Hansong DECT User Manual

User manual

DECT Module

User Manual

Abstract

This document provides user guide lines for the DECT Module reference design:
HW description, schematic and PCB details, testability.

HANSONG

Abstract ................................................................................................................................................

1

Contents ...............................................................................................................................................

2

Figures ..................................................................................................................................................

2

Tables ...................................................................................................................................................

2

1

Terms and definitions ...................................................................................................................

3

2

References .....................................................................................................................................

3 3 Introduction....................................................................................................................................

4 4 General description, block diagram ............................................................................................

5

5

Specifications ................................................................................................................................

6

6

Schematics.....................................................................................................................................

7 7 Interface Pinning ...........................................................................................................................

8 8 Layout ...........................................................................................................................................

10

9

BoM ...............................................................................................................................................

11

10

PCB Stackup ................................................................................................................................

12

11

Application PCB guidelines .......................................................................................................

13

11.1

RF considerations ...............................................................................................................

13

11.2

Routing ................................................................................................................................

13 11.3

Testability ............................................................................................................................

14

11.4

Debug interface ...................................................................................................................

15 11.5

USB interface ......................................................................................................................

16

11.6

Buttons and LEDs ...............................................................................................................

16

Revision history .................................................................................................................................

17

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Contents

Figures

Figure 1: Block diagram of DECT Module ............................................................................................. 5

Figure 2: DECT Module Schematics ..................................................................................................... 7

Figure 3: Layout plot of DECT Module ................................................................................................ 10

Figure 4: Debug connector .................................................................................................................. 15

Figure 5. USB interface ....................................................................................................................... 16

Figure 6. Buttons and LEDs on the application / host PCB ................................................................ 16

Tables

Table 1: Specifications table ................................................................................................................. 6

Table 2: Interface connector pinning ..................................................................................................... 8

Table 3: Bill of Materials List ............................................................................................................... 11

Table 4: PCB Layer Stackup ............................................................................................................... 12

Table 2: Pin out of connector , the debug interface of the DECT module........................................... 15

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1 Terms and definitions

BoM

CODEC

GPIO
GND
HDI
I2C
I2S

JTAG
LED
Lx
PCB
RF
SMD
UART
USB

Bill of Materials
COder / DECoder
General Purpose Input / Output (pin)
Ground
High Density Interconnect
Inter-IC (serial communication interface)

Inter-IC sound; in the context of this document it is in relation to the

interface on the module that is the scope in this document
Joint Test Action Group (specification of debug interface)
Light Emitting Diode
Layer x
Printed Circuit Board
Radio Frequency
Surface Mount Device
Universal Asynchronous Receiver / Transmitter
Universal Serial Bus

digital audio

2 References

[1] Dialog SmartBeat Wireless Audio brochure
[2] SC14492_493, Datasheet: “Single Chip ZBS DECT Audio Transceiver with USB”, Dialog

Semiconductor

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3 Introduction

This document aims to serve as a guide line in regard to the DECT Module and its use on
application level.

The DECT Module is an example HW implementation of the SC14492 chip on a module, to support
the development of wireless speaker systems. The air interface is based on the DECT standard,
meaning that the system can coexist with regular DECT systems such as DECT phones.

The audio CODEC that is used for audio compression is CELT (sample rate: 48kHz).
The DECT Module is meant to serve as a reference design only. The design files can be made

available upon request.

HANSONG

QSPI

Flash

RX

RX/TX

Ant

Con

trol

XTAL

(20.736
MHz)

balun

Switch

Switch

TX

Sc14492

balun

DP/DM

DC_IN and

VBUS

I2C

I2S/PCM

BXTAL

UART

JTAG

GPIO

LED

1V8

Reset

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4 General description, block diagram

The DECT Module is a reference design for a SC14492-based module/product. It is a self­contained unit, including the required supporting components such as crystal, FLASH, DC supply
and RF circuitry.

The module enables a platform-based product development, in which the RF development is
leveraged over multiple products. To further support this platform-based approach, the module
is suited to run the Hansong firmware that is fully configurable and enables easy customization
without requiring full SW development.

The module supports all required standard interfacing, such as I2S, I2C, USB and GPIO.

