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HP Elite x3
Maintenance and Service Guide
IMPORTANT! This document is intended for HP
authorized service providers only.
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© Copyright 2016 HP Development Company,
L.P.
Bluetooth is a trademark owned by its
proprietor and used by HP Inc. under license.
Adreno, Fluence, Qualcomm, and Snapdragon
are trademarks of Qualcomm Incorporated,
registered in the United States and other
countries, used with permission. Windows is a
trademark of the Microsoft group of
companies. SD Logo is a trademark of its
proprietor.
The information contained herein is subject to
change without notice. The only warranties for
HP products and services are set forth in
the express warranty statements
accompanying such products and services.
Nothing herein should be construed as
constituting an additional warranty. HP shall
not be liable for technical or editorial errors or
omissions contained herein.
First Edition: August 2016
Document Part Number: 855138-001
Product notice
This guide describes features that are common
to most products. Some features may not be
available on your device.
Not all features are available in all editions or
versions of Windows. Systems may require
upgraded and/or separately purchased
hardware, drivers, software or BIOS update to
take full advantage of Windows functionality.
See http://www.microsoft.com.
To access the latest user guides or manuals for
your product, go to http://www.hp.com/
support, and select your country. Select Find
your product, and then follow the on–screen
instructions.
Software terms
By installing, copying, downloading, or
otherwise using any software product
preinstalled on this device, you agree to be
bound by the terms of the HP End User License
Agreement (EULA). If you do not accept these
license terms, your sole remedy is to return the
entire unused product (hardware and software)
within 14 days for a refund subject to the
refund policy of your place of purchase.
For any further information or to request a full
refund of the device, please contact your local
point of sale (the seller).
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Table of contents
1 Product description ....................................................................................................................................... 1
2 External component identication .................................................................................................................. 3
Front ....................................................................................................................................................................... 3
Back ........................................................................................................................................................................ 6
Labels ..................................................................................................................................................................... 8
3 Illustrated parts catalog ................................................................................................................................ 9
Major components ................................................................................................................................................. 9
Miscellaneous parts ............................................................................................................................................. 10
4 Removal and replacement preliminary requirements ..................................................................................... 11
Tools required ...................................................................................................................................................... 11
Service considerations ......................................................................................................................................... 11
Plastic parts ....................................................................................................................................... 12
Cables and connectors ...................................................................................................................... 12
Grounding guidelines ........................................................................................................................................... 12
Electrostatic discharge damage ........................................................................................................ 12
Packaging and transporting guidelines .......................................................................... 14
Workstation guidelines ................................................................................ 14
5 Removal and replacement procedures ........................................................................................................... 16
Component replacement procedures .................................................................................................................. 16
Card reader tray ................................................................................................................................................... 16
End cap ................................................................................................................................................................. 17
Display panel assembly ....................................................................................................................................... 18
Chassis and battery removal ............................................................................................................................... 25
Rear camera ......................................................................................................................................................... 28
System board ....................................................................................................................................................... 30
Front camera ........................................................................................................................................................ 32
Iris camera ........................................................................................................................................................... 33
Antenna board ..................................................................................................................................................... 34
6 Specications .............................................................................................................................................. 35
iii
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7 Power adapter requirements ........................................................................................................................ 36
Requirements for all countries ............................................................................................................................ 36
Requirements for specic countries and regions ................................................................................................ 36
8 Recycling .................................................................................................................................................... 38
