Habey BIS-6590 User Manual

BIS-6590
Owner’s Manual
Fanless Ivy Bridge Dual GbE Barebone System with
PCI & PCIe Expansion Slots
Disclaimer
Except for the accessories attached to the product as spec-
ied herein, what is contained in this user manual does not
represent the commitments of Habey USA Company. Habey
gers due to improper installation or operation.
Before ordering products, please learn about the product per­formance from the distributors to see if it is in line with your needs.
The contents of this manual are protected by copyright law. All rights are strictly reserved. Any form of unauthorized re-
production including but not limited to carbon copy, facsimile
transmission and electronic copy or email is prohibited.
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Safety Instructions
1. Please read the product manual carefully before using this
product.
2. Put all the unused or uninstalled boards or electronic compo­nents on a static dissipative surface or in static shielding bag.
3. Always ground yourself to remove any static discharge before
touching board. To ground, place your hands on a grounding metal
object or wear a grounding wrist strap (not included) at all times.
4. When taking or fetching the boards or cards, please wear anti­static gloves and hold the boards by its edges.
5. Make sure that your power supply is set to the correct voltage in your area. Incorrect voltage may cause personal injuries and damage the system.
6. To prevent electronic shock hazard or any damage to the prod-
uct, please ensure that all power cables for the devices are un­plugged when adding or removing any devices or reconguring
the system.
7. To prevent electrical shock, disconnect the power cable from the electrical outlet before relocating the system.
8. When adding or removing components to or from the system, ensure that all the power cables for the system are unplugged pri­or to installation or removal.
9. To prevent any unnecessary damage to the products due to fre-
quent power on/off, please wait at least 30 seconds to restart the
unit after the shutdown.
10. If the system fails during normal operation, do not attempt to x yourself. Contact a qualied service technician or your retailer.
11. This product is classied as Class A product, which may cause radio interference in our living environment. In this occasion, users
need to take measures to handle the interference.
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Content
Section 1 Product Introduction ................................................. 1
1.1 Overview ............................................................................ 1
1.2 Specications ..................................................................... 1
1.2.1 Notes to use CPU............................................................ 3
Section 2 Installation Instructions ............................................. 3
Safety Precautions ................................................................... 3
2.1 Remove the Computer Cover............................................. 5
2.2. Install Motherboard............................................................ 5
2.2.1 Install CPU and Thermal Pad .......................................... 5
2.2.2 Dismount Rear Panel ...................................................... 7
2.2.3 Install the Motherboard.................................................... 7
2.2.4 Mount Rear Panel ........................................................... 8
2.3 Install Motherboard MOS Heatsink .................................... 8
2.4 Install RAM ....................................................................... 10
2.5 Install MINI-PCIE Devices ................................................ 11
2.6 Install HDD ....................................................................... 12
2.7 Mount the Top Cover ........................................................ 13
2.8 Dismount the Bottom Cover ............................................. 13
2.9 Install PCI/PCIE Cards ..................................................... 14
2.10 Install PCI/PCIE Devices ................................................ 14
2.11 Mount the Bottom Cover and Racks ............................... 15
2.12 Rack Dimension ............................................................. 16
Section 3 Hardware Functions ............................................... 17
3.1 External Interfaces Location ............................................. 17
3.1.1 Serial Ports .................................................................... 17
3.1.2 Ethernet Port ................................................................. 18
3.1.3 Audio ............................................................................. 19
3.1.4 Display Interface............................................................ 19
3.1.5 Power Interface ............................................................. 20
3.1.6 USB Ports ..................................................................... 20
3.2 Jumper Settings .............................................................. 20
3.2.1 CMOS Clear/Hold Jumper Setting ................................ 20
3.2.2 Hardware Switch for System Auto Boot Upon Power On ....... 22
3.2.3 COM2 Jumper Setting ................................................... 22
3.3 Internal Interfaces............................................................. 23
3.3.1 SATA Port ...................................................................... 23
3.3.2 Keyboard & Mouse Interface ......................................... 25
3.3.3 GPIO ............................................................................. 26
3.3.4 Front Panel Interface ..................................................... 27
3.3.5 DIMM Slot...................................................................... 28
3.3.6 MINI PCIe Socket .......................................................... 28
3.3.7 PCIe X16 ....................................................................... 28
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Section 4 BIOS Setup ............................................................. 29
AMI BIOS Flash ......................................................................29
AMI BIOS Description ............................................................. 29
BIOS Settings .........................................................................29
4.1 Main Menu ........................................................................30
4.2 Advanced Menu ................................................................ 31
4.2.1 ACPI Setting................................................................... 31
4.2.2 APM Conguration .........................................................32
4.2.3 CPU Conguration ......................................................... 33
4.2.4 SATA Conguration ........................................................34
4.2.5 USB Conguration .........................................................35
4.2.6 Supper IO Conguration ................................................ 36
4.2.7 H/W Monitor ................................................................... 37
4.3 Chipset Menu .................................................................... 37
4.3.1 North Bridge ................................................................... 37
4.3.2 South Bridge ..................................................................38
4.4 Boot Menu.........................................................................39
4.5 Security Menu ................................................................... 40
4.6 Save&Exit Menu ...............................................................40
Appendix ................................................................................. 41
Appendix 1: Install Drives .......................................................41
Appendix 2: Watchdog Programming Guide ...........................42
Appendix 3: Glossary .............................................................. 42
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Packing List
1
Thank you for purchasing a Habey USA product. Please check this package carefully to ensure all parts are pack-
aged. If you nd any defective, damaged, or lost compo­nents, please contact your vendor or retailer ASAP.
