HOLT HI-8588PST, HI-8588PSI, HI-8588PDT, HI-8588PDI, HI-8588CRT Datasheet

January2001

HI-8588

DESCRIPTION

TheHI-8588isanARINC429businterfacereceiverandis
availableinaSO8pinpackage.Thetechnologyis
analog/digitalCMOS.Thecircuitryrequiresonlya5volt
supply.

TheARINCbuscanbeconnecteddirectlytothechip.The
typical10voltdifferentialsignalistranslatedandinputtoa
windowcomparatorandlatch.Thecomparatorlevelsare
justbelowthestandard6.5voltminimumARINCdata
thresholdandjustabovethestandard2.5voltmaximum
ARINCnullthreshold.

TheTESTAandTESTBinputsbypasstheanalogfor
testingpurposes.AlsoifTESTAandTESTBareboth
takenhigh,theanalog powersdownandthedigitaloutputs
tri-stateallowingwire-orpossibilities.

PleaserefertotheHI-8588-10forapplicationswherean
externalresistanceinserieswiththeARINCinputsis
requiredforlightningprotectionorwhenthedigitaloutputs
needtobealogiczeroratherthanopencircuitwhen
TESTAandTESTBarebothhigh.

PINCONFIGURATION

VCC

TESTA

2
3

RINB

4 5

RINA GND

81
7
6

SUPPLYVOLTAGES

vcc =5.0V±5%

FUNCTIONTABLE

TESTB
ROUTB
ROUTA

FEATURES

!

DirectARINC429linereceiverinterface
inasmalloutlinepackage

!

Receiverinputhystersisatleast2volts

!

Testinputsthatbypassanaloginputand
canpowerdownandtri-stateoutputs

!

Plasticandceramicpackageoptions­surfacemountandDIP

!

Milprocessingavailable

PINDESCRIPTIONTABLE

PIN SYMBOL FUNCTION DESCRIPTION

VCC SUPPLY 5VOLTSUPPLY
TESTA LOGICINPUT CMOS
RINB ARINCINPUT RECEIVERBINPUT
RINA ARINCINPUT RECEIVERAINPUT
GND POWER GROUND
ROUTA LOGICOUTPUT RECEIVERCMOSOUTPUTA
ROUTB LOGICOUTPUT RECEIVERCMOSOUTPUTB
TESTB LOGICINPUT CMOS

HOLTINTEGRATEDCIRCUITS

(DS8588Rev.A)01/01

1

FUNCTIONALDESCRIPTION

RECEIVER

HI-8588

Figure1showsthegeneralarchitectureoftheARINC429
receiver.ThereceiveroperatesofftheVCCsupplyonly.
TheinputsRINAandRINBeachhaveseriesresistors,typi­cally35Kohms.Theyconnecttoleveltranslatorswhose
resistancetoGroundistypically10Kohms.Therefore,any
seriesresistanceaddedtotheinputswillaffectthevoltage
translation.

Afterleveltranslation,theinputsarebufferedandbecome
inputstoadifferentialamplifier.Theamplitudeofthedif­ferentialsignaliscomparedtolevelsderivedfromadi­viderbetweenVCCandGround.Thenominals ettingscor­respondtoaOne/Zeroamplitudeof6.0VandaNullampli­tudeof3.3V.

RINA

RINB

ESD

PROTECTION

AND

TRANSLATION

NULL

ZERO

ONE

NULL

ThestatusoftheARINCreceiverinputislatched.ANull
inputresetsthelatchesandaOneorZeroinputsetsthe
latches.

Thelogicattheoutputiscontrolledbythetestsignal
whichisgeneratedbythelogicalORoftheTestAand
TestBpins.IfTestAandTestBarebothOne,thenthere­ceiverispowereddownandtheoutputpinsfloat.The
powerdowndoesnotdisconnecttheinternalresistorsat
theARINCinput.

TEST

S Q
LATCH
R

S Q
LATCH
R

TEST
TESTA

TEST

TEST
TESTB

TESTA'TESTB

TESTA'TESTB

ROUTA

ROUTB

FIGURE1-RECEIVERBLOCKDIAGRAM

APPLICATIONINFORMATION

Figure2showsapossibleapplicationofthe
HI-8588interfacinganARINCreceivechannel
totheHI-6010whichinturninterfacestoan
8-bitbus.