Index ............................................................................................................................................................. 39
iv
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1 Product description
Category Description
Product Name HP Elite x3
Processor and chipset
Graphics
Panel 5.96 inch (15.14 cm), WQHD 2560x1440 AMOLED, 16:9 aspect ratio, 494 PPI, Gorilla Glass4 with
Memory 4 GB LPDDR4 memory, integrated onto system board, dual channel x32 PoP 32 Gbit
Storage eMMC 5.1
Audio and video Three internal microphones
Qualcomm® MSM 8996 SnapdragonTM 820 Quad Core Processor
AdrenoTM 530 GPU (integrated in the MSM 8996 processor)
anti-smudge coating. Viewing Angle: 85’/85’/85’/85’. Brightness: typical 350 nits (cd/m2)
Supports passive pen and Multi-touch
64 GB eMMC, integrated onto system board
Your device has read/write support for SDXC microSD cards up to 2 TB
One external microphone from audio-out (headphone)/audio-in (microphone) combo jack
Stereo speakers, one speaker sharing with earpiece, speaker rated power is 0.6 W per channel,
short-term maximum power is 1.2 W
Snapdragon Audio+ audio support, B&O Branding
Qualcomm FluenceTM Pro technology
16.0 MP full-frame high-denition (HD) rear-facing camera, with single LED ash, and low light
capabilities. (Phase detection auto focus support planned for future Over The Air (OTA) upgrade)
8.0 MP full-frame HD front-facing camera, with low light capabilities
2.4 MP IRIS scan (Iris Recognition)
Sensors Accelerometer + Gyroscope
Ambient light sensor (ALS) + Proxy combo
Pressure
e-Compass
Near Field Communication (NFC)
Sensor Hub (SSC on MSM 8996)
Hall eect sensor
Wireless networking Integrated WLAN option:
802.11 ac/a/b/g/n, dual band 2x2 MIMO with dual antenna
Miracast/Wi-Fi Direct mirroring
Bluetooth 4.0+ LE and security
Near eld communication (NFC):
NXP (NQ210)
1
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Category Description
WWAN:
●
EMEA+APC+Chile–2G: 850/900/1800/1900 MHz, 3G: B5/8/2/1/4, 4G: FDD
B1/3/5/7/8/19/20/26/28, TDD B38/39/40/41 (roaming bands B2/4/17/12/29 are desired
but no tests and performance conformance are required), 2DL CA: B3+B20, B3+B7, B20+B7,
B7+B28, B1+B3, B3+B5, B3+B8, B1+B5, B3+B28, TDD Intra CA; Frequency Ranges: LB
703-960 MHz, MB 1710-2170 MHz; HB 2300-2400 MHz, 2496-2690 MHz
●
Americas (excluding Chile)–2G: 850/900/1800/1900MHz, 3G: B5/8/2/1/4, 4G: FDD
B2/4/5/7/12/17/29/30 (roaming bands B1/3/20 are desired but no tests and performance
conformance are required), 2DL CA: B2+B29, B4+B29, B2+B17, B4+B17, B2+B12, B4+B12,
B4+B7; Frequency Ranges: LB 699-960 MHz; MB 1710-2170 MHz; HB 2496-2690 MHz
Select products support two SIM cards
External expansion microSD card slot expandable up to 2 TB, plus security feature
Ports
Docking HP Elite x3 Desk Dock
Keyboard/Mouse Support for USB or Bluetooth external keyboard and mouse
Power requirements Battery
●
Audio: 3.5 mm both 3 and 4-pole audio-out (headphone)/audio-in (microphone) combo jack
for headset
●
USB 3.0 Type-C connector
●
Dual Nano SIM card or Nano SIM+ microSD card via 3-in-2 card tray
●
Video out via USB 3.0, DP Alt Mode
●
POGO pin connector
Non-removable, 3.85 V, Pack capacity is 15.98 Wh Long life Battery (LLB).
Battery capacity is typical 4,150 mAh Lithium-Polymer, 1S1P
Adapter
USB charging, via USB 3.0 Type-C connector
Wall adaptor: 5 V/2 A 10 W
Wireless charging, WPC(Qi)/PMA dual mode
Full range (110-240 V)
Power cord
USB 3.0 Type C to A cable (1.0)
Operating system Preinstalled:
Serviceability End user replaceable parts:
2 Chapter 1 Product description
●
Windows® 10 Mobile - Dual SIM
●
Windows 10 Mobile - Single SIM
●
Operating system OTA upgrade for 2 years after purchase
●
AC adapter
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2 External component identication
Front
Front 3
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Component Description
(1) Power light
(2) Ambient light sensor Detects the light in the surrounding area and then adjusts the
(3) Earpiece Produces sound for phone calls.
(4) Audio-out (headphone)/Audio-in (microphone)
combo jack
●
Red: The battery is near depletion and is being charged.
This light will remain on until the battery is charged
enough for the device to be functional.
brightness of the display.
To set automatic brightness adjustment:
▲
Swipe down from the top of the screen, tap All
settings
, tap System, tap Display, and then follow the on-
screen instructions.
Connects optional powered stereo speakers, headphones,
earbuds, a headset, or a television audio cable. Also connects an
optional headset microphone. This jack does not support
optional microphone-only devices.
WARNING! To reduce the risk of personal injury, adjust the
volume before using headphones, earbuds, or a headset. For
additional safety information, see the Regulatory, Safety and
Environmental Notices.
To access this guide:
▲
Swipe up from the middle of the Start screen, tap
HP Device Hub, and then tap User Guide. Select your
language if prompted to do so, and then tap Regulatory,
Safety and Environmental Notices.
IMPORTANT: You must be connected to the Internet to access
the latest version of the document.
NOTE: When a device is connected to the jack, the external
speakers are disabled.
(5) Camera Records video and captures photographs.
(6) Iris camera Allows iris recognition to unlock your device, instead of a PIN.
(7) Power button
4 Chapter 2 External component identication
To use your camera:
▲
Tap on the Start screen.
●
When the device is o, press the button for about 5
seconds until the device vibrates to turn on the device.
●
When the device is on, press the button briey to turn o
and lock the screen.
●
When the screen is o, press the button to display the lock
screen.
●
When the device is on, press and hold the button until the
slide down to power o message appears. Release the
button, and then swipe down to turn o the device.
NOTE: The device will power on when connected to a power
source.
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Component Description
(8) Volume up button Increases speaker volume incrementally while you hold down
the button. The volume status bar appears when you press this
button.
(9) Volume down button Decreases speaker volume incrementally while you hold down
the button. The volume status bar appears when you press this
button.
(10) Internal microphone Transmits sound for phone calls and records sound for other
applications on your device.
(11) Speaker Produces sound.
(12) USB Type-C charging port Connects to the AC adapter to provide power to the device,
connects to the desk dock, or connects to any USB device with a
Type-C connector.
NOTE: Adapters (purchased separately) may be required.
(13) Nano SIM/microSD memory card reader Supports a nano subscriber identity module (SIM) card and a
microSD memory card in a dual-compartment tray. Select
products support two SIM cards.
Place your ngernail in the small recess on the bottom of the
card tray and pull the tray out to remove it from the device.
NOTE: Your device has read/write support for microSD
memory cards up to 2 TB.
Front 5
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Back
Component Description
(1) WWAN antennas* Send and receive wireless signals to communicate with wireless
wide area networks (WWANs).
(2) WLAN antennas* Send and receive wireless signals to communicate with wireless
local area networks (WLANs).
(3) Secondary microphones Record sound.
(4) Flash and ashlight Provides light for photographs and videos, and can operate as a
ashlight.
