查询HMC156供应商
4
MICROWAVE CORPORATION
Typical Applications
The HMC156 is suitable for:
• Wireless Local Loop
• LMDS, VSAT, and Pt to Pt Radios
• UNII & HiperLAN
• Test Equipment
Functional Diagram
v03.1203
HMC156
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 0.7 - 2.4 GHz INPUT
Features
Conversion Loss: 15 dB
Fo, 3Fo, 4Fo Isolation: 38 dB
Input Drive Level: 10 to 20 dBm
General Description
The HMC156 is a miniature frequency doubler
in a MMIC die. Suppression of undesired fundamental and higher order harmonics is 38 dB
typical with respect to input signal levels. The
doubler uses the same diode/balun technology
used in Hittite MMIC mixers, features small size
and requires no DC bias.
Electrical Specifi cations, T
Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Units
Frequency Range, Input 1.1 - 2.1 0.8 - 2.4 0.7 - 2.3 GHz
FREQ. MULTIPLIERS - CHIP
Frequency Range, Output 2.2 - 4.2 1.6 - 4.8 1.4 - 4.6 GHz
Conversion Loss 17 22 15 20 15 20 dB
FO Isolation
(with respect to input level)
3FO Isolation
(with respect to input level)
4FO Isolation
(with respect to input level)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
4 - 2
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
= +25° C, As a Function of Drive Level
A
Input = +10 dBm Input = +15 dBm Input = +20 dBm
42 47 43 47 27 35 dB
45 55 44 55 29 40 dB
28 38 31 38 25 35 dB
Order Online at www.hittite.com
MICROWAVE CORPORATION
v03.1203
HMC156
GaAs MMIC FREQUENCY
DOUBLER, 0.7 - 2.4 GHz INPUT
Conversion Gain vs. Drive Level
0
-10
-20
-30
CONVERSION GAIN (dB)
-40
1 1.5 2 2.5 3 3.5 4 4.5 5
OUTPUT FREQUENCY (GHz)
Input=+10dBm
Input=+15dBm
Input=+20dBm
Input Return Loss vs. Drive Level Output Return Loss @ +15 Drive Level
0
-5
-10
-15
-20
INPUT RETURN LOSS (dB)
-25
-30
012345
INPUT FREQUENCY (GHz)
Input=+10dBm
Input=+15dBm
Input=+20dBm
Isolation @ +15 dBm Drive Level*
0
-10
-20
-30
-40
-50
-60
ISOLATION (dB)
-70
-80
-90
-100
012345678910
*With respect to input level
0
-2
-4
-6
-8
-10
-12
-14
-16
OUTPUT RETURN LOSS (dB)
-18
-20
012345
Fo
3Fo
4Fo
FREQUENCY (GHz)
OUTPUT FREQUENCY (GHz)
4
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
FREQ. MULTIPLIERS - CHIP
4 - 3
MICROWAVE CORPORATION
v03.1203
HMC156
GaAs MMIC FREQUENCY
4
Absolute Maximum Ratings
Input Drive +27 dBm
Storage Temperature -65 to +150 °C
Operating Temperature -55 to +85 °C
Outline Drawing
DOUBLER, 0.7 - 2.4 GHz INPUT
FREQ. MULTIPLIERS - CHIP
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
4 - 4
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
NOTES:
1. ALL UNLABELED PADS MUST BE BONDED TO GROUND (8 TOTAL).
2. ALL DIMENSIONS IN INCHES [MILLIMETERS]
3. ALL TOLERANCES ARE ±0.001 [0.025]
4. DIE THICKNESS IS ±0.005 [0.127]
5. BOND PADS ARE ±0.004 [0.100] SQUARE
6. EQUALLY SPACED AT ±0.006 [0.150] CENTERS
7. BACKSIDE METALLIZATION: NONE
8. BOND PAD METALLIZATION: GOLD
Order Online at www.hittite.com
MICROWAVE CORPORATION
v03.1203
HMC156
GaAs MMIC FREQUENCY
DOUBLER, 0.7 - 2.4 GHz INPUT
Handling Precautions
Follow these precautions to avoid permanent damage.
Cleanliness: Handle the chips in a clean environment. DO NO T attempt to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and
bias cables to minimize inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent
tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet,
tweezers, or fi ngers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or
with electrically conductive epoxy. The mounting surface should be clean and fl at.
Epoxy Die Attach:
Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fi llet is observed around
the perimeter of the chip once it is placed into position.
4
Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams
is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds
should be started on the chip and terminated on the package. RF bonds should be as short as possible.
FREQ. MULTIPLIERS - CHIP
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
4 - 5
Loading...