The following figure shows the basic module’s block diagram and its interfacing to the application

PCB:

IPEX Connector

MAIN MODULE

Figure 1: Block diagram of DECT Module

Board interconnect

Board interconnect

Add-on board

HANSONG

5

Specifications

Table 1: Specifications table

Parameter

Value

Note

Module size

40.8mm x 36.5mm x 1.6mm

Fully embedded module,

including RF, FLASH, crystal

Mating connector

R6850-36TR-SMT

Or equivalent

Operating temperature range

0…+50C

Ambient

Interfacing

I2S (input and output)

FP = I2S Slave, PP = I2S

I2C

Master

USB

JTAG

UART

GPIOs

For LEDs and buttons

Antennas

2 printed PIFA

Optional up to 2 external

Antenna diversity support

antennas (U.FL Hirose / IPEX)

Antenna radiation pattern

Dipole, 2dBi

Operating frequency range

1880 - 1930MHz

EU DECT, US DECT

Current consumption

160 / 95 mA

FP / PP

Input power supply voltage

3.6V~5.0V

±150 mV

GPIO I/O levels

1.8 V

Type approval

ETSI/FCC

Pre-test only. Full certification

will need to be performed by

the customer. Changes to the

reference design may invalidate

the pre-test results.l

Range

50 m indoor, 300 m outdoor

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6 Schematics

Figure 2: DECT Module Schematics

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FCC Frequency

CE Frequency

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7

Interface Pinning

Table 2: Interface connector pinning

Connector pinning

Pin Description

Pin

Description

1

GND

19

GND

2

DC-PWR-IN

20

GPIO_P1.4

3

DC-PWR-IN

21

GPIO_P1.3

4

GND

22

GPIO_P1.5

5

GND

23

GND

6

1V8

24

I2C_SDA2

7

GND

25

I2C_SCL2

8

VBUS

26

GND

9

GND

27

UART_TX

10

USB_DM

28

UART_RX

11

USB_DP

29

GND

12

GND

30

JTAG

13

GND

31

GND

14

BXTAL

32 GPIO_P2.1(LED)

15

I2S_SDIN

33 GPIO_P2.0(LED)

16

I2S_LRCK

34

GND

17

I2S_SDOUT

35

RSTN

18

I2S_SCLK

36

GND

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The interface connector pins are also available on test pins (see also section 11.3).

Next to the connector pinning described here above, the DECT Module also holds two RF connectors that can be
used to connect one or two external antenna(s). These are standard U.FL Hirose (IPEX) connectors.

Note that using these will require changing some components on the PCB. Please contact Hansong
support for further details.

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Name/

Description

Power

Power supply input pin of I2S module.

GND

Connect to application PCB GND plane

JTAG

JTAG debug pin of SC14492 (pin A10)

UART_TX

UART TX, P0[0] of SC14492, connect to application PCB

UART RX pin if UART support is required

UART_RX

UART RX, P0[1] of SC14492, connect to application PCB

UART TX pin if UART support is required

LED 1/2

Can be used to drive external LED 1/2

GPIO1/2/3

GPIO pin used to connect to external switch, LED or other

digital IO device

I2C_SDA

I2C interface serial data pin, P0[2] of SC14492; requires

external pull up resistor

I2C_SCL

I2C interface serial clock pin, P0[3] of SC14492; requires

external pull up resistor

I2S data in

I2S interface data input of SC14492 on I2S module (connect

to external audio ADC/DAC I2S output)

I2S data out

I2S interface data output of SC14492 on I2S module

(connect to external audio ADC/DAC I2S input)

BCLK I2S interface bit clock

LRCK

I2S interface left/right clock

USB _DM

USB interface data ”-”

USB_DP

USB interface data ”+”

RF ANT 1/2

RF antenna 1/2: printed antenna with optional U.FL/IPEX

connector for external antenna support

VBUS

USB supply voltage (input to module)

1V8

1V8 power supply output of I2S module that can be used to

supply e.g. external audio ADC/DAC

Optional I2S master clock output:

note that this is a

BXTAL

10.368MHz signal. In case e.g. 12.288MHz is required, an

external PLL may be required.

Reset

Active low reset signal to reset SC14492 of I2S module

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Note that the digital IO levels (except I2C) are 1.8V.
Please also refer to the SC14492 datasheet [2] for further pinning details.

