Gigabyte GC-FMC-212 REV.1.1A Schematic
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GC-FMC-212 Scehmatic
D D
SHEET
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C C
COVER SHEET
BOM & PCB MODIFY HISTORY
ND3260-LD Chipset & USB/1394 Connectors
Storage Connector(CF, SD, MS, SM, xD)
TITLE
Revision 1.1A
B B
1.0 PCB Vendor:
PCB Size:214*150mm
0.1 PCB Vendor:
PCB Size:224.03*140 5mm
A A
Title
Size Document Number Rev
Custom
5
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2
Date: Sheet
GIGABYTE
COVER SHEET
GC-FMC-212
1
慶生， 育富 。
慶生， 育富 。
COMPONENT SIDE
(1 oz. Copper)
VCC LAYER
(1 oz. Copper)
GND LAYER
(1 oz. Copper)
SOLDER SIDE
(1 oz. Copper)
14Tuesday, January 04, 2005
of
1.1A
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1
GC-FMC-212
Version:1.1
Circuit or PCB layout change
for next version
Date Change Item Reason
D D
Component value change history
AUTOBOM
91/ /
93.10.11_0.1
93.10.25_1.0
Date Change Item Reason
93.10.19_0.1
93.11.10_1.0A PMOS
C C
94.01.04_1.1A EBOM改PBOM
For 1'st pilor run BOM
料件統一為
S_CF
改為背板原件.加鐵蓋長腳
S_MS改為support MS_Duo的socket.
CF change from Proconn to J&J
S_MS
改為
Add FDN338P to control VDD1
All PMOS add second source.
移除
12KS1-000002-10
FDN338P
LCP
材質 防止過錫爐導致塑膠片變形
For PMOS Voltage drop.
For ESD issue.
For MS, MS_PRO, MS_DUO support.
For ESD issue.93.12.14_1.1A
For Miscrsoft MDP<5sec issue.
For cost down
93.11.23_1.01 CF
93.12.07_1.1
下蓋會附螺絲
Rev 0.1 Gerber Out
改
端，需
(J&J)
7.4 mm。For
SQ2
靠近 。
SCF_LED & SMS_LED 5.2mm
SC3改接SQ2 input
改為板.下零件
CF socket
U2
的文字改為
R_USB
螺絲孔內圈孔徑改小。 防止
R46(MS_CLK) change to damping
resistor.
MH1 & MH2 rotate 90 degree. For EMI, EGND & GND splitting.
SR_1394 change to Green For NF Request.
增加包材(上蓋，下蓋，面x2板，螺絲 ，
1394&黃USB Cable)
綠
卡改用矽騰料件
增加
Pin
機構修改
PMOS
控制
24C02
由各個
Memory Card Detect
VDD1
電源。
工廠容易手銲
For CF card insert voltage drop issue.
Follow customer spec.
上一版文字.標錯
Follow廠商final
FMC-212 PCB
For EMI.
For ESD issue.
使不插卡時系統抓不到
LED issue.
機構圖
鎖螺絲時位置偏移。
ND3260
，解決
MDP 5 issue.
超過 秒鐘
B B
A A
Title
Size Document Number Rev
Custom
5
4
3
2
Date: Sheet
BOM & PCB MODIFY HISTORY
GIGABYTE
GC-FMC-212
1
1.1A
of
24Tuesday, January 04, 2005
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