HMC Electronics HM531 User Manual

HydroMark 531

HydroMark 531

Water-Soluble Solder Paste

Water-Soluble Solder Paste

Product Description

Kester HydroMark 531 is an organic acid, water­soluble solder paste that provides users with the
highest level of consistency and performance.
Batch after batch, HM531 provides hours of stable
stencil life, tack time and repeatable brick defini­tion. HM531’s robust printing characteristics result
in consistent solder paste volume regardless of
idle time, stencil life and print speed. The activator
package in the HM531 is very aggressive and
provides superior wetting to OSP-coated PCB’s
and Ag/Pd components.

The outstanding batch consistency, anti-slump
chemistry, consistent print volumes, solderability
and cleanability make the HM531 an ideal
water-soluble solder paste for any application.

• HM531 provides outstanding batch-to-batch
consistency

• Excellent anti-slump characteristics
minimizing bridging defects

• Capable of 60+ minute idle times in printing

• Capable of print speeds up to 150mm/sec

(6in/sec)

• Excellent solderability to a wide variety of

metallizations, including Palladium, leaving
bright, shiny joints

• Residues easily removed with hot DI water,

even up to 48 hours after soldering

• Minimal foam in wash systems

• 8+ hour stencil life

• Classified as ORM0 per J-STD-004

• Produces minimal voiding underneath

BGA components

• Compatible with enclosed print head systems

Standard Applications

90% Metal – Stencil Printing
90% Metal – Enclosed Head Printing

Physical Properties

(Data given for Sn63Pb37, 90% metal, -325+500 mesh)

Viscosity (typical): 1800 poise

Malcom viscometer @ 10rpm and 25°C

Initial Tackiness (typical): 43 grams

Tested to J-STD-005, IPC-TM-650, Method 2.4.44

Slump Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.35

Solder Ball Test: Preferred

Tested to J-STD-005, IPC-TM-650, Method 2.4.43

Wetting Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.45

Reliability Properties

Copper Mirror Corrosion: Low

Tested to J-STD-004, IPC-TM-650, Method 2.3.32

Corrosion Test: Low

Tested to J-STD-004, IPC-TM-650, Method 2.6.15

Silver Chromate: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.33

Chloride and Bromides: None Detected

Tested to J-STD-004, IPC-TM-650, Method 2.3.35

Fluorides by Spot Test: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1

SIR, IPC (typical): Pass

Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3

Blank HM531

Day 1

1.9 ´1010W 1.4 ´ 108W

Day 4

1.1 ´1010W 2.0 ´ 108W

Day 7

8.3 ´109W 8.3 ´ 109W

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

[phone]

Application Notes

Availability:

HydroMark 531 is commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh
is recommended, but different powder particle size distributions are available for standard and fine pitch
applications. For specific packaging information see Kester’s Solder Paste Packaging Chart for available
sizes. The appropriate combination depends on process variables and the specific application.

Printing Parameters:

Squeegee Blade 80 to 90 durometer polyurethane or stainless steel
Squeegee Speed Capable to a maximum speed of 150 mm/sec (6 in/sec)
Stencil Material Stainless Steel, Molybdenum, Nickel Plated, Brass
Temperature/Humidity Optimal ranges are 21-25°C (70-77°F) and 30-70% RH

Recommended Reflow Profile:

The recommended reflow profile for HM531 made with
either the Sn63Pb37 or Sn62Pb36Ag02 is shown here

.

This profile is simply a guideline. Since HM531 is a
highly active, water-soluble solder paste, it can solder
effectively over a wide range of profiles. Your optimal
profile may be different from the one shown based on
your oven, board and mix of defects. Please contact
Kester if you need additional profiling advice.

Cleaning:

HM531 residues are best removed using automated cleaning equipment (in-line or batch) within 48 hours of
soldering. De-ionized water is recommended for the final rinse. Water temperatures should be
49–60°C(120-140°F). Kester’s 5768 Bio-Kleen

®

saponifier can also be used in a 1-2% ratio for aqueous

cleaning systems.

Storage, Handling, and Shelf Life:

Refrigeration is the recommended optimum storage condition for solderpaste to maintain consistent viscosity,
reflow characteristics and overall performance. HM531 should be stabilized at room temperature prior to
printing. HM531 should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact
Kester if you require additional advice with regard storage and handling of this material. Shelf life is 6 months
from date of manufacture when handled properly and held at 0-10°C (32-50°F).

Health & Safety:

This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.

World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143-1341 USA

Phone: [phone] • Email: [e-mail] • Websi te: ww w.kester.c om

Kester Reflow Profile

Alloy: Sn63Pb37 or Sn62Pb36Ag02

0

2

0

4

0

6

0

8

0

1

00

1

20

140

160

180

2

00

220

2

40

0306090120150180210240270300330

Time (sec.)

Temperature (C)

Time to Peak Temperature

3.5-5.0 min. typical

5.5 min max

Soaking Zone

(120 sec. max.)

30-60 sec. typical

Reflow Zone

45-75 sec. typical

Peak Temp.
210 - 225 C

<1.8 C/Sec

Asia Pacific Headquarters

500 Chai Chee Lane

Singapore 469024

([phone]

[e-mail]

European Headquarters

Zum Plom 5

08541 Neuensalz

Germany

([phone]

[e-mail]

Japanese Headquarters

20-11 Yokokawa 2-Chome

Sumida-Ku

Tokyo 130-0003 Japan

([phone]

[e-mail]

The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the poten­tial hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in
the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.

HM531

Rev: 21Jan10

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

[phone]