HIT HM62W8511HLJP-12, HM62W8511HLJP-15, HM62W8511HJP-12, HM62W8511HJP-15 Datasheet

HM62W8511H Series
4M High Speed SRAM (512-kword × 8-bit)
ADE-203-750D (Z)
Rev. 1.0
Sep. 15, 1998

Description

The HM62W8511H is a 4-Mbit high speed static RAM organized 512-kword × 8-bit. It has realized high speed access time by employing CMOS process (4-transistor + 2-poly resistor memory cell) and high speed circuit designing technology. It is most appropriate for the application which requires high speed, high density memory and wide bit width configuration, such as cache and buffer memory in system. The HM62W8511H is packaged in 400-mil 36-pin SOJ for high density surface mounting.

Features

Single supply : 3.3 V ± 0.3 V
Access time 12/15 ns (max)
Completely static memoryNo clock or timing strobe required
Equal access and cycle times
Directly TTL compatibleAll inputs and outputs
Operating current : 150/130 mA (max)
TTL standby current : 60/50 mA (max)
CMOS standby current : 5 mA (max)
: 1 mA (max) (L-version)
Data retension current : 0.6 mA (max) (L-version)
Data retension voltage : 2 V (min) (L-version)
Center VCC and VSS type pinout
HM62W8511H Series

Ordering Information

Type No. Access time Package
HM62W8511HJP-12 HM62W8511HJP-15
HM62W8511HLJP-12 HM62W8511HLJP-15

Pin Arrangement

12 ns 15 ns
12 ns 15 ns
HM62W8511HJP/HLJP Series
400-mil 36-pin plastic SOJ (CP-36D)
A0 A1 A2 A3
A4 CS I/O1 I/O2 V
CC
V
SS
I/O3 I/O4 WE
A5 A6 A7 A8 A9
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
(T op Vie w)
36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19
NC A18 A17 A16 A15
OE
I/O8 I/O7 V
SS
V
CC
I/O6 I/O5 A14 A13 A12 A11 A10 NC
2

Pin Description

Pin name Function
A0 to A18 Address input I/O1 to I/O8 Data input/output
CS Chip select OE Output enable WE Write enable
V
CC
V
SS
Power supply Ground
NC No connection

Block Diagram

(LSB)
A1
A17
A7 A11 A16
A2
A6
A5
(MSB)
Row
decoder
Memory matrix
256 rows × 8 columns ×
256 blocks × 8 bit
(4,194,304 bits)
HM62W8511H Series
V
CC
V
SS
I/O1
. . .
I/O8
WE CS
OE
CS
CS
Input
data
control
Column I/O
Column decoder
A10 A8 A9 A12 A13 A14 A0 A18 A15 A3 A4
(LSB)
CS
(MSB)
3
HM62W8511H Series

Operation Table

CS OE WE Mode VCC current I/O Ref. cycle
H ××Standby I L H H Output disable I L L H Read I L H L Write I L L L Write I
, I
SB
SB1
CC
CC
CC
CC
Note: ×: H or L

Absolute Maximum Ratings

Parameter Symbol Value Unit
Supply voltage relative to V Voltage on any pin relative to V
SS
SS
Power dissipation P Operating temperature Topr 0 to +70 °C Storage temperature Tstg –55 to +125 °C Storage temperature under bias Tbias –10 to +85 °C
Notes: 1. VT (min) = –2.0 V for pulse width (under shoot) 8 ns
2. V
(max) = VCC+2.0 V for pulse width (over shoot) 8 ns
T
V
CC
V
T
T
High-Z — High-Z — Dout Read cycle (1) to (3) Din Write cycle (1) Din Write cycle (2)
–0.5 to +4.6 V –0.5*1 to VCC+0.5*
2
V
1.0 W

Recommended DC Operating Conditions (Ta = 0 to +70°C)

