HI-8585,HI-8586
January2001
DESCRIPTION
TheHI-8585andHI-8586areCMOSintegratedcircuits
designedtodirectlydrivetheARINC429businan8pin
package.Twologicinputscontroladifferentialvoltage
betweentheoutputpinsproducinga+10voltOne,a
-10voltZero,anda0voltNull.
TheCMOS/TTLcontrolinputsaretranslatedtoARINC
specifiedamplitudesusingonboardzeners.Alogicinput
isprovidedtocontroltheslopeofthedifferentialoutput
signal.Timingissetbyon-chipresistorandcapacitorand
testedtobewithinARINCrequirements.
TheHI-8585has37.5ohmsinserieswitheachlinedriver
output.TheHI-8586pr ovidestheoptiontobypassmost
oftheoutputresistancesothatseriesprotectioncircuits
canaddtheirresistances.
TheHI-8585ortheHI-8586alongwiththeHI-8588line
receiverofferthesmallestoptionsavailabletogetonand
offtheARINCbus.
ARINC429LINEDRIVER
PINCONFIGURATION
SLP1.5
TX0IN
TX1IN
GND
1
2
3
4 5
SUPPLYVOLTAGES
V+=12Vto15V
V-=-12Vto-15V
FUNCTIONTABLE
8
7
6
V+
TXBOUT
TXAOUT
V-
FEATURES
! DirectARINC429linedriver
interfaceinasmallpackage
On-chipzenertosetoutputlevels
!
On-chiplinedriverslopecontroland
!
selectionbylogicinput
Lowcurrent12to15voltsupplies
!
CMOS/TTLlogicpins
!
Plasticandceramicpackageoptions-
!
surfacemountandDIP
!
ThemallyenhancedSOICpackages
!
Milprocessingavailable
TX1IN TX0IN SLP1.5
0 0 X 0V 0V
0 1 0 -5V 5V 10µs
0 1 1 -5V 5V 1.5µs
1 0 0 5V -5V 10µs
1 0 1 5V -5V 1.5µs
1 1 X 0V 0V
TXAOUT TXBOUT
PINDESCRIPTIONTABLE
SYMBOL FUNCTION DESCRIPTION
PIN
1 SLP1.5 LOGIC INPUT CMOS OR TTL, V+ IS OK
2 TX0IN LOGIC INPUT CMOS OR TTL
3 TX1IN LOGIC INPUT CMOS OR TTL
4 GND POWER GROUND
5 V- POWER -12 TO -15 VOLTS
6 TXAOUT LOGIC OUTPUT LINE DRIVER TERMINAL A
7 TXBOUT LOGIC OUTPUT LINE DRIVER TERMINAL B
8 V+ POWER +12 TO +15 VOLTS
SLOPE
N /A
N /A
HOLTINTEGRATEDCIRCUITS
(DS8585Rev.D)01/01
1
FUNCTIONALDESCRIPTION
HI-8585,HI-8586
Figure1isablockdiagramofthelinedriver.The+5Vand
-5Vlevelsaregeneratedinternallyusingon-chipzeners.
Currentsforslopecontrolaresetbyzenervoltagesacross
on-chipresistors.
TheTX0INandTX1INinputsreceivelogicsignalsfroma
controltransmitterchipsuchastheHI-6010orHI-8282.
TXAOUTandTXBOUTholdeachsideoftheARINCbusat
GrounduntiloneoftheinputsbecomesaOne.IfforexampleTX1INgoeshigh,achargingpathisenabledto5Vonan
“A”sideinternalcapacitorwhilethe“B”sideisenabledto
-5V.ThechargingcurrentisselectedbytheSLP1.5pin.If
theSLP1 .5pinishigh,thecapacitorisnominallycharged
from10%to90%in1.5µs.IfSLP1.5islow,theriseandfall
timesare10µs.
5V
ONE
NULL
ESD
PROTECTION
AND
VOLTAGE
TRANSLATION
ZERO
CONTROL
LOGIC
ONE
NULL
ZERO
CONTROL
LOGIC
-5V
SLP1.5
5V
-5V
Aunitygainbufferreceivestheinternallygeneratedslopes
anddifferentiallydrivestheARINCline.Currentislimited
bytheseriesoutputresistorsateachpin.Thereareno
fusesattheoutputsoftheHI-8585asexistsontheHI-8382.
