HIT HN58C256AFP-10, HN58C256AFP-85, HN58C256AP-10, HN58C256AP-85, HN58C256AT-10 Datasheet

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HN58C256A Series HN58C257A Series
256k EEPROM (32-kword × 8-bit)
Ready/Busy and RES function (HN58C257A)
ADE-203-410D (Z)
Rev. 4.0
Oct. 24, 1997

Description

The Hitachi HN58C256A and HN58C257A are electrically erasable and programmable ROMs organized as 32768-word × 8-bit. They have realized high speed low power consumption and high reliability by employing advanced MNOS memory technology and CMOS process and circuitry technology. They also have a 64-byte page programming function to make their write operations faster.

Features

Single 5 V supply: 5 V ±10%
Access time: 85 ns/100 ns (max)
Power dissipationActive: 20 mW/MHz, (typ)Standby: 110 µW (max)
On-chip latches: address, data, CE, OE, WE
Automatic byte write: 10 ms max
Automatic page write (64 bytes): 10 ms max
Ready/Busy (only the HN58C257A series)
Data polling and Toggle bit
Data protection circuit on power on/off
Conforms to JEDEC byte-wide standard
Reliable CMOS with MNOS cell technology
105 erase/write cycles (in page mode)
10 years data retention
Software data protection
Write protection by RES pin (only the HN58C257A series)
Industrial versions (Temperatur range: – 20 to 85˚C and – 40 to 85˚C) are also available.
HN58C256A Series, HN58C257A Series

Ordering Information

Type No. Access time Package
HN58C256AP-85 HN58C256AP-10
HN58C256AFP-85 HN58C256AFP-10
HN58C256AT-85 HN58C256AT-10
HN58C257AT-85 HN58C257AT-10

Pin Arrangement

85 ns 100 ns
85 ns 100 ns
85 ns 100 ns
85 ns 100 ns
600 mil 28-pin plastic DIP (DP-28)
400 mil 28-pin plastic SOP (FP-28D)
28-pin plastic TSOP (TFP-28DB)
8 × 14 mm2 32-pin plastic TSOP (TFP-32DA)
HN58C256AP/AFP Series
A14
1
A12
2
A7
3
A6
4
A5
5
A4
6
A3
7
A2
8
A1
9
A0
10
I/O0
11
I/O1
12
I/O2
13
V
14
SS
(Top view)
28 27 26 25 24 23 22 21 20 19 18 17 16 15
V
CC
WE
A13 A8 A9 A11
OE
A10
CE
I/O7 I/O6 I/O5 I/O4 I/O3
A2 A1
A0 I/O0 I/O1 I/O2
V
SS
I/O3 I/O4 I/O5 I/O6 I/O7
CE
A10
A2
A1
A0
NC I/O0 I/O1 I/O2
V
SS
I/O3 I/O4 I/O5 I/O6 I/O7
NC
CE
A10
15 16 17 18 19 20 21 22 23 24 25 26 27 28
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
HN58C256AT Series
(Top view)
HN58C257AT Series
(Top view)
14 13 12 11 10
16 15 14 13 12 11 10
9 8 7 6 5 4 3 2 1
9 8 7 6 5 4 3 2 1
A3 A4 A5 A6 A7 A12 A14 V
CC
WE
A13 A8 A9 A11
OE
A3 A4 A5 A6 A7 A12 A14 RDY/Busy V
CC
RES WE
A13 A8 A9 A11
OE
2
HN58C256A Series, HN58C257A Series

Pin Description

Pin name Function
A0 to A14 Address input I/O0 to I/O7 Data input/output
OE Output enable CE Chip enable WE Write enable
V
CC
V
SS
RDY/Busy* RES*
1
1
NC No connection Note: 1. This function is supported by only the HN58C257A series.

Block Diagram

Power supply Ground Ready busy Reset
Note: This function is supported by only the HN58C257A series.
V
CC
V
SS
RES
OE
CE WE
RES
A0
to
A5
A6
to
A14
1
*
1
*
High voltage generator
Control logic and timing
Address buffer and latch
Y decoder
X decoder
to
I/O0 I/O7
I/O buffer and input latch
Y gating
Memory array
RDY/Busy
1
*
Data latch
3
HN58C256A Series, HN58C257A Series

Operation Table

Operation CE OE WE RES* Read V Standby V Write V Deselect V
IL
IH
IL
IL
V ×* V V
IL
2
IH
IH
V
IH
××High-Z High-Z V
IL
V
IH
VH*
V V
1
H
H
3
RDY/Busy* High-Z Dout
High-Z to V High-Z High-Z
3
I/O
OL
Din
Write inhibit ××VIH× ——
Data polling V
×V
IL
IL
V
IL
××—— V
IH
V
H
V
OL
Dout (I/O7)
Program reset ×××VILHigh-Z High-Z Notes: 1. Refer to the recommended DC operating condition.
2. × : Don’t care
3. This function is supported by only the HN58C257A series.