To access the ashlight:
▲
Swipe down from the top of the screen, tap Expand, and
then tap Flashlight.
Tap Flashlight again to turn o the ashlight.
(5) Fingerprint reader Allows a ngerprint recognition to unlock your device instead of
a PIN.
NOTE: The ngerprint reader may require additional software.
For more information, go to http://www.hp.com/support.
(6) NFC tapping area Allows you to share data and les with another device that has
Near Field Communications (NFC). Simply touch the devices
together.
6 Chapter 2 External component identication
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Component Description
(7) Wireless charging area Allows you to charge your device wirelessly.
(8) Accessory connector Connects optional accessories that support Pogo pin connectors.
(9) Camera Records video and captures photographs.
To use the camera:
▲
Tap on the Start screen.
*The antennas are not visible from the outside of the device. For optimal transmission, keep the areas immediately around the
antennas free from obstructions. For wireless regulatory notices, see the section of the Regulatory, Safety, and Environmental Notices
that applies to your country or region.
To access this guide:
▲
Swipe up from the middle of the screen, tap HP Device Hub, and then tap User Guide. Select your language if prompted to
do so, and then tap Regulatory, Safety and Environmental Notices.
IMPORTANT: You must be connected to the Internet to access the latest version of the document.
Back 7
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Labels
The labels for the device provide information you may need when you troubleshoot system problems or
travel internationally with the device.
IMPORTANT: Check the following locations for the labels described in this section: the HP Device Hub app,
the electronic regulatory labels, the back of the device, and the device box.
To access the HP Device Hub:
▲
Swipe up from the middle of the screen, tap HP Device Hub. From here you can view the model
name, the product number, the IMEI number, and other information.
To access the electronic regulatory labels:
▲
Swipe up from the middle of the screen, tap HP Device Hub, and then tap Regulatory.
●
Service label—Provides important information to identify your device. When contacting support, you
will probably be asked for the serial number, IMEI number, and possibly for the product number or the
model number. Locate these numbers before you contact support.
●
Regulatory label(s)—Provide(s) regulatory information about the device.
●
Wireless certication label(s)—Provide(s) information about optional wireless devices and the approval
markings for the countries or regions in which the devices have been approved for use.
Labels on the device are located on the bottom of the back of the device.
8 Chapter 2 External component identication
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3 Illustrated parts catalog
Major components
NOTE: HP continually improves and changes product parts. For complete and current information on
supported parts for your device, go to http://partsurfer.hp.com, select your country or region, and then follow
the on-screen instructions.
Item Component Spare part number
(1) 5.96 inch, WQHD 2560x1440 AMOLED, Touchscreen display panel assembly, includes
OLED panel, laminated touch sensor, lens adhesive, display ex
(2) Chassis; if you replace the chassis, you must also replace the battery 903685-001
(3) Battery,1C, 15 WHr, LI FC01015-PL non-user removable; if you replace the battery, you
must also replace the chassis
(4) Front camera (includes cable) 853377-001
903687-001
838524-005
Major components 9
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Item Component Spare part number
(5) Iris camera (includes cable) 900262-001
(6) Rear camera (includes cable) 853376-001
(7) System board, includes audio board and thermal pads
(8) Back cover
For use in North America—Pre-assembled and IP tested and includes audio-out
For use in rest of the world—Pre-assembled and IP tested and includes audio-out
(9) Card reader tray 903690-001
(10) Antenna board 903688-001
(11) End cap 903689-001
●
For use in North America, equipped with Windows 10, Snapdragon 820 quad core
processor, 4 GB, 64 G eMMC
●
For use in the rest of the world, equipped with Windows 10, Snapdragon 820 quad core
processor, 4 GB, 64 G eMMC
(headphone)/audio-in (microphone) combo jack for headset jack, USB port, NFC module,
rear charging, heat spreader, lens adhesive, WWAN/WLAN
(headphone)/audio-in (microphone) combo jack for headset, USB port, NFC module, rear
charging, heat spreader, lens adhesive, WWAN/WLAN
Miscellaneous parts
Component Spare part number
AC adapter, 10 W, NPFC. non-Smart USB, wall mount 911233-001
903660-001
905637-001
903684-001
904364-001
Cable, USB 3.1, Type-C 858604-001
Display pressure-sensitive adhesive 904362-001
Headset 906675-001
Metal kit, includes display ex retention bracket, battery ex retention bracket, rear camera retaining
bracket, and USB ex retaining bracket
Speaker mesh cap 904363-001
Tape, battery adhesive 903695-001
Screw kit, includes rubber screw cover grommet 903691-001
Device
●
For use in Americas region, X5V47AA, Black 907587-001
●
For use in APJ region, Black with 1 SIM card 908817-001
●
For use in APJ region, Black with 2 SIM cards 908818-001
●
For use in EMEA region, Y1M43EA, Black 908006-001
903686-001
10 Chapter 3 Illustrated parts catalog
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4 Removal and replacement preliminary
requirements
Tools required
You will need the following tools to complete the removal and replacement procedures:
●
Phillips 00 screw driver
●
Two plastic spudger tools
●
Torx T5 screw driver
●
Heat protective gloves
●
Hot plate (heats to 80.0° C (176.0° F))
●
Stand or way to secure the display
●
70 percent isopropyl alcohol
●
2 inch suction cup
●
0.05 mm thermal conductivity adhesive tape (heat tape)
●
Grounding tape
●
Compressed air
●
Lint- and static-free cloths
NOTE: The following items must be approved for use with the HP Elite X3. Contact your HP service
contact for additional information.