1
2
8

4
3

5

1

6
7

5

4

6
7

8

2
3

FIGURE2-APPLICATIONDIAGRAM

HOLTINTEGRATEDCIRCUITS

2

HI-8588

ABSOLUTEMAXIMUMRATINGS RECOMMENDEDOPERATINGCONDITIONS

VoltagesreferencedtoGround
Supplyvoltages

VCC...................................................7V

ARINCinput-pins3&4

Voltageateitherpin......+29Vto-29V

DCcurrentperinputpin................±10mA

Powerdissipationat25°C

plasticDIL............0.7W

ceramicDIL..........0.5W

SolderTemperature........275°Cfor10sec

StorageTemperature........-65°Cto+150°C

OPERATINGTEMPERATURERANGE,

SupplyVoltages

VCC........................................5V...±5%

TemperatureRange

IndustrialScreening........-40°Cto+85°C

Hi-TempScreening.......-55°Cto+125°C

MilitaryScreening.........-55°Cto+125°C

NOTE:Stressesaboveabsolutemaximum
ratingsoroutsiderecommendedoperatingcon­ditionsmaycausepermanentdamagetothe
device.Thesearestressratingsonly.Opera­tionatthelimitsisnotrecommended.

suppliesfloating

""

V

=0V

IN

V

=5V

IN

V=4.6V

OH

V=0.4V

OL

pins2,8=0V;pins3,4open
pins2,8=5V;pins3,4open

HOLTINTEGRATEDCIRCUITS

3

Kohm
Kohm

µ A
µ A

mA
mA

mA
mA

OPERATINGTEMPERATURERANGE,

HI-8588

DIFF

pin6

t

t

plhr

definedinFigure3,C=50pF

t

t

phlr

90%

10%

L

trrt

rr

0V1
0V

-10V

5V
0V

t

t

plhr

t

t

phlr

tfrt

5V

pin7

0V

FIGURE3-RECEIVERTIMING

PART PACKAGE TEMPERATURE BURN LEAD

NUMBER DESCRIPTION RANGE FLOW IN FINISH

HI-8588PDI 8 PIN PLASTIC DIP -40°C TO +85°C I NO SOLDER
HI-8588PDT 8 PIN PLASTIC DIP -55°C TO +125°C T NO SOLDER
HI-8588PSI 8 PIN PLASTIC NARROW BODY SOIC -40°C TO +85°C I NO SOLDER
HI-8588PST 8 PIN PLASTIC NARROW BODY SOIC -55°C TO +125°C T NO SOLDER
HI-8588CDI 8 PIN CERAMIC SIDE BRAZED DIP -40°C TO +85°C I NO GOLD
HI-8588CDT 8 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C T NO GOLD
HI-8588CDM 8 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C M YES SOLDER
HI-8588CRI 8 PIN CERDIP -40°C TO +85°C I NO SOLDER
HI-8588CRT 8 PIN CERDIP -55°C TO +125°C T NO SOLDER
HI-8588CRM 8 PIN CERDIP -55°C TO +125°C M YES SOLDER

HOLTINTEGRATEDCIRCUITS

4

8-PINPLASTICDIP

.135 ± .015

(3.429 ± .381)
.1375 ± .0125

(3.493 ± .318)

.019 ± .002

(.483 ± .102)

.385 ± .015

(4.699 ± .381)

.100 ± .010

(3.540 ± .254)

7 ° TYP.

HI-8588PACKAGEDIMENSIONS

inches(millimeters)

.250±.010

(6.350 ± .254)

.025 ± .010

(.635±.254)

.055 ± .010

(1.397 ± .254)

PackageType:

.300 ± .010

(7.620 ± .254)

.0115 ± .0035

(.292 ± .089)

.335 ± .035

(8.509 ± .889)

8P

8-PINPLASTICSMALLOUTLINE(SOIC)-NB

(NarrowBody)

.1935±.0035
(4.915±.085)

.236±.008

(5.994±.203)

INP1

.0165±.0035

(.4191±.0889)

.050±.010

(1.27±.254)

.1535±.0035

(3.90±.09)

0 ° to8 °

DetailA

.033±.017

(.8382±.4318)

DetailA

PackageType:

.0086±.0012

(.2184±.0305)

.055±.005

(1.397±.127)

8HN

.0069±.0029

(.1753±.0737)

HOLTINTEGRATEDCIRCUITS

5

8-PINCERAMICSIDE-BRAZEDDIP

.405 ± MAX

(10.287 ± MAX)

.050 ± .007

(1.270 ± .178)

HI-8588PACKAGEDIMENSIONS

inches(millimeters)

PackageType:

.250 ± .008

(7.366 ± .203)

8C

8-PINCERDIP

.163±.037

(4.140 ± .940 )

.005MIN.

(.127MIN.)

PIN1

.200MAX

(5.080MAX)

.018±.002

(.457 ± .051)

.380 ± .004

(9.652 ± .102)

.050 ± .005

(1.270 ± .127)

.035±.010

(.889 ± .254)

SEATING

PLANE

.100±.003

(2.540 ± .076)

.248 ± .003

(6.299 ± .076)

BASE

PLANE

.300±.010

(7.620 ± .254)

.0105 ± .0015

(.267 ± .038)

PackageType:

8D

(.991 ± .154)

.200MAX.

(5.080MAX.)

.163 ± .037

(4.140 ± .940)

.039 ± .006

.100 ± .008

(2.540 ± .203)

.015MIN.

(.381MIN.)

BasePlane

SeatingPlane

.018 ± .006

.056 ± .006

(1.422 ± .152)

(.457 ± .152)

HOLTINTEGRATEDCIRCUITS

6

.314 ± .003

(7.976 ± .076)

.010 ± .006

(.254 ± .152`)

.350 ± .030

(8.890 ± .762)