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8 Layout

Here below a layout plot is depicted of the DECT Module:

Figure 3: Layout plot of DECT Module

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9

BoM

Table 3: Bill of Materials List

ID

Description

Manufacturer

Order number

Count

1

MX25U8035EM1I-10G

MXIC

MX25U8035EM1I-10G

1

2

SC14492,ZBS DECT Transceiver with USB

Dialog
Semiconductor

SC14492A76R101ULC

1 3 SKY13453-385LF

SKYWORKS

SKY13453-385LF

2 4 AP2112K-3.3TRG1

Diodes(BCD)

MMBT4403M3T5G

1 5 MMBT4403M3T5G

ON

MMBT4403M3T5G

1 6 0Ω,0201,1/20W,±5%,RC0201JR-070RL

YAGEO

RC0201JR-070RL

1

7

0Ω,0201,1/20W,±5%,RC0201JR-070RL

YAGEO
RC0201JR-070RL

pcb
antenna：2

8

0Ω,0201,1/20W,±5%,RC0201JR-070RL

YAGEO
RC0201JR-070RL

external
antenna：2

9

0Ω,0402,1/16W,±5%,RC0402JR-070RL

Yageo/Phicomp

RC0402JR-070RL

1

10

10KΩ,0201,1/20W,±5%,RC0201JR-0710KL

Yageo

RC0201JR-0710KL

1

11

22R±5%,0201

YAGEO

2 12

2K7±5%,0201

YAGEO

1 13

33Ω,0201,1/20W,5%, RC0201JR-0733RL

Yageo

RC0201JR-0733RL

4

14

560R±5%,0201

YAGEO

1 15

56k 1% 0201

YAGEO

1 16

0.6p +/- 0.05 NP0,0201

2

17

1uK,16V,0402,X5R,C1005X5R1C105K

TDK/Phicomp

C1005X5R1C105K

2

18

100nF,10V,±10%,X5R,C0201KRX5R6BB104

TDK / YAGEO

C0201KRX5R6BB104

7

19

10nK,10V,0201,X7R,C0603X7R1A103KT00NN

Yageo/Phicomp

C0603X7R1A103KT00NN

3

20

10pF 25V ±5% 0201NPO,GRM0335C1E100JD01D

Murata

GRM0335C1E100JD01D

12

21

10uK,10V,0603,X5R,CL10A106KP8NNNC

Samsung

CL10A106KP8NNNC

1

22

CAP,0201,C0G,1.0pF,+/-0.1pF,25V

Murata

4 23

1.2pC,25V,0201,NPO,C0603C0G1E1R2C

TDK/Yageo

C0603C0G1E1R2C

1

24

1p5 ,+/-0.1pF NP0 25V

Murata

5

25

22pF 50V ±5% 0201 NPO, CC0201JRNPO9BN220

Murata

CC0201JRNPO9BN220

7

26

CAP,0201,C0G,2.7pF,+/-0.25pF,25V

MURATA

1 27

2.2uM,6.3V,0402,X5R

Yageo

3 28

3p3 ,+/-0.1pF NP0 25V,0201

Murata

1 29

4.7pF,+/-0.1pF,25V,0201,NPO

TDK/Yageo/和伸堂

2 30

Coil, chip 18nH Wirewound
±3%,LQW15AN18NH00x,0402

Murata
LQW15AN18NH00x

2
31

Inductor Chip 1n2,±0.1nH,LQP03TN1N2B02,0201

Murata

LQP03TN1N2B02

1

32

Inductor Chip 1n5'±0.1nH,LQP03TN1N5B02,0201

Murata

LQP03TN1N5B02

1

33

HK0603 2N2S-T,2.2 ±0.3nH,LQP03TN2N2B02#,0201

TAIYO YUDEN

LQP03TN2N2B02#

2

34

Inductor Chip 3n3,±0.1nH,LQP03TN3N3B02,0201

Murata

LQP03TN3N3B02

1

35

Inductor Chip 3n9'±0.1nH,LQP03TN3N9B02#,0201

TDK

LQP03TN3N9B02#

2

36

4.7nH ±0.3nH,LQP03TN4N7H02,0201

WE

LQP03TN4N7H02

2

37

5n6 '±3%,LQP03TN5N6H02,0201

Murata

LQP03TN5N6H02

2

38

KFM110Z-1002-7F
FOXCONN

external
antenna：2

39

36PIN,0.5mm, R6850-36TR-SMT

晋宇

R6850-36TR-SMT

1

40

SHIELDING COVER FRAM-2

1

41

SHIELDING COVER

1

42

TZ1284B, 20.736 MHz

TAI-SAW Technology

TZ1284B

1

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HANSONG

Parameter

Value

Note

Board Definition

PCB

Rigid

Stack-up

1-2-1

SMD

Single-sided

Via-type

Through, microvia

Layer Definition

Multilayer – 4L

Laminate

FR-4

Board size

36.5mm x 40.0mm

+/-0.2mm

Board thickness

1.6mm

+/-10%

Surface finish

Immersion Gold

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10 PCB Stackup

Table 4: PCB Layer Stackup

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11 Application PCB guidelines

This section describes some guidelines in relation to the use of the DECT Module with the
application (host) PCB.

11.1 RF considerations

To ensure optimum wireless performance of the DECT Module, special attention should be paid to
the antenna selection and placement. In case the internal/embedded printed antennas are used,
the module location would be best selected by focusing on the following:

