GE Industrial Solutions 20A Analog MicroDLynx User Manual

GE

Data Sheet

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 1

Features

 Compliant to RoHS EU Directive 2002/95/EC (Z versions)
 Compatible in a Pb-free or SnPb reflow environment (Z

versions)

 Compliant to IPC-9592 (September 2008), Category 2,

Class II

 DOSA based
 Wide Input voltage range (3Vdc-14.4Vdc)
 Output voltage programmable from 0.45Vdc to 5.5Vdc via

external resistor

 Tunable Loop

TM

to optimize dynamic output voltage

response

 Flexible output voltage sequencing EZ-SEQUENCE
 Power Good signal
 Fixed switching frequency with capability of external

synchronization

 Output over current protection (non-latching)
 Over temperature protection
 Remote On/Off
 Ability to sink and source current
 Cost efficient open frame design
 Small size: 20.32 mm x 11.43 mm x 8.5 mm (0.8 in x 0.45 in

x 0.334 in)

 Wide operating temperature range [-40°C to 85°C]
 UL* 60950-1 2

nd

Ed. Recognized, CSA† C22.2 No. 60950-1-

07 Certified, and VDE‡ (EN60950-1 2nd Ed.) Licensed

 ISO** 9001 and ISO 14001 certified manufacturing

facilities

Applications

 Distributed power architectures
 Intermediate bus voltage applications
 Telecommunications equipment
 Servers and storage applications
 Networking equipment
 Industrial equipment

Description

The 20A Analog MicroDLynxTM power modules are non-isolated dc-dc converters that can deliver up to 20A of output current.
These modules operate over a wide range of input voltage (VIN = 3Vdc-14.4Vdc) and provide a precisely regulated output voltage
from 0.6Vdc to 5.5Vdc, programmable via an external resistor. Features include remote On/Off, adjustable output voltage, over
current and over temperature protection. The module also includes the Tunable LoopTM feature that allows the user to optimize the
dynamic response of the converter to match the load with reduced amount of output capacitance leading to savings on cost and
PWB area.

* UL is a registered trademark of Underwriters Laboratories, Inc.

†

CSA is a registered trademark of Canadian Standards Association.

‡

VDE is a trademark of Verband Deutscher Elektrotechniker e.V.

** ISO is a registered trademark of the International Organization of Standards

TRIM

VOUT

VS+

GND

RTUNE

CTUNE

RTrim

VIN

Co

Cin

Vout+

Vin+

ON/OFF

SEQ

MODULE

PGOOD

SIG_GND

VS-

GND

SYNC

RoHS Compliant

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 2

Parameter

Device

Symbol

Min

Max

Unit

Input Voltage

All

V

IN

-0.3

15

V

Continuous

SEQ, SYNC, VS+

All 7 V

Operating Ambient Temperature

All

TA -40

85

°C

(see Thermal Considerations section)

Storage Temperature

All

T

stg

-55

125

°C

Parameter

Device

Symbol

Min

Typ

Max

Unit

Operating Input Voltage

All

VIN

3  14.4

Vdc

Maximum Input Current

All

I

IN,max

19

Adc

(VIN=3V to 14V, IO=I

O, max

)

Input No Load Current
(VIN = 12Vdc, IO = 0, module enabled)

V

O,set

= 0.6

Vdc

I

IN,No load

69 mA

V

O,set

=

5Vdc

I

IN,No load

134 mA

Input Stand-by Current
(VIN = 12Vdc, module disabled)

All

I

IN,stand-by

16.4 mA

Inrush Transient

All

I2t

1

A2s

Input Reflected Ripple Current, peak-to-peak

(5Hz to 20MHz, 1μH source impedance; VIN =0 to 14V, IO= I

Omax

;

See Test Configurations)

All

50 mAp-p
Input Ripple Rejection (120Hz)

All

-64 dB

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 3

Parameter

Device

Symbol

Min

Typ

Max

Unit

Output Voltage Set-point (with 0.1% tolerance for external
resistor used to set output voltage)

