Hitachi DK23CA-10, DK23EA, DK23CA-30F, DK23CA-30, DK23CA-15 Specifications

K6602637
Rev.3

02.27.01

- 1 -

OEM Manual

DK23CA-30F/30/15/75 Disk Drive

Specifications

REV.3

Caution for Safety
Read Safety descriptions carefully.
Read and recommend drive usage cautions to your end user.
Keep this manual with care.

(Total 104 pages)

H I T A C H I

All Rights Reserved, Copyright ©2001 Hitachi, Ltd.

K6602637
Rev.3

02.27.01

- 2 -

Rev.0: 01.30.01 Preliminary
Rev.1: 02.08.01 Preliminary
Rev.2: 02:15:01
Rev.3: 02:27:01

To use this product safely

To use the product, read safet y descript ions below and understand t hor oughly.

Keep this manual with care to insure unlimited use.

l

General Caution for Safety

The followings are general cautions for safe use of this product.

(Caution before Product Use)

- Please read and follow all instructions and cautions described on “Safety Instructions” (Page 4) and “1.2
General Caution” (Page 10 and 11) before attempting to use this product.

- Follow all instructions and cautions indicated throughout this manual and the product. Failure to follow
these instructions and cautions may cause injury, fire and product damage.

l

Advise y our end user of the safety caution

Read and recommend that your end users read the caution for drive usage in this manual.

l

Protect yourself

The safety instructions in this manual were thoroughly considered, but unexpect ed situations can occur.
Not only follow the instructions on this manual, but also be careful for t he safety of yourself.

l

Symbol of safety caution

Safety instructions and cautions are indicated as the following headline, which consist s a symbol (marking)
and word of “Caution”. The indication and meaning are as follows:

Caution:

This symbol indicates that potential danger may exist which may cause bodily

injury or damage to the product if safety instructions are not followed.

l

Safety caution in this manual

Followings are the cautions and contents described in this manual.

Items of indicating

Caution

:

-

Safety Instructions Page 4

-

General Caution Sec. 1.2, Page 10 – 11

-

Power Supply Requirements Sec.3.1, Page 14

-

Maximum Power off Interval Sec. 3.2, Page 15

-

Data Reliability Sec. 3.2, Page 16

-

Attention for HDD Installation Sec. 4.2.3, Page 21

-

Packing Sec. 5.1, Page 23

-

Handling Sec. 5.2, Page 24

K6602637
Rev.3

02.27.01

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To use this product safely (Continued)

l

Environmental circumstance

Although this product partially scatters electro-magnetic field into the air, it has been inspected and was
installed under Electro-magnetic regulations of resident areas, such as EMC standard EN55022
(corresponding to FCC part 15 Class B, etc.). However, anything other than this product, such as an
interface cable, is excluded. Therefore, the following cases require a system side improvement for the
electro-magnetic field regulations.

1) Disturbance of operations of other products or equipment in resident area

2) Disturbance caused by other product, such as cabling, to operations of other products or equipment.
Only Hitachi trained persons should change this product Hitachi assumes no responsibility for products

which have been changed by anyone else.

l

Safety regulations

This product meets the following safety regulations, but the sy st em side should consider the safet y of the
system with this product.

Regulations: - UL1950 Third Edition dated July 28, 1995

- CSA C22.2 N0.950-M95

- IEC60950 A4: 1996

- EN60950 A11: 1992

Warranty and Limited Liability

This product is sold with a limited warranty and specific remedies are available to the original purchaser in
the event the product fails to confor m t o t he limited warranty. Hitachi’s liability may be further limited in
accordance with its sales contact.

In general, Hitachi shall not be responsible for product damages caused by natural disasters, fire, static
discharge, misuse, abuse, neglect, improper handling or installation, unauthorized repair, alteration or
accident. In no event will Hitachi be liable for loss of dat a st or ed on pr oduct.

HITACHI SHALL NOT BE LIABLE FOR ANY SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES,
EVEN IF INFORMED OF THE POSSIBILI TY THEREOF IN ADVANCE.

Please see your sales contract for a complete statement of warranty rights, remedies and limitation of
liability.

K6602637
Rev.3

02.27.01

- 4 -

Safety Instructions

1. The product is not authorized for use in life support devices or syst ems or other applicat ions that pose a
significant risk of personal injury.

2. Since the drive uses glass media for the disk platter, opening of Metal Head Disk Assembly (HDA) may
cause bodily injury. Warranty void in case of opened HDA or any broken HDA seals. Don’t open the HDA
or break any HDA seals.

3. Dropping of the HDD may cause bodily injury. Handle with care.

4. Do not cover the breather hole. If the hole was cov ered w it h any material, it shall result in permanent
damage to the drive and/or loss of data. Label or seal shall be attached on the cover avoiding the
breather hole. Warranty void if the breather hole was covered.

5. Do not hit the interface connector pins against other objects. Do not make contact w ith the interface
connector pins. Contact causes pin dent, electrical discharge distraction or contact failure. Also, pins or
HDA corners may cause bodily injury. Handle with care.

6. Observe Clause 3.3 “Drive Usage Condition Specificat ions” . Since r eliability and product life depends on
usage conditions, please consult our sales or application engineers.

7. Keep usage conditions within specifications (Power Supply, Environment, etc.). If the conditions are not
kept within the specifications, failures may occur.

8. Hot swapping (Power-on swapping) can damage the drive. The drive shall be sw apped during Pow er O ff
only.

9. Electro Static Discharge (ESD) can damage the drive. Protect the drive from ESD during handling.

10. Voltage rise time 5 - 100 ms at power on is required for power supply. The power supply v olt age must
not be under below GND level (0 V) at power off.