Item QTY.
BIS-6590 1 DC 12V 10A Power Adapter 1 Power Cord 1 Drivers and Utilities 1
Section 1 : Product Introduction
1.1 Overview
The BIS-6590 is an Intel Sandy/Ivy Bridge and Celeron CPU powered embedded system utilizing the next generation proprietary large “ICEFIN” thermal design. The design ensures maximum heat dissipation and is a
true fanless system with Intel H61/Q77/B75 Chispets. 2x DDR3 DIMM slots support dual channel DDR3 1066/1333/1600 MHz , with maximum
memory of up to 16GB . Does not support ECC . The VGA + DVI dual independent display outputs supports resolutions up to 2048x 1536. The
fanless system also provides 1x SATA II / SATAIII hard disk interface , 6x USB 2.0, 2x COM, 2x Gigabit Ethernet ports and 1x8 channel GPIO . It also provides 1x PCIex4, 2x PCI for expansion exibility. Other features
include Wake on LAN and watchdog and other advanced features. This
system can be used for Intelligent Transportation, Information Control, On-Board Vehicle Computing, Media Players, Digital Signage, Industrial
Automation and many other applications.
1.2 Specication
Product Type
Platform
BIS-6660 The Next Generation Large “ICEFIN” Fanless Embedded System
Intel
Chassis
2
Mother-
board
Storage
System
Features
Power
Reliability
Color
Dimension
Structure
Material
Model No.
CPU
Chipset
Memory
CF
SSD
HDD
LAN
USB
COM
Display
Cooling Sys.
Audio
Expansion
LED
System Control
PS/2
WLAN
GPIO
Power Supply
Installation
Operating Temp
Storage Temp
Relative Humidity
Operating Vibration
EMC
Black
280mm× 219.2mm× 115 mm(W×D×H)
“ICEFIN” Enclosure
Aluminum+ Fine Quality Galvanized Steel Sheet
BPC-7937
Intel LGA1155 Sandy Bridge/Ivy Bridge Core i3/i5
and Celeron CPUs
Intel H61/Q77/B75
2x DDR3 DIMM slots support dual channel DDR3
1066/1333/1600 MHzRAM up to 16GB. Non-ECC
N/A
1x Mini PCIe SSD
1x SATAII/SATAIII HDD
Realtek RTL8111E,10/100/1000Mbps,2x RJ45,
Wake-on-LAN
H61 Chipset: 6x USB2.0; Q77 Chipset : 4x USB
2.0, 2x USB 3.0
2x COM. COM1/COM2 support RS232(DB9), COM2 also supports RS422/485
1x VGA (DB15), 1x DVI-D; VGA + DVI dual inde-
pendent display
Fanless, “ICEFIN” thermal design
ALC892, 5.1CH ,1x Mic-in, 1x Line-in, 1x Line-out
1x Mini PCIe supports Mini PCIe SSD. Inbuilt SIM slot for 3G Module. 2x PCI ( optional 1x PCI & 1x PCIE X4) can be extended by Expansion slot
Power LED, HDD LED
Power Switch
Reserved 2x 4Pin supports PS/2 keyboard and
mouse
1x 3G/WiFi SMA antenna (optional)
8 bit GPIO
DC +12V power adapter (Recommend to utilize high-power adapter if the power of CPU is over 65W)
Desktop or Wallmounted
0°C - 60°C
-40°C - 85°C
5%~95% relative humidity, non-condensing
0.5g rms/5~500Hz/random operating
CE/FCC Class B
1.2.1 Notes to use CPU
3
This product belongs to the Habey “ICEFIN” series. The BIS-6590 adopts the “ICEFIN” thermal design. Please note a CPU with a higher power consumption will dissipate more heat. If a CPU reaches its TJ Maximum (overheating) the system will underclock and result in a performance reduction. The following table shows the recommended CPU at different working temperatures:
Highest Temp Max CPU Consumption Recommended CPU Models
Intel® Core™ i7-3770S @ 3.90GHz
50° C 65W
60° C 35-45W
The CPUs listed in above table are the commonly used CPU. Select different CPU as per different working temperature.