All

V

O, set

-1.0 +1.0

% V

O, set

Output Voltage (Over all operating input voltage, resistive
load, and temperature conditions until end of life)

All

V

O, set

-3.0  +3.0

% V

O, set

Adjustment Range (selected by an external resistor)
(Some output voltages may not be possible depending on the
input voltage – see Feature Descriptions Section)

All

VO 0.6 5.5

Vdc

Remote Sense Range

All

0.5

Vdc

Output Regulation (for VO ≥ 2.5Vdc)

Line (VIN=V

IN, min

to V

IN, max

)

All

 +0.4

% V

O, set

Load (IO=I

O, min

to I

O, max

)

All

 10

mV

Output Regulation (for VO < 2.5Vdc)

Line (VIN=V

IN, min

to V

IN, max

)

All

 5

mV

Load (IO=I

O, min

to I

O, max

)

All

 10

mV

Temperature (T

ref=TA, min

to T

A, max

)

All

 0.4

% V

O, set

Output Ripple and Noise on nominal output

(VIN=V

IN, nom

and IO=I

O, min

to I

O, max

Co = 0.1μF // 22 μF ceramic

capacitors)

Peak-to-Peak (5Hz to 20MHz bandwidth)

All

 50

100

mV

pk-pk

RMS (5Hz to 20MHz bandwidth)

All

20

38

mV

rms

External Capacitance1

Without the Tunable Loop

TM

ESR ≥ 1 mΩ

All

C

O, max

2x47  2x47

μF

With the Tunable Loop

TM

ESR ≥ 0.15 mΩ

All

C

O, max

2x47  1000

μF

ESR ≥ 10 mΩ

All

C

O, max

2x47



10000

μF

Output Current (in either sink or source mode)

All

Io 0 20

Adc

Output Current Limit Inception (Hiccup Mode)
(current limit does not operate in sink mode)

All

I

O, lim

130 % I

o,max

Output Short-Circuit Current

All

I

O, s/c

1.4 Arms

(VO≤250mV) ( Hiccup Mode )

Efficiency

V

O,set

= 0.6Vdc

η 79.2 %

VIN= 12Vdc, TA=25°C

V

O, set

= 1.2Vdc

η 87.1 %

IO=I

O, max , VO

= V

O,set

V

O,set

= 1.8Vdc

η 90.4 %

V

O,set

= 2.5Vdc

η 92.6 %

V

O,set

= 3.3Vdc

η 93.8 %

V

O,set

= 5.0Vdc

η 95.2 %

Switching Frequency

All

f

sw



500  kHz

Electrical Specifications (continued)

1

External capacitors may require using the new Tunable LoopTM feature to ensure that the module is stable as well as getting the best

transient response. See the Tunable LoopTM section for details.

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 4

Parameter

Device

Symbol

Min

Typ

Max

Unit

Frequency Synchronization

All

Synchronization Frequency Range

All

425 600

kHz

High-Level Input Voltage

All

V

IH

2.0

V

Low-Level Input Voltage

All

V

IL

0.4 V Input Current, SYNC

All

I

SYNC

100

nA

Minimum Pulse Width, SYNC

All

t

SYNC

100

ns

Maximum SYNC rise time

All

t

SYNC_SH

100

ns

Parameter

Device

Min

Typ

Max

Unit

Calculated MTBF (IO=0.8I

O, max

, TA=40°C) Telecordia Issue 2

Method 1 Case 3

All

15,45
5,614

Hours

Weight



4.54

(0.16)



g (oz.)

