_DATA/CH0_APT_PDM

RF MIPI

RF interface 7 of 10

RF OTHER

ANT SEL

ANTPA_SEL00/GPIO_053

GPS_BLANKING

ANTPA_SEL01/GPIO_054

ANTPA_SEL02/GPIO_055
ANTPA_SEL03/GPIO_056

ANTPA_SEL04/GPIO_057

ANTPA_SEL05/GPIO_058

ANTPA_SEL06/GPIO_059

ANTPA_SEL07/GPIO_060
ANTPA_SEL08/GPIO_061
ANTPA_SEL09/GPIO_062
ANTPA_SEL10/GPIO_063
ANTPA_SEL11/GPIO_064
ANTPA_SEL12/GPIO_065
ANTPA_SEL13/GPIO_066
ANTPA_SEL14/GPIO_067
ANTPA_SEL15/GPIO_068
ANTPA_SEL16/GPIO_069
ANTPA_SEL17/GPIO_070
ANTPA_SEL18/GPIO_071
ANTPA_SEL19/GPIO_072
ANTPA_SEL20/GPIO_073
ANTPA_SEL21/GPIO_074

ANTPA_SEL22/GPIO_075

ANTPA_SEL23/GPIO_076

ANTPA_SEL24/GPIO_077

ANTPA_SEL25/GPIO_078

ANTPA_SEL26/GPIO_079

ANTPA_SEL27/GPIO_080

ANTPA_SEL28/GPIO_081

ANTPA_SEL29/GPIO_082

ANTPA_SEL30/GPIO_083

FLASH_MASK

FE6_MIPI_CLK

FE6_MIPI_DATA

CH0_APT_PDM

CH1_APT_PDM

FE5_MIPI_CLK

FE5_MIPI_DATA

FE4_MIPI_CLK

FE3_MIPI_CLK

FE3_MIPI_DATA

FE4_MIPI_CLK

FE4_MIPI_DATA

FE3_MIPI_CLK

FE3_MIPI_DATA

AJ17

AH15

AK2
AG8

AG9

AF6

AG5

AK3
AJ3
AF7
AH5
AK4
AL5
AJ5
AH6
AK5
AG7
AK6
AH4
AL3
AH7
AJ7

AK7

AK9

AL8

AJ10

AH10

AJ8

AK8

AH8

AH9

RF_GPIO01_FLASH_MASK

RF_GPIO04_APT_EN
RF_GPIO05_CHO_APT_PDM_SOC

RF_GPIO07_DPDT

RF_GPIO05_CHO_APT_PDM_SOC

R801

A

RF_GPIO05_CHO_APT_PDM

C803

B

C

C802

C801

The type and specification of the components refer to the BOM

D

DESIGNED

CHENZHENBIN 00264464

HL1JSNM

REVIEWED

MABO 00278126

VER PART_NUMBER

03025GKME

1

2 3 4 5 6

2018-07-06

DATEECA NO

03025GKM_SCH1ZH

8_SOC RF Interface

SHEET OF

60

HUAWEI TECH CO.,LTD.

D

9.SOC GND

www.DeviceDB.xyz

Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

Updates, additions, comments - look, add here https://devicedb.xyz/device/554-smartfon-honor-8x.html

A

B

1 2 3 4 5 6

P18

AA2
AA5
AA7
AB5
AC3
AC5
AD6
AD7
AF2
AF5
AG4
AH3
AJ2

A10
A13
A14
A17
A20
A24
A27
A28
A29

B10
B12
B13
B14

U4
U6
V4
V5
V7
W4
W5
Y3
Y7

A1
A2
A4

B1
B4
B7

U300

AVSS_PLL

AVSS_ABB_1
AVSS_ABB_2
AVSS_ABB_3
AVSS_ABB_4
AVSS_ABB_5
AVSS_ABB_6
AVSS_ABB_7
AVSS_ABB_8
AVSS_ABB_9
AVSS_ABB_10
AVSS_ABB_11
AVSS_ABB_12
AVSS_ABB_13
AVSS_ABB_14
AVSS_ABB_15
AVSS_ABB_16
AVSS_ABB_17
AVSS_ABB_18
AVSS_ABB_19
AVSS_ABB_20
AVSS_ABB_21
AVSS_ABB_22

VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSS_13
VSS_14
VSS_15
VSS_16
VSS_17
VSS_18
VSS_19

B23

VSS_20

B26

VSS_21

B28

VSS_22

B29

VSS_23

C7

VSS_24

C10

VSS_25

C12

VSS_26

C15

VSS_27

C19

VSS_28

C20

VSS_29

C23

VSS_30

C28

VSS_31

D1

VSS_32

D3

VSS_33

D5

VSS_34

D6

VSS_35

D10

VSS_36

D12

VSS_37

D16

VSS_38

D17

VSS_39

D29

VSS_40

E2

VSS_41

E3

VSS_42

E11

VSS_43

E12

VSS_44

E13

VSS_45

E15

VSS_46

E16

VSS_47

E17

VSS_48

E18

VSS_49

E19

VSS_50

E20

VSS_51

E21

VSS_52

E22

VSS_53

E27

VSS_54

E28

VSS_55

F3

GND1 interface 8 of 10

VSS_56
VSS_57
VSS_58
VSS_59
VSS_60
VSS_61
VSS_62
VSS_63

F8
F9
F11
F12
F13
F14
F15

F16
F17
F18
F19
F20
F29

G15
G21
G24
G28

H11
H13
H14
H16
H17
H19
H21
H29

J10
J20
J22

K10
K12
K14
K16
K18
K20
K23
K24
K27
K28

L24
L29

G4
G6
G9

H1
H7
H9

J6

K2
K5
K6
K8

L6

U300

VSS_64
VSS_65
VSS_66
VSS_67
VSS_68
VSS_69
VSS_70
VSS_71
VSS_72
VSS_73
VSS_74
VSS_75
VSS_76
VSS_77
VSS_78
VSS_79
VSS_80
VSS_81
VSS_82
VSS_83
VSS_84
VSS_85
VSS_86
VSS_87
VSS_88
VSS_89
VSS_90
VSS_91
VSS_92
VSS_93
VSS_94
VSS_95
VSS_96
VSS_97
VSS_98
VSS_99
VSS_100
VSS_101
VSS_102
VSS_103
VSS_104
VSS_105
VSS_106
VSS_107
VSS_108

