HIT 2SK2736 Datasheet

Features
Low on-resistance
R
= 20 mtyp. (VGS = 10V, ID = 15 A)
4V gate drive devices.
High speed switching
Outline
2SK2736
Silicon N Channel DV–L MOS FET
High Speed Power Switching
ADE-208-544
1st. Edition
TO–220CFM
G
D
1
2
3
S
1. Gate
2. Drain
3. Source
2SK2736
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body to drain diode reverse drain current I Channel dissipation Pch*
DSS
GSS
D
D(pulse)
DR
1
*
2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Notes: 1. PW 10µs, duty cycle 1 %
2. Value at Tc = 25°C
30 V ±20 V 30 A 120 A 30 A 25 W
2
2SK2736
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown
V
(BR)DSS
30——V I
voltage Gate to source breakdown
V
(BR)GSS
±20——V I
voltage Zero gate voltege drain
I
DSS
——10µAV
current Gate to source leak current I Gate to source cutoff voltage V Static drain to source on state R resistance R
GSS
GS(off)
DS(on)
DS(on)
——±10 µAV
1.0 2.0 V ID = 1mA, VDS = 10V —2028mΩI
—3550mΩI Forward transfer admittance |yfs|1218—SI Input capacitance Ciss 750 pF VDS = 10V Output capacitance Coss 520 pF VGS = 0 Reverse transfer capacitance Crss 210 pF f = 1MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body to drain diode forward
V
d(on)
r
d(off)
f
DF
16 ns VGS = 10V, ID = 15A
260 ns RL = 0.67
—85—ns
—90—ns
1.0 V IF = 30A, VGS = 0 voltage
Body to drain diode reverse
t
rr
45 ns IF = 30A, VGS = 0 recovery time
Note: 1. Pulse test
= 10mA, VGS = 0
D
= ±100µA, VDS = 0
G
= 30 V, VGS = 0
DS
= ±16V, VDS = 0
GS
= 15A, VGS = 10V*
D
= 15A, VGS = 4V*
D
= 15A, VDS = 10V*
D
diF/ dt = 50A/µs
1
1
1
See characteristics curves of 2SK2684
3
Loading...
+ 4 hidden pages