●
Glue machine and the glue for that machine
●
Display panel adhesive alignment xture
●
Display kit alignment xture
●
Display pressing xture
●
Glue Path Golden Sample
Service considerations
The following sections include some of the considerations that you must keep in mind during disassembly
and assembly procedures.
NOTE: As you remove each subassembly from the device, place the subassembly (and all accompanying
screws) away from the work area to prevent damage.
Tools required 11
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Plastic parts
CAUTION: Using excessive force during disassembly and reassembly can damage plastic parts. Use care
when handling the plastic parts. Apply pressure only at the points designated in the maintenance
instructions.
Cables and connectors
CAUTION: When servicing the device, be sure that cables are placed in their proper locations during the
reassembly process. Improper cable placement can damage the device.
Cables must be handled with extreme care to avoid damage. Apply only the tension required to unseat or seat
the cables during removal and insertion. Handle cables by the connector whenever possible. In all cases, avoid
bending, twisting, or tearing cables. Be sure that cables are routed in such a way that they cannot be caught
or snagged by parts being removed or replaced. Handle ex cables with extreme care; these cables tear
easily.
Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure determine
the degree of sensitivity. Networks built into many integrated circuits provide some protection, but in many
cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a nger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be aected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its life
expectancy.
CAUTION: To prevent damage to the device when you are removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines described in this
section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity aects the electrostatic voltage levels generated by
dierent activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl oor 12,000 V 5,000 V 3,000 V
12 Chapter 4 Removal and replacement preliminary requirements
Page 17
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
Grounding guidelines 13
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Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
●
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
●
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
●
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
●
Place items on a grounded surface before removing items from their containers.
●
Always be properly grounded when touching a component or assembly.
●
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive foam.
●
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipment used for moving materials is wired to ground and that proper materials are selected to avoid
static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
●
Cover the workstation with approved static-shielding material.
●
Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and
equipment.
●
Use conductive eld service tools, such as cutters, screw drivers, and vacuums.
●
When xtures must directly contact dissipative surfaces, use xtures made only of static-safe materials.
●
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids
and Styrofoam.
●
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle these
items only at static-free workstations.
●
Avoid contact with pins, leads, or circuitry.
●
Turn o power and input signals before inserting or removing connectors or test equipment.
14 Chapter 4 Removal and replacement preliminary requirements
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Equipment guidelines
Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation.
●
When seated, wear a wrist strap connected to a grounded system. Wrist straps are exible straps with a
minimum of one megohm ±10% resistance in the ground cords. To provide proper ground, wear a strap
snugly against the skin at all times. On grounded mats with banana-plug connectors, use alligator clips
to connect a wrist strap.
●
When standing, use foot straps and a grounded oor mat. Foot straps (heel, toe, or boot straps) can be
used at standing workstations and are compatible with most types of shoes or boots. On conductive
oors or dissipative oor mats, use foot straps on both feet with a minimum of one megohm resistance
between the operator and ground. To be
The following grounding equipment is recommended to prevent electrostatic damage:
●
Antistatic tape
●
Antistatic smocks, aprons, and sleeve protectors
●
Conductive bins and other assembly or soldering aids
●
Nonconductive foam
●
Conductive tabletop workstations with ground cords of one megohm resistance
●
Static-dissipative tables or oor mats with hard ties to the ground
●
Field service kits
eective, the conductive must be worn in contact with the skin.
●
Static awareness labels
●
Material-handling packages
●
Nonconductive plastic bags, tubes, or boxes
●
Metal tote boxes
●
Electrostatic voltage levels and protective materials
The following table lists the shielding protection provided by antistatic bags and oor mats.
Material Use Voltage protection level
Antistatic plastics Bags 1,500 V
Carbon-loaded plastic Floor mats 7,500 V
Metallized laminate Floor mats 5,000 V
Grounding guidelines 15
Page 20
5 Removal and replacement procedures
Component replacement procedures
CAUTION: Components described in this chapter should only be accessed by an authorized service provider.
Accessing these parts can damage the device and void the warranty.
NOTE: HP continually improves and changes product parts. For complete and current information on
supported parts for your device, go to http://partsurfer.hp.com, select your country or region, and then follow
the on-screen instructions.
This chapter provides removal and replacement procedures for authorized service provider only parts.
There are as many as 22 screws that must be removed, replaced, and/or loosened when servicing the device.
Make special note of each screw size and location during removal and replacement.
Card reader tray
CAUTION: To reduce the risk of loss of data or an unresponsive system, save your information and close all
programs associated with the microSD card.
Description Spare part number
Card reader tray 903690-001
Remove the card reader tray:
▲
Place your ngernail in the small recess on the bottom of the card reader tray, pull out the tray to
remove it from the device
Reverse the steps to replace the tray.
16 Chapter 5 Removal and replacement procedures
Page 21
End cap
Description Spare part number
End cap 903689-001
Speaker mesh cap 904363-001
Remove the end cap:
▲
Insert a spudger in the gap between the end cap and the device, and then remove the end cap.
If you need to replace the speaker mesh cap:
▲
Insert a spudger in the gap between device and the cap, and then remove the cap.
NOTE: Use the spudger to gently remove any remaining mesh.
End cap 17
Page 22
Reverse the steps to replace the end cap.
NOTE: A small amount of glue may be required to secure the end cap. Contact your HP service contact for
additional details.
Display panel assembly
Description Spare part number
5.96 inch, WQHD 2560x1440 AMOLED, Touchscreen display panel assembly, includes OLED panel,
laminated touch sensor, lens adhesive, and display ex
Display pressure-sensitive adhesive 904362-001
NOTE: A glue machine, glue, and repair xtures are required. Contact your HP service contact for
additional details.