VSS_109
VSS_110
VSS_111
VSS_112
VSS_113
VSS_114
VSS_115
VSS_116
VSS_117
VSS_118
VSS_119
VSS_120
VSS_121
VSS_122
VSS_123
VSS_124
VSS_125
VSS_126
VSS_127
VSS_128
VSS_129
VSS_130
VSS_131
VSS_132
VSS_133
VSS_134
VSS_135
VSS_136
VSS_137
VSS_138
VSS_139
VSS_140
VSS_141
VSS_142
VSS_143
VSS_144
VSS_145

GND2 interface 9 of 10

VSS_146
VSS_147
VSS_148
VSS_149
VSS_150
VSS_151
VSS_152
VSS_153

M5
M8
M10
M12
M14
M16
M19
M22
N4
N6
N23
N25
P2
P3
P5
P8
P10
P11
P12
P13
P16
P20
P22
P29
R5
R24
R25
T5
T8
T10
T11
T12
T13
T14
T16
T18
T19
T20
T21
T22
T23
U7
U24
V8
V10

V12
V14
V16
V19
V20
V21
V22
V23
W24
W29

Y10
Y12
Y14
Y16
Y18
Y19
Y20
Y21
Y22
Y23

AA24

AB8
AB10
AB12
AB14
AB17
AB18
AB19
AB20
AB21
AB22
AB23
AC16
AC24
AD10
AD14

Y1
Y2
Y8

U300

VSS_154
VSS_155
VSS_156
VSS_157
VSS_158
VSS_159
VSS_160
VSS_161
VSS_162
VSS_163
VSS_164
VSS_165
VSS_166
VSS_167
VSS_168
VSS_169
VSS_170
VSS_171
VSS_172
VSS_173
VSS_174
VSS_175
VSS_176
VSS_177
VSS_178
VSS_179
VSS_180
VSS_181
VSS_182
VSS_183
VSS_184
VSS_185
VSS_186
VSS_187
VSS_188
VSS_189
VSS_190
VSS_191
VSS_192

VSS_193
VSS_194
VSS_195
VSS_196
VSS_197
VSS_198
VSS_199
VSS_200
VSS_201
VSS_202
VSS_203
VSS_204
VSS_205
VSS_206
VSS_207
VSS_208
VSS_209
VSS_210
VSS_211
VSS_212
VSS_213
VSS_214
VSS_215
VSS_216
VSS_217
VSS_218
VSS_219
VSS_220
VSS_221
VSS_222
VSS_223
VSS_224
VSS_225
VSS_226

GND3 interface 10 of 10

VSS_227
VSS_228
VSS_229
VSS_230

AD17
AD18
AD19
AD20
AD21
AD22
AD23
AE6
AE15
AE24
AE29
AF8
AF10
AF11
AF13
AF14
AF16
AF17
AF23
AH21
AH29
AJ4
AJ19
AJ22
AK1
AK10
AK16
AK18
AK21
AK24
AK29
AL1
AL2
AL4
AL7
AL13
AL28
AL29

A

B

C

The type and specification of the components refer to the BOM

D

DESIGNED

CHENZHENBIN 00264464

HL1JSNM

REVIEWED

MABO 00278126

VER PART_NUMBER

E

03025GKM

1

2 3 4 5 6

2018-07-06

DATEECA NO

03025GKM_SCH1ZH

SHEET OF

9_SOC GND

60

HUAWEI TECH CO.,LTD.

C

D

1 2 3 4 5 6

www.DeviceDB.xyz

Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

Updates, additions, comments - look, add here https://devicedb.xyz/device/554-smartfon-honor-8x.html

10.PMU LDO

A

VBAT_SYS

200mA

VBAT_SYS

2.5A

B

750mA

300mA

C

2.5A

1A

VBUCK3_1V95

VBUCK2_1V2

VBUCK1_1V12

VBUCK0_0V8

DR1_LED_RED1

DR3_LED_RED
DR4_LED_GREEN
DR5_LED_BLUE
VOUT2_1V8

SG1001
SG1002

U1001

C1001
C1003

C1023

C1028
C1012
C1014
C1011

C1016
C1034
C1035

C1036
C1007
C1018
C1019
C1020

C1013
C1031

C1038

C1041

C1040

C1042

C1009

C1043

C1029
C1045
C1010
C1006

C1050
C1048

C1046
C1047
C1033

C1022

C1027

C1039

SG1005

S

S

G

SG1004

S

S

G

SG1007

G

SG1006

G

VOUT_PMUA
VOUT_PMUD

VCOIN
VOUT34_3V45

VOUT9_SD_IO
VOUT11_USIM0
VOUT12_USIM1
VOUT13_2V8
VOUT14_2V85
VOUT15_2V95
VOUT16_2V95

VOUT19_2V8
VOUT22_2V8
VOUT23_3V2
VOUT24_2V8
VOUT25_2V85
VOUT27_1V8
VOUT31_3V0

VOUT2_1V8
VOUT3_1V8
VOUT4_1V8
VOUT5_1V8
VOUT8_1V8
VOUT18_1V8
VOUT21_1V8

VOUT28_1V8
VOUT29_1V8
VOUT33_1V8
VOUT36_1V2

VOUT1_1V09
VOUT20_1V05
VOUT32_1V05

VOUT0_0V8
VOUT6_0V9
VOUT30_0V8

VOUT37_0V6

VOUT3_1V8

VOUT1_1V09

30mA

VPP

OUT9

OUT2
OUT3
OUT4
OUT5
OUT8

OUT1

OUT0
OUT6

VREF

AGND

N6
K6
L6
U3
L5

F6
A2
A3
A10
H7
A6
A7
G6
A12
B11
B4
B7
A9
C9
A5
G7

G18
B14
C14
A15
F18
G16
C12
B15
E13
D18
F14
D14
B18

U5
R4
U4

U8
U6
R7

M4

B13
A13
U7
K5
J6
B5
T6
E16
G8
C17

30mA

150mA
50mA

50mA
50mA
150mA
70mA
800mA
800mA
100mA
150mA
150mA
150mA
200mA
400mA
30mA
300mA
50mA