Parameter

Device

Symbol

Min

Typ

Max

Unit

On/Off Signal Interface

(VIN=V

IN, min

to V

IN, max

; open collector or equivalent,

Signal referenced to GND)

Device code with suffix “4” – Positive Logic (See Ordering
Information)

Logic High (Module ON)

Input High Current

All

IIH  1

mA

Input High Voltage

All

VIH 2  V

IN,max

V

Logic Low (Module OFF)

Input Low Current

All

IIL





1

mA

Input Low Voltage

All

VIL -0.2  0.6

V

Device Code with no suffix – Negative Logic (See Ordering
Information)

(On/OFF pin is open collector/drain logic input with

external pull-up resistor; signal referenced to GND)

Logic High (Module OFF)

Input High Current

All

IIH ― ― 1 mA

Input High Voltage

All

VIH 2 ―

V

IN, max

Vdc

Logic Low (Module ON)

Input low Current

All

IIL ― ―

10

μA

Input Low Voltage

All

VIL

-0.2 ― 0.6

Vdc

Electrical Specifications (continued)

General Specifications

Feature Specifications

Unless otherwise indicated, specifications apply overall operating input voltage, resistive load, and temperature conditions. See
Feature Descriptions for additional information.

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 5

Parameter

Device

Symbol

Min

Typ

Max

Units

Turn-On Delay and Rise Times

(VIN=V

IN, nom

, IO=I

O, max , VO

to within ±1% of steady state)

Case 1: On/Off input is enabled and then input power is
applied (delay from instant at which VIN = V

IN, min

until Vo =

10% of Vo, set)

All

Tdelay

―

1.2 ― msec

Case 2: Input power is applied for at least one second and
then the On/Off input is enabled (delay from instant at
which Von/Off is enabled until Vo = 10% of Vo, set)

All

Tdelay

―

0.8 ― msec

Output voltage Rise time (time for Vo to rise from
10% of Vo, set to 90% of Vo, set)

All

Trise

―

2.7 ― msec

Output voltage overshoot (TA = 25oC
VIN= V

IN, min

to V

IN, max,IO

= I

O, min

to I

O, max

)

With or without maximum external capacitance

3.0

% V

O, set

Over Temperature Protection
(See Thermal Considerations section)

All

T

ref

120

°C

Tracking Accuracy (Power-Up: 2V/ms)

All

VSEQ –Vo

100

mV

(Power-Down: 2V/ms)

All

VSEQ –Vo

100

mV

(V

IN, min

to V

IN, max

; I

O, min

to I

O, max

VSEQ < Vo)

Input Undervoltage Lockout

Turn-on Threshold

All

3.25

Vdc

Turn-off Threshold

All

2.6

Vdc

Hysteresis

All

0.25 Vdc

Resolution of Adjustable Input Under Voltage Threshold

All

500

mV

PGOOD (Power Good)

Signal Interface Open Drain, V

supply

 5VDC

Overvoltage threshold for PGOOD ON

All

108 %V

O, set

Overvoltage threshold for PGOOD OFF

All

105 %V

O, set

Undervoltage threshold for PGOOD ON

All

110 %V

O, set

Undervoltage threshold for PGOOD OFF

All

90 %V

O, set

Pulldown resistance of PGOOD pin

All

50  Sink current capability into PGOOD pin

All

5

mA

Feature Specifications (cont.)

* Over temperature Warning – Warning may not activate before alarm and unit may shutdown before warning

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 6

EFFICIENCY,  (%)
OUTPUT CURRENT, Io (A)

OUTPUT CURRENT, IO (A)

AMBIENT TEMPERATURE, TA OC

Figure 1. Converter Efficiency versus Output Current.

Figure 2. Derating Output Current versus Ambient
Temperature and Airflow.

OUTPUT VOLTAGE

V

O

(V) (10mV/div)

OUTPUT CURRENT, OUTPUT VOLTAGE

I

O

(A) (10Adiv) V

O

(V) (10mV/div)

TIME, t (1s/div)

TIME, t (20s /div)

Figure 3. Typical output ripple and noise (CO=2x47μF
ceramic, VIN = 12V, Io = Io,max, ).

Figure 4. Transient Response to Dynamic Load Change from
50% to 100% at 12Vin, Cout= 1x47uF +11x330uF CTune=47nF,
RTune=178 ohms

OUTPUT VOLTAGE ON/OFF VOLTAGE

V

O

(V) (200mV/div) V

ON/OFF

(V) (5V/div)

OUTPUT VOLTAGE INPUT VOLTAGE

V

O

(V) (200mV/div) V

IN

(V) (5V/div)

TIME, t (2ms/div)

TIME, t (2ms/div)

Figure 5. Typical Start-up Using On/Off Voltage (Io = Io,max).

