This flowchart indicates the disassembly steps for the
cabinet parts, and the CBA in order to gain access to
item(s) to be serviced. When reassembling, follow the
steps in reverse order. Bend, route and dress the
cables as they were.
[14] Junction CBA
[20] Speaker(s)
[19] IR Sensor
CBA
[7] Jack Holder(D)
[8] Shield Box[15] Panel Holder
[9] Digital Sub CBA
[10] Digital Main
CBA Unit
[13] Inverter CBA
[4] Rear Cabinet
[5] Chassis Bracket
[17] LCD
Module Assembly
[21] Front Cabinet
[18] Function CBA
[1] Stand Base
Plate
[2] Stand Hinge[11] Jack Holder(A)
[3] Stand Cover[12] Jack CBA
[6] Power Supply
CBA
[16] T-CON CBA
2. Disassembly Method
Removal
Step/
Loc.
Part
No.
Stand Base
[1]
Plate
Stand
[2]
Hinge
Stand
[3]
Cover
Rear
[4]
Cabinet
Chassis
[5]
Bracket
Power
[6]
Supply
CBA
Jack
[7]
Holder(D)
[8]Shield BoxD2
Digital Sub
[9]
CBA
Remove/*Unhook/
Fig.
No.
Unlock/Release/
Unplug/Unclamp/
Note
Desolder
D1 4(S-1), 6(S-2), 5(S-3)---
D1 ------------------
D1 ------------------
D1 11(S-4), 4(S-5)---
D2 8(S-6)---
4(S-7), *CN101B,
D2
*CN501, *CN801,
D5
*CN802, *CN3010,
*CN3014
D2 (S-8), (S-9), (N-1)---
5(S-11), *CN3001,
Shield Plate
D2
*CN1---
D5
---
---
Removal
Step/
Loc.
No.
Part
Remove/*Unhook/
Fig.
No.
Unlock/Release/
Unplug/Unclamp/
Note
Desolder
Digital Main
[10]
CBA UnitD2D5
Jack
[11]
Holder(A)
[12] Jack CBA
*CN3002, *CN3018,
*CN3023
---
D3 (S-12)---
D3
5(S-13)---
D5
6(S-14), *CN1050,
[13]
Inverter
CBA
*CN1100, *CN1150,
D3
*CN1200, *CN1250,
D5
---
*CN1300
[14]
[15]
[16]
Junction
CBA
Panel
Holder
T-CON
CBA
D3
Desolder---
D5
D3 8(S-15), 2(S-16)---
6(S-17), Shield Plate,
D4
*CN9001, *CN9002,
D5
*CN9005
---
LCD
[17]
Module
D4 6(S-18)---
Assembly
[18]
[19]
Function
CBA
IR Sensor
CBA
D4
3(S-19)---
D5
D4
2(S-20)---
D5
[20] Speaker(s)D4 8(S-21)---
Front
[21]
↓
(1)
Cabinet
↓
(2)
D4 ------------------
↓
(3)
↓
(4)
(5)
↓
Note:
(1) Order of steps in procedure. When reassembling,
follow the steps in reverse order. These numbers
are also used as the Identification (location) No. of
parts in figures.
(2) Parts to be removed or installed.
(3) Fig. No. showing procedure of part location
(4) Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
N = Nut, L = Locking Tab, S = Screw,
CN = Connector
* = Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
(5) Refer to the following "Reference Notes in the
Table."