11. This product is required over current protection for possible combustion due to circuit or component
failure. Secondary over current protection shall be prepared by the system. The requirement of the
current limitation is max. 10 A for the protection.

12. Improper insertion of connector or wrong jumper setting may cause catastrophic failures. Referring to

this manual prior to the connector insertion or jumper setting can help to insure correct insertion.

13. If a foreign conductive substance (metallic powder, fluid, etc.) adheres to active metal of the driv e
(Printed pattern, component lead, etc. on PCBA), it may cause catast rophic failures. Cust omer should
protect the drive from the above condition.

14. The PCBA side of the drive should be covered with insulation sheet if t he active metal of host system
may contact to the PCBA of the drive. If the insulation sheet is not provided for the possible contact of the
live metal, failures may occur.

15. Shock can result in permanent damage to the drive and/or loss of data. Prevent shocks, which is often
incurred by dropping, knocking over, or hitting the drive.

16. To fix the drive, use the size of screws and the torque recommended in this manual. If non­recommended size screws and torque are used, it may cause catastrophic failures.

17. Do not press top cover. It may cause catastrophic failures. In case of steel plate installation on HDD

cover side, the spacing between HDD cover and steel plate should be kept more than 2 mm. If this
spacing is not kept for the steel plate, it may affect Load/Unload mechanism.

18. Do not push the bottom PCBA of the drive. It may cause cat ast rophic failures.

Caution

K6602637
Rev.3

02.27.01

- 5 -

Safety Instructions

(Continued)

19. The long-term storage without power on should not exceed one year.

20. Prevent humidity when the drive is packed in a box.

21. Use original packages (50 units’ package) during drive transportation to protect from any damage.

(Keep some extra packages for the drive transportation)

22. To returning over 100 units, use original outside package with pallet or proper packaging with pallet to

protect from any damage.

23. Recorded data on the disk may be lost due to accidents such as disasters, shock damage during

handling or drive failure. To prepare for accidents, back up data. Hitachi does not perform data
recovery.

24. Data may be lost due to unexpected or accidental power loss during write operat ion.

NOTICE TO USERS

While every effort has been made to ensure that the information provided herein is correct please feel free
to notify us in the event of an error or inconsistency.

Hitachi makes no representations or warranties with respect to the contents hereof and specifically
disclaims any implied warranties or merchantability or fitness for any purpose.

Further Hitachi reserves the right to revise this publication and t o make changes from time to time in the
content hereof without obligation to notify any person of such revisions or changes.

Caution

K6602637
Rev.3

02.27.01

- 6 -

Contents Page



To use this product safely

--------------------------- 2

1. 0 General --------------------------- 9

1.1 General --------------------------- 9

1.2 General Caution --------------------------- 10

2.0 Components --------------------------- 12

3.0 Specification Summary --------------------------- 13

3.1 Principal Specifications --------------------------- 13

3.2 Environmental Specifications and Reliability --------------------------- 15

3.3 Drive Usage Condition Specifications --------------------------- 16

3.4 Load/Unload Specifications --------------------------- 17

3.4.1 Normal Load/Unload --------------------------- 17

3.4.2 Emergency Unload --------------------------- 17

3.4.3 Required Power Off Sequence --------------------------- 17

4.0 Installation --------------------------- 18

4.1 Installation Direction --------------------------- 18

4.2 Mounting HDD --------------------------- 19

4.2.1 Mounting HDD with Screws --------------------------- 19

4.2.2 Single HDD Test Condition --------------------------- 20

4.2.3 Attention for HDD Installation --------------------------- 21

4.3 Drive Address Setting(DRIVE 0/DRIVE 1) --------------------------- 21

4.4 Dimensions --------------------------- 22

5.0 Packing and Handling --------------------------- 23

5.1 Packing --------------------------- 23

5.2 Handling --------------------------- 24

6.0 Interface --------------------------- 25

6.1 Power Interface --------------------------- 25

6.2 Physical Interface --------------------------- 26

6.2.1 Connector --------------------------- 26

6.2.2 Connector Pin Assignment --------------------------- 27

6.2.3 Description of the Interface Signals --------------------------- 28

6.3 Logical Interface --------------------------- 31

6.3.1 I/O Registers --------------------------- 31

6.3.1.1 Data Register --------------------------- 31

6.3.1.2 Error Register --------------------------- 31

6.3.1.3 Features Register --------------------------- 32

6.3.1.4 Sector Count Register --------------------------- 32

6.3.1.5 Sector Number Register --------------------------- 32

6.3.1.6 Cylinder Low Register --------------------------- 32

6.3.1.7 Cylinder High Register --------------------------- 32

6.3.1.8 Device/Head Register --------------------------- 33

6.3.1.9 Status Register --------------------------- 33

6.3.1.10 Command Register --------------------------- 33

6.3.1.11 Alternate Status Register --------------------------- 34

6.3.1.12 Device Control Register --------------------------- 34

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Rev.3

02.27.01

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6.3.2 Command --------------------------- 35