Parameter Symbol Min Typ Max Unit
3
Supply voltage V
Input voltage V
CC
VSS*
IH
V
IL
*
4
Notes: 1. VIL (min) = –2.0 V for pulse width (under shoot) 8 ns
2. V
(max) = VCC+2.0 V for pulse width (over shoot) 8 ns
IH
3. The supply voltage with all V
4. The supply voltage with all V
4
3.0 3.3 3.6 V 000V
2.2 VCC + 0.5*
1
–0.5*
pins must be on the same level.
CC
pins must be on the same level.
SS
0.8 V
2
V
HM62W8511H Series

DC Characteristics (Ta = 0 to +70°C, VCC = 3.3 V ± 0.3 V, VSS = 0V)

Parameter Symbol Min Typ*
Input leakage current II
I——2 µA Vin = VSS to V
LI
1
Max Unit Test conditions
Output leakage current IILOI——2 µA Vin = VSS to V Operation power
supply current
12 ns cycle I
CC
150 mA Min cycle
CS = V
IL
, lout = 0 mA
Other inputs = V
Standby power supply current
15 ns cycle I 12 ns cycle I
CC
SB
130 — 60 mA Min cycle
CS = V
IH
,
Other inputs = V
15 ns cycle I
SB
I
SB1
——50 — 0.05 5 mA f = 0 MHz
V
CS VCC - 0.2 V,
CC
(1) 0 V Vin 0.2 V or (2) V
Vin VCC - 0.2 V
CC
Output voltage V
2
—*
OL
V
OH
0.4 V IOL = 8 mA
2.4 V IOH = –4 mA
0.05*21.0*
2
Notes: 1. Typical values are at VCC = 3.3 V, Ta = +25°C and not guaranteed.
2. This characteristics is guaranteed only for L-version.
CC
CC
IH/VIL
IH/VIL

Capacitance (Ta = +25°C, f = 1.0 MHz)

Parameter Symbol Min Typ Max Unit Test conditions
Input capacitance*
1
Input/output capacitance* Note: 1. This parameter is sampled and not 100% tested.
Cin 6 pF Vin = 0 V
1
C
I/O
——8 pFV
= 0 V
I/O
5
HM62W8511H Series

AC Characteristics (Ta = 0 to +70°C, VCC = 3.3 V ± 0.3 V, unless otherwise noted.)

Test Conditions
Input pulse levels: 3.0 V/0.0 V
Input rise and fall time: 3 ns
Input and output timing reference levels: 1.5 V
Output load: See figures (Including scope and jig)
3.3 V
Dout
Zo=50
RL=50
Dout
353
5 pF
1.5 V
319
Output load (A)
(for t
CLZ
Output load (B)
, t
, t
OLZ
CHZ
, t
, t
OHZ
, and tOW)
WHZ
Read Cycle
HM62W8511H
-12 -15
Parameter Symbol Min Max Min Max Unit Notes
Read cycle time t Address access time t Chip select access time t Output enable to outpput valid t Output hold from address change t Chip select to output in low-Z t Output enable to output in low-Z t Chip deselect to output in high-Z t Output disable to output in high-Z t
RC
AA
ACS
OE
OH
CLZ
OLZ
CHZ
OHZ
12 15 ns — 12 15 ns — 12 15 ns —6 —7 ns 3—3—ns 3—3—ns1 0—0—ns1 —6 —7 ns1 —6 —7 ns1
6
HM62W8511H Series
Write Cycle
HM62W8511H
-12 -15
Parameter Symbol Min Max Min Max Unit Notes
Write cycle time t Address valid to end of write t Chip select to end of write t Write pulse width t Address setup time t Write recovery time t Data to write time overlap t Data hold from write time t Write disable to output in low-Z t Output disable to output in high-Z t Write enable to output in high-Z t
WC
AW
CW
WP
AS
WR
DW
DH
OW
OHZ
WHZ
Note: 1. Transition is measured ±200 mV from steady voltage with Load (B). This parameter is sampled
and not 100% tested.
2. Address should be valid prior to or coincident with CS transition low.
3. WE and/or CS must be high during address transition time.
4. if CS and OE are low during this period, I/O pins are in the output state. Then, the data input signals of opposite phase to the outputs must not be applied to them.
5. If the CS low transition occurs simultaneously with the WE low transition or after the WE transition, output remains a high impedance state.
6. t
is measured from the latest address transition to the later of CS or WE going low.
AS
7. t
is measured from the earlier of CS or WE going high to the first address transition.
WR
8. A write occurs during the overlap of a low CS and a low WE. A write begins at the latest transition among CS going low and WE going low. A write ends at the earliest transition among CS going high and WE going high. t
9. t
is measured from the later of CS going low to the the end of write.
CW
is measured from the beginnig of write to the end of write.
WP
12 15 ns 8 10 ns 8—10—ns9 8—10—ns8 0—0—ns6 0—0—ns7 6—7—ns 0—0—ns 3—3—ns1 —6 —7 ns1 —6 —7 ns1
7
HM62W8511H Series