TheHI-8585has37.5ohmsinserieswitheachoutput.The
HI-8586has10ohmsinseries.TheHI-8586isforapplicationswheremoreseriesresistanceisaddedexternally,
typicallyforlightningprotectiondevices.
“A”SIDE
CURRENT
CONTROL
CURRENT
CONTROL
“B”SIDE
HI-8585=37.5OHMS
HI-8556=10.0OHMS
HI-8585=37.5OHMS
HI-8586=10.0OHMS
TXAOUT
TXBOUT
APPLICATIONINFORMATION
Figure2showsapossibleapplication
oftheHI-8585/86interfacinganARINC
transmitchannelfromtheHI-6010.
FIGURE1-LINEDRIVERBLOCKDIAGRAM
2
8
4
3
5
1
6
7
4 5
FIGURE2-APPLICATIONDIAGRAM
1
6
7
8
2
3
HOLTINTEGRATEDCIRCUITS
2
HI-8585,HI-8586
ABSOLUTEMAXIMUMRATINGS
VoltagesreferencedtoGround
RECOMMENDEDOPERATINGCONDITIONS
SupplyVoltages
V+....................+12V±5%or+15V±10%
Supplyvoltages
V-.....................-12V±5%or-15V±10%
V+....................................................20V
V-....................................................-20V
TemperatureRange
IndustrialScreening.........-40°Cto+85°C
DCcurrentperinputpin................+10mA
Hi-TempScreening........-55°Cto+125°C
MilitaryScreening..........-55°Cto+125°C
Powerdissipationat25°C
plasticDIL............1.0W,derate10mW/°C
ceramicDIL..........0.5W,derate7mW/°C
NOTE:Stressesaboveabsolutemaximum
SolderTemperature........275°Cfor10sec
ratingsoroutsiderecommendedoperating
conditionsmaycausepermanentdamageto
StorageTemperature........-65°Cto+150°C
thedevice.Thesearestressratingsonly.
Operationatthelimitsisnotrecommended.
DCELECTRICALCHARACTERISTICS
V+=+12Vto+15V,V-=-12Vto-15V,T=OperatingTemperatureRange(unlessotherwisestated)
PARAMETERSSYMBOLTESTCONDITIONSMINTYPMAXUNITS
Inputvoltage(TX1IN,TX0IN,SLP1.5)
highV2.1-V+volts
lowV--0.5volts
A
IH
IL
Inputcurrent(TX1IN,TX0IN,SLP1.5)
sourceIV=0V--0.1A
sinkIV=5V--0.1A
IHIN
ILIN
ARINCoutputvoltage(Differential)
oneVnoload;TXAOUT-TXBOUT9.0010.0011.00volts
zeroVnoload-11.00-10.00-9.00volts
nullVnoload-0.5000.50volts
DIFF1
DIFF0
DIFFN
;TXAOUT-TXBOUT
;TXAOUT-TXBOUT
ARINCoutputvoltage(Ref.toGND)
oneorzeroVnoload&magnitudeatpin4.505.005.50volts
nullVnoload-0.2500.25volts
Operatingsupplycurrent
V+I-6.014.0mA
V-I-14.0-6.0-mA
ARINCoutputimpedenceZNote1
DOUT
NOUT
DD
EE
OUT
SLP1.5=V+
TX1IN&TX0IN=0V:noload
IN&TX1IN=0V:noloadTX0
HI-8585-37.5-ohms
HI-8586-10-ohms
NOTE:
1.TheoutputresistanceischeckedbymeasuringthemomentaryshortcircuitcurrentateachARINCoutputpin.