6.3.2.1 Command Summary --------------------------- 35

6.3.2.2 Command BSY Timing --------------------------- 36

6.3.2.3 PIO Data In Commands --------------------------- 37

6.3.2.3.1 Identify Device [ECh] --------------------------- 38

6.3.2.3.2 Read Buffer [E4h] --------------------------- 45

6.3.2.3.3 Read Sectors [20h, 21h] --------------------------- 45

6.3.2.3.4 Read Long [22h, 23h] --------------------------- 45

6.3.2.3.5 Read Multiple [C4h] --------------------------- 45

6.3.2.4 PIO Data Out Commands --------------------------- 46

6.3.2.4.1 Write Buffer [E8h] --------------------------- 46

6.3.2.4.2 Write Sectors [30h, 31h] --------------------------- 46

6.3.2.4.3 Write Long [32h, 33h] --------------------------- 46

6.3.2.4.4 Write Multiple [C5h] --------------------------- 46

6.3.2.4.5 Format Track [50h] --------------------------- 47

6.3.2.5 Non-Data Commands --------------------------- 47

6.3.2.5.1 Initialize Device Parameters [91h] --------------------------- 47

6.3.2.5.2. Read Verify [40h, 41h] --------------------------- 48

6.3.2.5.3 Recalibrate [1Xh] --------------------------- 48

6.3.2.5.4 Seek [7Xh] --------------------------- 48

6.3.2.5.5 Set Features [EFh] --------------------------- 48

6.3.2.5.6 Set Multiple Mode [C6h] --------------------------- 49

6.3.2.5.7 Execute Device Diagnostic [90h] --------------------------- 49

6.3.2.5.8 Flush Cache [E7h] --------------------------- 50

6.3.2.6 Power Commands --------------------------- 51

6.3.2.6.1 Power Management --------------------------- 51

6.3.2.6.2 Advanced Power Management --------------------------- 52

6.3.2.6.3 Check Power Mode [98h, E5h] --------------------------- 53

6.3.2.6.4 Idle [97h, E3h] --------------------------- 54

6.3.2.6.5 Idle Immediate [95h, E1h] --------------------------- 54

6.3.2.6.6 Sleep [99h, E6h] --------------------------- 54

6.3.2.6.7 Standby [96h, E2h] --------------------------- 54

6.3.2.6.8 Standby Immediate [94h, E0h] --------------------------- 54

6.3.2.7 DMA Data In/Out Commands --------------------------- 55

6.3.2.7.1 Read DMA [C8h, C9h] --------------------------- 55

6.3.2.7.2 Write DMA [CAh, CBh] --------------------------- 55

6.3.2.8 SMART Feature --------------------------- 56

6.3.2.8.1 Attribute Parameters --------------------------- 56

6.2.7.8.2 SMART Device Error Log Reporting --------------------------- 57

6.2.7.8.3 SMART Operation with Management Modes --------------------------- 57

6.3.2.8.4 SMART Function Default Setting --------------------------- 57

6.3.2.8.5 SMART Enable Operations [B0h, Sub D8h] --------------------------- 57

6.3.2.8.6 SMART Disable Operations [B0h, Sub D9h] --------------------------- 58

6.3.2.8.7 SMART Return Status [B0h, Sub DAh] --------------------------- 59

6.3.2.8.8 SMART Enable/Disable Attribute AUTOSAVE [B0h, Sub D2h] ------------------ 59

6.3.2.8.9 SMART Save Attribute Values [B0h, Sub D3h] ---------------------------- 60

6.3.2.8.10 SMART Enable/Disable Automatic Off-line [B0h, Sub DBh] ------------------- 61

6.3.2.8.11 SMART Execute Off-line Immediate [B0h, Sub D4h] ------------------------- 62

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02.27.01

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6.3.2.8.12 SMART Read Log Sector [B0h, Sub D5h] --------------------------- 65

6.3.2.8.13 SMART Write Log Sector [B0h, Sub D6h] --------------------------- 70

6.3.2.9 Security Mode Feature --------------------------- 71

6.3.2.9.1 Security Mode Default Setting --------------------------- 71

6.3.2.9.2 Initial Setting of the User Password --------------------------- 72

6.3.2.9.3 Security Mode Operation from Power-on or Hardware Reset ---------------------- 72

6.3.2.9.4 User Password Lost --------------------------- 73

6.3.2.9.5 Security Set Password [F1h] --------------------------- 74

6.3.2.9.6 Security Unlock [F2h] --------------------------- 75

6.3.2.9.7 Security Erase Prepare [F3h] --------------------------- 76

6.3.2.9.8 Security Erase Unit [F4h] -------------------------- 76

6.3.2.9.9 Security Freeze Lock [F5h] --------------------------- 77

6.3.2.9.10 Security Disable Password [F6h] --------------------------- 77

6.3.2.9.11 Security Mode Command Action [F1h] --------------------------- 78

6.3.2.10 Protected Area Feature, Address Offset Feature --------------------------- 79

6.3.2.10.1 Protected Area Feature and Set Max Security Extension -------------------------- 79

6.3.2.10.2 Address Offset Feature --------------------------- 80

6.3.2.10.3 Read Max Address Command [F8h] --------------------------- 82

6.3.2.10.4 Set Max Address Command [F9h, Sub 00h] --------------------------- 83

6.3.2.10.5 Set Max Set Password Command [F9h, Sub 01h] --------------------------- 85

6.3.2.10.6 Set Max Lock Command [F9h, Sub 02h] --------------------------- 85

6.3.2.10.7 Set Max Unlock Command [F9h, Sub 03h] --------------------------- 86

6.3.2.10.8 Set Max Freeze Lock Command [F9h, Sub 04h] --------------------------- 86

6.3.2.11 Note for Write Cache and Auto Reallocation --------------------------- 87

6.4 Interface Signal Timing --------------------------- 88

6.4.1 Data Transfer Timing --------------------------- 88

6.4.2 Ultra DMA Data Transfer Timing --------------------------- 91

6.4.3 Power On and Hardware Reset Timing --------------------------- 101
< Glossary > --------------------------- 102
< Reference > --------------------------- 103

K6602637
Rev.3

02.27.01

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1.0 General

1.1 Introduction

The DK23CA series disk drives reach high capacities (30,005MB, 15,103MB and 7,501MB for 9.5mm
height) in a 2.5 type form factor by applying the latest high-density recording technology. Model Names
DK23CA-xxF indicates FDB (Fluid Bering) motor type, and DK23CA-xx indicates Ball Bering motor type.

