GIGABYTE MD72-HB2 Datasheet

MD72-HB2

Intel Xeon E-ATX Server Motherboard

Specification

Specification

Features

• 3rd Gen. Intel® Xeon® Scalable Processors

• 8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs

®

• Supports Intel

®

C621A Express Chipset

• Intel

• 2 x 10Gb/s BASE-T LAN ports (Intel

• 2 x 1Gb/s LAN ports (Intel

• 1 x Dedicated management port

• 2 x 7-pin SATA 6Gb/s ports

• 3 x SlimSAS with 12 x SATA 6Gb/s ports

• 2 x Ultra-Fast M.2 with PCIe Gen4 x4 interface

• 6 x PCIe Gen4 x16 expansion slots

• Aspeed

®

Optane™ Persistent Memory 200 series

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X710 -AT2)

®

I210 - AT)

AST2600 management controller

Dimensions

CPU

Socket

Chipset

Memory

LAN

Video

SATA

RAID

Expansion
Slots

Rear I/O

E-ATX (305W x 330D mm)

3rd Gen Intel
Intel
Intel
10nm technology, CPU TDP up to 270W

2 x LGA 4189 (Socket P+)

Intel

8-Channel DDR4 memory per processor, 16 x DIMM slots
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported

1.2V modules: 3200/2933/2666 MHz

2 x 10Gb/s BASE-T LAN ports (Intel
2 x 1Gb/s LAN ports (Intel
1 x 10/100/1000 management LAN

Integrated in Aspeed
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

2 x 7-pin SATA 6Gb/s ports
3 x SlimSAS with 12 x SATA 6Gb/s ports

Intel

6 x PCIe x16 (Gen4 x16) slots

2 x M.2 slot:

- M-key

- PCIe Gen4 x4 per slot

- Supports NGFF-22110/2280 cards

2 x USB 3.0, 1 x VGA, 1 x COM (RJ45 type), 4 x RJ45,
1 x MLAN, 1 x ID button with LED

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®

®

®

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Xeon® Scalable Processors
Xeon® Platinum Processor, Intel® Xeon® Gold Processor,
Xeon® Silver Processor

C621A Express Chipset

®

X710-AT2)

®

AST2600

SATA RAID 0/1/10/5

®

I210-AT)

Internal I/O

TPM

OS
Compatibility

Board
Management

PSU Connectors

Operating
Properties

Retail Packaging
Content

Bulk Packaging
Content

Reference
Numbers

1 x 24-pin ATX main power connector, 2 x 8-pin ATX 12V power
connectors, 1 x 6-pin PCIe power connectors, 3 x SlimSAS connectors,
2 x 7-pin SATA connectors, 2 x M.2 slots, 1 x HDD back plane board
header, 2 x CPU fan headers, 5 x System fan headers, 1 x USB 3.0
header, 1 x TPM header, 1 x VROC connector, 1 x Front panel header,
1 x PMBus connector, 1 x IPMB connector, 1 x Clear CMOS jumper,
1 x BIOS recovery jumper, 1 x Case open heade

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Windows Server 2016 / 2019
RHEL 8.3 ( x64) or later
SLES 12 SP5 ( x64) / 15 SP2 ( x64) or later
Ubuntu 18.04.5 LTS (x64) / 20.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 / 7.0 Update1 or later
Citrix Hypervisor 8.2.0 or later

®

Aspeed

AST2600 management controller

GIGABYTE Management Console (AMI MegaRAC SP-X)

1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors

Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

1 x MD72-HB2, 1 x I/O shield, 1 x Quick start guide,
1 x SlimSAS for 4 x SATAIII 6Gb/s cable

10 x MD72-HB2, 10 x I/O shields
Carton dimensions: 473 x 600 x 495 mm

Retail: 9MD72HB2MR-00
Bulk: 9MD72HB2NR-00

- I/O shield: 12AIO-MD72HB-00R

- SlimSAS for 4 x SATAIII 6Gb/s cable: 25CFM-550820-A4R

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* All specifications are subject to change without notice. Please visit our website for the latest information.
* Intel, the Intel logo, the Intel Inside logo, Xeon, and Optane are trademarks of Intel Corporation or its subsidiaries.

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