HAIER
COLOUR TELEVISION
SERVICE MANUAL
PART # TV-8888-24
HAIER AMERICA TRADING, LLC
www.haieramerica.com
1
TABLE OF CONTENTS
Product Code Explanation and Series |
|
3 |
Introduction |
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|
Features |
|
4 – 5 |
Safety Precautions |
|
6 |
Warning and Cautions |
|
7 – 8 |
General Servicing Precautions |
9 |
– 13 |
Net Dimension |
|
14 |
Parts and Functions |
|
15 |
Remote Controller Functions |
|
16 |
Program Diagram |
17 –22 |
|
Maintenance Service and Troubleshooting |
23 |
– 27 |
Circuit Diagram |
28 |
– 30 |
Circuit Explanation |
31 |
– 33 |
Service Mode and Adjusting Items and |
34 –36 |
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Data |
|
|
Circuit Signals Processing |
37 |
– 41 |
Adjustment |
42 |
– 43 |
Information of Resistors and Capacitors |
|
44 |
Abbreviation of Part Name and |
|
45 |
Description |
|
|
Terminal View of Transistors |
|
46 |
2
PRODUCT CODE EXPLANATION AND SERIES INTRODUCTION
BH 2004 D
BRAND
CRT cater corner 20inch
Color television appearance
3
FEATURES
No |
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|
FUNCTION |
|
|
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|
|
|
1 |
|
Main IC |
|
76814 |
2 |
|
CRT |
|
Flat picture |
3 |
PIC |
Color system |
|
NTSC3.58 |
4 |
Audio system |
|
M |
|
5 |
No. Of channels |
|
181 |
|
|
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|||
6 |
|
OSD language |
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ENGLISH FRENCH SPANISH |
7 |
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Multi-picture modes |
|
|
8 |
|
AV stereo |
|
|
9 |
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Super woofer |
|
|
10 |
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Surrounding sound |
|
|
11 |
AUDIO |
Treble/bass boost |
|
|
12 |
Left/right balancer |
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|
|
13 |
NICAM |
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|
|
14 |
Multi-audio modes |
|
|
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||
15 |
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Tone adjuster |
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|
16 |
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MTS/SAP |
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17 |
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Auto-volume leveling |
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|
18 |
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AV input |
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Y |
19 |
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AV output |
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|
20 |
JIC |
DVD terminal |
|
|
21 |
S-video jack |
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|
|
|
|
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||
22 |
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Headphone socket |
|
Y |
23 |
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SCART socket |
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24 |
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Digital curtain |
|
|
25 |
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Slow fading on & off |
|
|
26 |
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Semitransparent menu |
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|
27 |
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Non-flashing channel changing |
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|
28 |
SOFTWARE |
ZOOM |
|
|
29 |
16:9 mode |
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|
30 |
Games |
|
|
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31 |
Calendar |
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32 |
Child-lock |
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|
|
33 |
Multi-functional lock |
|
Y |
|
34 |
|
No-picture listening |
|
|
35 |
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Background light |
|
|
36 |
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Auto-timer on |
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|
37 |
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CCD |
|
Y |
38 |
|
V-CHIP |
|
Y |
4
Continued:
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
FUNCTION
|
NO. Of built-in speakers |
1 |
|
|
Audio output power (W) |
3W |
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|
Total power input W |
70W |
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PARAMETER |
Voltage range V |
120V |
|
Power frequency Hz |
60HZ |
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|||
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Time of sleep timer (mins) |
120MIN |
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|
Net weight (lbs) |
46.2 |
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Gross weight (lbs) |
50.7 |
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|
Net dimension (MM) |
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|
|
Packaged dimension (MM) |
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Quantity for 20' container |
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Quantity for 40' container |
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Quantity for 40' high container |
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APPROVAL |
Acquired certificate |
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|
|
Suitable market |
|
5
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
These parts identified by many electrical and mechanical parts in this chassis have special safety-related characteristics.
It is essential that these special safety parts be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other hazards.
Do not modify the original design without permission of the manufacturer.
General Guidance
An Isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents that might result in personal injury caused by electrical shocks.
It will also protect the receiver and its components from being damaged by accidental shorts of the circuitry that might be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with a specified one.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 0.39inch away from PCB.
Keep wires away from high voltage or high temperature parts.
Due to the high vacuum and large surface area of the picture tube, extreme care should be taken in handling the Picture Tube. Do not lift the Picture Tube by its Neck.
X-RAY Radiation Warning:
The sources of X-RAY RADIATION in this TV receiver are the High Voltage Section and the Picture Tube.