Figure 6. Typical Start-up Using Input Voltage (VIN = 12V, Io =
Io,max).

50

55

60

65

70

75

80

85

90

0 5 10 15 20

Vin=3.3V

Vin=14V

Vin=12V

2

6

10

14

18

22

55 65 75 85 95 105

0.5m/s

(100LFM)

1.5m/s

(300LFM)

1m/s

(200LFM)

NC

2m/s

(400LFM)

Characteristic Curves

The following figures provide typical characteristics for the 20A Analog MicroDLynxTM at 0.6Vo and 25oC.

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 7

EFFICIENCY,  (%)

OUTPUT CURRENT, Io (A)

OUTPUT CURRENT, IO (A)

AMBIENT TEMPERATURE, TA OC

Figure 7. Converter Efficiency versus Output Current.

Figure 8. Derating Output Current versus Ambient
Temperature and Airflow.

OUTPUT VOLTAGE

V

O

(V) (20mV/div)

OUTPUT CURRENT, OUTPUT VOLTAGE

I

O

(A) (10Adiv) V

O

(V) (20mV/div)

TIME, t (1s/div)

TIME, t (20s /div)

Figure 9. Typical output ripple and noise (CO=2x47μF
ceramic, VIN = 12V, Io = Io,max, ).

Figure 10. Transient Response to Dynamic Load Change from
50% to 100% at 12Vin, Cout= 1x47uF +5x330uF, CTune=10nF
& RTune=178 ohms

OUTPUT VOLTAGE ON/OFF VOLTAGE

V

O

(V) (500mV/div) V

ON/OFF

(V) (5V/div)

OUTPUT VOLTAGE INPUT VOLTAGE

V

O

(V) (500mV/div) V

IN

(V) (5V/div)

TIME, t (2ms/div)

TIME, t (2ms/div)

Figure 1. Typical Start-up Using On/Off Voltage (Io = Io,max).

Figure 12. Typical Start-up Using Input Voltage (VIN = 12V, Io =
Io,max).

50

55

60

65

70

75

80

85

90

95

0 5 10 15 20

Vin=3.3V

Vin=14V

Vin=12V

2

6

10

14

18

22

55 65 75 85 95 105

2m/s

(400LFM)

1.5m/s

(300LFM)

1m/s

(200LFM)

0.5m/s

(100LFM)

NC

Characteristic Curves

The following figures provide typical characteristics for the 20A Analogl MicroDLynxTM at 1.2Vo and 25oC.

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 8

EFFICIENCY,  (%)
OUTPUT CURRENT, Io (A)

OUTPUT CURRENT, IO (A)

AMBIENT TEMPERATURE, TA OC

Figure 13. Converter Efficiency versus Output Current.

Figure 14. Derating Output Current versus Ambient
Temperature and Airflow.

OUTPUT VOLTAGE

V

O

(V) (20mV/div)

OUTPUT CURRENT, OUTPUT VOLTAGE

I

O

(A) (10Adiv) V

O

(V) (20mV/div)

TIME, t (1s/div)

TIME, t (20s /div)

Figure 15. Typical output ripple and noise (CO=2X47μF
ceramic, VIN = 12V, Io = Io,max, ).

Figure 16. Transient Response to Dynamic Load Change from
50% to 100% at 12Vin, Cout= 2x47uF +3x330uF,
CTune=5600pF & RTune=220 ohms

OUTPUT VOLTAGE ON/OFF VOLTAGE

V

O

(V) (500mV/div) V

ON/OFF

(V) (5V/div)

OUTPUT VOLTAGE INPUT VOLTAGE

V

O

(V) (500mV/div) V

IN

(V) (5V/div)

TIME, t (2ms/div)

TIME, t (2ms/div)

Figure 17. Typical Start-up Using On/Off Voltage (Io = Io,max).

