The HM62W8511H is a 4-Mbit high speed static RAM organized 512-kword × 8-bit. It has realized high
speed access time by employing CMOS process (4-transistor + 2-poly resistor memory cell) and high speed
circuit designing technology. It is most appropriate for the application which requires high speed, high
density memory and wide bit width configuration, such as cache and buffer memory in system. The
HM62W8511H is packaged in 400-mil 36-pin SOJ for high density surface mounting.
Features
• Single supply : 3.3 V ± 0.3 V
• Access time 12/15 ns (max)
• Completely static memory
No clock or timing strobe required
• Equal access and cycle times
• Directly TTL compatible
All inputs and outputs
• Operating current : 150/130 mA (max)
• TTL standby current : 60/50 mA (max)
• CMOS standby current : 5 mA (max)
: 1 mA (max) (L-version)
• Data retension current : 0.6 mA (max) (L-version)
Recommended DC Operating Conditions (Ta = 0 to +70°C)
ParameterSymbolMinTypMaxUnit
3
Supply voltageV
Input voltageV
CC
VSS*
IH
V
IL
*
4
Notes: 1. VIL (min) = –2.0 V for pulse width (under shoot) ≤ 8 ns
2. V
(max) = VCC+2.0 V for pulse width (over shoot)≤ 8 ns
IH
3. The supply voltage with all V
4. The supply voltage with all V
4
3.03.33.6V
000V
2.2—VCC + 0.5*
1
–0.5*
pins must be on the same level.
CC
pins must be on the same level.
SS
—0.8V
2
V
HM62W8511H Series
DC Characteristics (Ta = 0 to +70°C, VCC = 3.3 V ± 0.3 V, VSS = 0V)
ParameterSymbol MinTyp*
Input leakage currentII
I——2 µAVin = VSS to V
LI
1
MaxUnitTest conditions
Output leakage currentIILOI——2 µAVin = VSS to V
Operation power
supply current
12 ns cycle I
CC
——150mAMin cycle
CS = V
IL
, lout = 0 mA
Other inputs = V
Standby power supply
current
15 ns cycle I
12 ns cycle I
CC
SB
——130
——60mAMin cycle
CS = V
IH
,
Other inputs = V
15 ns cycle I
SB
I
SB1
——50
—0.055mAf = 0 MHz
V
≥CS≥ VCC - 0.2 V,
CC
(1) 0 V ≤ Vin ≤ 0.2 V or
(2) V
≥ Vin ≥ VCC - 0.2 V
CC
Output voltageV
2
—*
OL
V
OH
——0.4VIOL = 8 mA
2.4——VIOH = –4 mA
0.05*21.0*
2
Notes: 1. Typical values are at VCC = 3.3 V, Ta = +25°C and not guaranteed.
2. This characteristics is guaranteed only for L-version.
CC
CC
IH/VIL
IH/VIL
Capacitance (Ta = +25°C, f = 1.0 MHz)
ParameterSymbolMinTypMaxUnitTest conditions
Input capacitance*
1
Input/output capacitance*
Note: 1. This parameter is sampled and not 100% tested.
Cin——6pFVin = 0 V
1
C
I/O
——8 pFV
= 0 V
I/O
5
HM62W8511H Series
AC Characteristics (Ta = 0 to +70°C, VCC = 3.3 V ± 0.3 V, unless otherwise noted.)
Test Conditions
• Input pulse levels: 3.0 V/0.0 V
• Input rise and fall time: 3 ns
• Input and output timing reference levels: 1.5 V
• Output load: See figures (Including scope and jig)
3.3 V
Dout
Zo=50 Ω
RL=50 Ω
Dout
353Ω
5 pF
1.5 V
319Ω
Output load (A)
(for t
CLZ
Output load (B)
, t
, t
OLZ
CHZ
, t
, t
OHZ
, and tOW)
WHZ
Read Cycle
HM62W8511H
-12-15
ParameterSymbolMinMaxMinMaxUnitNotes
Read cycle timet
Address access timet
Chip select access timet
Output enable to outpput validt
Output hold from address changet
Chip select to output in low-Zt
Output enable to output in low-Zt
Chip deselect to output in high-Zt
Output disable to output in high-Zt
Write cycle timet
Address valid to end of writet
Chip select to end of writet
Write pulse widtht
Address setup timet
Write recovery timet
Data to write time overlapt
Data hold from write timet
Write disable to output in low-Zt
Output disable to output in high-Zt
Write enable to output in high-Zt
WC
AW
CW
WP
AS
WR
DW
DH
OW
OHZ
WHZ
Note: 1. Transition is measured ±200 mV from steady voltage with Load (B). This parameter is sampled
and not 100% tested.
2. Address should be valid prior to or coincident with CS transition low.
3. WE and/or CS must be high during address transition time.
4. if CS and OE are low during this period, I/O pins are in the output state. Then, the data input
signals of opposite phase to the outputs must not be applied to them.
5. If the CS low transition occurs simultaneously with the WE low transition or after the WE transition,
output remains a high impedance state.
6. t
is measured from the latest address transition to the later of CS or WE going low.
AS
7. t
is measured from the earlier of CS or WE going high to the first address transition.
WR
8. A write occurs during the overlap of a low CS and a low WE. A write begins at the latest transition
among CS going low and WE going low. A write ends at the earliest transition among CS going
high and WE going high. t
9. t
is measured from the later of CS going low to the the end of write.
CW
is measured from the beginnig of write to the end of write.
Low VCC Data Retention Characteristics (Ta = 0 to +70°C)
This characteristics is guaranteed only for L-version.
ParameterSymbolMinTyp*1MaxUnitTest conditions
for data retentionV
V
CC
Data retention currentI
Chip deselect to data
CCDR
t
CDR
DR
retention time
Operation recovery timet
R
Note: 1. Typical values are at VCC = 3.0 V, Ta = +25˚C, and not guaranteed.
Low VCC Data Retention Timing Waveform
2.0——VVCC ≥CS≥ VCC – 0.2 V
(1) 0 V ≤ Vin ≤ 0.2 V or
(2) V
≥ Vin ≥ VCC – 0.2 V
CC
—40600µAVCC = 3 V, VCC ≥CS≥ VCC – 0.2 V
(1) 0 V ≤ Vin ≤ 0.2 V or
(2) V
≥ Vin ≥ VCC – 0.2 V
CC
0——nsSee retention waveform
5 ——ms
V
CC
3.0 V
V
DR
2.2 V
CS
0 V
t
CDR
Data retention mode
VCC ≥CS≥ VCC – 0.2 V
t
R
11
HM62W8511H Series
Package Dimensions
HM62W8511HJP/HLJP Series (CP-36D)
23.25
23.62 Max
36
1
0.74
19
18
10.16 ± 0.13
Unit: mm
11.18 ± 0.13
1.30 Max
0.43 ± 0.10
0.41 ± 0.08
Dimension including the plating thickness
Base material dimension
0.10
1.27
3.50 ± 0.26
+0.25
–0.17
0.80
Hitachi Code
JEDEC
EIAJ
Weight
9.40 ± 0.25
(reference value)
2.85 ± 0.12
CP-36D
Conforms
Conforms
1.4 g
12
HM62W8511H Series
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual
property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of
bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic,
safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for
maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and
other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the
guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or
failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the
equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage
due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & IC Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URLNorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
2000 Sierra Point Parkway
Brisbane, CA 94005-1897
Tel: <1> (800) 285-1601
Fax: <1> (303) 297-0447
Europe: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore): http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan): http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong): http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan: http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Europe GmbH
Electronic components Group
Dornacher Straße 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
13
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