HMC Electronics EP256 User Manual

Easy Profile

Easy Profile

®

®

256HA

256HA

No-Clean Solderpaste

No-Clean Solderpaste

Product Description

Easy Profile®256HA is a no-clean, air or nitrogen
reflowable solder paste specifically designed to
provide maximum print characteristics and
solderability. EP256HA has been designed for
applications that require the ultimate activity with
respect to difficult to solder to components and
board surface metallizations. EP256HA is also
capable of stencil printing after downtimes of up to
90 minutes with an effective first print down to
20 mils. EP256HA is a solder paste formula that
maintains its activity and printing characteristics
for up to 8 hours without any shear thinning.

• Excellent solderability on difficult to solder to
components, i.e., PdAg

• High activity on all substrates, including OSPs

• Excellent printing characteristics to 0.4mm
(16 mil) pitch with Type 3 powder

• Capable of 90 minute break times in printing

• High print speeds to 150 mm/sec (6 in/sec)

• Stencil life: 8+ hours (process dependent)

• Scrap is reduced due to less paste dry out

• Stable tack: 8+ hours

• Classified as ROL0 per J-STD-004

• Compatible with enclosed print head systems

Standard Applications

90% Metal - Stencil Printing
90% Metal - Enclosed Head Printing

Physical Properties

(Data given for Sn63Pb37 90% metal, -325+500 mesh)

Viscosity (typical):1800 poise

Malcom Viscometer @ 10rpm and 25°C

Initial Tackiness (typical): 37 grams

Tested to Kester Method 1W-QC-3-04

Slump Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.35

Solder Ball Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.43

Wetting Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.45

Reliability Properties

Copper Mirror Corrosion: Low

Tested to J-STD-004, IPC-TM-650, Method 2.3.3

Corrosion Test: Low

Tested to J-STD-004, IPC-TM-650, Method 2.6.15

Silver Chromate: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.33

Chloride and Bromides: None Detected

Tested to J-STD-004, IPC-TM-650, Method 2.3.35

Fluorides by Spot Test: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1

SIR, IPC (typical): Pass

Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3

Blank EP256HA

Day 1

1.6 ×1010Ω 1.0 × 109Ω

Day 4

9.9 ×109Ω 2.1 × 109Ω

Day 7

7.7 ×109Ω 1.9 × 109Ω

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

[phone]

Application Notes

Availability:

Easy Profile® 256HA is commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder
mesh is recommended, but different powder particle size distributions are available for standard and fine
pitch applications. For specific packaging information, see Kester's Solder Paste Chart for available sizes.
The appropriate combination depends on process variables and the specific application.

Printing Parameters:

Squeegee Blade 80 to 90 durometer polyurethane or stainless steel
Squeegee Speed Capable to a maximum speed of 200 mm/sec (8 in/sec)
Stencil Material Stainless Steel, Molybdenum, Nickel Plated, Brass
Temperature/Humidity Optimal ranges are 21-25°C (70-77°F) and 35-65% R.H.

Recommended Reflow Profile:

The recommended reflow profile for EP256HA made
with either the Sn63Pb37 or Sn62Pb36Ag02 is shown
here. This profile is simply a guideline. Since
EP256HA is a highly active solder paste, it can solder
effectively over a wide range of profiles. Your optimal
profile may be different from the one shown based on
your oven, board and mix of defects. Please contact
Kester if you need additional profiling advice.

Cleaning:

EP256HA is a no-clean formula. The residues don't need to be removed for typical applications. Although
EP256HA is designed for no-clean applications, its residues can be easily removed using automated cleaning
equipment (in-line or batch) with a variety of readily available cleaning agents. Call Kester Technical Support
for details.

Storage, Handling, and Shelf Life:

Refrigeration is the recommended optimum storage condition for solderpaste to maintain consistent viscosity,
reflow characteristics and overall performance. EP256HA should be stabilized at room temperature prior to
printing. EP256HA should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact
Kester if you require additional advice with regard storage and handling of this material. Shelf life is 6 months
from date of manufacture when handled properly when held at 0-10°C (32-50°F).

Health & Safety:

This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.

World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143-1341 USA

Phone: [phone] • Email: [e-mail] • Website: www.kester.com

Kester Reflow Profile

Alloy: Sn63Pb37 or Sn62Pb36Ag02

0

20

40

60

80

100

120

140

160

180

200

220

240

0 30 60 90 120 150 180 210 240 270 300 330

Time (sec.)

Temperature (C)

Time to Peak Temperature

3.5-5.0 min. typical

5.5 min max

Soaking Zone

(120 sec. max.)

30-60 sec. typical

Reflow Zone

45-75 sec. typical

Peak Temp.
210 - 225 C

<1.8 C/Sec

Asia Pacific Headquarters

500 Chai Chee Lane

Singapore 469024

([phone]

[e-mail]

European Headquarters

Zum Plom 5

08541 Neuensalz

Germany

([phone]

[e-mail]

Japanese Headquarters

20-11 Yokokawa 2-Chome

Sumida-Ku

Tokyo 130-0003 Japan

([phone]

[e-mail]

The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the poten­tial hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in
the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.

EP256HA

Rev: 21Sep09

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

[phone]