µ
µ
HOLTINTEGRATEDCIRCUITS
3
HI-8585,HI-8586
A
definedinFigure3,noload
pin1=logic1
pin1=logic1
Notes:
1.Guaranteedbutnottested
PACKAGETHERMALCHARACTERISTICS
PACKAGE STYLE
8 Lead Plastic DIP
8 Lead Plastic SOIC
8 Lead Plastic SOIC
PACKAGE STYLE
8 Lead Plastic DIP
8 Lead Plastic SOIC
8 Lead Plastic SOIC
MAXIMUM ARINC LOAD
1
5
6
ARINC 429
DATA RATE
Low Speed
High Speed
Low Speed 17.4 17.5 16.9 68 126 166
High Speed 27.6 27.1 25.9 97 147 186
Low Speed 17.1 17.2 16.7 52 110 151
High Speed 27.3 27.1 26.2 57 112 157
SUPPLY CURRENT (mA)
Ta = 25oC Ta = 85oC Ta=125oC Ta = 25oC Ta = 85oC Ta=125oC
3
16.8 17.2 16.9 58 116 157
4
27.3 26.7 25.9 75 132 169
TXAOUT and TXBOUT Shorted to Ground
1
5
6
ARINC 429
DATA RATE
Low Speed
High Speed
Low Speed 46.4 47.6 68.1 167 191 221
High Speed 42.1 43.8 67.1 177 212 223
Low Speed 48.5 45.6 46.1 112 161 186
High Speed 46.8 41.1 40.5 116 168 197
SUPPLY CURRENT (mA)
Ta = 25oC Ta = 85oC Ta=125oC Ta = 25oC Ta = 85oC Ta=125oC
3
53.6 50.7 52.2 131 181 217
4
46.9 38.7 42.5 135 181 219
9
2
2
JUNCTION TEMP, Tj (°C)
7, 8, 9
JUNCTION TEMP, Tj (°C)
Notes:
1.AlldatatakeninstillairondevicessolderedtosinglelayercopperPCB(3"X4.5"X.062").
2.At100%dutycycle,15Vpowersupplies.For12Vpowersuppliesmultiplyalltabulatedvaluesby0.8.
3.LowSpeed:DataRate=12.5Kbps,Load:R=400Ohms,C=30nF.
4.HighSpeed:DataRate=100Kbps,Load:R=400Ohms,C=10nF.DatanotpresentedforC=30nF
asthisisconsideredunrealisticforhighspeedoperation.
5.8LeadPlasticSOIC(Thermallyenhancedwithbuiltinheatsink).HeatsinknotsolderedtothePCB.
6.8LeadPlasticSOIC(Thermallyenhancedwithbuiltinheatsink).Heatsinks olderedtothePCB.
7.SimilarresultswouldbeobtainedwithTXAOUTshortedtoTXBOUT.
8.Forapplicationsrequiringsurvivalwithcontinuousshortcircuit,operationaboveTj=175°Cisnotrecommended .
9.Datawillvarydependingonairflowandthemethodofheatsinkingemployed.
HOLTINTEGRATEDCIRCUITS
4
pin3
HI-8585,HI-8586
t
phlx
5V
0V
t
plhx
t
plhx
5V
pin2
t
phlx
0V
trxt
trxt
10V
0V
-10V
DIFF
90%
10%
90%
10%
10%
tt
fx
tfxt
FIGURE3-LINEDRIVERTIMING
PART PACKAGE TEMPERATURE BURN LEAD
NUMBER DESCRIPTION RANGE FLOW IN FINISH
HI-8585PDI 8 PIN PLASTIC DIP -40°C TO +85°C I NO SOLDER
HI-8585PDT 8 PIN PLASTIC DIP -55°C TO +125°C T NO SOLDER
HI-8585PSI 8 PIN PLASTIC ESOIC - NB -40°C TO +85°C I NO SOLDER
HI-8585PST 8 PIN PLASTIC ESOIC - NB -55°C TO +125°C T NO SOLDER
HI-8585CDI 8 PIN CERAMIC SIDE BRAZED DIP -40°C TO +85°C I NO GOLD
HI-8585CDT 8 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C T NO GOLD
HI-8585CDM 8 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C M YES SOLDER
HI-8585CRI 8 PIN CERDIP -40°C TO +85°C I NO SOLDER