Capacity

Model (Formatted) Height Interface

DK23CA-30F/30 30,005 MB 9.5 mm ATA-5(IDE)

DK23CA-15 15,103 MB 9.5 mm ATA-5(IDE)
DK23CA-75 7,501 MB 9.5 mm ATA-5(IDE)

[Features]

-

GMR Head

-

ID-less Format

-

ME

2

PRML Read Channel

-

Data Transfer Rate

(Host-Device)

-16.6 MB/sec: PIO mode-4/Multiword DMA mode-2

- 100 MB/sec: Ultra DMA mode-5
(Device-Buffer)

- 16.5 to 28.7 MB/sec

-

CDR (Constant Density Recording)

-

On-the-fly ECC Correction

-

Buffer: 2MB(DK23CA-30F/30)/512 KB(DK23CA-15/75)

-

Read-ahead Cache/Write Cache

-

Auto Read Reassign/Auto Write Reassign

-

SMART

-

Average Access Time 12 ms

-

Embedded Sector Servo

-

FDB Motor (DK23CA-30F)/Ball Bering Motor (DK23CA-30/15/75)

-

Rotary Actuator

-

Load/Unload Mechanism

-

95 grams(DK23CA-30F/30)/91 grams(DK23CA-15/75)

-

Low Power Consumption: 0.65W(130mA) at Idle mode, 0.25W(50mA) at Standby mode

-

Advanced Power Management(APM)

-

Non-operating Shock 7,840m/S

2

(800G, 2ms, half-sine wave)

-

Operating Shock 1,764m/S

2

(180G, 2ms, half-sine wave)

-

MCC 2.5 inch Small Form Factor(9.5mm height)

[Identify Device Information for Setup]

Table 1.1 Identify Device information (Addressing)

Model Word 1

Number of CYL.

Word 3

Number of HD

Word 6

Number of SPT

Word 60､61

Total LBA

DK23CA-30F/30 16383

(3FFFh)

16

(0010h)

63

(3Fh)

58605120

(037E3E40h)

DK23CA-15 16383

(3FFFh)

16

(0010h)

63

(3Fh)

29498112

(01C21B00h)

DK23CA-75

15504 (

*1)

(3C90h)

15

(000Fh)

63

(3Fh)

14651280

(00DF8F90h)

*1.

Maximum capacity in CHS mode is 8,455MB.

K6602637
Rev.3

02.27.01

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1.2 General Caution

Adhere to the following cautions.

(a) Warranty void if Metal Head Disk Assembly (HDA) is opened, or any HDA seal/label is broken.
(b) Hot swapping (Power on) damages the drive. The drive should be swapped during Power O ff only.
(C) Shock can result in permanent damage to the drive and/or loss of data.

Prevent shocks often incurred by dropping, knocking over, or hitting the drive.

(Dropping) (Knocking over)

(Hitting) (Hitting)

Figure 1-1

Caution

PREVENT SHO CK S

Caution

K6602637
Rev.3

02.27.01

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(Continued)

(d) Do not cover the breather hole. If the hole was covered w ith any material, it shall result in permanent

damage to the drive and/or loss of data. Label or seal shall be attached on the cover avoiding the
breather hole. Warranty void if the breather hole was covered.

Caution

Do not cover the breather hole

Breather hole

Figure 1-2 Breather hole location

K6602637
Rev.3

02.27.01

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2.0 Components

DK23CA-30F/30/15/75 Disk Drive

Figure 2-1 Overview of DK23CA-30F/30/15/75 (9.5mm height)

Note: 1) Prepare connection cables referring to Sec. 6.2.

2) Mounting holes are compatible with DK237A-XX, DK238A-XX, DK239A-XX, DK23AA-XX
DK23BA-xx and DK23BA - XXE.

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Rev.3

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3.0 Specification Summary

3.1 Principal Specifications

Table 3.1 Principal Specifications

Specifications

No. Item

DK23CA-30F/30 DK23CA-15 DK23CA-75

Units

1 Capacity per drive (Formatted

)

30,005 15,103 7,501 MB
Capacity per sector 512 Bytes
Disks 2 1 1
Heads 4 2 1
Cylinders 28,134

2 Seek time Average 12

*1

ms

(

Nominal Maximum 24

*1

ms

value

)

Minimum 3 ms

3Average latenc

y

7.1 ms

Disk rotational speed 4,200 RPM

4 Recording densit

y

Max. 530 kBPI

Track densit

y

46.8 kTPI

Recording method ME2PRML, ID-Less format

5 Interface ATA-5(IDE

)

Data transfer rate (Disk-Buffer

)

16.3 – 30.2 MB/sec

Data transfer rate (Host-Buffer

)

Max. 16.6 MB/sec

(

PIO mode 4/ Multiword DMA mode 2

)

Max. 100 (Ultra DMA mode 5

)

MB/sec

Buffer size 2048 512 512 kB

6 Power on - Ready

*2

5 (Typical)

*3

sec

Sleep/Standby - Ready

*2

3 (Typical)

*3

sec

7

Dimensions（W×H×D) 70W×9.5H×100D

mm

Weight (Approximate value

)

95 91 91

g

rams

8 DC Power Requirements

*4

(Typical)

+

5v ± 5% Ripple noise 100mvp-p or less

- Start up *5 0.90 A(4.5W)

- Idle *6 0.13 A(0.65W)

- Low Power Active *7 0.33 A(1.65W)

-Seek *8 0.45 A(2.25W)

- Read/Write *9 0.40/0.40 A(2.0/2.0W)

- Standby 0.050 A(0.25W)

- Sleep 0.020 A(0.1W)

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*1

:Average time of seek is calculated under the following condition. (Read/Write ratio: Read only)

Average of 10,000 random seeks, Voltage 5.0V, Temperature 25°C.
Maximum time of seek is calculated under the following condition.
Average of 1,000 full stroke seeks, Voltage 5.0V, Temperature 25°C.
This maximum time is not included the seek time by seek retry.

