HMC Electronics R500 User Manual

R500

R500

Dispensable Water-soluble Solder Paste

Dispensable Water-soluble Solder Paste

for Leaded Alloys

for Leaded Alloys

Product Description

Kester R500 is a water-soluble solder paste
formula specifically designed as a consistent dot
dispensing paste for automated dispense equipment.
This solder paste exhibits excellent wetting
characteristics in a wide range of profiles. The
activator package in this formula is extremely
aggressive. It is active enough to remove tenacious
oxide layers or to solder to OSP coated boards.
Kester R500 is a water soluble formula that
maintains its activity and tackiness characteristics
for up to 8 hours.

• Excellent dispensing characteristics using 21
gauge needles and Type 3 powder

• Capable of dispensing rate of 4 dots per
second

• Leaves bright/shiny solder joints after reflow

• Packaged Void-Free

• Scrap is reduced due to minimal paste clog­ging and separation

• Residues easily removed with DI water

• Classified as ORM0 per J-STD-004

Standard Applications

86% Metal -- Syringe Dispensing

Physical Properties

Data given for Sn63Pb37 86% metal, -325+500 mesh

Viscosity (typical): 1000 poise

Malcom viscometer @ 10rpm and 25°C

Initial Tackiness (typical): 45 grams

Tested to J-STD-005, IPC-TM-650, Method 2.4.44

Slump Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.35

Solder Ball Test: Preferred

Tested to J-STD-005, IPC-TM-650, Method 2.4.43

Wetting Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.45

Reliability Properties

Copper Mirror Corrosion: Low

Tested to J-STD-004, IPC-TM-650, Method 2.3.32

Corrosion Test: Low

Tested to J-STD-004, IPC-TM-650, Method 2.6.15

Silver Chromate: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.33

Chloride and Bromides: None Detected

Tested to J-STD-004, IPC-TM-650, Method 2.3.35

Fluorides by Spot Test: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1

SIR, IPC (typical): Pass

Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3

Blank R500

Day 1

1.9 ×1010Ω 1.4 × 108Ω

Day 4

1.1 ×1010Ω 2.0 × 108Ω

Day 7

8.3 ×109Ω 8.3 × 109Ω

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

[phone]

Application Notes

Availability:

Kester R500 is available in the Sn63Pb37 and Sn62Pb36Ag02 alloys with Type 3 powder. Type 3 powder
mesh is recommended for all typical dispensing applications. For specific packaging information see
Kester's Solder Paste Packaging Chart for available sizes. The appropriate combination depends on
process variables and the specific application.

Dispensing Parameters:

Needle size 15 to 21 gauge (with Type 3 powder)
Dispense Rate Capable of 4 dots/second
Temperature/Humidity Optimal ranges are 21-25°C (70-77°F) and 35-65% RH

Recommended Reflow Profile:

The recommended reflow profile for R500 made with
Sn63Pb37 and Sn62Pb36Ag02 alloys is shown here.
This profile is simply a guideline. Since R500 is a high­ly active, water soluble solderpaste, it can solder effec­tively over a wide range of profiles. Your optimal profile
may be different from the one shown based on your
oven, board and mix of defects. Please contact Kester
if you need additional profiling advice.

Cleaning:

R500 residues are best removed using automated cleaning equipment (in-line or batch). De-ionized water is
recommended for the final rinse. Water temperatures should be 49-60

°C (120-140°F).Kester's 5768

Bio-Kleen

®

saponifier can also be used in a 1-2% ratio for aqueous cleaning systems.

Storage, Handling, and Shelf Life:

Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity,
reflow characteristics, and overall performance. R500 should be stabilized at room temperature prior to
dispensing. R500 should be kept at standard refrigeration temperatures, 0-10

°C (32-50°F). Please contact

Kester if you require additional advice with regard to storage and handling of this material. Shelf life is 6
months from date of manufacture and held at 0-10°C (32-50°F).

Health & Safety:

This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.

World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143-1341 USA

Phone: [phone] • Email: [e-mail] • Website: www.kester.com

Kester Reflow Profile

Alloy: Sn63Pb37 or Sn62Pb36Ag02

0

20

40

60

80

100

120

140

160

180

200

220

240

0 30 60 90 120 150 180 210 240 270 300 330

Time (sec.)

Temperature (C)

Time to Peak Temperature

3.5-5.0 min. typical

5.5 min max

Soaking Zone

(120 sec. max.)

30-60 sec. typical

Reflow Zone

45-75 sec. typical

Peak Temp.
210 - 225 C

<1.8 C/Sec

Asia Pacific Headquarters

500 Chai Chee Lane

Singapore 469024

([phone]

[e-mail]

European Headquarters

Zum Plom 5

08541 Neuensalz

Germany

([phone]

[e-mail]

Japanese Headquarters

20-11 Yokokawa 2-Chome

Sumida-Ku

Tokyo 130-0003 Japan

([phone]

[e-mail]

The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the poten­tial hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in
the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.

R500

Rev: 21Sep09

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

[phone]