For continued X-RAY RADIATION protection, the replacement tube must be of the same type as specified in the Replacement Parts List.
Before returning the receiver to the customer, always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to make sure that the set is safe to operate without any danger of electrical shock.
6
WARNING AND CAUTIONS
1. When you clean the TV set, please pull out the power plug from AC outlet. Don't clean the cabinet and the screen with benzene, petrol and other chemicals.
2. In order to prolong the using life of the TV set, please place it on a ventilated place.
3. Don't place the TV set in the sunshine or near heat source.
4. To prevent the TV set from firing and electric shock, don't
make the TV set rain or moisture.
5. Don't open the back cover, otherwise it is possible to damage the components in the TV set and harm you.
6. When the TV set isn't going to be used for long time or it is in thunder and lightening, please pull out the plug from AC outlet and the antenna plug from the cover of the TV set.
7
Explanation on the display tube
Generally, it is not required to clean the tube surface. However, if necessary, its surface can be cleaned with a dry cotton cloth after putting off the power. Don’t use any cleanser. Avoid using a hard cloth; the tube surface will be damaged.
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS.
NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions, always follow the safety precautions.
NB: Remember; Safety First.
8
GENERAL SERVICING PRECAUTIONS
1.Always unplug the receiver AC power cord from the AC power source before:
a.Removing or reinstalling any component, circuit board module or any other assembly of the receiver.
b.Disconnecting or reconnecting any receiver electrical plug or other electrical connection.
c.Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.
CAUTION: A wrong substitution part or incorrect installation polarity of electrolytic capacitors may result in an explosion hazard.
d.Discharging the picture tube anode.
2.Test high voltage only by measuring it with an appropriate high voltage meter or other voltage-measuring device (DVM, FETVOM, etc.) equipped with a suitable high voltage probe. Do not test high voltage by “drawing an arc”.
3.Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.
4.Do not spray chemicals on or near this receiver or any of its assemblies.
5.Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable nonabrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of contacts is not required.
6.Do not defeat any plug / socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
7.Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
8.Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in this service manual.
CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.
9
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components are usually called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity.
1.Immediately before handling any semiconductor component or semiconductorequipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static type folder removal device. Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise even some normally harmless motions such as mutual brushing of your clothes’ fabric or lifting of your foot from a carpeted floor might generate static electricity sufficient to damage an ES device.)
General Soldering Guidelines
1.Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range of 500 oF to 600 oF.
2.Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3.Keep the soldering iron tip clean and well tinned.
4.Thoroughly clean the surfaces to be soldered. Use a mall wire bristle (0.5 inch) brush with a metal handle. Do not use freon-propelled spay-on cleaners.
10
5.Use the following unsoldering technique
a.Allow the soldering iron tip to reach normal temperature. (500 oF to 600oF)
b.Heating the component lead until the solder melts.
c.Quickly draw the melted solder with an anti-static, suction-type solder removal device with solder braid.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
6.Use the following unsoldering technique
a.Allow the soldering iron tip to reach normal temperature. (500 o F to 600o F)
b.First, hold the soldering iron tip and solder the strand against the component lead until the solder melts.
c.Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
Removal /Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are of slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined.
Removal
De-solder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
Carefully insert the replacement IC in the circuit board.
Carefully bend each IC lead against the circuit foil pad and solder it.
Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
11
“Small-Signal” Discrete Transistor
Removal/Replacement
Remove the defective transistor by clipping its leads as close as possible to the component body.
Bend into a “U” shape the end of each of three leads remaining on the circuit board. Bend into a “U” shape the replacement transistor leads.
Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the “U” with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
Heat and remove all solder from around the transistor leads. Remove the heat sink mounting screw (if so equipped).
Carefully remove the transistor from the heat sink of the circuit board. Insert new transistor in the circuit board.
Solder each transistor lead, and clip off excess lead. Replace heat sink.
Diode Removal/Replacement
Remove defective diode by clipping its leads as close as possible to diode body. Bend the two remaining leads perpendicularly to the circuit board.
Observing diode polarity, wrap each lead of the new diode round the corresponding lead on the circuit board.
Securely crimp each connection and solder it.
Inspect (on the circuit board copper side) the solder joints of the two “original” leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1.Clip each fuse or resistor lead at top of the circuit board hollow stake.
2.Securely crimp the leads of replacement component around notch at stake top.
3.Solder the connections
12
CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds foil to the circuit board causing the foil to separate from or “liftoff” the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).
1.Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2.Carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3.Bend a small “U” in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4.Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At other connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1.Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to insure that a hazardous condition will not exist if the jumper wire opens.
2.Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.
3.Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so that it does not touch components or sharp edges.
13
NET DIMENSION
14
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