903687-001
Before disassembling the device, follow these steps:
1. Disconnect the power from the device by unplugging the power adapter cord from the device.
2. Turn o the device. If you are unsure whether the device is o, turn the device on, and then shut it down
through the operating system.
3. Disconnect all external devices from the device.
4. Remove the card reader tray (see Card reader tray on page 16).
5. Remove the end cap (see End cap on page 17).
Remove the display panel assembly:
CAUTION: The display panel is fragile. Before turning the display panel assembly upside down, make sure
the work surface is clear of tools, screws, and any other foreign objects. Failure to follow this caution can
result in damage to the display panel .
18 Chapter 5 Removal and replacement procedures
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CAUTION: Have heat protective gloves or a way to safely move the device once it is heated.
IMPORTANT: Once the device is heated, you will need to work quickly to remove the display panel assembly
before the glue hardens again.
NOTE: Have a stand to hold the display or have way to secure the display panel assembly at a 90 degree
angle after you release the left side of the display. The display panel assembly will need to be secured as you
release the battery and display ex cables.
1. Preheat the hot plate to 80.0° C (176.0° F).
2. Place the device with the display side down on the hot plate for 8 minutes, and then carefully remove
the device to your workstation.
NOTE: There is a display ex cable on the top of the right side.
3. Insert a spudger (1) between the bottom of the display panel and chassis, move the spudger from left to
right, and then place a 2 inch suction cup (2) on the bottom right and gently pry the right edge of the
display away from the chassis.
4. Place the suction cup (3) on the bottom left and gently pry the left edge of the display away from the
chassis.
5. Place the suction cup (4) in the middle of the display and gently pry the rest of the display away from the
chassis.
Display panel assembly 19
Page 24
6. With the suction in the middle, lift the display (1) to open it. The display ex cable is still connected on
the right side.
7. Use a spudger (2) to break the adhesive at the top of the device.
8. Lift the left side (1) of the display assembly. The display ex cable is still connected on the right side.
9. Remove the two M1.6_L4.35 Phillips screws (2) securing the battery ex retaining bracket.
10. Use a spudger to release the battery ex retaining bracket (3). The bracket is part of the Metal Kit, part
number 903686-001.
NOTE: The battery ex retaining bracket may be glued to the battery ex.
11. Use a spudger to gently disconnect the battery ex (4) from the chassis.
12. Unscrew the two M1_L1.4 Phillips screws (5) securing the display ex retention bracket at the top right
of the device.
13. Remove the display ex retention bracket (6). The bracket is part of the Metal Kit, part number
903686-001.
20 Chapter 5 Removal and replacement procedures
Page 25
14. Use a spudger to disconnect the 60 pin display ex connector (7).
15. Use a spudger and 70 percent isopropyl alcohol to remove any remaining glue from the display and main
assembly.
Use the following procedures to replace the display panel assembly.
IMPORTANT: The following instructions are general guide to replace the display panel assembly. Follow the
instructions for your specic glue machine to apply the glue to the device, and then replace the display panel
assembly.
1. Set up the glue machine.
a. Program the glue machine to dispense glue to match the Glue Path Golden Sample provided by
your HP service contact.
b. Make sure the glue tube is installed per the manufacturer’s instructions.
NOTE: As many as 10 samples of the glue path could be required. Each sample must t the
following criteria:
●
Have a clear, protective lm for the glue that can be discarded without ruining the device
●
Visually match the Glue Path Golden Sample
●
Have a glue weight of no less than 0.23 g and no more than 0.28 g
c. Test the glue path with at least four samples. Be sure to clean the glue nozzle after each sample.
NOTE: Calibrate the glue machine every 80 to 100 runs.
2. Apply the display pressure-sensitive adhesive.
IMPORTANT: Before applying the display pressure-sensitive adhesive, be sure the chassis side of the
device is completely clean. Remove any dust with compressed air or with a lint- and static-free cloth and
alcohol.
Display panel assembly 21
Page 26
a. Remove the device side of the protective lm from the display pressure-sensitive adhesive.
b. With the removed adhesive side up, insert the display pressure-sensitive adhesive into the display
panel adhesive alignment xture.
NOTE: Make sure the device is oriented to match the display pressure-sensitive adhesive
orientation.
c. Place the device with the chassis side face down into the display panel adhesive alignment xture
to attach the display pressure-sensitive adhesive to the device.
NOTE: The device back cover will be facing up.
d. Hold the device in place on the adhesive with 240±10 N (24.5±1 kg) for 20 seconds.
e. Remove the device from the display panel adhesive alignment xture, and then verify the display
pressure-sensitive adhesive is located properly.
f. Use a plastic spudger to press the display pressure-sensitive adhesive along all four sides.
g. Remove the display side of the protective lm from the display pressure-sensitive adhesive.
h. Clean the camera area with 70 percent isopropyl alcohol or compressed air.
3. Apply the glue.
a. Secure the device, chassis-side up, in the glue machine xture.
b. Clean the glue machine nozzle with a lint- and static-free cloth and 70 percent isopropyl alcohol.
c. Run the glue program.
d. Visually inspect the glue path.
