HIT HN58S256AT-15, HN58S256AT-20 Datasheet

HN58S256A Series
256 k EEPROM (32-kword × 8-bit)
ADE-203-692B (Z)
Rev. 2.0
Nov. 1997

Description

The Hitachi HN58S256A is a electrically erasable and programmable EEPROM’s organized as 32768­word × 8-bit employing advanced MNOS memory technology and CMOS process and circuitry technology. It also has a 64-byte page programming function to make the write operations faster.

Features

Single supply: 2.2 to 3.6 V
Access time: 150 ns (max)/200 ns (max)
Power dissipation:Active: 10 mW/MHz, (typ)Standby: 36 µW (max)
On-chip latches: address, data, CE, OE, WE
Automatic byte write: 15 ms (max)
Automatic page write (64 bytes): 15 ms (max)
Data polling and Toggle bit
Data protection circuit on power on/off
Conforms to JEDEC byte-wide standard
Reliable CMOS with MNOS cell technology
105 erase/write cycles (in page mode)
10 years data retention
Software data protection
Industrial versions (Temperatur range:–40 to 85˚C) are also available.
HN58S256A Series

Ordering Information

Type No. Access time Package
HN58S256AT-15 HN58S256AT-20

Pin Arrangement

A2 A1
A0 I/O0 I/O1 I/O2
V
SS
I/O3 I/O4 I/O5 I/O6 I/O7
CE
A10
150 ns 200 ns
15 16 17 18 19 20 21 22 23 24 25 26 27 28
28-pin plastic TSOP (TFP-28DB)
HN58S256AT Series
(Top view)
14 13 12 11 10
A3 A4 A5 A6 A7 A12
9
A14
8
V
7
CC
6
WE
5
A13 A8
4 3
A9
2
A11
1
OE

Pin Description

Pin name Function
A0 to A14 Address input I/O0 to I/O7 Data input/output
OE Output enable CE Chip enable WE Write enable
V
CC
V
SS
Power supply Ground

Block Diagram

V
CC
V
SS
OE
CE WE
High voltage generator
Control logic and timing
HN58S256A Series
to
I/O0 I/O7
I/O buffer and input latch
A0
to
Y decoder
Y gating
A5
Address buffer and latch
X decoder
Memory array
A6
to
A14
Data latch

Operation Table

Operation CE OE WE I/O
Read V Standby V Write V Deselect V
IL
IH
IL
IL
V ×* V V
IL
2
IH
IH
Write inhibit ××V
Data polling V
× V
IL
IL
V
IL
Notes: 1. Refer to the recommended DC operating condition.
2. × = Don’t care
V
IH
Dout × High-Z V
IL
V
IH
IH
Din
High-Z
× — V
IH
Data out (I/O7)
HN58S256A Series

Absolute Maximum Ratings

Parameter Symbol Value Unit
Power supply voltage relative to V Input voltage relative to V Operationg temperature range*
SS
2
SS
V
CC
Vin –0.5*1 to +4.6* Topr 0 to +70 °C
Storage temperature range Tstg –55 to +125 °C Notes: 1. Vin min = –3.0 V for pulse width 50 ns
2. Including electrical characteristics and data retention
3. Should not exceed V
+ 1.0 V.
CC

Recommended DC Operating Conditions

Parameter Symbol Min Typ Max Unit
Supply voltage V
Input voltage V
Operating temperature Topr 0 70 °C Notes: 1. VIL min: –1.0 V for pulse width 50 ns.
2. V
max: VCC + 1.0 V for pulse width 50 ns.
IH
CC
V
SS
IL
V
IH
–0.6 to +4.6 V
3
V
2.2 3.0 3.6 V 000V
1
–0.3*
0.4 V
Vcc × 0.7 VCC + 0.3*2V

DC Characteristics (Ta = 0 to +70 °C, VCC = 2.2 to 3.6 V)

Parameter Symbol Min Typ Max Unit Test conditions
Input leakage current I Output leakage current I
Standby VCC current I
Operating VCC current I
Output low voltage V Output high voltage V
LI
LO
CC1
I
CC2
CC3
OL
OH
——2 µAVCC = 3.6 V, Vin = 0 to 3.6 V ——2 µAVCC = 3.6 V, Vout = 3.6/0.4 V,
CE = V ——10µA CE = V 500 µA CE = V
, Vin = 0 to 3.6 V
IH
CC
IH
8 mA Iout = 0 mA, Duty = 100%,
Cycle = 1 µs at V — 12 mA Iout = 0 mA, Duty = 100%,
Cycle = 150 ns at V — 0.4 V IOL = 1.0 mA VCC × 0.8 V IOH = –100 µA
= 3.6 V
CC
CC
= 3.6 V
HN58S256A Series

Capacitance (Ta = 25°C, f = 1 MHz)

Parameter Symbol Min Typ Max Unit Test conditions
Input capacitance* Output capacitance*
1
1
Note: 1. This parameter is periodically sampled and not 100% tested.

AC Characteristics (Ta = 0 to +70 °C, VCC = 2.2 to 3.6 V)

Test Conditions
Input pulse levels: 0.4 V to 1.9 V (VCC 2.7V), 0.4V to 2.4 V (VCC > 2.7 V)
Input rise and fall time: 5 ns
Input timing reference levels: 0.8, 1.8 V
Output load: 1TTL Gate +100 pF
Output reference levels: 1.1 V, 1.1 V (VCC 2.7V),1.5 V, 1.5 V (VCC > 2.7 V)
Read Cycle
Cin 6 pF Vin = 0 V Cout 12 pF Vout = 0 V
HN58S256A
-15 -20
Parameter Symbol Min Max Min Max Unit Test conditions
Address to output delay t
CE to output delay t OE to output delay t
Address to output hold t OE (CE) high to output float*1t
ACC
CE
OE
OH
DF
150 200 ns CE = OE = VIL, WE = V — 150 200 ns OE = VIL, WE = V 10 80 10 100 ns CE = VIL, WE = V 0—0—ns CE = OE = VIL, WE = V 0 100 0 100 ns CE = VIL, WE = V
IH
IH
IH
IH
IH
HN58S256A Series
Write Cycle
Parameter Symbol Min*2Typ Max Unit Test conditions Address setup time t Address hold time t
CE to write setup time (WE controlled) t CE hold time (WE controlled) t WE to write setup time (CE controlled) t WE hold time (CE controlled) t OE to write setup time t OE hold time t
Data setup time t Data hold time t
WE pulse width (WE controlled) t CE pulse width (CE controlled) t
Data latch time t Byte load cycle t Byte load window t Write cycle time t Write start time t
AS
AH
CS
CH
WS
WH
OES
OEH
DS
DH
WP
CW
DL
BLC
BL
WC
DW
Notes: 1. tDF is defined as the time at which the outputs achieve the open circuit conditions and are no
longer driven.
2. Use this device in longer cycle than this value.
3. t
must be longer than this value unless polling techniques is used. This device automatically
WC
completes the internal write operation within this value.
4. Next read or write operation can be initiated after t
5. A6 through A14 are page addresses and these addresses are latched at the first falling edge of WE.
6. A6 through A14 are page addresses and these addresses are latched at the first falling edge of CE.
7. See AC characteristics.
0 ——ns 150 ns 0 ——ns 0 ——ns 0 ——ns 0 ——ns 0 ——ns 0 ——ns 150 ns 0 ——ns 200 ns 200 ns 200 ns
0.4 30 µs 100 µs — 15*
4
0*
——ns
if polling techniques is used.
DW
3
ms
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