VanceBaldwin Electronics
[4] Rear Cabinet
(S-4)
(S-5)
(S-4)
(S-4)
(S-4)
(S-2)
(S-1)
(S-5)
(S-1)
(S-3)
(S-1)
(S-4)
(S-1)
[3] Stand Cover
[2] Stand Hinge
[1] Stand Base Plate
(S-3)
(S-2)
Fig. D1
VanceBaldwin Electronics
[6] Power Supply CBA
[10] Digital Main
CBA Unit
[9] Digital Sub
CBA
(S-7)
[7] Jack Holder(D)
(S-9)
(S-8)
(N-1)
(S-11)
(S-7)
[8] Shield Box
Shield Plate
(S-6)
(S-6)
(S-6)
(S-6)
[5] Chassis Bracket
Fig. D2
VanceBaldwin Electronics
[15] Panel Holder
(S-15)
(S-16)
(S-15)
(S-16)
(S-14)
[12] Jack CBA
(S-15)
Desolder
[14] Junction CBA
(S-14)
(S-15)
[11] Jack Holder (A)
(S-12)
(S-13)
[13] Inverter CBA
Fig. D3
VanceBaldwin Electronics
[20] Speaker
(S-21)
[21] Front Cabinet
[20] Speaker
[19] IR Sensor
CBA
(S-20)
(S-19)
(S-21)
[17] LCD Module Assembly
[16] T-CON CBA
(S-18)
(S-17)
(S-17)
(S-18)
Shield Plate
(S-17)
[18] Function CBA
Fig. D4
VanceBaldwin Electronics
Cabinet
A1
A21
EXPLODED VIEWS
L2
A4
B16
L2
SP801
SP802
A11
L4
CLN802
A13
CLN101
B16
IR Sensor CBA
Function CBA
CLN801
CLN102
L4
See Electrical Parts List
for parts with this mark.
A3
A7
L1
L4
B16
L4
LCD Module Assembly
L4
B19
L1
L1
B33
L9
B27
L9
B1
L9
L9
L9
Inverter CBA
L6
Junction
CBA
B12
L1
L1
B1
L9
B19
L9
L1
L1
Digital Main
L9
CBA Unit
Digital Sub CBA
Power Supply CBA
B34
AC501
L1
T-CON CBA
CL3023
B20
B13
L16
L9
CL7501
B18
B3
B10
Jack CBA
B6
L15
L16
L6
L9
B5
L9
B11
L7
B16
L18
L7
B4
B16
L2
B29
L9
L11
L11
B32
L11
B4
L11
B32
L3
L2
A12
L12
L13
L3
L13
L13
L12
A12
L13
A12
A10
L12
L13
L13
L2
B8
A14
L2
S5
A6
A9
B7
A12
L3
VanceBaldwin Electronics
Packing
X2
Packing Tape
Some Ref. Numbers are
not in sequence.
X9-1 X9-2
X4
X3
S2
Packing Tape
S4
Packing Tape
S5
X1
Packing Tape
Tape
S6
S3
Packing Tape
VanceBaldwin Electronics
FRONT
Packing Tape
S1
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
# have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTE: Parts that are not assigned part numbers
(---------) are not available.
# have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTES:
1. Parts that are not assigned part numbers (---------)
are not available.
2. Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
LCD MODULE ASSEMBLY
*VCOM Adjustment and White Balance Adjustment
are required when reparing T-CON CBA.
Ref. No.DescriptionPart No.
LCD MODULE ASSEMBLY
Consists of the following:
T-CON CBA
CELL ACF ASSEMBLY
BACKLIGHT ASSEMBLY
UF320XA
1FSA10238
----------
----------
DIGITAL MAIN CBA UNIT
Ref. No.DescriptionPart No.
DIGITAL MAIN CBA UNIT1ESA15613
MPS CBA
Ref. No.DescriptionPart No.
MPS CBA
Consists of the following
POWER SUPPLY CBA(MPS-1)
FUNCTION CBA(MPS-2)
IR SENSOR CBA(MPS-3)
JACK CBA(MPS-4)
POWER SUPPLY CBA
Ref. No.DescriptionPart No.