4. Install the display, and then reconnect the cables and brackets.
IMPORTANT: Be sure the display panel is completely clean. Remove any dust with compressed air or
with a lint- and static-free cloth and alcohol.
a. Secure the device, chassis-side up, in the display kit alignment xture.
b. Place the display side of the display assembly against the wall of the display kit alignment xture.
c. Connect the 60 pin display ex connector (1).
d. Replace the display ex retention bracket (2) and rescrew the two M1_L1.4 Phillips screws (3)
securing the bracket to the top right of the device.
e. Connect the battery ex (4).
f. Replace the battery ex retention bracket (5) and rescrew the two M1.6_L4.35 Phillips screws (6)
securing the bracket to the device.
22 Chapter 5 Removal and replacement procedures
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g. Apply grounding tape (7) on the display ex retention bracket and chassis.
5. Align the display.
a. Align the display assembly with the guides in the display kit alignment xture.
b. Press the display assembly on the glue on the device.
c. Visually conrm the display assembly is in the correct location.
d. Use a lint- and static-free cloth with 70 percent isopropyl alcohol to remove any excess glue.
Display panel assembly 23
Page 28
e. Use 7 pieces of 0.05 mm thermal conductivity adhesive tape (heat tape) to secure the display
assembly in place.
6. Allow the glue to cure.
a. Insert the device in the display pressing xture.
b. Insert the Torx screws in the order shown with 1.3±0.5 kgf·cm.
NOTE: Refer to the glue specications for additional acceptable environments.
24 Chapter 5 Removal and replacement procedures
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c. Allow glue to dry at least 4 hours in an environment of 75%–85% humidity and 25.0° C (77.0° F).
d. Remove the screws in the order shown.
e. Remove the device from the display pressing xture.
f. Remove the 7 pieces of tape.
7. Clean the glue
a. Visually inspect the glue locations along all of the edges.
NOTE: Most glue will be found along the top edge.
b. Use a plastic spudger to remove any excess glue.
c. Visually inspect the glue locations along all of the edges again.
d. Use a lint- and static-free cloth with 70 percent isopropyl alcohol to remove any excess glue.
e. Visually inspect the glue locations along all of the edges again.
f. Repeat steps b. – e. as needed.
g. Replace the end cap, card reader tray, and any external devices.
Chassis and battery removal
Description
Chassis, pre-assembled and IP tested, includes upper and lower speakers, battery, lens, adhesive, and
thermal pad
Spare part number
903685-001
Battery, 1C, 15 WHr, LI FC01015-PL non-user removable 838524-005
Tape, battery adhesive 903695-001
Chassis and battery removal 25
Page 30
Before disassembling the device, follow these steps:
1. Disconnect the power from the device by unplugging the power adapter cord from the device.
2. Turn o the device. If you are unsure whether the device is o, turn the device on, and then shut it down
through the operating system.
3. Disconnect all external devices from the device.
4. Remove the card reader tray (see Card reader tray on page 16).
5. Remove the end cap (see End cap on page 17).
6. Remove the display panel assembly (see Display panel assembly on page 18).
CAUTION: Disconnecting a battery that is the sole power source for the device can cause loss of
information. To prevent loss of information, save your work or shut down the device through the operating
system before disconnecting the battery.
IMPORTANT: Do not remove the battery from the chassis. If you are installing a new battery or a new
chassis, you must replace both the chassis and battery with a new chassis and new battery.
Remove the chassis and battery:
1. Remove the 15 T5 chassis screws from the chassis.
NOTE: The three screws at the top and four screws at the bottom are captive screws.
For certain products, adhesive tape may cover one of the top screws. Remove the adhesive tape to
access the screw.
2. Gently remove the chassis. You can use suction cups or a thin metal tool to help remove the chassis.
To install a new battery:
1. Remove the bottom protective lm from the battery adhesive, and then attach the battery adhesive to
the battery location (1) on the new chassis.
26 Chapter 5 Removal and replacement procedures
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NOTE: Press down the battery adhesive and make sure it is smooth and even.
2. Remove the top protective lm from the adhesive on the chassis, position the top of the battery over the
chassis, and make sure the connectors (2) are aligned.
3. Attach the battery (3) to the chassis.
4. To replace the chassis, place it in the back cover, replace the 15 T5 screws, and then reverse the
remaining prerequisite procedures to complete installation.
Chassis and battery removal 27
Page 32
Rear camera
Description Spare part number
Rear camera (includes cable) 853376-001
Before removing the rear camera, follow these steps:
1. Disconnect the power from the device by unplugging the power cord from the device.
2. Turn o the device. If you are unsure whether the device is o, turn the computer on, and then shut it
down through the operating system.
3. Disconnect all external devices from the device.
4. Remove the card reader tray (see Card reader tray on page 16).
5. Remove the end cap (see End cap on page 17).
6. Remove the display panel assembly (see Display panel assembly on page 18).
7. Remove the chassis (see Chassis and battery removal on page 25).
Remove the rear camera:
1. Remove the M1_L1.4 Phillips screw (1) securing the rear camera ex retaining bracket.
2. Remove the rear camera ex retaining bracket (2). The bracket is part of the Metal Kit, part number
903686-001.
3. Use a spudger to gently disconnect the rear camera ex (3).
4. Use a spudger to gently disconnect the following ex cables from the system board:
1.
Iris camera
2.
Front camera
28 Chapter 5 Removal and replacement procedures
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3.
Audio-out (headphone)/Audio-in (microphone) combo jack
4.
Rear camera
5. Use a spudger to gently remove the rear camera from the chassis.
Reverse this procedure to install the rear camera.