● Ensure that the antennas are uninhibited as much as possible (e.g. by placing the module at

the corner of the application PCB

● Ensure that no components , traces or ground/power planes are close to the module; they

should preferably be spaced >>2cm away

● The module location with respect to the product’s enclosure should be such that the antennas

are not close to conductive parts (e.g. metallic paint, metal parts, wiring, …)

○ Should this be insufficiently feasible, it can be considered to use external antennas instead,

to have optimum design freedom with respect to the antenna placement for optimum

● The antennas may radiate significant RF power. Care should be taken to ensure that e.g. an

● The module has a provision for an optional RF shield that can be used to minimize EMC/EMI

11.2 Routing

High speed signals, such as the I2S bus (most notably the BLCK) and/or other digital/clock

signals should be routed with great care, to ensure that their harmonics aren’t received by the
module’s antennas, limiting its receiver sensitivity. To this effect, the following can be considered:

● Use C-R-C filtering pi-networks on signal lines that are high speed

● Route high speed signals on inner layers, while ensuring that they are sandwiched

Other general audio/RF design guidelines would apply, such as the use of a good (uninterrupted)
system ground plane, sufficiently thick traces for the power supply routing, etc.

Also, to minimize current switching noise from the module to the application PCB, it may
be advisable to use solid, wide frequency1 decoupling close to the connector.

1

E.g. at least a large valued capacitor, e.g. 100uF, to buffer the larger LF current peaks and 10pF to decouple the RF content.

performance

analog audio ADC/DAC is not affected by this (i.e. rectifying the RF energy inside the
ADC/DAC and causing audible artefacts). This can be accomplished by any of the following:

○ Ensure sufficient physical separation between the antennas
○ Use a C-R-C filtering pi-network at the analog audio IO (e.g. R=33Ohm, C=10pF)

in case this is required on the application level

between power/GND planes for optimum shielding/isolation

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11.3 Testability

BAT files can be made available that configure the module in specific test modes that can be
used for production level testing.

The interface pins are also available on test pins, located on the bottom side of the PCB, suitable
for a bed-of-nails (pogo-pins) test bed (pin-to-pin spacing >100 mil).

HANSONG

Pin

Label

Connect to

Function

1

GND GND 2

URX

See picture, pin 4

UART 3

UTX

See picture, pin 3

UART 4

JTAG

See picture, pin 2

1wire JTAG

5

1v8

See picture, pin 1,

Power

including resistor

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11.4 Debug interface

On the application / host PCB, in order to support application programming debugging, there
needs to be a provision for the debug connector. For connecting the Unity box the standard (white)
connector has to be used.

Table 5: Pin out of connector , the debug interface of the DECT module

Figure 4: Debug connector

HANSONG

11.5 USB interface

Here below the USB interface to/from the DECT module is depicted.
Note that D1 should become part of the application / host PCB.

Figure 5. USB interface

11.6 Buttons and LEDs

Here below a possible implementation of buttons/LEDs is depicted for the application / host PCB:

Figure 6. Buttons and LEDs on the application / host PCB

Federal Communications Commission (FCC) Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part15 of the FCC Rules.