POWER SUPPLY CBA(MPS-1)
Consists of the following:
CAPACITORS
C601#ELECTROLYTIC CAPACITOR 270µF/200VCA2D271DYG05
C602CERAMIC CAP. R K 680pF/2KV(HR)CCD3DKA0R681
C604FILM CAP.(P) 0.033µF/50V JCA1J333MS029
C605CERAMIC CAP.(AX) B K 0.01µF/50VCA1J103TU011
C606FILM CAP.(P) 0.1µF/50V JCA1J104MS029
C608SAFETY CAP. 4700pF/250VCCD2EMA0E472
C633ELECTROLYTIC CAP. 470µF/25V MCE1EMASDL471
C634ELECTROLYTIC CAP. 1000µF/10V MCE1AMASDL102
C635CERAMIC CAP.(AX) B K 0.01µF/50VCA1J103TU011
C636CERAMIC CAP. R K 1500pF/2KV(HR)CCD3DKA0R152
C638CAP ELE STD-85 4700µF 6.3V SLCE0KMZNDL472
C644ELECTROLYTIC CAP. 1000µF/16V MCA1C102SP085
C647ELECTROLYTIC CAP. 10µF/50V MCE1JMASDL100
C648ELECTROLYTIC CAP. 1000µF/25V MCE1EMZNDL102
C650ELECTROLYTIC CAP. 1µF/50V MCE1JMASDL1R0
C652ELECTROLYTIC CAP. 100µF/10V MCE1AMASDL101
C653ELECTROLYTIC CAP. 100µF/10V MCE1AMASDL101
C655ELECTROLYTIC CAP. 1000µF/10V MCE1AMASDL102
C656ELECTROLYTIC CAP. 1000µF/6.3V MCE0KMASDL102
C657CHIP CERAMIC CAP.(1608) F Z 0.1µF/50VCHD1JZ30F104
C658CHIP CERAMIC CAP.(1608) F Z 0.1µF/50VCHD1JZ30F104
C659CHIP CERAMIC CAP.(1608) F Z 0.1µF/50VCHD1JZ30F104
C660CHIP CERAMIC CAP.(1608) F Z 0.1µF/50VCHD1JZ30F104
C661CHIP CERAMIC CAP.(1608) F Z 0.1µF/50VCHD1JZ30F104
C662CHIP CERAMIC CAP.(1608) F Z 0.1µF/50VCHD1JZ30F104
C663ELECTROLYTIC CAP. 100µF/25V MCE1EMASDL101
C664CAP ELE STD-85 4700µF 6.3V SLCE0KMZNDL472
C665CHIP CERAMIC CAP.(1608) F Z 0.1µF/50VCHD1JZ30F104
C801ELECTROLYTIC CAP. 100µF/16V MCA1C101SP085
C802CHIP CERAMIC CAP. (1608) B K 1µF/16VCHD1CK30B105
C803CHIP CERAMIC CAP. (1608) B K 1µF/16VCHD1CK30B105
C804ELECTROLYTIC CAP. 100µF/16V MCA1C101SP085
C805ELECTROLYTIC CAP. 10µF/16V MCE1CMASDL100
C806CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C807CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C808ELECTROLYTIC CAP. 3.3µF/50V MCE1JMASDL3R3
C809CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C810CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C811ELECTROLYTIC CAP. 1000µF/25V MCE1EMZNDL102
C812CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C813CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C814CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C815CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C816ELECTROLYTIC CAP. 10µF/50V MCE1JMASDL100
C817CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C818CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C819ELECTROLYTIC CAP. 1µF/50V MCE1JMASDL1R0
C821ELECTROLYTIC CAP. 4.7µF/16V MCE1CMASDL4R7
C823CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C824CHIP CERAMIC CAP. (1608) B K 1µF/16VCHD1CK30B105
C825CHIP CERAMIC CAP. (1608) B K 1µF/16VCHD1CK30B105
C826CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C827ELECTROLYTIC CAP. 4.7µF/16V MCE1CMASDL4R7
C833CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C834ELECTROLYTIC CAP. 10µF/50V MCE1JMASDL100
C835ELECTROLYTIC CAP. 10µF/50V MCE1JMASDL100
C842CHIP CERAMIC CAP. (1608) B K 1µF/16VCHD1CK30B105
C843CHIP CERAMIC CAP. (1608) B K 1µF/16VCHD1CK30B105
C857ELECTROLYTIC CAP. 100µF/16V MCA1C101SP085
C859ELECTROLYTIC CAP. 47µF/16V MCA1C470SP085
C860CHIP RES.(1608) 1/10W 0 ΩRRXAZR5Z0000
C861CHIP RES.(1608) 1/10W 0 ΩRRXAZR5Z0000
C862ELECTROLYTIC CAP. 4.7µF/16V MCE1CMASDL4R7
C863ELECTROLYTIC CAP. 4.7µF/16V MCE1CMASDL4R7
C864CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C865CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
VanceBaldwin Electronics
Ref. No.DescriptionPart No.
