HMC Electronics EM907 User Manual

EnviroMark

EnviroMark

TM

TM

907

907

Lead-Free No-Clean Solder Paste

Lead-Free No-Clean Solder Paste

Product Description

EnviroMarkTM907 is a lead-free, air and nitrogen
reflowable no-clean solder paste specifically
designed for the thermal requirements of lead free
alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The
paste flux system allows joint appearances that
closely resemble that achieved with SnPb alloys.
EM907 is capable of stencil printing downtimes up
to 60 minutes with an effective first print down to
20 mils without any kneading. EM907 also
exhibits excellent continual printability for fine pitch
(0.4mm/16 mils) and is able to print at high speeds
up to 6”/s (150 mm/s). This solder paste also
exceeds the reliability standards required by
J-STD-004.

• Lead free joints that closely resemble those
achieved with SnPb solder paste

• Excellent solderability to a wide variety of
surface metallizations, including Ni/Au, Im Sn
and Im Ag

• High print speeds up to 150 mm/s

• Capable of 60 minute break times in printing

• Stencil life: 12+ hours (process dependent)

• Excellent printing characteristics to 16 and 20
mils pitch

• Excellent print and reflow characteristics for
0201 applications

• Stable tack life

• Classified as ROL0 per J-STD-004

Standard Applications

88.5% Metal – Stencil Printing

RoHS Compliance

This product meets the requirements of the RoHS
(Restriction of Hazardous Substances) Directive,
2002/95/EC Article 4 for the stated banned
substances.

Physical Properties

(Data given for Sn96.5 Ag3.0 Cu0.5, 88.5% metal, -325+500 mesh)

Viscosity (typical): 1800 poise

Malcom viscometer @ 10rpm and 25°C

Initial Tackiness (typical): 44 grams

Tested to J-STD-005, IPC-TM-650, Method 2.4.44

Slump Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.35

Solder Ball Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.43

Wetting Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.45

Reliability Properties

Copper Mirror Corrosion: Low

Tested to J-STD-004, IPC-TM-650, Method 2.3.32

Corrosion Test: Low

Tested to J-STD-004, IPC-TM-650, Method 2.6.15

Silver Chromate: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.33

Chloride and Bromides: None Detected

Tested to J-STD-004, IPC-TM-650, Method 2.3.35

Fluorides by Spot Test: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1

SIR, IPC (typical): Pass

Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3

Blank EM907

Day 1

1.1 ×1010Ω 7.7 × 108Ω

Day 4

1.5 ×1010Ω 1.2 × 109Ω

Day 7

1.4 ×1010Ω 1.4 × 109Ω

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

[phone]

Application Notes

Availability:

Kester EM907 is available in the Sn96.5Ag3.0Cu0.5 and Sn96.5Ag3.5 alloys. Type 3 powder mesh is normally
recommended, but type 4 is available for fine pitch applications. EM907 is also compatible with other
SnAgCu alloys in a similar melting range to the listed alloys. For specific packaging information, see Kester's
Paste Packaging Chart for available sizes. The appropriate combination depends on process variables and
the specific application.

Printing Parameters:

Squeegee Blade 80 to 90 durometer polyurethane or stainless steel
Squeegee Speed Capable to a maximum speed of 150 mm/sec (6 in/sec)
Stencil Material Stainless Steel, Molybdenum, Nickel Plated, Brass
Temperature/Humidity Optimal ranges are 21-25°C (70-77°F) and 35-65% RH

Recommended Reflow Profile:

Full convection reflow method is most com­monly used to reflow the EM907 formula.
The recommended convection reflow profile
for EM907 made with either the Sn96.5Ag3.5
or SnAgCu alloys is shown here.

Cleaning:

EM907 is a no-clean formula. The residues do not need to be removed for typical applications. Although
EM907 is designed for no-clean applications, its residues can be easily removed using automated cleaning
equipment (in-line or batch) with a variety of readily available cleaning agents. Call Kester technical support
for details.

Storage, Handling, and Shelf Life:

Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity,
reflow characteristics, and overall performance. EM907 should be stabilized at room temperature prior to
printing. EM907 should be kept at standard refrigeration temperatures, 0-10°C (32-50°F). Please contact
Kester if you require additional advice with regard to storage and handling of this material. Shelf life is 4
months from date of manufacture and held at 0-10°C (32-50°F).

Health & Safety:

This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.

World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143-1341 USA

Phone: [phone] • Email: [e-mail] • Website: www.kester.com

Kester Reflow Profile

SnAgCu Alloys

0

50

100

150

200

250

300

0 30 60 90 120 150 180 210 240 270 300

Time (sec.)

Temperature (C)

Pre-heating Zone

(2.0-4.0 min. max.)

Soaking Zone

(2.0 min.max.)

60-90 sec. typical

Reflow Zone

time above 217 C

(90 sec max)

60-75 sec. typical

Peak Temp.

235 - 255 C

<2.5 C/Sec

Asia Pacific Headquarters

500 Chai Chee Lane

Singapore 469024

([phone]

[e-mail]

European Headquarters

Zum Plom 5

08541 Neuensalz

Germany

([phone]

[e-mail]

Japanese Headquarters

20-11 Yokokawa 2-Chome

Sumida-Ku

Tokyo 130-0003 Japan

([phone]

[e-mail]

The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the
potential hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used
in the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.

EM907

Rev: 03Aug09

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

[phone]