Rear camera 29
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System board
Description Spare part number
System board, includes audio board and thermal pads:
●
For use in North America, equipped with Windows 10, Snapdragon 820 quad core processor, 4 GB,
64 G eMMC
●
For use in the rest of the world, equipped with Windows 10, Snapdragon 820 quad core processor,
4 GB, 64 G eMMC
Before removing the system board, follow these steps:
1. Disconnect the power from the device by unplugging the power cord from the device.
2. Turn o the device. If you are unsure whether the device is o, turn the computer on, and then shut it
down through the operating system.
3. Disconnect all external devices from the device.
4. Remove the card reader tray (see Card reader tray on page 16).
5. Remove the end cap (see End cap on page 17).
6. Remove the display panel assembly (see Display panel assembly on page 18).
7. Remove the chassis (see Chassis and battery removal on page 25).
903660-001
905637-001
8. Remove the rear camera (see Rear camera on page 28).
Remove the system board:
1. Remove the two M1_L1.4 Phillips screws (1) securing the USB ex retaining bracket.
2. Remove the USB ex retaining bracket (2). The bracket is part of the Metal Kit, part number
903686-001.
3. Use a spudger to gently disconnect the USB ex (3) from the system board.
30 Chapter 5 Removal and replacement procedures
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4. Disconnect the main antenna cable (4) from the system board.
NOTE: Note the routing of the cable.
5. Remove the four T5 screws (1) securing the system board.
6. Lift the system board from the back cover.
NOTE: The ngerprint reader/NFC sensor ex cable is connected under the system board. It is next to
the power button, and is routed under the antenna wire.
7. Release the ngerprint reader/NFC module ex cable from the ZIF connector, and then remove the
system board (2).
Reverse this procedure to install the system board.
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Front camera
Description Spare part number
Front camera (includes cable) 853377-001
Before removing the front camera, follow these steps:
1. Disconnect the power from the device by unplugging the power cord from the device.
2. Turn o the device. If you are unsure whether the device is o, turn the computer on, and then shut it
down through the operating system.
3. Disconnect all external devices from the device.
4. Remove the card reader tray (see Card reader tray on page 16).
5. Remove the end cap (see End cap on page 17).
6. Remove the display panel assembly (see Display panel assembly on page 18).
7. Remove the chassis (see Chassis and battery removal on page 25).
8. Remove the rear camera (see Rear camera on page 28).
9. Remove the system board (see System board on page 30).
Remove the front camera:
▲
Lift and remove the front camera.
NOTE: There is adhesive securing the camera to the back cover.
Reverse this procedure to install the front camera.
32 Chapter 5 Removal and replacement procedures
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Iris camera
Description Spare part number
Iris camera (includes cable) 900262-001
Before removing the iris camera, follow these steps:
1. Disconnect the power from the device by unplugging the power cord from the device.
2. Turn o the device. If you are unsure whether the device is o, turn the computer on, and then shut it
down through the operating system.
3. Disconnect all external devices from the device.
4. Remove the card reader tray (see Card reader tray on page 16).
5. Remove the end cap (see End cap on page 17).
6. Remove the display panel assembly (see Display panel assembly on page 18).
7. Remove the chassis (see Chassis and battery removal on page 25).
8. Remove the rear camera (see Rear camera on page 28).
9. Remove the system board (see System board on page 30).
Remove the iris camera:
▲
Lift and remove the iris camera.
NOTE: There is adhesive securing the camera to the back cover.
Reverse this procedure to install the iris camera.
Iris camera 33
Page 38
Antenna board
Description Spare part number
Antenna board 903688-001
Before removing the antenna board, follow these steps:
1. Disconnect the power from the device by unplugging the power cord from the device.
2. Turn o the device. If you are unsure whether the device is o, turn the computer on, and then shut it
down through the operating system.
3. Disconnect all external devices from the device.
4. Remove the card reader tray (see Card reader tray on page 16).
5. Remove the end cap (see End cap on page 17).
6. Remove the display panel assembly (see Display panel assembly on page 18).
7. Remove the chassis (see Chassis and battery removal on page 25).
8. Remove the rear camera (see Rear camera on page 28).
9. Remove the system board (see System board on page 30).
IMPORTANT: Make careful note of the routing of antenna cable for later replacement.
Remove the antenna board:
1. Remove the two M1.1_L2.1 Phillips screws (1) securing the antenna board.
2. Lift and remove the antenna board (2).
Reverse this procedure to install the antenna board.
34 Chapter 5 Removal and replacement procedures
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6 Specications
Metric U.S.
Dimensions (portrait orientation)
Height 16.18 cm 6.37 in
Width 8.35 cm 3.29 in
Depth 0.78 cm 0.31 in
Weight (lowest weight conguration) 0.195 kg 0.43 lb
Input power
The device operates on DC power, which can be supplied by an AC or a DC power source. The AC power source must be rated at 100-240
V, 50/60 Hz, 0.3-1.0 A.
NOTE: The HP adapter included with the device is recommended for charging the device.
Temperature
Operating 0°C to 35°C 32°F to 95°F
Nonoperating ‑20°C to 60°C ‑4°F to 140°F
Relative humidity (non-condensing)
Operating 10% to 90%
Nonoperating 5% to 95%
Maximum altitude (unpressurized)
Operating ‑15 m to 3,048 m ‑50 ft to 10,000 ft
Nonoperating ‑15 m to 12,192 m ‑50 ft to 40,000 ft
NOTE: Applicable product safety standards specify thermal limits for plastic surfaces. The device operates well within this range of
temperatures.
35
Page 40
7 Power adapter requirements
The wide-range input feature of the device permits it to operate from any line voltage from 100 to 120 volts
AC, or from 220 to 240 volts AC.