C866CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C867CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C868CHIP CERAMIC CAP.(1608) B K 2700pF/50VCHD1JK30B272
C869CHIP CERAMIC CAP.(1608) B K 2700pF/50VCHD1JK30B272
C870CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C871CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C872CHIP CERAMIC CAP. F Z 0.068µF/50VCHD1JZ30F683
C873CHIP CERAMIC CAP.(1608) B K 5600pF/50VCHD1JK30B562
C875ELECTROLYTIC CAP. 4.7µF/16V MCE1CMASDL4R7
C876ELECTROLYTIC CAP. 4.7µF/16V MCE1CMASDL4R7
C877CHIP CERAMIC CAP. (1608) B K 1µF/16VCHD1CK30B105
C878CHIP CERAMIC CAP. (1608) B K 1µF/16VCHD1CK30B105
C880CHIP CERAMIC CAP. (1608) B K 1µF/16VCHD1CK30B105
C1602ALUMINUM ELECTROLYTIC CAP 1000µF/35V MCE1GMZNTM102
C101ELECTROLYTIC CAP. 47µF/16V M H7CE1CMAVSL470
C102CHIP CERAMIC CAP. F Z 0.01µF/50VCHD1JZ30F103
C105CHIP CERAMIC CAP.(1608) F Z 0.1µF/50VCHD1JZ30F104
C106CHIP CERAMIC CAP.(1608) F Z 0.1µF/50VCHD1JZ30F104
C107CHIP CERAMIC CAP.(1608) F Z 0.1µF/50VCHD1JZ30F104
BC101PCB JUMPER D0.6-P5.0JW5.0T
RCV891PHOTO LINK MODULE KSM-712TH2EUSESJRSKK044
JACK CBA
Ref. No.DescriptionPart No.
JACK CBA(MPS-4)
Consists of the following:
CAPACITORS
C7001ELECTROLYTIC CAP. 47µF/16V M H7CE1CMAVSL470
C7002CHIP CERAMIC CAP.(2125) F Z 10µF/10VCHE1AZ30F106
C7003CHIP CERAMIC CAP.(2125) F Z 10µF/10VCHE1AZ30F106
C7004CHIP CERAMIC CAP. F Z 0.47µF/16VCHD1CZ30F474
C7005CHIP CERAMIC CAP. F Z 0.47µF/16VCHD1CZ30F474
C7006CHIP CERAMIC CAP. F Z 0.47µF/16VCHD1CZ30F474
C7007CHIP CERAMIC CAP. F Z 0.47µF/16VCHD1CZ30F474
C7008CHIP CERAMIC CAP.(1608) F Z 0.1µF/50VCHD1JZ30F104
C7009CHIP CERAMIC CAP.(1608) F Z 0.1µF/50VCHD1JZ30F104
C7010CHIP CERAMIC CAP.(1608) F Z 0.1µF/50VCHD1JZ30F104
C7012CHIP CERAMIC CAP.(1608) F Z 0.1µF/50VCHD1JZ30F104
C7013CHIP CERAMIC CAP.(1608) F Z 0.1µF/50VCHD1JZ30F104
C7101ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C7102CERAMIC CAP.(AX) B K 1000pF/50VCCA1JKT0B102
C7109CHIP CERAMIC CAP. F Z 4.7µF/16V(2012)CHE1CZ30F475
C7110CHIP CERAMIC CAP. F Z 4.7µF/16V(2012)CHE1CZ30F475
C7111ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C7602CHIP CERAMIC CAP. F Z 4.7µF/16V(2012)CHE1CZ30F475
C7605CHIP CERAMIC CAP. F Z 4.7µF/16V(2012)CHE1CZ30F475
C7608CHIP CERAMIC CAP. F Z 4.7µF/16V(2012)CHE1CZ30F475
C7611CHIP CERAMIC CAP. F Z 4.7µF/16V(2012)CHE1CZ30F475
C7615CHIP CERAMIC CAP. F Z 4.7µF/16V(2012)CHE1CZ30F475
C7618CHIP CERAMIC CAP. F Z 4.7µF/16V(2012)CHE1CZ30F475
C7621CHIP CERAMIC CAP. F Z 4.7µF/16V(2012)CHE1CZ30F475
C7624CHIP CERAMIC CAP. F Z 4.7µF/16V(2012)CHE1CZ30F475
C7701CHIP CERAMIC CAP.(1608) CH J 100pF/50VCHD1JJ3CH101
C7702CHIP CERAMIC CAP. F Z 0.47µF/16VCHD1CZ30F474
C7705CHIP CERAMIC CAP.(1608) CH J 100pF/50VCHD1JJ3CH101
C7706CHIP CERAMIC CAP. F Z 0.47µF/16VCHD1CZ30F474
C7709CHIP CERAMIC CAP.(1608) CH J 100pF/50VCHD1JJ3CH101
C7710CHIP CERAMIC CAP. F Z 0.47µF/16VCHD1CZ30F474
C7714CHIP CERAMIC CAP.(1608) CH J 100pF/50VCHD1JJ3CH101
----------
Ref. No.DescriptionPart No.