*2

: Periodically, during start up, the drive may perform a spin up retr y operation. When this operation occurs,

the start up sound will change slightly and the ready timing will also be altered from typical time.

*3

: Power on to Ready time could take up to 20 seconds in case of spin up retries under certain

conditions of the voltage specifications(Table 3.1) and environmental specifications(Table 3.2).

*4 :

For DC power input, the average current is measured at the connector of the PCBA of this drive and in

the nominal condition in which the power voltage and the temperature are 5.0V and 25°C, respectively.
Burst free (common mode). The average current may have some tolerance after power-on. The current

measurement is recommended at 5 minutes later after power-on.

Voltage rise time 5 - 100 ms at power on is required for power supply. The power
supply voltage must not be under below GND lev el ( 0 V) at power off.

This product is required over current protection for possible combustion due to

circuit or component failure. Secondary over current protection shall be prepared
by the system. The requirement of the current limitation is max. 10 A for the
protection.

*5

: For more information, refer to Section 6.1.

*6

: This value is at Low Power Idle mode. The heads are unloaded.

*7

: Power mode automatically enters to Low Power Active mode after Read/ Write operation. Head position

is kept on the same track before this power transition.

*8

: Measured during random seek , and the seek interval is 1.5 revolution times (i.e. the average latency

and one revolution).

*9

: Measured while reading or writing 16 sectors of data located on the same track.

Caution

Caution

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3.2 Environmental Specifications and Reliability

Table 3.2 Environmental Specification and Reliability

No. Item Specification

DK23CA-30F DK23CA-30/15/75

1

Ambient

*1

Operational

5 to 55°C

temperature Non-operational

-40 to 70°C

*2

Temperature gradient

Max. 20°C /hour

2 Relative humidity Operational 5 to 90 %

Non-operational 5 to 95 %

Maximum wet Operat ional

29°C (without condensation)

bulb Non-operational

40°C (without condensation)

*3

3 Vibration Operational 1.0mm p-p or less (5 - 22Hz)

9.8 m/s2 (1.0G) or less m/s2 (22 – 500Hz)

Non-operational 5mm p-p or less (5 – 22Hz)

49m/s2(5G) or less (22 – 500Hz)

4

Shock

*6

Operational

1,764m/s2(180G) or less (2 ms, half sine wave)

Non-operational

7,840m/s2(800G) or less (2 ms, half sine wave)
5 Atmospheric condition Without corrosive vapors or salt
6 Acoustic-noise

*4

Idle Typical 2.5 Bels Typical 2.8 Bels

7 Height Operational 3,000m or less

(Altitude) Non-operational 12,000m or less

Height gradient Max. 300m/min.(3.1kpa/min.)

8

(*5)

Data reliability

(with retries and ECC)

Less than 1 non-recoverable error in

10 E 13 bits read

9 External magnetic field 1,500 micro Tesla (DC) or less

*1

: Ambient temperature should be measured at point 10 mm away from the nameplate of the drive. If the

maximum operational ambient temperature cannot be measured at a point 10 mm away from the
nameplate, a substitution method is stipulated in the table below.

Ambient

temperature

Temperature at cover

(Point A)

55°C62

°

C

5°C5

°

C

*2

: In case the ambient temperature is -40 to 0°C, the drive should be

packed in HDD package box. Please see specification 5.1 Packing
for reference.

Maximum power-off interval is 12 months.

*3

: In case of the maximum wet bulb 40°C , the drive should be packed in HDD package box with ESD bag
and desiccant. Please see specification 5.1 Packing for reference. If the drive is not packed in the HDD
package box with ESD bag and desiccant, maximum wet bulb 29°C is applied.

Caution

Measurement point

(Point A

）

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Rev.3

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*4

: 3.9 Bels are the maximum sound power levels with A-weighted . This value is specified at product

shipment, except during startup, seek, load, unload or st op. Clicking noise of releasing magnet latch will
occur at power-on and loading operation. Also, the licking noise of locking magnet latch will occur at
normal and emergency unloading operations.

*5

:

Data reliability is not to be used to compromise t he host system data backup.
For the HDD evaluation, long term operation is not r ecommended. In case of

evaluation, once or more unload operation by Power off , Standby or Sleep is
recommended within twelve hours’ power on time.

*6

: These shock specifications are defined for each axis. For non-operating rotational shock, the

specification is 15K radian/sec

2

or less (2 ms, half sine wave).

3.3 Drive Usage Condition Specifi cat i ons

The drive is designed for usage under the following conditions. Since reliability and product life depends on
usage conditions, please consult our sales representatives or application engineers if the drive may be
operated outside these conditions.

-Power on hours (POH) : Less than 160 hours/month
POH includes Sleep and Standby modes.
The heads are unloaded during Power off, Standby, Sleep or Low Power Idle
modes. The spindle motor is stopped during Standby and Sleep modes.