HI-8585CRT 8 PIN CERDIP -55°C TO +125°C T NO SOLDER
HI-8585CRM 8 PIN CERDIP -55°C TO +125°C M YES SOLDER
HI-8586PDI 8 PIN PLASTIC DIP -40°C TO +85°C I NO SOLDER
HI-8586PDT 8 PIN PLASTIC DIP -55°C TO +125°C T NO SOLDER
HI-8586PSI 8 PIN PLASTIC ESOIC - NB -40°C TO +85°C I NO SOLDER
HI-8586PST 8 PIN PLASTIC ESOIC - NB -55°C TO +125°C T NO SOLDER
HI-8586CDI 8 PIN CERAMIC SIDE BRAZED DIP -40°C TO +85°C I NO GOLD
HI-8586CDT 8 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C T NO GOLD
HI-8586CDM 8 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C M YES SOLDER
HI-8586CRI 8 PIN CERDIP -40°C TO +85°C I NO SOLDER
HI-8586CRT 8 PIN CERDIP -55°C TO +125°C T NO SOLDER
HI-8586CRM 8 PIN CERDIP -55°C TO +125°C M YES SOLDER
Legend:
ESOIC-ThermallyEnhancedSmallOutlinePackage(SOICw/built-inheatsink)
NB-NarrowBody
HOLTINTEGRATEDCIRCUITS
5
HI-8585/HI-8586PACKAGEDIMENSIONS
8-PINPLASTICSMALLOUTLINE(ESOIC)-NB
(NarrowBody,ThermallyEnhanced)
TopView BottomView
.1935±.0035
(4.915±.085)
.0085±.0015
(.2159±.0381)
inches(millimeters)
PackageType:
.140±.010
(3.556±.254)
8HNE
.236±.008
(5.994±.203)
8-PINPLASTICDIP
.0165±.0035
(.4191±.0889)
.050±.010
(1.27±.254)
.385 ± .015
(4.699 ± .381)
INP1
.1535±.0035
(3.90±.09)
0 ° to8 °
ETAILDA
.033±.017
(.8382±.4318)
.055±.005
(1.397±.127)
ETAILDA
.100±.010
(2.540±.254)
.0025±.0015
(.0635±.0381)
PackageType:
Heatsinkstud
onbottomof
package
8P
.135 ± .015
(3.429 ± .381)
.1375 ± .0125
(3.493 ± .318)
.019 ± .002
(.483 ± .102)
.250±.010
(6.350 ± .254)
.100 ± .010
(3.540 ± .254)
7 ° TYP.
.025 ± .010
(.635±.254)
.055 ± .010
(1.397 ± .254)
HOLTINTEGRATEDCIRCUITS
6
.300 ± .010
(7.620 ± .254)
.0115 ± .0035
(.292 ± .089)
.335 ± .035
(8.509 ± .889)
HI-8585/HI-8586PACKAGEDIMENSIONS
8-PINCERAMICSIDE-BRAZEDDIP
.405 ± MAX
(10.287 ± MAX)
.050 ± .007
(1.270 ± .178)
.250 ± .008
(7.366 ± .203)
inches(millimeters)
PackageType:
8C
8-PINCERDIP
.163±.037
(4.140 ± .940 )
.005MIN.
(.127MIN.)
PIN1
.200MAX
(5.080MAX)
.018±.002
(.457 ± .051)
.380 ± .004
(9.652 ± .102)
.050 ± .005
(1.270 ± .127)
.035±.010
(.889 ± .254)
SEATING
PLANE
.100±.003
(2.540 ± .076)
.248 ± .003
(6.299 ± .076)
BASE
PLANE
.300±.010
(7.620 ± .254)
.0105 ± .0015
(.267 ± .038)
PackageType:
8D
(.991 ± .154)
.200MAX.
(5.080MAX.)
.163 ± .037
(4.140 ± .940)
.039 ± .006
.100 ± .008
(2.540 ± .203)
.015MIN.
(.381MIN.)
BasePlane
SeatingPlane
.018 ± .006
.056 ± .006
(1.422 ± .152)
(.457 ± .152)
HOLTINTEGRATEDCIRCUITS
7
.314 ± .003
(7.976 ± .076)
.010 ± .006
(.254 ± .152`)
.350 ± .030
(8.890 ± .762)
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