900mA
200mA
200mA
500mA
140mA
350mA
180mA
30mA
50mA
140mA
120mA
10mA
30mA

350mA
700mA
400mA

300mA
320mA
100mA

400mA

VREF_RF

AGND_BUFF

C1008

C1044

C1015

C1004
C1021
C1032

S

S

S

S

M6

VSYS

C1002

D10

VIN_LDO_H1_1

D11

VIN_LDO_H1_2

D7

VIN_LDO_H2_1

E7

VIN_LDO_H2_2

C1051

D13

VIN_LDO_1P95_1

E14

VIN_LDO_1P95_2

F15

VIN_LDO_1P95_3

P5

VIN_LDO_1P2_1

P6

VIN_LDO_1P2_2

P7

VIN_LDO_1P1

M5

VIN_LDO_0P8

T1

DR1

T2

DR2

T8

DR3

U9

DR4

R8

DR5

H16

VDD_IO

L7

S

S

G

S

S

G

AGND_OSC

B16
E12
F13

PGND_DR
AGND_OSC
AGND_COUL
AGND_REF

OUT_PMUA
OUT_PMUD

VCOIN
OUT34

OUT11
OUT12
OUT13
OUT14
OUT15
OUT16
OUT17
OUT19
OUT22
OUT23
OUT24
OUT25
OUT27
OUT31

OUT_PMUH

MISC1 Interface 1 of 4

OUT18
OUT21
OUT26
OUT28
OUT29
OUT33
OUT36

LDO_BUFF

OUT20
OUT32

OUT30

OUT37

VREF_RF

VREF_LDO1

AGND_BUCK
AGND_LDO_H
AGND_LDO_L

AGND_LDO_1P95

AGND_ADDA

AGND_BUFF

LDO1
LDO2
LDO3
LDO4
LDO5

LDO8
LDO9

LDO11
LDO12
LDO13
LDO14
LDO15
LDO16
LDO17
LDO18
LDO19
LDO20
LDO21
LDO22
LDO23
LDO24
LDO25
LDO26
LDO27
LDO28
LDO29
LDO30
LDO31
LDO32
LDO33
LDO34

currentTYP voltagedefault functionOutput

350 1.09

OFF

900

ON

200

OFF

200

OFF

500

ON

140

OFF

50

OFF

50

OFF

50

OFF

150

OFF

70

OFF

800

ON

800

OFF

100

OFF

350

ON

300

OFF

400

OFF

180

OFF

150

OFF
ON

200 2.8 X Sensor AVDD

ON
OFF

30 1.35 38.4_AVDD

ON
ON

50 1.8 RF MIPI I/O

OFF
ON

OFF

400 1.1 S Camera Core

OFF
OFF
ON

1.8

1.8

1.8

1.8

1.8

1.8/2.95

1.8

1.8

2.85

2.85

2.95

2.95

2.8

1.8

2.8

1.11

1.8

2.8

RFIC0_AVDD

PMU dig/RFIC/SOC1V8IO/64031V8/LPDDR4X VDD/UFS VCCQ2/SMART PA IO

RFIC0 AVDD2
LCD1V8 IO/TP1V8 IO
PHY ANA/ABB_AVDD1V8

6403ANALOG/CLASSD1V8
SD IO

SIM0
SIM1
S camera analog
RF FEM/AUXDAC
EMMC/UFS VDD
SD card
LCD TP VCI
fp/SENSOR IO FP AVDD/CON IO/NFC IO
M camera anlog
M Camera Core
Camera io
Back Camera Analog
HKADC3.2150

Camera VCM2.85400
HKADC1.850
UFS PHY/SYS CLK_BUF1.8140
Vibrator3.0300
EFUSE1.8120

CODEC RCV/MICBIAS3.45150

B

C

A

C1049

The type and specification of the components refer to the BOM

D

DESIGNED

CHENZHENBIN 00264464

HL1JSNM

REVIEWED

MABO 00278126

VER PART_NUMBER

03025GKME

1

2 3 4 5 6

2018-07-06

DATEECA NO

03025GKM_SCH1ZH

SHEET OF

10_PMU LDO

60

HUAWEI TECH CO.,LTD.

D

1 2 3 4 5 6

www.DeviceDB.xyz

Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

Updates, additions, comments - look, add here https://devicedb.xyz/device/554-smartfon-honor-8x.html