-Operating (Seek/Write : Less than 20% of POH
Read operations)

-Motor Start/Stop Count : Max. 100,000 times. This number includes Standby, Sleep and pow er-on/off
count.

-Environment : Within environmental specifications given in Table 3.2

-Power Requirement : Within DC power requirement specifications given in Table 3.1 “Principal
Specifications”

-Drive Grounding : Drive frame should be grounded to system ground with four screws electrically.
Grounding noise should be less than 500mVp-p. The grounding noise
should be measured between electrical ground and system frame ground
without the drive. Grounding AC current (measuring between two of side
mounting holes) should be less than 50 mAp-p (Frequency Range: less than
20MHz). The grounding current should be measured through 50 ohm resistor.

-External Magnetic Field : Within specifications given in Table 3.2

-Mounting : Mount with recommended screws and regular torque.

-Physical/Electrical Interface: ATA-5

-Handling : Do not add Electrical Static Discharge, and Vibration and Shock to the drive.
Do not press top cover and bottom PCBA surface of the drive.

Caution

K6602637
Rev.3

02.27.01

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3.4 Load/Unload Specifications

Load /Unload is a mechanism to load/unload the heads on the disk surfaces.

3.4.1 Normal Load/Unload

Normal load/unload operations are limited to maximum 300,000 times during HDD life. The normal unload
operation is performed by the following commands.

-

Standby

-

Standby Immediate

-

Sleep

Also, the normal unload is automatically performed by control software, during Idle mode. The abov e normal
unload time does not include an emergency unload as explained in Sec. 3.4.2.

3.4.2 Emergency Unload

The emergency unload is occurred by unexpected power down, and is limited to maximum 20,000 times
during HDD life. Since normal unload can not be performed by the softwar e cont r o l aft er power off, the
heads are unloaded by a hardware control. The maximum number of emergency unload is defined
separately.

3.4.3 Required Power Off Sequence

To operate the load/unload normally, the following BIOS sequence is required by Host system before power
off.

[Sequence #1]: Execute one of following commands.

-

Standby

-

Standby Immediate

-

Sleep

Note:

Such as Soft Reset, Flush Cache command or Check Power Mode command does

not unload the heads. Soft Reset does not unload the heads from DK23CA-xx.

[Sequence #2]: Check the Status Register, and wait the command complete.

Note:

The head is unload by the sequence #1 command, and the command completion

normally takes about 400 ms. Considering the error retries, BIOS timer should be set
to over 30 sec by the Host side.

[Sequence #3]: Power off the drive

Above sequence is required for the Host system at Power off, Suspend and Hibernation operations.

K6602637
Rev.3

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4.0 Installation

4.1 Installation Direction

The DK23CA-30F/30/15/75 can be installed in the 6 directions as shown below.

Figure 4-1 Installation

K6602637
Rev.3

02.27.01

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4.2 Mounting HDD

4.2.1 Mounting HDD with screws

Mount the HDD with the screws according to the following instruction to optimize the
performance.

(a) Mount the HDD with M3 screws. Take care not t o add any distorting force to the HDD when mounting.
Using 4 screws holes, secure the HDD.
(b) Use screws with the following specifications when t he HDD is mounted.
i) M3 (screw engagement of 2.5mm max)
ii) The torque for fixing the screws is 3±0.5kgcm(2.6±0.4 lb. inch)
(c) Any distortion of HDD over 0.020mm should be avoided. Take care that the system chassis are
flat enough.
(d) Consider an appropriate cooling to keep the temperature of cent er of HDD top cover less than 62°C.
(e) The inertia of the chassis around the Z-axis of the gravity center of the device must be more than
7 X 10

-4

kg m2.

Note) In case of general Sub-Notebook PC(Weight: 1.7kg), the inertia of the chassis around the Z-axis of

the gravity center of the device is greater t han 100 X 10

-4

kg

m2. Therefore, the required inertia level

has no problem with the general electronic equipment.

Caution

(0.2)

4-M3x0.5

Chassis

X

Z

Y

(

Unit: mm

)

HDD

Figure 4-2 Mounting the HDD

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Rev.3

02.27.01

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4.2.2 Single HDD Test Condition

To optimize the performance, keep the following instructions.

1) For the Single HDD test, HDD should be placed on an ABS-sheet. HDD should be place wit h
no movement by external force min. 0.39N for X axis and Y-axis directions.

2) Don’t place HDD on a soft sponge sheet or hard surface at HDD test. I f the HDD is placed on
the soft sponge sheet or slippery hard desk surface, the HDD has unstable condit ions such as HDD
self-vibration at seek operations or spindle motor rotation. It may cause performance reduction or
some errors. Also, HDD floating by t ension of I /F cabling may cause the similar symptom. The HDD
should be placed without any floating. Don’t test the HDD under these unstable conditions.

3) If the HDD cannot be fixed by the required holding torque above item 1), put a body weight on the
HDD as shown in Figure 4-3. The body weight is prov ided for pr eventing the HDD movement or HDD
floating by tension of I/F cabling.

Use the body weight as specified below.

Material : SS41 with ELP-coat
Weight : M=0.66kg
Inertia : I=7.3X10 kg m

Figure 4-3 Single HDD Test Condition

Y Axis Direction

X Axis Direction

(70)

(13)

(92)

Weight

SS41 with Insulation sheet

(m=0.66kg, I=7.3X10 kg m )

-4

2

HDD

ABS-sheet

(t = 5mm)

K6602637
Rev.3

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4.2.3 Attent i on f or HDD Installation

(1) In case of steel plate installation on HDD cover side, the spacing between
HDD cover and steel plate should be kept more than 2 mm. If this spacing is not

kept for the steel plate, it may affect Load/Unload mechanism.

