Gigabyte GC-IR2P64E REV1.0 Schematic

1 頁,共 1 頁Technical Information Release Notice
Technical Information Release Notice
Doc Type Schematic Date 2005/6/24 下午 05:23:21 Project Code S93040-0 Customer Hitachi Project Name GS-SR195H Revision Old NA New 1.0 Model Name GC-IR2P64E IT Doc No DR056279 P/N RD Doc No PCB Rev. 1.0 Check Sum
R N M
RISER CARD GC-IR2P64E 1.0B
P/N Description
FINISHED GOOD HITACHI
Description GC-IR2P64E R1.0 schemtic Remark Approved By daniel.hou 2005/6/24 下午 07:02:01 Applicant peter.chen
Research Management
Mimosa.Kao 2005/6/27 上午 08:58:22
Validation Manager 890622(何士弘 ) Project Manager 916001(李育荏)
Effected Class
gfedc gfedcb gfedc
A B C D E F
gfedc
gfedcb
A B
gfedc gfedcb
gfedc gfedc
gfedc gfedc
I
I
T
T
R
R
e
e
s
s
e
e
a
a
r
r
c
c
2
2
h
h
0
0
M
M
0
0
5
5
a
a
/
/
n
n
6
6
/
/
a
a
2
2
g
g
7
7
e
e
m
m
e
e
n
n
t
t
FinePrint - www.fineprint.com 列印 可在 訂購
2005/6/27http://gwfap/ef2kweb/CHT/Forms/RTC009/RTC009_P.asp
5
4
GC-IR2P64E SR195H riser card
3
2
1
D D
1 TITLE 2 PCI EXP X8 SLOT1 GOLD_ FINGE 3 PCI-X SLOT 66M GOLD_ FINGER 4 PCI EXPRESS X8 SLOT1 5 PCI-X SLOT 66MHZ 6 Change list
Pin A1Pin B1
C C
PCI-E X8 slot
B B
Slim type PCI-X slot
PCI-E X8 slot
Pin B1 side
Slim type PCI-X slot
Pin A1 side
BOARD STACK-UP
Copper
Prepreg
Copper
Prepreg
Copper
Core
Copper
Prepreg
Copper
Prepreg
Copper
COMPONENT SIDE
GND
INT 1(Layer 3)
(PWR)
GND
SOLDER SIDE
A A
Title
Size Document Number Rev
5
4
3
2
Date: Sheet
GIGA-BYTE TECHNOLOGY CO., LTD.
COVER SHEET
GC-IR2P64E
1
17Friday, June 24, 2005
of
1.0
5
P3V3_STBY
D D
I2C_BUS1_SCL(4) I2C_BUS1_SDA(4)
PCIE_TRST#(4)
WAKE#(4)
WAKE#
DIFFERENTIAL PAIRS
C C
DIFFERENTIAL PAIRS
EXP_A_TXP[0..7] EXP_A_TXN[0..7]
B B
EXP_A_TXP[0..7] (4) EXP_A_TXN[0..7] (4)
PCIE_TRST#
EXP_A_TXP0 EXP_A_TXN0
EXP_A_TXP1 EXP_A_TXN1
EXP_A_TXP2 EXP_A_TXN2
EXP_A_TXP3 EXP_A_TXN3
EXP_A_TXP4 EXP_A_TXN4
EXP_A_TXP5 EXP_A_TXN5
EXP_A_TXP6 EXP_A_TXN6
EXP_A_TXP7 EXP_A_TXN7
6000mils
6000mils
COUPON1
COUPON2
1 2
COUPON1 COUPON/X
1 2
COUPON2 COUPON/X
LAYER1
LAYER6
4
P3V3
PCI-E_GF_1
P12V
PCI_EXP_8PORT
B1
12V_2
B2
12V_3
B3
RSVD3
B4
GND18
B5
SMCLK
B6
SMDATA
B7
GND19
B8
3.3V_2
B9
JTAG1
B10
3.3VAUX
B11
WAKE_N
B12
RSVD4
B13
GND20
B14
HOSP0+
B15
HOSP0-
B16
GND21
B17
PRSNT2_N
B18
GND22
B19
HOSP1+
B20
HOSP1-
B21
GND23
B22
GND24
B23
HOSP2+
B24
HOSP2-