www.DeviceDB.xyz

A

B

C

D

11.PMU BUCK/CODEC

C1119
C1120

R1102
R1101

MAINMIC_P
MAINMIC_N

AUXMIC_P
AUXMIC_N

SPK_P_CODEC

SPK_N_CODEC

C1117
C1102

C1109
C1110

C1118

HS_FB_L

HS_L
HS_R

HS_FB_R

HS_DET
MBHC_IN

EAR_P
EAR_N

HS_MIC_P
HS_MIC_N

AVREF

K16
K17
K18
L15

P12
R17

P17
N17

T11
T10

T15
U16

N13
M14

R15
R14

T16
U17

T17
T18

U14

HS_FB_L
HS_L
HS_R
HS_FB_R

HSD
MBHC_IN

EAR_P
EAR_N

SPKOUT_P
SPKOUT_N

MAINMIC_P
MAINMIC_N

AUXMIC_P
AUXMIC_N

MIC3_P
MIC3_N

HSMIC_P
HSMIC_N

LINEOUT_P
LINEOUT_N

AVREF

U1001

MISC4 Interface 4 of 4

L17/M18 must separate collect to C1112

MCLK_49M
SDATA_FLAG
ADC_SDATA0
ADC_SDATA1

DAC_SDATA

PVDD_SPK

PGND_SPK

AVDD_MIC

MICBIAS1

MICBIAS2
HS_MICBIAS

AGND_MIC

AVDD_TX
AGND_TX

AVDD_RX
AGND_RX

AVDD_HP
AVDD_CP

FLY_P
FLY_N

CPOUTN
AVSS_HP
AGND_CP

S

S

SG1101

G

H15
H13
J15
J14
J16

R9

P11

U15
N14
R13
N15
T14

P16
P15

U13
T13

L16
M17

N18
P18

M18
L17
M15

SIF_CLK
SIF_SYNC
SIF_DI_0
SIF_DI_1
SIF_DO

MICBIAS1

HS_MICBIAS

C1128

C1112

S

S

G

SG1102

C1107

C1131

VBAT_SYS

VOUT_CLASSD

S

S

C1116

SG1103

G

C1115

600mA

800mA

1.5A

600mA

VOUT34_3V45

VOUT34_3V45

VOUT8_1V8

VBUCK3_1V95

C1111

GND

U1001

L1101

K1

PGND0

C1103

C1133

PGND1

PGND2

PGND3

C1134 C1104

C1135

Source star route

PGND4

PVDD0_1

K2

PVDD0_2

H1

PGND0_1

H2

PGND0_2

H3

PGND0_3

N1

PVDD12_1

N2

PVDD12_2

N3

PVDD12_3

L1

PGND1_1

L2

PGND1_2

L3 K4

R1

PGND2_1

R2

PGND2_2

PVDD3_1 LX3_1

D2 C2
D3

PVDD3_3

B1

PGND3_1

B2

PGND3_2

B3

PGND3_3

PVDD4_1 LX4_1

E2

PVDD4_2

G1

PGND4_1

G2

PGND4_2

A1

DGND_1

A18

DGND_2

B6

DGND_3

B17

DGND_4

C15

DGND_5

D16

DGND_6

F3

DGND_7

F16

DGND_8

G4

DGND_9

H5

DGND_10

J10

DGND_11

K3

DGND_12

K8

DGND_13

K9

DGND_14

K10

DGND_15

K13

DGND_16

L9

DGND_17

M9

DGND_18

M13

DGND_19

P3

DGND_20

SG1104
SG1105

SG1106

SG1107
SG1108

LX0_1
LX0_2
LX0_3

VO0_PULL

VO0_FB

LX1_1
LX1_2
LX1_3

VO1_FBPGND1_3

LX2_1
LX2_2

VO2_FB

LX3_2PVDD3_2
LX3_3

VO3_FB

LX4_2

MISC2 Interface 2 of 4

VO4_FB

DGND_21
DGND_22
DGND_23
DGND_24
DGND_25
DGND_26
DGND_27
DGND_28
DGND_29
DGND_30
DGND_31
DGND_32
DGND_33
DGND_34
DGND_35
DGND_36
DGND_37
DGND_38
DGND_39
DGND_40

S

G

S

S

G

S

S

G

S

S

G

S

S

G

S

The type and specification of the components refer to the BOM

DESIGNED

CHENZHENBIN 00264464

HL1JSNM

REVIEWED

MABO 00278126

VER PART_NUMBER

LX0

J1
J2
J3

Current=1A,DCR=100mohm

H6
J5

L1102

LX1

M1
M2
M3

L1103

LX2

P1
P2

L4

L1104

LX3

C1D1

C3

C5

L1105

LX4

F1E1
F2

E4

R5
R18
T5
U1
U18
L8
M8
E3
E17
G10
H8
H10
J4
J8
L11
L13
N9
P4
P10
T4

PGND0
PGND1

PGND2

PGND3
PGND4

03025GKM_SCH1ZH

3.5A

C1127

2.3A

C1126

2A
C1130
C1124

3A

C1123

2A

C1122

2018-07-06

SHEET OF

11_PMU BUCK_CODEC

VBUCK0_0V8

S

G

S

SG1109

VBUCK1_1V12

S

G

S

SG1110

VBUCK2_1V2

SG1111

S

G

S

VBUCK3_1V95

S

G

S

SG1112

VBUCK4_0V8

S

G

S

SG1113

DATEECA NO

60

A

B

C

D

03025GKME

1

2 3 4 5 6

HUAWEI TECH CO.,LTD.

A

www.DeviceDB.xyz

Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

Updates, additions, comments - look, add here https://devicedb.xyz/device/554-smartfon-honor-8x.html