(2) The PCBA side of the drive should be covered with insulation sheet if the active

metal of host system may contact to the PCBA of t he drive. If the insulation sheet
is not provided for the possible contact of the live metal, failures may occur.

(3) Do not push the bottom PCBA. It may cause catastrophic failures.

4.3 Device Address Setting (DRI VE 0/DRIVE 1)

When the device is connected to the host bus, Device address setting is necessary to configure
a device as DRIVE 0 or DRIVE 1. The device address setting is established bet ween drives on
the interface connector by using jumper 0-2 (pin # A, B, D)
The DRIVE 0 is assigned to device address 0, and the DRIVE 1 is assigned to device address 1.

O - - - - - - - - O O O O O
O - - - - - - - - O O O O O

43 5 3 1

CA

44

642 DB

O - - - - - - - - O O O O O
O - - - - - - - - O O O O O

43 5 3

1

CA

44 642 DB

O - - - - - - - - O O O O O
O - - - - - - - - O O O O O

43 5 3 1

CA

44 642 DB

1) DRIVE 0 (or single)

2) DRIVE 1

3) CSEL Selection

If all of pins A,B, D are open, the drive is
DRIVE 0(or single).

If jumper Position A-B is used, the driv e is
DRIVE 1.

If jumper Position B-D is used, DRIVE 0 or
DRIVE 1 settin g is deter mined b y the con dition of
CSEL signal (pin# 28).

Caution

Steel Plate

HDD Cover

2 mm

PCBA

More than

Insulation sheet

(Recommended type of jumper socket)
Vender: IRISO ELECTRONICS CO., LTD.
Vender Part Number: 9721HJ-GF

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Rev.3

02.27.01

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±

0.25

4.4 Dimensions

Figure 4-4 Dimensions (DK23CA-30F/30/15/75)

9.5

±

0.2

14.0 ± 0.25

4-M3

3.0mm min. full thread

10.14

±

0.375

100±0.45

61.72

±

0.25

(70.1

Maximum drive width

)

69.85

4.07

±

0.25

10.24 ± 0.25

3

±

0.25

4-M3

3.5mm min.
full thread

76.6 ± 0.25

2

3.99

±

0.25

2

42

(Unit : mm)

Drive width at mountin

g

K6602637
Rev.3

02.27.01

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5.0 Packing and Handling

5.1 Packing

When you package the device, clean it and execute the following procedures
to prevent humidity and handling damage.

(1) Pack the device in an ESD protective bag with desiccant.
(2) Use the original Hitachi cardboard box and the cushioning materials or equivalent cushioning
structures to surround the above bag.
(3) Never stack or package drives next to each other with at the proper cushion material separating
them.
(4) Indicate which side is upside or downside on the exterior of the package box and attach notices
requesting careful treatment and preventing the box from being turned upside down.
(5) Prevent excessive pressure from being applied on the top and bottom of the drive(top cover and
PCBA side) when packing, unpacking, and transporting.
(6) Remember, mishandling of a drive can void the drive’s warranty.

Prevent humidity when the drive is packed in a box.

Caution

Caution

K6602637
Rev.3

02.27.01

- 24 -

5.2 Handling

Mount the HDD with the screws according to the following instructions to optimize the
performance.

It is necessary to prevent vibration, shock, and static electricity to the dr ive because it will damage the
precision parts. In particular, prevent vibration or shock generated by dropping, knocking over, or hitting the
drive. Also, avoid touching the electrical components directly, which can discharge electrostatic energy and
damage the drive.

(Dropping) (Knocking over)

(Hitting) (Hitting)

Figure 5-1

Caution

K6602637
Rev.3

02.27.01

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6.0 Interface

6.1 Power Interface

Only +5VDC power is applied to this Device. Figures 6-1 and 6-2 show power current transitions
after turning on the power.

Typical Spin-up Current Transition

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0
0123456

7

Time (sec)

Current of
+5V power



(A)

Figure 6-1 Power Current Transition

Typical Spin-up Current Transition with Retry

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0
0

123456

7

Time (sec)

Current of
+5V power



(A)

8

9

10 11

121413

Retry

Figure 6-2 Power Current Transition with retries

K6602637
Rev.3

02.27.01

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6.2 Physical Interface

6.2.1 Connector

This device has a 2mm pitch interface connector which contains a power line. The connector
location is shown in Figure 6-3.

Table 6.1 Connector Parts List

Name Parts number of recommended type

Interface cable side

Signal Connector

Receptacle

Molex 87259-4413 or equivalent

Cable AWG#28 or equivalent

Drive side

Signal Connector

Plug

Molex 87400-5005 or equivalent

Figure 6-3 Connector Location

2 mm

PIN44

PIN20 REMOVED(KEY)

PINS REMOVED(KEY)

PIN1

3.86 mm

2 mm

K6602637
Rev.3

02.27.01

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

6.2.2 Connector Pin Assignment

Figure 6-4 Pin Assignments

JUMPER0

JUMPER2

KEY(Removed)

DD7

RESET-

DD6

DD5

DD4

DD3

DD2

DD1

DD0

GND

DMARQ

DIOW-

DIOR-

IORDY

DMACK-

DA1

DA0

CS0-

DASP-

5VDC(Logic)

GND(Logic)

A
C
E
1
3
5
7

9
11
13
15
17
19
21
23
25
27
29

31

33
35
37
39
41
43

B
D

F
2
4
6

8

10

12

14

18

16

20
22
24

28

32

26

30

34
36

38

40
42

44

JUMPER1

JUMPER3

KEY(Removed)
GND
DD8
DD9
DD10
DD11
DD12
DD13

DD14
DD15
KEY(Removed)
GND
GND
GND
CSEL
GND

IOCS16­PDIAG­DA2

CS1­GND(Motor)

5VDC(Motor)
Reserved

INTRQ

PCB

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Rev.3

02.27.01

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6.2.3 Description of the Interface Signals

The interface is an ATA(IDE) interface. Reserved pins should be left unconnected. The signal names
and the pin numbers are shown in Figure 6-4 and Table 6.2. Table 6.2 shows signal definitions.
"I" of I/O type represents an input signal from the device and "O" represents an output signal from the
device.

