January2001
HI-8105&HI-8106
DESCRIPTION
TheHI-8105&HI-8106aresilicongateCMOSdevices
designedfor'glue'logicapplications.Theyaresimple16
stagedividerswithprogrammabledivision.TheHI-8105
hasaonepinoscillatorwhiletheHI-8106receivesaclock
input.Theonepinoscillatorfrequencyissetbyaresistor
toVDDandthecapacitancetoACgroundatthepin.
Thewaferprocessingenablesoperationto1voltguaranteed.Thechipisdesignedforlowpowerperformance.As
aresultthemaximumoutputfrequencyis5MHzwhilethe
internallogicwillrunconsiderablyhigher.
Acompanionversion,HI-8107,featuresacrys taloscillator
circuitanda8stageprogrammabledivider.
FEATURES
PINCONFIGURATION
VDD
2
VSS
3
OUT
4 5
A0
SUPPLYVOLTAGES
VDD =1Vto5V
FUNCTIONTABLE
A3 A2 A1 A0 OUT
0 0 0 0 DIV by 2
0 0 0 1 4
0 0 1 0 8
0 0 1 1 16
0 1 0 0 32
0 1 0 1 64
0 1 1 0 128
0 1 1 1 256
1 0 0 0 512
1 0 0 1 1024
1 0 1 0 2048
1 0 1 1 4096
1 1 0 0 8192
1 1 0 1 16384
1 1 1 0 32768
1 1 1 1 65536
OSConHI-8105
81
{
CLKonHI-8106
7
A3
6
A2
A1
PINDESCRIPTIONTABLE
PIN SYMBOL FUNCTION DESCRIPTION
1 VDD SUPPLY POSITIVE SUPPLY, 1V TO 5V
2 VSS SUPPLY GROUND
3 OUT LOGIC OUTPUT CMOS
4 A0 LOGIC INPUT CMOS
5 A1 LOGIC INPUT CMOS
6 A2 LOGIC INPUT CMOS
7 A3 LOGIC INPUT CMOS
8 OSC (8105) INPUT/OUTPUT RC - CONNECT TO VDD
8 CLK (8106) LOGIC INPUT CMOS
HOLTINTEGRATEDCIRCUITS
(DS8105Rev.A)01/01
1
HI-8105&HI-8106
FUNCTIONALDESCRIPTION
TheHI8105andHI-8106are16stageserialcounters.
Eachstage'sQisinputtoa1of16decoder.A4bitcodeat
pins4through7selectswhichstageisroutedtotheoutput
atpin3.Thecounterclocksonthenegativetransitionof
pin8.
Figure1showstheoscillatorcircuitoftheHI-8105.The
chargingtimeiscontrolledbyadelaycircuitandthe
hystersiswindow.Thewindowistypically0.6Vwideat
VDD=5.0V.
Figure2showsthebondingoptionwhichomitstheN
devicepulldownandtherebyallowsthesimpleclockinput
oftheHI-8106.
APPLICATIONINFORMATION
TheHI-8105oscillatorfrequencyissetbyselectingaresistorandcapacitortoapplyatpin8.Typicalparameters
atroomtemperatureare:
OSCILLATORFREQUENCYDATA
VDD
C R
o o
clock
pin8
delay
FIGURE1-HI-8105Oscillator
pin8 clock
FIGURE2-HI-8106ClockInput
Co=100pF Co=1nF
Ro VDD=5V VDD=1V VDD=5V VDD=1V
1K Ω 7.80MHz - 2.12MHz 3K Ω 4.22MHz 914KHz 1.10MHz 231KHz
10K Ω 1.46MHz 464KHz 359KHz 100KHz
100K Ω 165KHz 64KHz 39.6KHz 12KHz
ORDERINGINFORMATION
PART PACKAGE TEMPERATURE BURN LEAD
NUMBER DESCRIPTION RANGE FLOW IN FINISH
HI-8105PDI 8 PIN PLASTIC DIP -40°C TO +85°C I NO SOLDER
HI-8105PDT 8 PIN PLASTIC DIP -55°C TO +125°C T NO SOLDER
HI-8105PSI 8 PIN PLASTIC NARROW BODY SOIC -40°C TO +85°C I NO SOLDER
HI-8105PST 8 PIN PLASTIC NARROW BODY SOIC -55°C TO +125°C T NO SOLDER
HI-8105CDI 8 PIN CERAMIC SIDE BRAZED DIP -40°C TO +85°C I NO GOLD
HI-8105CDT 8 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C T NO GOLD
HI-8105CDM 8 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C M YES SOLDER
HI-8105CRI 8 PIN CERDIP -40°C TO +85°C I NO SOLDER
HI-8105CRT 8 PIN CERDIP -55°C TO +125°C T NO SOLDER
HI-8105CRM 8 PIN CERDIP -55°C TO +125°C M YES SOLDER
Note:TheHI-8106isavailableinthesameoptions
HOLTINTEGRATEDCIRCUITS
2
HI-8105&HI-8106
ABSOLUTEMAXIMUMRATINGS RECOMMENDEDOPERATINGCONDITIONS
VoltagesreferencedtoGround
Supplyvoltages
VCC...................................................7V
DCcurrentperinputpin................±10mA
Powerdissipationat25°C................500mW
SolderTemperature........275°Cfor10sec
StorageTemperature........-65°Cto+150°C
SupplyVoltages
VCC........................................1Vto5.25V
TemperatureRange
IndustrialScreening........-40°Cto+85°C
Hi-TempScreening.......-55°Cto+125°C
MilitaryScreening.........-55°Cto+125°C
NOTE:Stressesaboveabsolutemaximum
ratingsoroutsiderecommendedoperating
conditionsmaycausepermanentdamageto
thedevice.Thesearestressratingsonly.