B

C

1 2 3 4 5 6

12. PMU Digital

CHG_REGN

1%1%

R1215

R1212

TP1205

C1231

B8PINfilteringwithC1013

TP1206

SOC_RST_PMU_N
PMU_VBUS_SENSE

PWRON_N
PMU_PWR_HOLD
PMU_PERI_EN

VBATT_VD

XIN_38M4_PMU
XOUT_38M4_PMU
SYS_CLK_EN

NFC_CLK_REQ

R1250

GPIO_206_SIM_SD_DET
GPIO_206_SIM_SD_DET
SPMI_DATA

R1214

SPMI_CLK

R1213

PMU_AUXDAC_SSI

VOUT_PMUD

R1202

C1220

VOUT27_1V8

ifNFCNCR1250SMT

C1221

N12

T7
R3
U2

B10 L10

E11

B8

A17
A16
G15

G13

C11
B12
J18
H18
H14
K14

G17
P13
R12

R6
T12
L12

U1001

HRESET_N

VBUS_SENSE
PWRON_N
PWR_HOLD

VBAT_SENSE

ADC_REF

XIN_38M4
XOUT_38M4
SYS_CLK_EN
WIFI_CLK_EN ABB_CLK_38M4
NFC_CLK_EN

SIM0_HPD
SIM1_HPD
PMU_DATA
SPMI_CLK
AUXDAC_SSI
XOADC_SSI

DGND_41
DGND_42
DGND_43
DGND_44
DGND_45
DGND_46

SYS_RST_N

PMU0_IRQ_N

DFT_MODEPERI_EN

SRP
SRN

HKADC_IN0
HKADC_IN1
HKADC_IN2
HKADC_IN3
HKADC_IN4
HKADC_IN5
HKADC_IN6
HKADC_IN7
HKADC_IN8

HKADC_IN9
HKADC_IN10
HKADC_IN11
HKADC_IN12
HKADC_IN13

MISC3 Interface 3 of 4

XOADC_IN

CODEC_CLK_19M2

SYS_CLK_19M2

RF_CLK_38M4

WIFI_CLK_38M4

NFC_CLK_38M4

CLK32_SYS

CLK32_BT

CLK32_GPS

AUXDAC0

SPMI_SSI_SEL

DGND_47
DGND_48
DGND_49
DGND_50
DGND_51
DGND_52

J17

M11

G11
F12

F8
F10
K11
H9
G9
J11
H11
J9
H4
D4
F4
D5
J7
G5
J12

F17
E15
C16
D17T9
C18
E18

N10
M12
N11

D6
T3

K12
N16
P8
F11
G12
K7

PMU_PWR_HOLD

DEBUG

C1222

PMU_RST_OUT_N

GPIO_225_PMU0_IRQ_N
GND
SRP

SRN

HKADC_IN0_PCB_ID0
HKADC_IN1_PCB_ID1
HKADC_IN2_PCB_ID2

HKADC_IN4_PA_TEMP_1
HKADC_IN5_CHG_TEMP
HKADC_IN6_USB_TEMP
HKADC_IN7_AP_TEMP
HKADC_IN8_USB_BOARD_ID

HKADC_IN10_BAT_TEMP
HKADC_IN11_BAT_ID
HKADC_IN12_OTG

XOADC_IN

R1201

C1201

R1205

R1220

RF_AUXDAC0

RFAUXDAC0:analogsignal,enclosedbyground

SYS_CLK_19M2
RF0_CLK_38M4

ABB_CLK_38M4

NFC_CLK_38M4

SYS_CLK_32K
CLK32_BFGN

C1205

C1230

C1230nearwifi/BTIC

USB CON TEMP DETUSB Board ID DET

VOUT27_1V8VOUT27_1V8

HKADC_IN6_USB_TEMP

1%

HKADC_IN8_USB_BOARD_ID

R1204

1%

R1218

BOARD ID

VOUT27_1V8

HKADC_IN0_PCB_ID0

HKADC_IN1_PCB_ID1

HKADC_IN2_PCB_ID2

4 1 6

1%

R1203

1%

R1210

1%

R1211

1%

R1209

Mode

AL00B/C/D/E
L42IB/IC/ID
AL00C/E/F
L42IC/ID/IE

TL00C/D
L22C/L22D

TL00/L22 VN1

JSN-L21C/D

AL00C/E/F
L42IC/ID/IE

TL00/L22
JSN-L21C/D
JSN-L23C

1%

R1208 R1207

boardID

7606
7610 51K 100K

51K

7602

51K

7612

7613

7614
7615

7616
7619

51K
51K
51K

51K

Board ID Resistor Set

UP RESID

0

NC

1

150K

2

100K
200K

3
4

150K
121K

5

51K 100K

6
7

30K

8

20K

9

150K

100K
100K

100K51K

100K
100K
100K

100K

HKADC·ÖÅä±í

HKADC_IN0
HKADC_IN1
HKADC_IN2
HKADC_IN3
HKADC_IN4
HKADC_IN5
HKADC_IN6
HKADC_IN7
HKADC_IN8
HKADC_IN9
HKADC_IN10
HKADC_IN11
HKADC_IN12
HKADC_IN13

JSN-AL/TL
JSN-L21D/L31C
JSN-L23C/L4
Reserved
Reserved
Reserved
Reserved
Reserved

DOWN RES

0K
22K
30K
100K
121K
150K

100K
150K
NC

NC 0100K51K

150K

NC 0

150K 22K

150K 22K

150K
150K
150K

150K

22K

22K
22K
22K

22K

APU Board ID0(RF USE)
APU Board ID1
APU Board ID2
RESERVERD
PA TEMP DET0
Charge TEMP
USB_TEMP_ADC
AP TEMP
USB_BOARD_ID
RESERVERD
BATT TEMP
BATT ID
HKADC_IN12_OTG
RESERVERD

CodeR1218
07091406
07092138
07091246
07091302

07091172
TBD

Resistor Code

0K 07090911
20K

22K
30K 07091299

51K
100K
121K
150K
200K

R1210R1203R1209R1211R1208R1207
100K51K

NC 0

30K100K

100K 30K

100K30K7607 V3JSN-L21D 0NC100K51K
200K 100K
150K
150K 121K
121K 150K

51K 100K
150K NC

NC

Value
200k
150k
100k
51k
68k07091408
30k07091299
22K
TBD

07092448
07091172

07091302
07091246
07091176
07092138
07091406

V1.1-V3
VN1
V3

VN1
VN17609 0NC100K51KJSN-L23C

VN1.1
VN1.1
VN1.1
VN1.1

A

B

C

VOUT27_1V8

R1223

1%

XOADC_IN

The type and specification of the components refer to the BOM

DESIGNED

CHENZHENBIN 00264464

HL1JSNM

REVIEWED

MABO 00278126

D

C1204

XIN_38M4_PMU

X1201

4 3

HOT/X_TAL/XT1 GND/RT2

HOT/X_TAL/XT2SENSOR/RT1

21

XOUT_38M4_PMU

AGND_OSC

VER PART_NUMBER

03025GKME

1

2 3 4 5 6

2018-07-06

DATEECA NO

03025GKM_SCH1ZH

12_PMU Digital

SHEET OF

60

HUAWEI TECH CO.,LTD.

D

1 2 3 4 5 6

www.DeviceDB.xyz

Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

Updates, additions, comments - look, add here https://devicedb.xyz/device/554-smartfon-honor-8x.html

