General Semiconductor GI1004, GI1003, GI1002, GI1001 Datasheet

Reverse Voltage - 50 to 200 Volts Forward Current - 1.0 Ampere

0.034 (0.86)

0.028 (0.71)
DIA.

0.150 (3.8)

0.100 (2.5)
DIA.

1.0 (25.4)
MIN.

0.240 (6.1)

MAX.

1.0 (25.4)
MIN.

PATENTED*

Dimensions in inches and (millimeters)

*

Brazed lead assembly is covered by Patent No.3,930,30

GI1001 THRU GI1004

GLASS PASSIVATED FAST EFFICIENT RECTIFIER

FEATURES

DO-204AP

♦ High temperature metallurgically bonded construction
♦ Glass passivated cavity-free junction
♦ Superfast recovery time for high efficiency
♦ Low forward voltage, high current capability
♦ Capable of meeting environmental standards of

MIL-S-19500

♦ Hermetically sealed package
♦ Low leakage current
♦ High surge capability
♦ High temperature soldering guaranteed:

350°C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension

MECHANICAL DATA

Case: JEDEC DO-204AP solid glass body
Terminals: Plated axial leads, solderable per MIL-STD-750,

Method 2026

Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.02 ounce, 0.56 gram

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified.

Maximum repetitive peak reverse voltage V
Maximum RMS voltage V
Maximum DC blocking voltage V
Maximum average forward rectified current

0.375" (9.5mm) lead length at T
Peak forward surge current

8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) at T

Maximum instantaneous forward voltage at 1.0A V
Maximum DC reverse current T

at rated DC blocking voltage T
Maximum reverse recovery time
Typical junction capacitance
Typical thermal resistance

Operating junction and storage temperature range T

L

(NOTE 2)

(NOTE 3)
(NOTE 4)

=75°C

75°C

L=

=25°C 2.0

A

=100°C

A

(NOTE 1)

SYMBOLS GI1001 GI1002 GI1003 GI1004 UNITS

50 100 150 200 Volts
35 70 105 140 Volts
50 100 150 200 Volts

1.0 Amp

30.0 Amps

0.975 Volts

50.0

µA

25.0 ns

45.0 pF

65.0

20.0

°C/W

-65 to +175 °C

R
R

J

RRM
RMS

I

(AV)

I

FSM

C

, T

DC

F

I

R

t

rr

J

ΘJA
ΘJL

STG

NOTES:
(1) Reverse recovery test conditions:IF=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1.0 MH
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length and mounted on P.C.B.with 0.5 x 0.5” (12 x 12mm)
(4) Thermal resistance from junction to lead at 0.375" (9.5mm) lead length with both leads attached to heatsinks

and applied reverse voltage of 4.0 Volts

Z

4/98

0.40.60.81.01.21.41.61.8

0.01

0.1

1

10

50

1 10 100

0

5.0

10

15

20

25

30

0.1 1 10 100

0

15

30

45

60

75

90

105

0 25 50 75 100 125 150 175

0

0.5

1.0

1.5

0 20 40 60 80 100

0.01

0.1

1

10

100

1,000

RATINGS AND CHARACTERISTIC CURVES GI1001 THRU GI1004

FIG. 1 - MAXIMUM FORWARD CURRENT

RESISTIVE OR
INDUCTIVE LOAD

CURRENT, AMPERES

AVERAGE FORWARD RECTIFIED

FIG. 3 - TYPICAL INSTANTANEOUS

DERATING CURVE

0.8 x 0.8 x.04" THICK COPPER HEATSINK
(20 x 20 x 1.0mm)

LEAD TEMPERATURE, °C

FORWARD CHARACTERISTICS

T

0.375" (9.5mm)

TJ=25°C

PULSE WIDTH=300µs
1% DUTY CYCLE

FIG. 2 - MAXIMUM NON-REPETITIVE PEAK

FORWARD SURGE CURRENT

8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method) at TL=75°C

L

AMPERES

PEAK FORWARD SURGE CURRENT,

NUMBER OF CYCLES AT 60 H

FIG. 4 - TYPICAL REVERSE LEAKAGE

CHARACTERISTICS

Z

TJ=125°C

AMPERES

INSTANTANEOUS FORWARD CURRENT,

INSTANTANEOUS FORWARD VOLTAGE,

VOLTS

FIG. 5 - TYPICAL JUNCTION CAPACITANCE

JUNCTION CAPACITANCE, pF

TJ=25°C
f=1.0 MH

Z

Vsig=50mVp-p

MICROAMPERES

TJ=100°C

INSTANTANEOUS REVERSE LEAKAGE CURRENT,

TJ=25°C

PERCENT OF RATED PEAK REVERSE

VOLTAGE, %

REVERSE VOLTA GE, VOLTS