General Semiconductor BAW56 Datasheet
BA W56
Small Signal Diodes
SOT-23
.122 (3.1)
.118 (3.0)
.016 (0.4)
3
12
.037(0.95).037(0.95)
.016 (0.4) .016 (0.4)
Dimensions in inches and (millimeters)
Top View
)
.056 (1.43
max. .004 (0.1)
)
.052 (1.33
.007 (0.175)
Marking
JD
3
1
2
.005 (0.125)
.102 (2.6)
.094 (2.4)
Top View
.045 (1.15)
FEATURES
Silicon Epitaxial Planar Diodes
♦
♦
Fast switching dual diode wit h co m m on
anode.
♦
This diode is also available in other
configurations including: a single diode with type
designation BAL99, a dual anode to cathode with
type designation BAV99, and a dual common cathode
with type designation BAV70.
.037 (0.95)
SOT-23 Plastic Package
Case:
Weight:
MECHANICAL DATA
approx. 0.008 g
Ratings for a single diode at
Rev erse Volt age, Peak Reverse Voltage V
Forw ard Current (continuous) I
Non-Repetitive Peak Forward Current
at t = 1 µs
at t = 1 ms
at t = 1 s
Power Dissipation at T
Junction Temperature T
Storage Temperature Range T
1)
Device on fiberglas s subs tr at e, see layout
ambient temperature unless otherwise specified.
25 °C
= 25 °C P
amb
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Symbol Value Unit
R, VRM
F
I
FSM
I
FSM
I
FSM
tot
j
S
70 V
250 mA
2
1
0.5
350
1)
A
A
A
mW
150 °C
–65 to +150 °C
4/98
Ratings at
ambient temperature unless otherwise specified
25 °C
Forw ard Voltage
= 1 mA
at I
F
= 10 mA
at I
F
= 50 mA
at I
F
= 150 mA
at I
F
Leakage Current
= 70 V
at V
R
= 70 V, Tj = 150 °C
at V
R
= 25 V, Tj = 150 °C
at V
R
BA W56
ELECTRICAL CHARACTERISTICS
Symbol Min. Ty p. Max. Unit
V
F
V
F
V
F
V
F
I
R
I
R
I
R
–
–
–
–
–
–
–
–
–
–
–
–
–
–
0.715
0.855
1.0
1.25
2.5
100
30
V
V
V
V
A
µ
A
µ
A
µ
Capacitance
= VR = 0, f = 1 MHz
at V
F
Rev erse Recovery Time
= 10 mA to IR = 10 mA
from I
F
measured at I
= 1 mA, RL = 100
R
Ω
Thermal Resistance
Junct ion to Ambient Ai r
1)
Device on fiberg lass subs tr ate, see layout
.30 (7.5)
.12 (3)
.04 (1)
.08 (2)
.04 (1)
.59 (15)
.03 (0.8)
.47 (12)
0.2 (5)
.06 (1.5)
.20 (5.1)
.08 (2)
Dim ensions in inches (mil limete rs)
C
t
R
rr
tot
thJA
––2pF
––6ns
– – 430
1)
K/W
Layout fo r R
thJA
test
Thickness: Fiberglass 0.059 in (1.5 mm)
Copper leads 0.012 in (0.3 mm)
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