13.Hi6422

A

B

C

VBAT_SYS

C1312

C1314

C1309

C1301

C1306

C1305

C1313

1%

R1301

D6

A5
A6

C4
C5
C6

J5
J6

G4
G5
G6

J1
J2

G1
G2
G3

A1
A2

C1
C2
C3

F6
E6

U1301

VSYS

IN0_1
IN0_2

PGND0_1
PGND0_2
PGND0_3

IN1_1
IN1_2

PGND1_1
PGND1_2
PGND1_3

IN2_1
IN2_2

PGND2_1
PGND2_2
PGND2_3

IN3_1
IN3_2

PGND3_1
PGND3_2
PGND3_3

VREF
IREF

LX0_1
LX0_2
LX0_3
LX1_1
LX1_2
LX1_3
LX2_1
LX2_2
LX2_3
LX3_1
LX3_2
LX3_3

VFB0_P
VFB0_N
VFB1_P
VFB1_N
VFB2_P
VFB2_N

PHASE_CTRL_SET1
PHASE_CTRL_SET0

SSI_CLK

SSI_PMU1

PMU1_IRQ_N

PMU1_EN

VDD_IO

VPP

AGND1
AGND2
AGND3
AGND4

SGND

L1305

1

L1306

1

L1307

1

B4
B5
B6
H4
H5
H6
H1
H2
H3
B1
B2
B3

D5
D4
F1
F2
E3
D3

J4
A3
D1
D2

J3

A4
E2
E1

E4
E5
F4
F5
F3

VDD_CPU_B_REMOTE
VSS_CPU_B_REMOTE
VDD_GPU_REMOTE
VSS_GPU_REMOTE
VDD_CPU_L_REMOTE
VSS_CPU_L_REMOTE

PMU1_CLK_19M2

PMU1_SSI_DATA
GPIO_149_PMU1_IRQ_N
GPIO_177_PMU1_EN

VOUT_PMUD

S

S

S

G

SG1301

S

G

SG1305

L1308

C1317

1

C1320
C1321

R1302

TP1304

2

2

VDD_CPU_B

2

VDD_GPU

2

VDD_CPU_L

VOUT2_1V8

A

B

C

S

SG1306

S

G

The type and specification of the components refer to the BOM

D

DESIGNED

CHENZHENBIN 00264464

HL1JSNM

REVIEWED

MABO 00278126

VER PART_NUMBER

03025GKME

1

2 3 4 5 6

2018-07-06

DATEECA NO

03025GKM_SCH1ZH

SHEET OF

13_Hi6422

60

HUAWEI TECH CO.,LTD.

D

1 2 3 4 5 6

www.DeviceDB.xyz

Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

Updates, additions, comments - look, add here https://devicedb.xyz/device/554-smartfon-honor-8x.html

A

B

C

14. UFS/eMMC/DDR

TP1402

VOUT2_1V8

SOC_EMMC_CMD

PMU_RST_OUT_N

C1401

R1401

21

SOC_EMMC_DATA0
SOC_EMMC_DATA1
SOC_EMMC_DATA2
SOC_EMMC_DATA3
SOC_EMMC_DATA4
SOC_EMMC_DATA5
SOC_EMMC_DATA6
SOC_EMMC_DATA7

TP1401
SOC_EMMC_STRB

SOC_EMMC_CLK

H10

A3
A4
A5
B2
B3
B4
B5
B6

H5

M6

M5

K5

A6
E7
G5

J5
K8

C4
N2
N5
P4
P6

DAT0
DAT1
DAT2
DAT3
DAT4
DAT5
DAT6
DAT7

RCLK/DS

CLK

CMD

RST_N

VSS1
VSS2
VSS3
VSS4
VSS5
VSS6

VSSQ/VSS1
VSSQ/VSS2
VSSQ/VSS3
VSSQ/VSS4
VSSQ/VSS5

NC/RFU1
NC/RFU2
NC/RFU3
NC/RFU4

U1402

MISC Interface 1 of 2

NC/RFU5
NC/RFU6

NC/RFU/VSF1
NC/RFU/VSF2
NC/RFU/VSF3

RFU/VSF1
RFU/VSF2
RFU/VSF3
RFU/VSF4

VCC/VDDF1
VCC/VDDF2
VCC/VDDF3
VCC/VDDF4

VCCQ/VDD1
VCCQ/VDD2
VCCQ/VDD3
VCCQ/VDD4
VCCQ/VDD5

VDDI

A7
E5
G3
K6
K7
P7

E8
G10
P10

E9
E10
F10
K10

E6
F5
J10
K9

C6
M4
N4
P3
P5

C2

TP1405
TP1406
TP1403
TP1404

VOUT2_1V8

A10
A11
A12
A13
A14

B10
B11
B12
B13
B14

C10
C11
C12
C13
C14

D12
D13
D14

E12
E13
E14

F12
F13
F14

G12
G13
G14

A1
A2
A8
A9

B1
B7
B8
B9

C1
C3
C5
C7
C8
C9

D1
D2
D3
D4

E1
E2
E3

F1
F2
F3

G1
G2

H1

NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9
NC10
NC11
NC12
NC13
NC14
NC15
NC16
NC17
NC18
NC19
NC20
NC21
NC22
NC23
NC24
NC25
NC26
NC27
NC28
NC29
NC30
NC31
NC32
NC33
NC34
NC35
NC36
NC37
NC38
NC39
NC40
NC41
NC42
NC43
NC44
NC45
NC46
NC47
NC48
NC49
NC50
NC51
NC52
NC53
NC54

VOUT15_2V95

H2

NC55

H3

NC56

H12

NC57

H13

NC58

H14

NC59

J1

NC60

J2

NC61

J3

NC62

J12

NC63

J13

NC64

J14

NC65

K1

NC66

K2

NC67

K3

U1402

NC Interface 2 of 2

NC68
NC69
NC70
NC71
NC72
NC73
NC74
NC75
NC76
NC77
NC78
NC79
NC80
NC81
NC82
NC83
NC84
NC85
NC86
NC87
NC88
NC89
NC90
NC91
NC92
NC93
NC94
NC95
NC96
NC97
NC98

NC99
NC100
NC101
NC102
NC103
NC104
NC105
NC106
NC107

K12
K13
K14
L1
L2
L3
L12
L13
L14
M1
M2
M3
M7
M8
M9
M10
M11
M12
M13
M14
N1
N3
N6
N7
N8
N9
N10
N11
N12
N13
N14
P1
P2
P8
P9
P11
P12
P13
P14

V12
V14
V16
V19
V20
V21
V22
V23
W24
W29

Y10
Y12
Y14
Y16
Y18
Y19
Y20
Y21
Y22
Y23

AA24

AB8
AB10
AB12
AB14
AB17
AB18
AB19
AB20
AB21
AB22
AB23
AC16
AC24
AD10
AD14

Y1
Y2
Y8

VSS_154
VSS_155
VSS_156
VSS_157
VSS_158
VSS_159
VSS_160
VSS_161
VSS_162
VSS_163
VSS_164
VSS_165
VSS_166
VSS_167
VSS_168
VSS_169
VSS_170
VSS_171
VSS_172
VSS_173
VSS_174
VSS_175
VSS_176
VSS_177
VSS_178
VSS_179
VSS_180
VSS_181
VSS_182
VSS_183
VSS_184
VSS_185
VSS_186
VSS_187
VSS_188
VSS_189
VSS_190
VSS_191
VSS_192