C7715CHIP CERAMIC CAP.(1608) B K 0.047µF/50VCHD1JK30B473
C7718CHIP CERAMIC CAP.(1608) CH J 100pF/50VCHD1JJ3CH101
C7719CHIP CERAMIC CAP. F Z 0.47µF/16VCHD1CZ30F474
C7723CHIP CERAMIC CAP.(1608) CH J 100pF/50VCHD1JJ3CH101
C7724CHIP CERAMIC CAP.(1608) B K 0.047µF/50VCHD1JK30B473
C7729CHIP CERAMIC CAP. CH J 39pF/50VCHD1JJ3CH390
C7730CHIP CERAMIC CAP. F Z 0.47µF/16VCHD1CZ30F474
C7733CHIP CERAMIC CAP. CH J 39pF/50VCHD1JJ3CH390
C7734CHIP CERAMIC CAP. F Z 0.47µF/16VCHD1CZ30F474
C7738CHIP CERAMIC CAP. CH J 39pF/50VCHD1JJ3CH390
C7739CHIP CERAMIC CAP. F Z 0.47µF/16VCHD1CZ30F474
C7743CHIP CERAMIC CAP. CH J 39pF/50VCHD1JJ3CH390
C7744CHIP CERAMIC CAP. F Z 0.47µF/16VCHD1CZ30F474
C7747CHIP CERAMIC CAP. CH J 39pF/50VCHD1JJ3CH390
C7748CHIP CERAMIC CAP. F Z 0.47µF/16VCHD1CZ30F474
C7751CHIP CERAMIC CAP. CH J 39pF/50VCHD1JJ3CH390
C7752CHIP CERAMIC CAP. F Z 0.47µF/16VCHD1CZ30F474
C7801ELECTROLYTIC CAP. 100µF/16V M H7CE1CMAVSL101
C7802ELECTROLYTIC CAP. 100µF/16V M H7CE1CMAVSL101
JK7701JACK SW DIN PCB S 04 S4-16SHJYEJ040SNJ01
JK7702JACK SW RCA PCB S RCA-347HDT-02JYRJ030YUQ01
JK7705JACK SW DIN PCB L DIN-435C(777D)JYEL040YUQ03
JK7706JACK SW RCA PCB L 05 RCA-340NI-01JYRL030YUQ14
JK7711JACK RCA PCB S 03 RCA-347HT-03JXRJ030YUQ01
JK7712JACK SW RCA PCB S RCA-228H(2)NI-01JYRJ020YUQ02
JK7713JACK RCA PCB S 03 RCA-347HT-03JXRJ030YUQ01
JK7714JACK SW RCA PCB S RCA-228H(2)NI-01JYRJ020YUQ02
MUT CBA
Ref. No.DescriptionPart No.
MUT CBA
Consists of the following
INVERTER CBA
JUNCTION CBA
INVERTER CBA
Ref. No.DescriptionPart No.
