HMC Electronics R276 User Manual

R276

R276

Dispensable No-Clean Solderpaste

Dispensable No-Clean Solderpaste

for Lead-free Alloys

for Lead-free Alloys

Product Description

Kester R276 is a lead-free, no-clean solder paste
specifically designed for optimal characteristics in
all types of dispensing applications. R276 is
packaged void-free to insure consistent dispensing
in high speed automated processes. The flow
characteristics of R276 provide for excellent
dispensing characteristics with a wide range of
needle diameters.

• Excellent dispensing characteristics using 22
gage needles and Type 3 powder

• Manufactured and packaged void-free to insure

the most consistent dispensibility available

• Capable of several thousands of dots per hour

in high speed automated dispense equipment

• High activity on all substrates, including OSPs

• Stable tack over 8+ hours

• Available with leaded alloys

• Compatible with Kester Easy Profile

®

256

stenciling solderpaste

• Classified as ROL0 per J-STD-004

• Compliant to Bellcore GR-78

Standard Application

86% Metal -- Dispensing

RoHS Compliance

This product meets the requirements of the RoHS
(Restriction of Hazardous Substances) Directive,
2002/95/EC Article 4 for the stated banned
substances.

Physical Properties

(Data given for Sn96.5Ag3.0Cu0.5 86% metal, -325+500 mesh)

Viscosity (typical): 650 poise

Malcom Viscometer @ 10rpm and 25°C

Initial Tackiness (typical): 30 grams

Tested to J-STD-005, IPC-TM-650, Method 2.4.44

Slump Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.35

Solder Ball Test: Preferred

Tested to J-STD-005, IPC-TM-650, Method 2.4.43

Wetting Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.45

Reliability Properties

Copper Mirror Corrosion: Low

Tested to J-STD-004, IPC-TM-650, Method 2.3.3

Corrosion Test: Low

Tested to J-STD-004, IPC-TM-650, Method 2.6.15

Silver Chromate: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.33

Chloride and Bromides: None Detected

Tested to J-STD-004, IPC-TM-650, Method 2.3.35

Fluorides by Spot Test: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1

SIR, IPC (typical): Pass

Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3

Blank R276

Day 1

1.0 ×1010Ω 9.8 × 108Ω

Day 4

1.3 ×1010Ω 1.6 × 109Ω

Day 7

1.3 ×1010Ω 1.1 × 109Ω

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

[phone]

Application Notes

Availability:

R276 is available in the Sn96.5 Ag3.0Cu0.5 and Sn96.5Ag3.5 alloys. Type 3 powder mesh is recommended,
but Type 4 is available for fine needle applications. R276 is also compatible with other SnAgCu alloys in a
similar melting range to the listed alloys. R276 is available only in 10cc and 30cc syringes. For specific
packaging information, see Kester's Solder Paste Chart.

Dispensing Parameters:

Needle diameter Type 3 powder may be used with needle sizes down to 22 gauge.

Type 4 powder may be used for finer needle applications.
Dispense Speed Capable of at least 4 dots per second
Temperature/Humidity Optimal ranges are 21-25°C (70-77°F) and 35-65% R.H.

Recommended Reflow Profile:

The recommended reflow profile for R276 made
with SAC alloys is shown here. This profile is
simply a guideline. Since R276 is a highly active
solderpaste, it can solder effectively over a wide
range of profiles. Your optimal profile may be
different from the one shown based on you oven,
board and mix of defects. Please contact Kester if
you need additional profiling advice.

Cleaning:

R276 is a no-clean formula. The residues do not need to be removed for typical applications. Although R276
is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment
(in-line or batch) with a variety of readily available cleaning agents. Call Kester Technical Support for details.

Storage, Handling, and Shelf Life:

Refrigeration is the recommended optimum storage condition for solderpaste to maintain consistent viscosity,
reflow characteristics and overall performance. R276 should be stabilized at room temperature prior to
dispensing. R276 should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact
Kester if you require additional advice with regard storage and handling of this material. Shelf life is 6 months
from date of manufacture when handled properly when held at 0-10°C (32-50°F).

Health & Safety:

This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.

World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143-1341 USA

Phone: [phone] • Email: [e-mail] • Website: www.kester.com

Kester Reflow Profile

SnAgCu Alloys

0

50

100

150

200

250

300

0 30 60 90 120 150 180 210 240 270 300

Time (sec.)

Temperature (C)

Pre-heating Zone

(2.0-4.0 min. max.)

Soaking Zone

(2.0 min.max.)

60-90 sec. typical

Reflow Zone

time above 217 C

(90 sec max)

60-75 sec. typical

Peak Temp.
235 - 255 C

<2.5 C/Sec

Asia Pacific Headquarters

500 Chai Chee Lane

Singapore 469024

([phone]

[e-mail]

European Headquarters

Zum Plom 5

08541 Neuensalz

Germany

([phone]

[e-mail]

Japanese Headquarters

20-11 Yokokawa 2-Chome

Sumida-Ku

Tokyo 130-0003 Japan

([phone]

[e-mail]

The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the poten­tial hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in
the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.

R276

Rev: 21Sep09

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

[phone]