The 2-conductor power adapter included with the device meets the requirements for use in the country or
region where the equipment is purchased.
Power adapters for use in other countries and regions must meet the requirements of the country or region
where the device is used.
Requirements for all countries
The following requirements are applicable to all countries and regions:
●
The length of the adapter cord set must be at least 1.0 m (3.3 ft) and no more than 2.0 m (6.5 ft).
●
All power adapters must be approved by an acceptable accredited agency responsible for evaluation in
the country or region where the adapter will be used.
Requirements for specic countries and regions
Country/region Accredited agency
Argentina IRAM
Australia SAA
Austria OVE
Belgium CEBEC
Brazil ABNT
Canada CSA
Chile IMQ
Denmark DEMKO
Finland FIMKO
France UTE
Germany VDE
India ISI
Israel SII
Italy IMQ
Japan JIS
The Netherlands KEMA
New Zealand SANZ
36 Chapter 7 Power adapter requirements
Page 41
Country/region Accredited agency
Norway NEMKO
The People's Republic of China CCC
Saudi Arabia SASO
Singapore PSB
South Africa SABS
South Korea KTL
Sweden SEMKO
Switzerland SEV
Taiwan BSMI
Thailand TISI
The United Kingdom ASTA
The United States UL
Requirements for specic countries and regions 37
Page 42
8 Recycling
When a non-rechargeable or rechargeable battery has reached the end of its useful life, do not dispose of the
battery in general household waste. Follow the local laws and regulations in your area for battery disposal.
HP encourages customers to recycle used electronic hardware, HP original print cartridges, and rechargeable
batteries. For more information about recycling programs, see the HP Web site at http://www.hp.com/recycle.
38 Chapter 8 Recycling
Page 43
Index
A
ambient light sensor, identifying 4
antenna board
removal 34
spare part number 10, 34
audio, product description 1
audio-out (headphone)/audio-in
(microphone) combo jack
identifying 4
B
back cover
spare part number 10
battery
removal 25
spare part number 9, 25
Bluetooth label 8
bottom 8
button
power 4
volume down 5
volume up 5
C
cable kit
spare part number 10
cables, service considerations 12
camera
identifying 7
spare part numbers 9, 10, 28
camera, identifying 4
cameras, identifying 4
card reader tray
removing 16
spare part number 10
chassis
removal 25
spare part number 9, 25
chipset, product description 1
components
back 6
front 3
connectors, service considerations
12
D
device, spare part number 10
display kit pressing xture
spare part number 18
display panel assembly
removal 18
spare part number 18
display panel assembly, spare part
number 9
display panel, product description 1
docking, product description 2
E
earpiece, identifying 4
electrostatic discharge 12
end cap
removing 17
spare part number 10
equipment guidelines 15
external expansion, product
description 2
F
ngerprint reader, identifying 6
ashlight
identifying 6
front camera
removal 32
spare part number 9, 32
G
glue for display
spare part number 18
graphics 1
grounding guidelines 12
guidelines
equipment 15
grounding 12
packaging 14
transporting 14
workstation 14
I
IMEI number, locating 8
internal microphone, identifying 5
Iris camera
spare part number 10
iris camera
removal 33
spare part number 33
iris camera, identifying 4
J
jacks
audio-out (headphone)/audio-in
(microphone) combo
K
keyboard, product description 2
L
labels
Bluetooth 8
regulatory 8
serial number 8
service 8
wireless certication 8
WLAN 8
lights
status 4
M
major components 9
mass storage device, product
description 1
memory module, product
description 1
microphone, product description 1
microphones
identifying 6
microSD card reader, identifying 5
microSD card size 5
microSD card tray
removing 16
model name 1
model name, locating 8
mouse, product description 2
4
Index 39
Page 44
N
nano SIM card tray
removing 16
NFC tapping area, identifying 6
O
operating system, product
description 2
P
packaging guidelines 14
plastic parts, service
considerations 12
Pogo pin connector, identifying 7
ports
product description 2
USB Type-C charging 5
power adapter
set requirements 36
power adapter, spare part numbers
10
power button, identifying 4
power requirements, product
description 2
processor, product description 1
product description
audio 1
chipset 1
display panel 1
docking 2
external expansion 2
keyboard 2
mass storage 1
memory module 1
microphone 1
mouse 2
operating system 2
ports 2
power requirements 2
processors 1
product name 1
sensor 1
serviceability 2
storage 1
video 1
wireless networking 1
product name 1
product name and number, device 8
product number, locating 8
R
rear camera
removal 28
spare part number 10, 28
spare part numbers 28
regulatory information
regulatory label 8
wireless certication labels 8
regulatory information, locating 8
S
screw kit, spare part number 10
sensor, product description 1
serial number 8
serial number, device 8
service considerations
cables 12
connectors 12
plastic parts 12
service labels, locating 8
serviceability, product description 2
SIM card
inserting 5
removing 5
SIM card slot, identifying 5
slots
microSD card reader 5
SIM card 5
speakers, identifying 5
specications 35
status light 4
storage, product description 1
system board
removal 30
spare part number 10
spare part numbers 30
T
tape, spare part number 10, 25
tools required 11
transporting guidelines 14
traveling with the device 8
U
USB Type-C charging port,
identifying 5
V
video, product description 1
volume button, identifying 5
W
wireless antennas, identifying 6
wireless certication label 8
wireless charging area, identifying
7
wireless networking, product
description 1
WLAN antennas, identifying 6
WLAN device 8
WLAN label 8
workstation guidelines 14
WWAN antennas, identifying 6
40 Index
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