INVERTER CBA
Consists of the following:
CAPACITORS
C501#ALUMINUM ELECTROLYTIC CAP 470µF/200V MCA2D471NC190
C504#METALIZED FILM CAP. 0.47µF/250VCT2E474MS037
C505#METALIZED FILM CAP. 0.47µF/250VCT2E474MS037
C510FILM CAP.(P) 0.022µF/50V JCA1J223MS029
C511CERAMIC CAP.(AX) B J 390pF/50VCCA1JJT0B391
C512CERAMIC CAP.(AX) B J 100pF/50VCCA1JJT0B101
C513CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C514ELECTROLYTIC CAP. 10µF/50V MCE1JMASDL100
C515PCB JUMPER D0.6-P5.0JW5.0T
C516CAP POLYPROPYLENE 0.047µF/630V JCA2K473F7001
C517CERAMIC CAP. R K 1000pF/2KVCCD3DKA0R102
C520FILM CAP.(P) 0.022µF/50V JCA1J223MS029
C551CHIP CERAMIC CAP. F Z 0.01µF/50VCHD1JZ30F103
C555CERAMIC CAP. B K 1000pF/500VCCD2JKS0B102
C556FILM CAP.(P) 0.01µF/50V JCA1J103MS029
C558#CAP ELE STD-85 4700µF/35V SLCE1GMZNDL472
C560ELECTROLYTIC CAP. 0.1µF/50V MCE1JMASDL0R1
C561CAP ELE STD-85 4700µF/35V SLCE1GMZNDL472
C1000CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C1002CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
1FSA10280
----------
----------
----------
Ref. No.DescriptionPart No.
C1003CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C1004CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1005CHIP CERAMIC CAP.(1608) CH J 1000pF/50V CHD1JJ3CH102
C1006CHIP CERAMIC CAP.(1608) B K 0.047µF/50VCHD1JK30B473
C1007CHIP CERAMIC CAP. CH J 330pF/50VCHD1JJ3CH331
C1008CHIP CERAMIC CAP. F Z 2.2µF/10VCHD1AZ30F225
C1009CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C1010CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C1011CHIP CERAMIC CAP.(1608) B K 0.47µF/10VCHD1AK30B474
C1012CHIP CERAMIC CAP.(1608) B K 0.47µF/10VCHD1AK30B474
C1013CHIP CERAMIC CAP.(1608) B K 1µF/25VCHD1EK30B105
C1014CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C1015ELECTROLYTIC CAP. 470µF/35V MCE1GMZNDL471
C1016CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C1017CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C1018CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C1019CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C1020CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C1021CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C1032ELECTROLYTIC CAP. 47µF/35V MCE1GMASDL470
C1040CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C1044CHIP CERAMIC CAP.(1608) B K 1µF/25VCHD1EK30B105
C1046CHIP CERAMIC CAP.(1608) B K 1µF/25VCHD1EK30B105
C1061CAP CERAMIC HV 15pF/3.15KV/SL/JCCD3FJASL150
C1062CHIP CERAMIC CAP. B K 1500pF/50VCHD1JK30B152
C1063CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1064CAP CERAMIC HV 15pF/3.15KV/SL/JCCD3FJASL150
C1065CHIP CERAMIC CAP. B K 1500pF/50VCHD1JK30B152
C1066CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1067CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1100ELECTROLYTIC CAP. 100µF/35V MCE1GMASDL101
C1101CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C1102ELECTROLYTIC CAP. 100µF/35V MCE1GMASDL101
C1103CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C1104CHIP CERAMIC CAP. CH J 180pF/50VCHD1JJ3CH181
C1105CHIP CERAMIC CAP. CH J 180pF/50VCHD1JJ3CH181
C1106CHIP CERAMIC CAP. CH J 180pF/50VCHD1JJ3CH181
C1107CHIP CERAMIC CAP. CH J 180pF/50VCHD1JJ3CH181
C1111CAP CERAMIC HV 15pF/3.15KV/SL/JCCD3FJASL150
C1112CHIP CERAMIC CAP. B K 1500pF/50VCHD1JK30B152
C1113CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1114CAP CERAMIC HV 15pF/3.15KV/SL/JCCD3FJASL150
C1115CHIP CERAMIC CAP. B K 1500pF/50VCHD1JK30B152
C1116CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1117CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1161CAP CERAMIC HV 15pF/3.15KV/SL/JCCD3FJASL150
C1162CHIP CERAMIC CAP. B K 1500pF/50VCHD1JK30B152
C1163CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1164CAP CERAMIC HV 15pF/3.15KV/SL/JCCD3FJASL150
C1165CHIP CERAMIC CAP. B K 1500pF/50VCHD1JK30B152
C1166CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1167CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1211CAP CERAMIC HV 15pF/3.15KV/SL/JCCD3FJASL150
C1212CHIP CERAMIC CAP. B K 1500pF/50VCHD1JK30B152
C1213CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1214CAP CERAMIC HV 15pF/3.15KV/SL/JCCD3FJASL150
C1215CHIP CERAMIC CAP. B K 1500pF/50VCHD1JK30B152
C1216CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1217CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1250ELECTROLYTIC CAP. 100µF/35V MCE1GMASDL101
C1251CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C1252ELECTROLYTIC CAP. 100µF/35V MCE1GMASDL101
C1253CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
VanceBaldwin Electronics
Ref. No.DescriptionPart No.
