HMC Electronics 5768G User Manual

®

5768

5768

Bio-Kleen

Bio-Kleen

®

®

For W

For W

ater Removal of Rosin Flux Residue

ater Removal of Rosin Flux Residue

Product Description

Kester 5768 Bio-Kleen®is a highly concentrated
liquid cleaner which is added to water to make a
non-foaming solution for removing rosin flux
residue. The alkaline chemicals in Kester 5768
react with rosin by a chemical conversion known
as saponification to form soaps which are
water-soluble. The resulting rosin soap and any
water-soluble residue, such as activator salts, can
then be rinsed away with water. Kester 5768
possesses enhanced ability to solubilize
unsaponifiable material that is normally present in
rosin and in additives used in some flux or
solderpaste formulations. This assures excellent
visual and ionic cleanliness of circuit boards after
cleaning. Asignificant feature of this formulation is
its stable composition during use at elevated
temperatures such that a greatly increased
operating life is achieved. This results in less
frequent discharge of the wash tank for
replacement with fresh solution and in a process
cost reduction. Another special feature of Kester
5768 is that unlike other saponifier products which
tend to mildly etch the solder surface, it leaves
joints bright and shiny after cleaning. Kester 5768
eliminates the need for expensive, toxic and
environmentally harmful solvents traditionally
used for flux removal.

Performance Characteristics:

• Enhanced ability to solubilize flux residues

• Easily cleaned in water

• Effective for both rosin and water-soluble
flux chemistries

Physical Properties

Specific Gravity: 0.998 ± 0.005

Antoine Paar DMA 35 @ 25°C

pH (10% solution): 11.4

Hanna Instruments 8314 @ 25°C

Amine Value: 284 ± 15 mgKOH/g

ASTM D-2076

Flash Point: 110°C (230°F)

Application Notes

Kester 5768 Bio-Kleen®is specifically designed for
use in automatic in-line spray cleaning equipment
but can also be used in batch type washers.
Excellent cleaning is accomplished with low foaming
and minimal odor. This product contains a very
effective organic anti-foaming agent. No silicone
defoamers or other oils which do not rinse
completely from a circuit board assembly are
present in the formulation. For typical applications
a 5-10% by volume solution of Kester 5768 is
required. A higher or lower concentration may be
used depending on specific production
requirements. How much Kester 5768 will be
used depends on the specific flux or solderpaste
formulation, the solids content of the rosin flux, the
solution temperature and efficiency of the cleaning
equipment. The detergency action of Kester 5768
allows its use to assist in the removal of organic
water-soluble fluxes when increased cleaning
efficiency or lower surface tension are desired.
Kester 5768 is not compatible with PVC or CPVC.
As a general guideline, the following table shows
the recommended temperature range and
concentration of Kester 5768.

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

[phone]

Cleaning:

Deionized water is recommended for the wash solution and rinse tank section of in-line spray cleaning
equipment. Use of hard or high mineral content tap water will reduce cleaning efficiency and cause scale
build up in the cleaning equipment. There will also be increased consumption of Kester 5768 because the
saponifier will react with the minerals in hard tap water.

Disposal:

Kester 5768 does not contain phosphates, dichromates, caustic soda, inorganic salts, terpenes or
halogenated hydrocarbon solvents. The spent cleaning solution is biodegradable. However, the water may
contain some lead. Local regulations should be consulted for limitations on such factor as pH, solids
content, COD level and metals percentage.

Storage and Shelf Life:

Shelf life is 2 years from date of manufacture when handled properly and held at 10-25°C (50-77°F).

Health & Safety:

This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.

World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143 USA

Phone: [phone] • Email: [e-mail] • Website: www.kester.com

Asia Pacific Headquarters

500 Chai Chee Lane

Singapore 469024

([phone]

[e-mail]

European Headquarters

Zum Plom 5

08541 Neuensalz

Germany

([phone]

[e-mail]

Japanese Headquarters

20-11 Yokokawa 2-Chome

Sumida-Ku

Tokyo 130-0003 Japan

([phone]

[e-mail]

The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the poten­tial hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in
the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.

5768

Rev: 15Jun07

Application

Concentration

(% by volume)

Temperature

In-line Cleaner:

Solderpaste

8-12 49-71°C (120-160°F)
Liquid Rosin Flux 5-10 49-71°C (120-160°F)
Organic Water-soluble Flux 1-2 49-71°C (120-160°F)

Batch Cleaner:

Solderpaste and Liquid Flux 4-5 43-65°C (110-150°F)
Organic Water-soluble Flux 1-2 43-65°C (110-150°F)

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

[phone]