Table 6.2 Signal List(1/3)

Signal name Pin I/O type Description

RESET- 1 I This is a reset signal output from the host system and to be

used for interface logic circuit.

DD0-DD15 3-18 I/O This is a 16-bit bi-directional data bus. The lower 8 bits are

used for register access other than data register.

DIOW- 23 I The rising edge of this Write Strobe signal clocks data from

the host data bus into a register on the device.

STOP

*1

Assertion of this signal by the host during an Ultra DMA burst
signals the termination of the Ultra DMA burst.

DIOR- 25 I Activating this Read Strobe signal enables data from a register

on the device to be clocked onto the host data bus. The rising
edge of this signal latches data at the host.

HDMARDY-

*1

This signal is a flow control signal for Ultra DMA Read.
Host asserts this signal, and indicates that the host is ready t o
receive Ultra DMA Read data .

HSTROBE

*1

This signal is Write data strobe signal from the host for an
Ultra DMA Write. Both the rising and falling edge latch
the data from DD(15:0) into the device.

IORDY 27 O This signal is used to temporarily stop the host register access

(read or write) when the device is not ready to respond t o a
data transfer request.

DDMARDY-

*1

This signal is a flow control signal for Ultra DMA Write. Device
asserts this signal, and indicates that the device is ready t o
receive Ultra DMA Write data .

DSTROBE

*1

This signal is the data in strobe signal from the device for an
Ultra DMA Read. Both the rising and falling edge latch
the data from DD(15:0) into the host.

CSEL 28 I This signal is used to configure a device as either DRIVE 0 or

DRIVE1 when CSEL mode is selected.
This signal is pulled up inside the drive.

CSEL

GND

OPEN

0
1

Drive address



*1

: Signal name in Ultra DMA mode

K6602637
Rev.3

02.27.01

- 29 -

Table 6.2 Signal List(2/3)

Signal name Pin I/O type Description

INTRQ 31 O This is an interrupt signal for the host system. This signal is

asserted by a selected device when the nIEN bit in the Device
Control Register is "0". In other cases, this signal should be a high
impedance state.

IOCS16- 32 O This signal indicates to the host that the 16-bit data port has been

addressed and a 16-bit word can be read or written to the device.

DA0-2 33,35,36 I This is a register address signal from the host system.

PDIAG-:CBLID-

(*1)

34 I/O The PDIAG- signal is asserted by Device 1 to indicate to Device 0

that it has completed diagnostics. This signal is pulled up inside the
device.

The host may sample CBLID- after a power-on or hardware reset in
order to detect the presence or absence of an 80-conductor cable
assembly by performing the following steps:

a) The host shall wait until the power on or hardware reset

sequence is complete for all devices on the cable;

b) If Device 1 is present, the host should issue IDENTIFY DEVI CE

or IDENTIFY PACKET DEVICE and use the returned data to
determine that Device 1 is compliant with ATA-3 or subsequent
standards. Any device compliant with ATA-3 or subsequent
standards releases PDIAG- no later than after the first
command following a power on or hardware reset sequence.

If the host detects that CBLID- is connected to ground, an 80­conductor cable assembly is installed in the system. If the host
detects that this signal is not connected to ground, an 80-conductor
cable assembly is not installed in the system.

CS0- 37 I This device chip selection signal is used to select the Command

Block Registers from the host system.

CS1- 38 I This device chip selection signal is used to select the Control Block

Registers from the host system.

*1

: PDIAG-:CBLID- (Passed diagnostics: Cable assembly ty pe identifier

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Rev.3

02.27.01

- 30 -

Table 6.2 Signal List(3/3)

Signal name Pin I/O type Description

DASP- 39 I/O This signal indicates that a device is active or that Drive 1 is present

when the power is turned on.
Upon receipt of a command from the host, the device asserts this
signal. At command completion, the device de-asserts this signal.
However, When a sequential read command is received from the
host, the device does not assert this signal.

DMARQ 21 O The device shall assert this signal, used for DMA data transfers

between host and device, when it is ready t o t r ansfer dat a.

DMACK- 29 I The host in response to DMARQ to either acknowledge that data

has been accepted, or that data is available shall use this signal.

JUMPER0,1,2 PIN-A,B,D - See Sec. 4.3 “ Drive Address Setting (Drive 0/Drive 1)” for the detail.

The I/O signal levels are as follows.

(1) Input signal High level +2.0V to Vcc+0.5V

Low level -0.5V to +0.8V

(2) Output signal High level +2.4V to +5.25V or an open circuit
Low level +0.4V or less (IOL=2mA), +0.5V or less (IOL=12mA)
Note) The I/F cable should be no longer than 50cm(20 inches) including the circuit pattern length in the host

system. If the cable length is not within this specification, it may cause fact ional degradat ions or some
errors.