Intel® Core™ i5-3550S @ 3.00GHz Intel® Core™ i3-3220 @ 3.30GHz Intel® Celeron G530 @ 2.4GHz
Intel® Core™ i3-3240T @ 2.90GHz Intel® Core™ i5-3470T @ 3.60GHz Intel® Core™ i7-3770T @ 3.70GHz Intel® Pentium G860T @ 3.60GHz
Section 2 Installation Instructions
Safety
Electricity is used to perform many useful functions, but it can also cause
personal injuries and property damage if improperly handled. This product has been engineered and manufactured with the highest priority on safety.
However, improper use can result in electric shock and/or re. In order to ensure your safety and prolong the service life of the system, please ob-
serve the following and read the following precautions when installing and handling the product.
Warning
Always completely disconnect the power cord from your chassis whenev­er you work with the hardware. Do not make connections while the power is on. Sensitive electronic components can be damaged by sudden power surges. Only experienced electronics personnel should open the Player chassis.
Caution
4
• Please make sure the thermal conductive adhesive and thermal pad are properly coated and applied when installing the CPU and motherboard MOS heatsink. For help and instructions please contact a qualied techni-
cian or your retailer, for optimal cooling performance.
• Only use the original DC 12V 10A power adapter supplied by the man­ufacturer.
• It will be a normal for the chassis temperature to reach temperatures of up to 40-50°C when the system is working.
• Please read this manual in detail before using this product.
• The product specications and pictures listed in this manual are subject to change with out prior notice.
Electrical Safety
• If the power supply is broken, do not try to x it yourself. Contact a qual­ied service technician or your retailer.
• When adding or removing devices to or from the system, ensure that the power cables for the devices are unplugged before the signal cables
are connected. If possible, disconnect all power cables from the existing
system before you add a device.
• To prevent electrical shock hazard, disconnect the power cable from the electrical outlet before relocating the system.
• Before connecting or removing signal cables from the motherboard, please ensure that all power cables are unplugged.
• To prevent damage to the power cord, do not place heavy objects on,
stretch, or bend power cord. Damage to the cord may result in or electric shock.
• Make sure that your power supply is set to the correct voltage in your
area. Incorrect voltage may cause personal injuries and damage the sys­tem.
Operation Safety
• Before installing the motherboard and adding devices on it, carefully read
all the guides that came with the package.
• To avoid short circuits, keep paper clips, screws, staples, and any other
small metal objects away from connectors, slots, sockets and circuitry.
• Do not use the system where there is a lot of dust, humidity is high, or
5
where the system may come into contact with oil or steam, as this could lead to re.
• Ensure that the system does not come into contact with water or other uids. Ensure that no objects such as paper clips or pins enter the sys­tem as this could lead to electric shock.
• Do not place the system in unsafe places. Do not allow the system to receive strong shocks or to strongly vibrate. This may cause the system to fall or topple over damaging the system.
• Do not use the system near heating equipment or in places where there
is likelihood of high temperature, as this may lead to excessive heat and outbreak of re.
• Do not use the system in places where it may be exposed to direct sunlight.
2.1 Remove the Computer Cover
Remove the four screws on cover and dismount the cover.
2.2 Install Motherboard
2.2.1 Install CPU & Thermal Pad
Unlock the buckle and re­move the CPU base cover.
The part circled in black
6
in the picture is the CPU buckle footstand. Align CPU with its footstand and press it into its socket evenly.
Lock and tighten CPU buckle.
The thermal pad is tailored as per the size of CPU and Chipset and is pressed on to the CPU and south-
bridge evenly with ngers.
2.1.2 Dismount the Rear Panel
7
2.1.3 Install Motherboard
Loosen the four screws on the side of the rear panel and remove the rear panel module.
Align the semi-circle guide holes of the motherboard with the four guide posts on the bracket and place the motherboard on the back cover evenly. Insert the expansion slots into the expansion board con-
necting nger.
Tighten the 7 screws onboard that x the moth­erboard (M3x6mm screw x7PCS).
2.1.4 Mount the Rear Panel
8
Mount back the rear panel and tighten the four screws on panel
2.3 Install Motherboard MOS Heatsink
Install the thermal con­ductive copper pipe inside the chassis. Loosen the two screws on the left side panel (marked with black circle) and rotate the heat pipe to the side panel locating slot.
Remove the two screws on MOS lock block and remove the lock block.
Make sure the heat
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conductive module slot is coating with thermal con­ductive silicon.
Put the heat pipe into MOS heatsink socket and cover it with MOS lock block.
Tighten the two screws of the lock block.
2.4 Install Ram
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Tighten the two screws
on the left side panel, that
is outside the position marked in black circle.
Unlock the buckle of the memory socket and re­move the memory bank.
Align the memory bank with the memory slot and press the memory bank downward into the slot. Check if the buckle locks the memory bank.
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