General Semiconductor GF1A, GF1J, GF1G, GF1D, GF1B Datasheet

...
GF1A THRU GF1M
0.167 (4.24)
0.187 (4.75)
0.0065 (0.17)
0.0105 (0.27)
0.030 (0.76)
0.060 (1.52)
0.006
0.152 TYP.
0.196 (4.98)
0.226 (5.74)
0.094 (2.39)
0.114 (2.90)
0.106 (2.69)
0.118 (3.00)
0.040 (1.02)
0.060 (1.52)
0.098 (2.49)
0.108 (2.74)
®
SURFACE MOUNT GLASS PASSIVATED JUNCTION RECTIFIER
Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere
DO-214BA
PATENTED*
Dimensions in inches and (millimeters)
*
Patent No.3,996,602, brazed-lead assembly by Patent No. 3,930,306 and lead
Glass-plastic encapsulation technique is covered by
forming by Patent No. 5,151,846
FEATURES
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
Ideal for surface mount automotive applicationsHigh temperature metallurgically bonded constructionGlass passivated cavity-free junctionCapable of meeting environmental standards of
MIL-S-19500
Built-in strain reliefEasy pick and placeHigh temperature soldering guaranteed: 450°C/5 seconds
at terminals
Complete device submersible temperature of 265°C for
10 seconds in solder bath
MECHANICAL DATA
Case: JEDEC DO-214BA molded plastic over glass body Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.0048 ounces, 0.120 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
Device marking code Maximum repetitive peak reverse voltage V Maximum RMS voltage V Maximum DC blocking voltage V Maximum average forward rectified current
=125°C
at T
L
Peak forward surge current
8.3ms single half sine-wave superimposed on I rated load (JEDEC Method)
Maximum instantaneous forward voltage at 1.0A V Maximum DC reverse current T
at rated DC blocking voltage T Typical reverse recovery time Typical junction capacitance Typical thermal resistance
Operating junction and storage temperature range T
NOTES: (1) Reverse recovery test conditions:IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHz and applied V (3) Thermal resistance from junction to ambient and from junction to lead
P.C.B.mounted on 0.2 x 0.2” (5.0 x 5.0mm) copper pad areas
(NOTE 1)
(NOTE 2)
(NOTE 3)
=4.0 Volts
R
=25°C 5.0
A
=125°C
A
SYMBOLS GF1A GF1B GF1D GF1G GF1J GF1K GF1M UNITS
GA GB GD GG GJ GK GM
50 100 200 400 600 800 1000 Volts 35 70 140 280 420 560 700 Volts 50 100 200 400 600 800 1000 Volts
1.0 Amp
30.0 Amps
1.10 1.20 Volts
50.0
µA
2.0 µs
15.0 pF
80.0
26.0
°C/W
-65 to +175 °C
J
RRM RMS
I
(AV)
FSM
C
R R
, T
DC
F
I
R
t
rr
J
ΘJA ΘJL
STG
4/98
0.4 0.6 0.8 1.0 1.2 1.4 1.6
0.01
0.1
1
10
110100
0
5.0
10
15
20
25
30
110100
1
10
30
0.5
100 110 120 130 140 150 160 175
0
1.0
0 20406080100
0.01
0.1
1
10
0.01 0.1 1 10 100
0.1
1
10
100
RATINGS AND CHARACTERISTIC CURVES GF1A THRU GF1M
FIG. 1 - FORWARD CURRENT DERATING CURVE
60 H
Z
RESISTIVE OR INDUCTIVE LOAD P.C.B.MOUNTED on
0.2 x 0.2” (5.0 x 5.0mm) COPPER PAD AREAS
AMPERES
AVERAGE FORWARD RECTIFIED CURRENT,
LEAD TEMPERATURE, °C
FIG. 3 - TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
PULSE WIDTH=300µs 1% DUTY CYCLE
TJ=25°C
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
TJ=TJmax.
8.3ms SINGLE HALF SINE-WAVE (JEDEC Method)
AMPERES
PEAK FORWARD SURGE CURRENT,
NUMBER OF CYCLES AT 60 H
FIG. 4 - TYPICAL REVERSE CHARACTERISTICS
Z
TJ=100°C
AMPERES
INSTANTANEOUS FORWARD CURRENT,
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
TJ=25°C f=1.0 MH
Z
Vsig=50mVp-p
MICROAMPERES
INSTANTANEOUS REVERSE CURRENT,
PERCENT OF RATED PEAK REVERSE
FIG. 6 - TYPICAL TRANSIENT THERMAL IMPEDANCE
MOUNTED ON 0.20 x 0.27” (5 x 7mm) COPPER PAD AREAS
TJ=25°C
VOLTAGE, %
JUNCTION CAPACITANCE, pF
REVERSE VOLT AGE, VOL TS
TRANSIENT THERMAL IMPEDANCE (°C/W)
t, PULSE DURATION, sec
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