Operationatthelimitsisnotrecommended.
1.0 5.0
pins4,5,6,7
pins4,5,6,7
pins3
Vout=3.5V
Vout=0.8V
pins4,5,6,7allatVSSand
pin8=VSS
Ro=1KandCo=100pFΩ
clockingpin8at10MHz
pins4,5,6,7allatVSSand
Ro=10KandCo=100pFΩ
3.5
-1.0
1.7 2.8
2.5
2.5
-2.4 -1.6
0.5
0.6
38 70
1.5
1.0
1.0
0.8
1.0
HOLTINTEGRATEDCIRCUITS
3
8-PINPLASTICDIP
.135 ± .015
(3.429 ± .381)
.1375 ± .0125
(3.493 ± .318)
.019 ± .002
(.483 ± .102)
HI-8105/HI-8106PACKAGEDIMENSIONS
inches(millimeters)
.385 ± .015
(4.699 ± .381)
.100 ± .010
(3.540 ± .254)
7 ° TYP.
.250±.010
(6.350 ± .254)
.025 ± .010
(.635±.254)
.055 ± .010
(1.397 ± .254)
PackageType:
.300 ± .010
(7.620 ± .254)
.0115 ± .0035
(.292 ± .089)
.335 ± .035
(8.509 ± .889)
8P
8-PINPLASTICSMALLOUTLINE(SOIC)-NB
(NarrowBody)
.1935±.0035
(4.915±.085)
.236±.008
(5.994±.203)
INP1
.0165±.0035
(.4191±.0889)
.050±.010
(1.27±.254)
.1535±.0035
(3.90±.09)
0 ° to8 °
DetailA
.033±.017
(.8382±.4318)
DetailA
PackageType:
.0086±.0012
(.2184±.0305)
.055±.005
(1.397±.127)
8HN
.0069±.0029
(.1753±.0737)
HOLTINTEGRATEDCIRCUITS
4
HI-8105/HI-8106PACKAGEDIMENSIONS
8-PINCERAMICSIDE-BRAZEDDIP
.405 ± MAX
(10.287 ± MAX)
.050 ± .007
(1.270 ± .178)
.250 ± .008
(7.366 ± .203)
inches(millimeters)
PackageType:
8C
8-PINCERDIP
.163±.037
(4.140 ± .940 )
.005MIN.
(.127MIN.)
PIN1
.200MAX
(5.080MAX)
.018±.002
(.457 ± .051)
.380 ± .004
(9.652 ± .102)
.050 ± .005
(1.270 ± .127)
.035±.010
(.889 ± .254)
SEATING
PLANE
.100±.003
(2.540 ± .076)
.248 ± .003
(6.299 ± .076)
BASE
PLANE
.300±.010
(7.620 ± .254)
.0105 ± .0015
(.267 ± .038)
PackageType:
8D
(.991 ± .154)
.200MAX.
(5.080MAX.)
.163 ± .037
(4.140 ± .940)
.039 ± .006
.100 ± .008
(2.540 ± .203)
.015MIN.
(.381MIN.)
BasePlane
SeatingPlane
.018 ± .006
.056 ± .006
(1.422 ± .152)
(.457 ± .152)
HOLTINTEGRATEDCIRCUITS
5
.314 ± .003
(7.976 ± .076)
.010 ± .006
(.254 ± .152`)
.350 ± .030
(8.890 ± .762)
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