Absolute Maximum Ratings

Parameter Symbol Value Unit
Power supply voltage rerative to V Input voltage rerative to V Operationg temperature range*
SS
2
SS
V
CC
Vin –0.5*1 to +7.0* Topr 0 to +70 °C
Storage temperature range Tstg –55 to +125 °C Notes: 1. Vin min = –3.0 V for pulse width ≤ 50 ns
2. Including electrical characteristics and data retention
3. Should not exceed V
+ 1 V.
CC
–0.6 to +7.0 V
3
V
4
HN58C256A Series, HN58C257A Series

Recommended DC Operating Conditions

Parameter Symbol Min Typ Max Unit
Supply voltage V
Input voltage V
V
V VH*
CC
SS
IL
IH
3
Operating temperature Topr 0 70 °C Notes: 1. VIL min: –1.0 V for pulse width 50 ns.
2. V
max: VCC + 1.0 V for pulse width 50 ns.
IH
3. This function is supported by only the HN58C257A series.

DC Characteristics (Ta = 0 to +70°C, VCC = 5.0 V±10%)

Parameter Symbol Min Typ Max Unit Test conditions
Input leakage current I Output leakage current I Standby VCC current I
Operating VCC current I
Output low voltage V Output high voltage V
LI
LO
CC1
I
CC2
CC3
OL
OH
Note: 1. ILI on RES = 100 µA max (only the HN58C257A series)
——2* ——2 µAVCC = 5.5 V, Vout = 5.5/0.4 V ——20µACE = V ——1 mACE = V 12 mA Iout = 0 mA, Duty = 100%,
30 mA Iout = 0 mA, Duty = 100%,
0.4 V IOL = 2.1 mA
2.4 V IOH = –400 µA
4.5 5.0 5.5 V 000V
1
–0.3*
0.8 V
2.2 VCC + 0.3*2V VCC – 0.5 VCC + 1.0 V
1
µAVCC = 5.5 V, Vin = 5.5 V
CC
IH
Cycle = 1 µs at V
Cycle = 85 ns at V
= 5.5 V
CC
= 5.5 V
CC

Capacitance (Ta = +25°C, f = 1 MHz)

Parameter Symbol Min Typ Max Unit Test conditions
Input capacitance* Output capacitance*
1
1
Note: 1. This parameter is periodically sampled and not 100% tested.
Cin 6 pF Vin = 0 V Cout 12 pF Vout = 0 V
5
HN58C256A Series, HN58C257A Series

AC Characteristics (Ta = 0 to +70°C, VCC = 5 V±10%)

Test Conditions
Input pulse levels: 0.4 V to 3.0 V
0 V to VCC (RES pin*2)
Input rise and fall time: ≤ 5 ns
Input timing reference levels: 0.8, 2.0 V
Output load: 1TTL Gate +100 pF
Output reference levels: 1.5 V, 1.5 V
Read Cycle
HN58C256A/HN58C257A
-85 -10
Parameter Symbol Min Max Min Max Unit Test conditions
Address to output delay t
CE to output delay t OE to output delay t
Address to output hold t
OE (CE) high to output float*1t RES low to output float*
RES to output delay*
1, 2
2
ACC
CE
OE
OH
DF
t
DFR
t
RR
85 100 ns CE = OE = VIL,
WE = V
IH
85 100 ns OE = VIL, WE = V 10 40 10 50 ns CE = VIL, WE = V 0—0—nsCE = OE = VIL,
WE = V
IH
0 40 0 40 ns CE = VIL, WE = V 0 350 0 350 ns CE = OE = VIL,
WE = V
IH
0 450 0 450 ns CE = OE = VIL,
WE = V
IH
IH
IH
IH
6
HN58C256A Series, HN58C257A Series
Write Cycle
Parameter Symbol Min*3Typ Max Unit Test conditions
Address setup time t Address hold time t
CE to write setup time (WE controlled) t CE hold time (WE controlled) t WE to write setup time (CE controlled) t WE hold time (CE controlled) t OE to write setup time t OE hold time t
Data setup time t Data hold time t
WE pulse width (WE controlled) t CE pulse width (CE controlled) t
Data latch time t Byte load cycle t Byte load window t Write cycle time t Time to device busy t Write start time t Reset protect time* Reset high time*
Notes: 1. tDF and t
2
2, 6
are defined as the time at which the outputs achieve the open circuit conditions and are
DFR
no longer driven.
2. This function is supported by only the HN58C257A series.
3. Use this device in longer cycle than this value.
4. t
must be longer than this value unless polling techniques or RDY/Busy (only the HN58C257A
WC
series) are used. This device automatically completes the internal write operation within this value.
5. Next read or write operation can be initiated after t HN58C257A series) are used.
6. This parameter is sampled and not 100% tested.
7. A6 through A14 are page address and these addresses are latched at the first falling edge of WE.
8. A6 through A14 are page address and these addresses are latched at the first falling edge of CE.
9. See AC read characteristics.
AS
AH
CS
CH
WS
WH
OES
OEH
DS
DH
WP
CW
DL
BLC
BL
WC
DB
DW
t
RP
t
RES
0 ——ns 50——ns 0 ——ns 0 ——ns 0 ——ns 0 ——ns 0 ——ns 0 ——ns 50——ns 0 ——ns 100 ns 100 ns 50——ns
0.2 30 µs 100 µs — 10*
4
ms
120 ns
5
0*
——ns 100 µs 1——µs
if polling techniques or RDY/Busy (only the
DW
7
HN58C256A Series, HN58C257A Series

Read Timing Waveform

Address
t
ACC
CE
OE
WE
Data Out
2
RES *
High
t
t
CE
t
OE
OH
t
DF
Data out valid
t
RR
t
DFR
8
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