C1254CHIP CERAMIC CAP. CH J 180pF/50VCHD1JJ3CH181
C1255CHIP CERAMIC CAP. CH J 180pF/50VCHD1JJ3CH181
C1256CHIP CERAMIC CAP. CH J 180pF/50VCHD1JJ3CH181
C1257CHIP CERAMIC CAP. CH J 180pF/50VCHD1JJ3CH181
C1261CAP CERAMIC HV 15pF/3.15KV/SL/JCCD3FJASL150
C1262CHIP CERAMIC CAP. B K 1500pF/50VCHD1JK30B152
C1263CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1264CAP CERAMIC HV 15pF/3.15KV/SL/JCCD3FJASL150
C1265CHIP CERAMIC CAP. B K 1500pF/50VCHD1JK30B152
C1266CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1267CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1311CAP CERAMIC HV 15pF/3.15KV/SL/JCCD3FJASL150
C1312CHIP CERAMIC CAP. B K 1500pF/50VCHD1JK30B152
C1313CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1314CAP CERAMIC HV 15pF/3.15KV/SL/JCCD3FJASL150
C1315CHIP CERAMIC CAP. B K 1500pF/50VCHD1JK30B152
C1316CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1317CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1500CHIP CERAMIC CAP.(1608) B K 0.22µF/25VCHD1EK30B224
C1502CHIP CERAMIC CAP.(1608) B K 0.22µF/25VCHD1EK30B224
C1550CHIP CERAMIC CAP.(1608) B K 0.22µF/25VCHD1EK30B224
C1552CHIP CERAMIC CAP.(1608) B K 0.22µF/25VCHD1EK30B224
CONNECTORS
CN501CONNECTOR B2P3-VH(LF)(SN)J3VH020JG001
CN1050CONNECTOR PRINT OSU KW05-120-02-00J30502KET001
CN1100CONNECTOR PRINT OSU KW05-120-02-00J30502KET001
CN1150CONNECTOR PRINT OSU KW05-120-02-00J30502KET001
CN1200CONNECTOR PRINT OSU KW05-120-02-00J30502KET001
CN1250CONNECTOR PRINT OSU KW05-120-02-00J30502KET001
CN1300CONNECTOR PRINT OSU KW05-120-02-00J30502KET001
Q501#FET MOS 2SK3561(Q) IDSS100UAQFWZ2SK3561Q
Q502TRANSISTOR KTC3199-GR-AT/PNQS4KTC3199P
Q551TRANSISTOR KTC3199-GR-AT/PNQS4KTC3199P
Q552TRANSISTOR KTC3199-GR-AT/PNQS4KTC3199P
Q1001TRANSISTOR KTC3199-GR-AT/PNQS4KTC3199P
Q1002TRANSISTOR KTC3199-GR-AT/PNQS4KTC3199P
Q1003TRANSISTOR KTC3199-GR-AT/PNQS4KTC3199P
Q1020TRANSISTOR KTA1267-GR-AT/PNQS1KTA1267P
Q1100MOS FET 2SK2614QF1Z2SK2614Q
Q1101MOS FET 2SK2614QF1Z2SK2614Q
Q1102MOS FET 2SK2614QF1Z2SK2614Q
Q1103MOS FET 2SK2614QF1Z2SK2614Q
Q1250MOS FET 2SK2614QF1Z2SK2614Q
Q1251MOS FET 2SK2614QF1Z2SK2614Q
Q1252MOS FET 2SK2614QF1Z2SK2614Q
Q1253MOS FET 2SK2614QF1Z2SK2614Q
Q1701TRANSISTOR KTA1267-GR-AT/PNQS1KTA1267P