User manual
DECT Module
User Manual
Abstract
This document provides user guide lines for the DECT Module reference design:
HW description, schematic and PCB details, testability.
HANSONG
Abstract ................................................................................................................................................
Contents ...............................................................................................................................................
Figures ..................................................................................................................................................
Tables ...................................................................................................................................................
Terms and definitions ...................................................................................................................
References .....................................................................................................................................
3 3 Introduction....................................................................................................................................
4 4 General description, block diagram ............................................................................................
Specifications ................................................................................................................................
Schematics.....................................................................................................................................
7 7 Interface Pinning ...........................................................................................................................
8 8 Layout ...........................................................................................................................................
BoM ...............................................................................................................................................
PCB Stackup ................................................................................................................................
Application PCB guidelines .......................................................................................................
RF considerations ...............................................................................................................
Routing ................................................................................................................................
Testability ............................................................................................................................
Debug interface ...................................................................................................................
USB interface ......................................................................................................................
Buttons and LEDs ...............................................................................................................
Revision history .................................................................................................................................
Contents
Figures
Figure 1: Block diagram of DECT Module ............................................................................................. 5
Figure 2: DECT Module Schematics ..................................................................................................... 7
Figure 3: Layout plot of DECT Module ................................................................................................ 10
Figure 4: Debug connector .................................................................................................................. 15
Figure 5. USB interface ....................................................................................................................... 16
Figure 6. Buttons and LEDs on the application / host PCB ................................................................ 16
Tables
Table 1: Specifications table ................................................................................................................. 6
Table 2: Interface connector pinning ..................................................................................................... 8
Table 3: Bill of Materials List ............................................................................................................... 11
Table 4: PCB Layer Stackup ............................................................................................................... 12
Table 2: Pin out of connector , the debug interface of the DECT module........................................... 15
HANSONG
1 Terms and definitions
BoM
CODEC
GPIO
GND
HDI
I2C
I2S
JTAG
LED
Lx
PCB
RF
SMD
UART
USB
Bill of Materials
COder / DECoder
General Purpose Input / Output (pin)
Ground
High Density Interconnect
Inter-IC (serial communication interface)
Inter-IC sound; in the context of this document it is in relation to the
interface on the module that is the scope in this document
Joint Test Action Group (specification of debug interface)
Light Emitting Diode
Layer x
Printed Circuit Board
Radio Frequency
Surface Mount Device
Universal Asynchronous Receiver / Transmitter
Universal Serial Bus
digital audio
2 References
[1] Dialog SmartBeat Wireless Audio brochure
[2] SC14492_493, Datasheet: “Single Chip ZBS DECT Audio Transceiver with USB”, Dialog
Semiconductor
HANSONG
3 Introduction
This document aims to serve as a guide line in regard to the DECT Module and its use on
application level.
The DECT Module is an example HW implementation of the SC14492 chip on a module, to support
the development of wireless speaker systems. The air interface is based on the DECT standard,
meaning that the system can coexist with regular DECT systems such as DECT phones.
The audio CODEC that is used for audio compression is CELT (sample rate: 48kHz).
The DECT Module is meant to serve as a reference design only. The design files can be made
available upon request.
HANSONG
4 General description, block diagram
The DECT Module is a reference design for a SC14492-based module/product. It is a selfcontained unit, including the required supporting components such as crystal, FLASH, DC supply
and RF circuitry.
The module enables a platform-based product development, in which the RF development is
leveraged over multiple products. To further support this platform-based approach, the module
is suited to run the Hansong firmware that is fully configurable and enables easy customization
without requiring full SW development.
The module supports all required standard interfacing, such as I2S, I2C, USB and GPIO.
The following figure shows the basic module’s block diagram and its interfacing to the application
PCB:
IPEX Connector
MAIN MODULE
Figure 1: Block diagram of DECT Module
Board interconnect
Board interconnect
Add-on board
HANSONG
Table 1: Specifications table
including RF, FLASH, crystal
Operating temperature range
Optional up to 2 external
Antenna diversity support
antennas (U.FL Hirose / IPEX)
Antenna radiation pattern
Operating frequency range
Input power supply voltage
Pre-test only. Full certification
will need to be performed by
the customer. Changes to the
reference design may invalidate
50 m indoor, 300 m outdoor