Figure 18. Typical Start-up Using Input Voltage (VIN = 12V, Io =
Io,max).

70

75

80

85

90

95

0 5 10 15 20

Vin=3.3V

Vin=14V

Vin=12V

2

6

10

14

18

22

55 65 75 85 95 105

2m/s

(400LFM)

1.5m/s

(300LFM)

1m/s

(200LFM)

0.5m/s

(100LFM)

NC

Characteristic Curves

The following figures provide typical characteristics for the 20A Analog MicroDLynxTM at 1.8Vo and 25oC.

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 9

EFFICIENCY,  (%)
OUTPUT CURRENT, Io (A)

OUTPUT CURRENT, IO (A)

AMBIENT TEMPERATURE, TA OC

Figure 19. Converter Efficiency versus Output Current.

Figure 20. Derating Output Current versus Ambient
Temperature and Airflow.

OUTPUT VOLTAGE

V

O

(V) (20mV/div)

OUTPUT CURRENT, OUTPUT VOLTAGE

I

O

(A) (10Adiv) V

O

(V) (20mV/div)

TIME, t (1s/div)

TIME, t (20s /div)

Figure 21. Typical output ripple and noise (CO=2x47μF
ceramic, VIN = 12V, Io = Io,max, ).

Figure 22. Transient Response to Dynamic Load Change from
50% to 100% at 12Vin, Cout= 2x47uF +2x330uF,
CTune=3300pF & RTune=220 ohms

OUTPUT VOLTAGE ON/OFF VOLTAGE

V

O

(V) (1V/div) V

ON/OFF

(V) (5V/div)

OUTPUT VOLTAGE INPUT VOLTAGE

V

O

(V) (1V/div) V

IN

(V) (5V/div)

TIME, t (2ms/div)

TIME, t (2ms/div)

Figure 23. Typical Start-up Using On/Off Voltage (Io = Io,max).

Figure 24. Typical Start-up Using Input Voltage (VIN = 12V, Io =
Io,max).

70

75

80

85

90

95

100

0 5 10 15 20

Vin=4.5V

Vin=14V

Vin=12V

2

6

10

14

18

22

55 65 75 85 95 105

2m/s

(400LFM)

1.5m/s

(300LFM)

1m/s

(200LFM)

0.5m/s

(100LFM)

NC

Characteristic Curves

The following figures provide typical characteristics for the 20A Analog MicroDLynxTM at 2.5Vo and 25oC.

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 10

EFFICIENCY,  (%)
OUTPUT CURRENT, Io (A)

OUTPUT CURRENT, IO (A)

AMBIENT TEMPERATURE, TA OC

Figure 25. Converter Efficiency versus Output Current.

Figure 26. Derating Output Current versus Ambient
Temperature and Airflow.

OUTPUT VOLTAGE

V

O

(V) (50mV/div)

OUTPUT CURRENT, OUTPUT VOLTAGE

I

O

(A) (10Adiv) V

O

(V) (50mV/div)

TIME, t (1s/div)

TIME, t (20s /div)

Figure 27. Typical output ripple and noise (CO=2x47μF
ceramic, VIN = 12V, Io = Io,max, ).

Figure 28 Transient Response to Dynamic Load Change from
50% to 100% at 12Vin, Cout= 5x47uF +1x330uF,
CTune=2200pF & RTune=220 ohms

OUTPUT VOLTAGE ON/OFF VOLTAGE

V

O

(V) (1V/div) V

ON/OFF

(V) (5V/div)

OUTPUT VOLTAGE INPUT VOLTAGE

V

O

(V) (1V/div) V

IN

(V) (5V/div)

TIME, t (2ms/div)

TIME, t (2ms/div)

Figure 29. Typical Start-up Using On/Off Voltage (Io = Io,max).

Figure 30. Typical Start-up Using Input Voltage (VIN = 12V, Io =
Io,max).