POP LPDDR 4X

U300_POP

GND3 interface 10 of 10

VSS_193
VSS_194
VSS_195
VSS_196
VSS_197
VSS_198
VSS_199
VSS_200
VSS_201
VSS_202
VSS_203
VSS_204
VSS_205
VSS_206
VSS_207
VSS_208
VSS_209
VSS_210
VSS_211
VSS_212
VSS_213
VSS_214
VSS_215
VSS_216
VSS_217
VSS_218
VSS_219
VSS_220
VSS_221
VSS_222
VSS_223
VSS_224
VSS_225
VSS_226
VSS_227
VSS_228
VSS_229
VSS_230

AD17
AD18
AD19
AD20
AD21
AD22
AD23
AE6
AE15
AE24
AE29
AF8
AF10
AF11
AF13
AF14
AF16
AF17
AF23
AH21
AH29
AJ4
AJ19
AJ22
AK1
AK10
AK16
AK18
AK21
AK24
AK29
AL1
AL2
AL4
AL7
AL13
AL28
AL29

eMMC 5.1

4006100664GB

128GB 40061007
LPDDR4X

4GB

40020492
400204936GB

A

B

C

D

C1406

C1402

C1408

C1405

C1404

C1407

The type and specification of the components refer to the BOM

DESIGNED

CHENZHENBIN 00264464

HL1JSNM

REVIEWED

MABO 00278126

VER PART_NUMBER

03025GKM

1

2 3 4 5 6

2018-07-06

DATEECA NO

03025GKM_SCH1ZH

SHEET OF

14_eMMC/DDRE60

HUAWEI TECH CO.,LTD.

D

1 2 3 4 5 6

www.DeviceDB.xyz

Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

Updates, additions, comments - look, add here https://devicedb.xyz/device/554-smartfon-honor-8x.html

www.DeviceDB.xyz

A

B

15. Battery & Fuel guage

Battery Connector

VBATT_VD

BATT_TS

VBATT-

S

S

SG1506

G

C1507

D1502

11
13
15

J1501

3
5
7
9

P1
P3
P5
P7
P9
P11
P13
P15

P10
P12
P14
P16

21

P2

4

P4

6

P6

8

P8

10
12
14
16

BATT_SW_JIG

VBATTVBATT
BATT_ID

VBATT-

SRN

SRP

SG1505

SG1501

SG1502

SG1503

SG1504

S

S

R1501

G

1%

S

S

S

S

S

S

S

S

VBATT-

G

G

G

G

CAD note:1.Trace for 6A

2.Differential trace

A

B

C

D

VOUT27_1V8

1%

R1505

BATT_TS

R1508

Battery Temperature

BATT_ID

VOUT27_1V8

1%

R1506

R1507

HKADC_IN11_BAT_IDHKADC_IN10_BAT_TEMP

Battery ID

The type and specification of the components refer to the BOM

DESIGNED

CHENZHENBIN 00264464

HL1JSNM

REVIEWED

MABO 00278126

VER PART_NUMBER

15_Battery

SHEET OF

2018-07-06

DATEECA NO

03025GKM_SCH1ZH

60

C

D

E

03025GKM

1

2 3 4 5 6

HUAWEI TECH CO.,LTD.

1 2 3 4 5 6

www.DeviceDB.xyz

Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

Updates, additions, comments - look, add here https://devicedb.xyz/device/554-smartfon-honor-8x.html

16. Charge Management

A

VOUT27_1V8

1%

Charger IC

A

B

C

R1601

T

RT1601

HKADC_IN5_CHG_TEMP

VCHG_USB_CON

C1603

C1604

CHG_PGND

I2C6_SDA

I2C6_SCL

GPIO_221_CHG_INT_N
TP1601

GPIO_189_CHARGER_EN

I2C address=1101011b(0x6B)

place close to U1601

U1601

SW1
SW2

BTST
REGN

SYS1
SYS2

BAT1
BAT2

ILIM

QON

19
20

21
22

17
18

15
16

13
14

10

11

TS

12

CHG_PGND

R1609

I=355AR/681R=0.52A for RT9466

CHG_REGN

CHG_PGND

1

VBUS

24

NC

23

PMID

4

STAT

3

PG

6

SDA

5

SCL

7

INT

8

OTG/IUSB

9

CE

2

PSEL

25

SINK

PGND1
PGND2

L1601

C1607

CHG_REGN CHG_PGND

C1610

R1607

SG1602

S

G

S

VBATT

C1611

C1608

C1609

B

VBAT_SYS

12

D1601

C

R1610

SG1601

CHG_PGND

SG1603

SG1604

S

G

S

S

G

S

S

G

S

The type and specification of the components refer to the BOM

D

DESIGNED

CHENZHENBIN 00264464

HL1JSNM

REVIEWED

MABO 00278126

VER PART_NUMBER

03025GKME

1

2 3 4 5 6

2018-07-06

DATEECA NO

03025GKM_SCH1ZH

16_Scharger

SHEET OF

60

HUAWEI TECH CO.,LTD.

D

A

www.DeviceDB.xyz

Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

Updates, additions, comments - look, add here https://devicedb.xyz/device/554-smartfon-honor-8x.html

