HMC Electronics 66040-LOC User Manual

Technical Data Sheet
LOCTITE®660™
December-2009
PRODUCT DESCRIPTION
LOCTITE®660™ provides the following product characteristics:
Technology Acrylic Chemical Type Urethane methacrylate Appearance (uncured) Metallic gray paste
LMS
Fluorescence No Components One component - requires no mixing Viscosity High Cure Anaerobic Secondary Cure Activator Application Retaining Strength High
LOCTITE®660™ is designed for the bonding of cylindrical fitting parts, particularly where bond gaps can approach 0.50 mm (0.02 in.). The product cures when confined in the absence of air between close fitting metal surfaces and prevents loosening and leakage from shock and vibration. This product possesses excellent gap cure characteristics. Typical applications include restoring correct fits on worn shafts, spun bearings, and damaged keyways.
NSF International Registered to NSF Category P1 for use as a sealant where
there is no possibilty of food contact in and around food processing areas. Note: This is a regional approval. Please contact your local Technical Service Center for more information and clarification.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.13 Flash Point - See MSDS Viscosity, Brookfield - HBT, 25 °C, mPa·s (cP):
Spindle TB, speed 0.5 rpm, Helipath
1,000,000 to 2,000,000
LMS
Spindle TB, speed 5.0 rpm, Helipath
150,000 to 350,000
LMS
TYPICAL CURING PERFORMANCE
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The graph below shows the shear strength developed with time on steel pins and collars compared to different materials and tested according to ISO 10123.
% of Full Strength on Steel
Cure Time
100
75
50
25
0 1min 5min10min 30min 1h 3h 6h 24h 72h
Steel
Aluminum
Zinc dichromate
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. The following graph shows shear strength developed with time on steel pins and collars at different controlled gaps and tested according to ISO 10123.
% of Full Strength on Steel
Cure Time
100
75
50
25
0 1min 5min10min 30min 1h 3h 6h 24h 72h
0.154 mm
0.27 mm
Cure Speed vs. Temperature
The rate of cure will depend on the temperature. The graph below shows the shear strength developed with time at different temperatures on steel pins and collars and tested according to ISO 10123.
% of Full Strength on Steel
Cure Time
100
75
50
25
0 1min 5min10min 30min 1h 3h 6h 24h 72h
4 °C
40 °C
22 °C
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440
TDS LOCTITE®660™, December-2009
Cure Speed vs. Activator
Where cure speed is unacceptably long, or large gaps are present, applying activator to the surface will improve cure speed. The graph below shows the shear strength developed with time on zinc dichromate steel pins and collars using Activator 7471™ and 7649™ and tested according to ISO
10123.
% of Full Strength on Steel
Cure Time
100
75
50
25
0 1min 5min10min 30min 1h 3h 6h 24h 72h
Activator 7471™
Activator 7649™
No activator
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion, ISO 11359-2, K
-1
80×10
-6
Coefficient of Thermal Conductivity, ISO 8302, W/(m·K)
0.1
Specific Heat, kJ/(kg·K) 0.3 Elongation, at break, ISO 37, % <2
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
After 24 hours @ 22 °C
Compressive Shear Strength, ISO 10123:
Steel pins and collars N/mm² ≥17.2
LMS
(psi) (2,490)
TYPICAL ENVIRONMENTAL RESISTANCE
Cured for 1 week @ 22 °C
Compressive Shear Strength, ISO 10123:
Steel pins and collars
Hot Strength
Tested at temperature
% Strength @ 22 °C
Temperature, °C
100
75
50
25
0
-50 0 50 100 150
Heat Aging
Aged at temperature indicated and tested @ 22 °C
% Initial Strength @ 22 °C
Exposure Time, hours
200
150
100
50
0
0 1000 2000 3000 4000 5000
120 °C
150 °C
Chemical/Solvent Resistance
Aged under conditions indicated and tested @ 22 °C.
% of initial strength
Environment °C 100 h 500 h 1000 h
Motor oil (MIL-L-46152) 125 100 100 100
Unleaded gasoline 22 100 100 100
Brake fluid 22 80 75 75
Water/glycol 50/50 87 100 90 80
Ethanol 22 95 95 95
Acetone 22 80 80 80
GENERAL INFORMATION This product is not recommended for use in pure oxygen
and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials
For safe handling information on this product, consult the Material Safety Data Sheet (MSDS).
Where aqueous washing systems are used to clean the surfaces before bonding, it is important to check for compatibility of the washing solution with the adhesive. In some cases these aqueous washes can affect the cure and performance of the adhesive.
This product is not normally recommended for use on plastics (particularly thermoplastic materials where stress cracking of the plastic could result). Users are recommended to confirm compatibility of the product with such substrates.
Directions for use: For Assembly
1.
For best results, clean all surfaces (external and internal) with a LOCTITE® cleaning solvent and allow to dry.
2. If the material is an inactive metal or the cure speed is too slow, spray with Activator 7471™ or 7649™ and allow to dry.
3. For Slip Fitted Assemblies, apply adhesive around the leading edge of the pin and the inside of the collar and use a rotating motion during assembly to ensure good coverage.
4. For Press Fitted Assemblies, apply adhesive thoroughly to both bond surfaces and assemble at high press on rates.
Henkel Americas +860.571.5100
Henkel Europe
+49.89.320800.1800
Henkel Asia Pacific
+86.21.2891.8863
For the most direct access to local sales and technical support visit: www.henkel.com/industrial
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440
TDS LOCTITE®660™, December-2009
5. For Shrink Fitted Assemblies the adhesive should be
coated onto the pin, the collar should then be heated to create sufficient clearance for free assembly.
6. Parts should not be disturbed until sufficient handling strength is achieved.
For Disassembly
1. Apply localized heat to the assembly to approximately 250 °C. Disassemble while hot.
For Cleanup
1. Cured product can be removed with a combination of soaking in a Loctite solvent and mechanical abrasion such as a wire brush.
Loctite Material Specification
LMS
LMS dated September-1, 1995. Test reports for each batch are available for the indicated properties. LMS test reports include selected QC test parameters considered appropriate to specifications for customer use. Additionally, comprehensive controls are in place to assure product quality and consistency. Special customer specification requirements may be coordinated through Henkel Quality.
Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.
Optimal Storage: 8 °C to 21 °C. Storage below 8 °C or greater than 28 °C can adversely affect product properties.
Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.
Conversions
(°C x 1.8) + 32 = °F kV/mm x 25.4 = V/mil mm / 25.4 = inches µm / 25.4 = mil N x 0.225 = lb N/mm x 5.71 = lb/in N/mm² x 145 = psi MPa x 145 = psi N·m x 8.851 = lb·in N·m x 0.738 = lb·ft N·mm x 0.142 = oz·in mPa·s = cP
Note
The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user's responsibility to determine suitability for the user's purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation
specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion
herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.
Trademark usage
Except as otherwise noted, all trademarks in this document are trademarks of Henkel Corporation in the U.S. and elsewhere. ® denotes a trademark registered in the U.S. Patent and Trademark Office.
Reference 0.4
Henkel Americas +860.571.5100
Henkel Europe
+49.89.320800.1800
Henkel Asia Pacific
+86.21.2891.8863
For the most direct access to local sales and technical support visit: www.henkel.com/industrial
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440
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