B25
GND25
B26
GND26
B27
HOSP3+
B28
HOSP3-
B29
GND27
B30
RSVD5
B31
PRSNE2_N
B32
GND28
B33
HOSP4+
B34
HOSP4-
B35
GND29
B36
GND30
B37
HOSP5+
B38
HOSP5-
B39
GND31
B40
GND32
B41
HOSP6+
B42
HOSP6-
B43
GND33
B44
GND34
B45
HOSP7+
B46
HOSP7-
B47
GND35
B48
PRSNT2_N
B49
GND36
PCI EXPRESS 98PIN GOLD FINGER/X
Component layer :5mil,50ohm +/-10%
Bottom layer :5mil,50ohm +/-10%
PRSNT1_N
12V_0 12V_1
GND0 JTAG2 JTAG3 JTAG4 JTAG5
3.3V_0
3.3V_1
PWRGD
GND1
REFCLK+
REFCLK-
GND2
HSIP0+
HSIP0-
GND3
RSVD0
GND4
HSIP1+
HSIP1-
GND5
GND6
HSIP2+
HSIP2-
GND7
GND8
HSIP3+
HSIP3-
GND9
RSVD1
RSVD2 GND10 HISP4+
HISP4-
GND11 GND12 HISP5+
HISP5-
GND13 GND14 HISP6+
HISP6-
GND15 GND16 HISP7+
HISP7-
GND17
P12V
A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11
A12 A13 A14 A15 A16 A17 A18
A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 A32
A33 A34 A35 A36 A37 A38 A39 A40 A41 A42 A43 A44 A45 A46 A47 A48 A49
Differential
Differential
Differential
3
P3V3
PCIE_TCK PCIE_TDI
PCIE_TMS
EXP_SLOT_100MHZ_CLK_P EXP_SLOT_100MHZ_CLK_N
6000mils
6000mils
6000mils
PCIE_TCK (4) PCIE_TDI (4)
PCIE_TMS (4)
SYS_PWR_GD_BUFF (4)
EXP_SLOT_100MHZ_CLK_P (4) EXP_SLOT_100MHZ_CLK_N (4)
EXP_A_RXP0 EXP_A_RXN0
EXP_A_RXP1 EXP_A_RXN1
EXP_A_RXP2 EXP_A_RXN2
EXP_A_RXP3 EXP_A_RXN3
EXP_A_RXP4 EXP_A_RXN4
EXP_A_RXP5 EXP_A_RXN5
EXP_A_RXP6 EXP_A_RXN6
EXP_A_RXP7 EXP_A_RXN7
1
2
COUPON3 COUPON/X
1
2
COUPON4 COUPON/X
1
2
COUPON5 COUPON/X
2
K2
1
Fiducial_Point/X
K6
1
Fiducial_Point/X
K1
1
Fiducial_Point/X
DIFFERENTIAL PAIRS
DIFFERENTIAL PAIRS
DIFFERENTIAL PAIRS
EXP_A_RXP[0..7] EXP_A_RXN[0..7]
3
3
3
EXP_A_RXP[0..7] (4) EXP_A_RXN[0..7] (4)
L1
6/6/6 FOR PCI Express
L3
6/6/6 FOR PCI Express
L6
6/6/6 FOR PCI Express
K3
1
Fiducial_Point/X
K4
1
Fiducial_Point/X
K5
1
Fiducial_Point/X
I1
1
POSITION/X
1
I4
1
POSITION/X
1
I2
1
POSITION/X
1
I3
1
POSITION/X
1
Component layer : 85ohm +/-15%
In1 layer : 85ohm +/-15%
Bottom layer : 85ohm +/-15%
MH2
MB_HOLE/X
5 4 3 2
1
MH1
MB_HOLE_oval-D177*157/X
6
5
7
4
8
3
9
2
1
6 7 8 9
1
Differential
COUPON6 COUPON/X
1
3
2
L6
5/12/5 FOR Clock
Bottom layer : 100ohm +/-10%
A A
6000mils
Title
Size Document Number Rev
5
4
3
2
Date: Sheet
GIGA-BYTE TECHNOLOGY CO., LTD.
PCI EXPRESS GOLD FINGER
GC-IR2P64E
1
27Friday, June 24, 2005
of
1.0
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