1 2 3 4 5 6

17. LCD and TP INTERFACE

J1701

VOUT4_1V8

R1713

LCD_VSN
LCD_VSP

VOUT4_1V8

GPIO_039_LCD_RST_N
GPIO_015_LCD_TE0
GPIO_185_LCD_CABC_PWM

GPIO_210_TP_INT_N

TP_SPI1_MOSI
TP_SPI1_MISO
TP_SPI1_CLK
TP_SPI1_CS

GPIO_040_TP_RST_N

LED1­LED2-

GPIO_036_LCD_ID0
GPIO_037_LCD_ID1

1

P1

3

P3

5

P5

7

P7

9

P9

11

P11

13

P13

15

P15

17

P17

19

P19

21

P21

23

P23

25

P25

27

P27

29

P29

31

P31

33

P33

S1 S2
S3 S4

P2
P4
P6

P8
P10
P12
P14
P16
P18
P20
P22
P24
P26
P28
P30
P32
P34

A

2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32

LEDA_BTB

34

3635
3837

LED3-

DSI0_DATA2_P_BTB
DSI0_DATA2_N_BTB

DSI0_DATA1_P_BTB
DSI0_DATA1_N_BTB

DSI0_CLK_P_BTB
DSI0_CLK_N_BTB

DSI0_DATA0_P_BTB
DSI0_DATA0_N_BTB

DSI0_DATA3_P_BTB
DSI0_DATA3_N_BTB

1 2

LB1715

LB1715 First Bom:07090800 Bead Code:10070019

LED+

DSI0_DATA2_N

DSI0_DATA2_P

R1710

T1705

R1711

DSI0_DATA2_N_BTB

*
*

1

34

DSI0_DATA2_P_BTB

2

B

C

D

VBAT_SYS

C1702

C1771

C1769

C1770

C1765

C1764

C1763

C1762

C1761

LCD POS/NEG Voltage Driver

L1702

VBAT_SYS
GPIO_035_LCD_VSP_EN

GPIO_045_LCD_VSN_EN
I2C3_SCL

I2C3_SDA

C1705

U1702

C1 D1

B1

ENP

A1

ENN

B2

SCL

C2

SDA

B3

PGND1

E1

PGND2

D2

AGND

SG1701

S

S

G

REG1
REG2

OUTP
OUTN

CFLY1
CFLY2

SWVIN

C1706

D3
E2

E3
A2

C3
A3

C1707

LCD BL DRIVER

21

C1716

R1714

C1720

TP1701

L1701

2 1

L1703

GPIO_209_LCD_BL_EN

GPIO_186_LCD_BL_PWM

C1727

U1701

C2 C3

C1

EN

B1

PWM

COMP GND

IFB2
IFB1

ISET

SWVIN

A2
A3

A1
B3B2

LED2­LED1-

R1701

D1701
2

modularizationok

LCD_VSP
LCD_VSN

C1709

C1708

CAP tolerance above 50V

C1701

LED+

R1702

1

C1704

C1767

For 3P6S, R1715/1716 can DNI when 2P9S

LED1-

2P9S

R1715

DNI

R1716
R1717

R1715R1716

LED2-

LED3-

R1701
L1701
R1718

07091300
07091405

SMT DNI

3P6S
R1715DNI
R1716

07091299
07091250

SMTDNI

R1704

DSI0_DATA1_N

*

T1702

R1703

R1709

4

T1701

1

R1708

R1707

T1703

R1712

R1706

T1704

R1705

*

1

*
*

*
*

1

*
*

1

Johnson I/F at V0 and V1 stage

LCD_VSN

LCD_VSP

C1772

C1773

DSI0_DATA1_P

DSI0_CLK_N

DSI0_DATA0_N

DSI0_DATA0_P

DSI0_DATA3_N

DSI0_DATA3_P

The type and specification of the components refer to the BOM

DESIGNED

CHENZHENBIN 00264464

HL1JSNM

REVIEWED

MABO 00278126

VER PART_NUMBER

DSI0_DATA1_N_BTB

34

DSI0_DATA1_P_BTB

2

3

2

34

2

34

2

DSI0_CLK_N_BTB

DSI0_CLK_P_BTBDSI0_CLK_P

DSI0_DATA0_N_BTB

DSI0_DATA0_P_BTB

DSI0_DATA3_N_BTB

DSI0_DATA3_P_BTB

2018-07-06

DATEECA NO

03025GKM_SCH1ZH

17_LCD

SHEET OF

B

C

D

60

1

2 3 4 5 6

R1717

03025GKME

HUAWEI TECH CO.,LTD.

A

www.DeviceDB.xyz

Обновления, дополнения, комментарии и т.п. смотрим, добавляем здесь https://devicedb.xyz/device/554-smartfon-honor-8x.html

Updates, additions, comments - look, add here https://devicedb.xyz/device/554-smartfon-honor-8x.html

1 2 3 4 5 6

18. Flash/front Camera

U1801

B3

VBAT_SYS

C1832

L1801

GPIO_180_FLASH_STROBE
RF_GPIO01_FLASH_MASK
I2C3_SDA
I2C3_SCL

A2

B2
C1
C2
C3

IN
SW

STROBE
TX/TORCH
SDA
SCL

OUT

LED

GND

A

C1830

A1

B1

A3

GND

C1866

LED1801

2 1
3

B

C

CSI1_DATA1_N
CSI1_DATA1_P

CSI1_DATA0_N
CSI1_DATA0_P

SCAM0_ISP_SDA1
SCAM0_ISP_SCL1

C1863

C1864

Front SUB Camera

16M Sub 23060300

J1801

2625
21

P2

43
65
87
109
1211
1413
1615
1817
2019
2221
2423

2827

SG1801

S

G

S1 S2

AGND

XVS

DGND
DATA1_N
DATA1_P

CLK_N

CLK_P DATA2_N
DATA0_N
DATA0_P

SDA

SCL

S

P1
P3 P4
P5 P6
P7 P8
P9 P10
P11 P12
P13 P14
P15 P16
P17 P18
P19 P20
P21 P22
P23 P24

S3 S4

AVDD
DGND
MCLK
DGND
DATA3_N
DATA3_P

DATA2_P
DGND
RESETDGND
DVDD
VDDIO

Max Mated High=0.8mm

VOUT13_2V8

SCAM0_ISP_CLK1

CSI1_DATA3_N
CSI1_DATA3_PCSI1_CLK_N
CSI1_DATA2_NCSI1_CLK_P
CSI1_DATA2_P

GPIO_031_SCAM0_RST_N

VOUT32_1V05
VOUT21_1V8

C1810

C1862

C1861

C1809

B

C

The type and specification of the components refer to the BOM

D

DESIGNED

CHENZHENBIN 00264464

HL1JSNM

REVIEWED

CAD note: C1825 & C1821 must close to J1802

MABO 00278126

VER PART_NUMBER

E

03025GKM

1

2 3 4 5 6

2018-07-06

DATEECA NO

03025GKM_SCH1ZH

18_Flash/Front Camera

SHEET OF

60

HUAWEI TECH CO.,LTD.

D