These limits are designed to provide reasonable protection against harmful interference in a
residentiallinstallation. This equipment generate, uses and can radiate radio frequency energy and, if
not installed and used in accordance with the instructions, may cause harmful interference to radio
communications.

However, there is no guarantee that interference will not occur in a particular installation. If this
equipment doescause harmful interference to radio or television reception, which can be determined
by turning the equipmentoff and on, the user is encouraged to try to correct the interference by one of
the following measures:

 Reorient or relocate the receiving antenna.
 Increase the separation between the equipment and receiver.
 Connect the equipment into an outlet on a circuit different from that to which the receiver

is connected.

 Consult the dealer or an experienced radio/TV technician for help.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment.

RF exposure warning

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment must be installed and operated in accordance with provided instructions and the
antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20
cm from all persons and must not be collocated or operating in conjunction with any other antenna or
transmitter.

Industry Canada (IC)

CAN ICES-3 (B)/NMB-3(B)

This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the
following two conditions:
(1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause
undesired operation.
Cetappareilestconforme à la norme RSS d'Industrie Canada. Son fonctionnementestsujet aux deux
conditions suivantes:
(1) ledispositif ne doit pas produire de brouillagepréjudiciable, et
(2) cedispositifdoit accepter tout brouillagereçu, y compris un brouillage susceptible de provoquer un
fonctionnementindésirable.

IMPORTANT NOTE:

Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20cm between the radiator
and your body.
Déclarationd'exposition aux radiations:
Cetéquipementestconforme aux limitesd'exposition aux rayonnements IC établies pour
unenvironnement non contrôlé. Cetéquipementdoitêtreinstalléetutilisé avec un minimum de 20cm de
distance entre la source de rayonnement et votre corps.

OEM Integration Instructions：

Antenna Type

Part No.

Peak Antenna Gain

Dipole Antenna

N/A

2dBi

Monopole Antenna

45-2-000272

2dBi

PCB Antenna

RC12WFI0283A1

2dBi

This device is intended only for OEM integrators under the following conditions：
The module can be used to installation in other host. The antenna must be installed such that 20 cm

is maintained between the antenna and users, and the transmitter module may not be co-located with
any other transmit or antenna. The module shall be only used with the integral antenna(s) that has
been originally tested and certified with this module. As long as 3 conditions above are met, further
transmitter test will not be required. However, the OEM integrator is still responsible for testing their
end-product for any additional compliance requirement with this module installed (for example, digital
device emission, PC peripheral requirements, etc.)

IMPORTANT NOTE：

In the event that these conditions cannot be met (for example certain laptop configuration or co­location with another transmitter), then the FCC authorization for this module in combination with the
host equipment is no longer considered valid and the FCC ID of the module cannot be used on the
final product. In these and circumstance, the OEM integrator will be responsible for re-evaluating. The
end product (including the transmitter) and obtaining a separate FCC authorization. The final end

product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID:
XCO-DECT or Contains FCC ID: XCO-DECT”.

Antenna Specification:

IMPORTANT NOTE：

Antenna Type

Part No.

Peak Antenna Gain

Dipole Antenna

N/A

2dBi

Monopole Antenna

45-2-000272

2dBi

PCB Antenna

RC12WFI0283A1

2dBi

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This DECT Module (IC: 7756A-DECT) has been approved by Industry Canada to operate with the
antenna types listed below with the maximum permissible gain indicated. Antenna types not included
in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.

The Host Marketing Name(HMN) must be displayed (according to e-labelling requirements) or
indicated at any location on the exterior of the host product or product packaging or product literature,
which shall be available with the host product or online.
The host product shall be properly labelled to identify the modules within the host product. The
Innovation, Science and Economic Development Canada certification label of a module shall be
clearly visible at all times when installed in the host product; otherwise, the host product must be
labelled to display the Innovation, Science and Economic Development Canada certification number
for the module, preceded by the word “Contains” or similar wording expressing the same meaning, as
follows: Contains IC: 7756A-DECT.
Antenna Specification:

Revision

Date

Description

1.0

13-Dec-2017

Initial version.

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Revision history