Timing Waveforms

Read Timing Waveform (1) (WE = VIH)

t
RC
Address
Valid address
t
AA
t
ACS
CS
t
OE
OE
t
OLZ
t
CLZ
Dout
High Impedance

Read Timing Waveform (2) (WE = VIH, CS = VIL, OE = VIL)

t
RC
Address
t
OH
Valid address
t
AA
t
CHZ
t
OHZ
Valid data
t
OH
t
OH
Dout
Valid data
8
HM62W8511H Series
Read Timing Waveform (3) (WE = VIH, CS = VIL, OE = VIL)*
t
RC
CS
t
ACS
Dout
t
CLZ
High Impedance

Write Timing Waveform (1) (WE Controlled)

t
WC
Address
OE
Valid address
t
AW
2
Valid data
t
WR
t
CHZ
High Impedance
CS*
WE*
Dout
Din
t
CW
3
t
AS
3
t
OHZ
*
t
WP
High impedance*
4
5
t
DW
Valid data
t
DH
4
*
9
HM62W8511H Series

Write Timing Waveform (2) (CS Controlled)

t
WC
Address
3
CS *
3
WE *
Dout
Din
Valid address
t
CW
t
AW
t
WP
t
AS
t
WHZ
High impedance*
t
DW
4
*
Valid data
t
t
WR
t
DH
OW
5
4
*
10
HM62W8511H Series

Low VCC Data Retention Characteristics (Ta = 0 to +70°C)

This characteristics is guaranteed only for L-version.
Parameter Symbol Min Typ*1Max Unit Test conditions
for data retention V
V
CC
Data retention current I
Chip deselect to data
CCDR
t
CDR
DR
retention time Operation recovery time t
R
Note: 1. Typical values are at VCC = 3.0 V, Ta = +25˚C, and not guaranteed.

Low VCC Data Retention Timing Waveform

2.0 V VCC CS VCC – 0.2 V (1) 0 V Vin 0.2 V or (2) V
Vin VCC – 0.2 V
CC
40 600 µAVCC = 3 V, VCC CS VCC – 0.2 V
(1) 0 V Vin 0.2 V or (2) V
Vin VCC – 0.2 V
CC
0 ns See retention waveform
5 ——ms
V
CC
3.0 V
V
DR
2.2 V
CS
0 V
t
CDR
Data retention mode
VCC CS VCC – 0.2 V
t
R
11
HM62W8511H Series

Package Dimensions

HM62W8511HJP/HLJP Series (CP-36D)

23.25
23.62 Max
36
1
0.74
19
18
10.16 ± 0.13
Unit: mm
11.18 ± 0.13
1.30 Max
0.43 ± 0.10
0.41 ± 0.08
Dimension including the plating thickness
Base material dimension
0.10
1.27
3.50 ± 0.26
+0.25
–0.17
0.80
Hitachi Code JEDEC EIAJ Weight
9.40 ± 0.25
(reference value)
2.85 ± 0.12
CP-36D Conforms Conforms
1.4 g
12
HM62W8511H Series
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
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Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan.
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