70

75

80

85

90

95

100

0 5 10 15 20

Vin=4.5V

Vin=14V

Vin=12V

2

6

10

14

18

22

55 65 75 85 95 105

2m/s

(400LFM)

1.5m/s

(300LFM)

1m/s

(200LFM)

0.5m/s

(100LFM)

NC

2m/s

(400LFM)

1.5m/s

(300LFM)

1m/s

(200LFM)

0.5m/s

(100LFM)

NC

Characteristic Curves

The following figures provide typical characteristics for the 20A Analog MicroDLynxTM at 3.3Vo and 25oC.

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 11

EFFICIENCY,  (%)
OUTPUT CURRENT, Io (A)

OUTPUT CURRENT, IO (A)

AMBIENT TEMPERATURE, TA OC

Figure 31. Converter Efficiency versus Output Current.

Figure 32. Derating Output Current versus Ambient
Temperature and Airflow.

OUTPUT VOLTAGE

V

O

(V) (50mV/div)

OUTPUT CURRENT, OUTPUT VOLTAGE

I

O

(A) (10Adiv) V

O

(V) (50mV/div)

TIME, t (1s/div)

TIME, t (20s /div)

Figure 33. Typical output ripple and noise (CO=2x47μF
ceramic, VIN = 12V, Io = Io,max, ).

Figure 34. Transient Response to Dynamic Load Change from
50% to 100% at 12Vin, Cout= 8x47uF, CTune=1500pF &
RTune=220 ohms

OUTPUT VOLTAGE ON/OFF VOLTAGE

V

O

(V) (2V/div) V

ON/OFF

(V) (5V/div)

OUTPUT VOLTAGE INPUT VOLTAGE

V

O

(V) (2V/div) V

IN

(V) (5V/div)

TIME, t (2ms/div)

TIME, t (2ms/div)

Figure 35. Typical Start-up Using On/Off Voltage (Io = Io,max).

Figure 36. Typical Start-up Using Input Voltage (VIN = 12V, Io =
Io,max).

70

75

80

85

90

95

100

0 5 10 15 20

Vin=7V

Vin=12V

Vin=14V

2

6

10

14

18

22

55 65 75 85 95 105

2m/s

(400LFM)

1.5m/s

(300LFM)

1m/s

(200LFM)

0.5m/s

(100LFM)

NC

Characteristic Curves

The following figures provide typical characteristics for the 20A Analog MicroDLynxTM at 5Vo and 25oC.

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 12

Input Ripple Voltage (mVp-p)

Output Voltage (Vdc)

0

50

100

150

200

250

300

350

400

450

0.5 1 1.5 2 2.5 3 3.5 4 4.5 5

2x22uF
3x22 uF

0

10

20

30

40

50

60

70

0.5 1 1.5 2 2.5 3 3.5 4 4.5 5

Ripple (mVp-p)

Output Voltage(Volts)

2x47uF Ext Cap
4x47uF Ext Cap
6x47uF Ext Cap
8x47uF Ext Cap

Design Considerations

Input Filtering

The 20A Analog MicroDLynxTM module should be
connected to a low ac-impedance source. A highly
inductive source can affect the stability of the module. An
input capacitance must be placed directly adjacent to the
input pin of the module, to minimize input ripple voltage
and ensure module stability.

To minimize input voltage ripple, ceramic capacitors are
recommended at the input of the module. Figure 37 shows
the input ripple voltage for various output voltages at 20A
of load current with 2x22 µF or 3x22 µF ceramic capacitors
and an input of 12V.

Figure 38. Output ripple voltage for various output
voltages with external 2x47 µF, 4x47 µF or 6x47 µF
ceramic capacitors at the output (20A load). Input voltage
is 12V.

Safety Considerations

For safety agency approval the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standards, i.e.,
UL 60950-1 2nd, CSA C22.2 No. 60950-1-07, DIN EN 60950­1:2006 + A11 (VDE0805 Teil 1 + A11):2009-11; EN 60950­1:2006 + A11:2009-03.

Figure 37. Input ripple voltage for various output
voltages with 2x22 µF or 3x22 µF ceramic capacitors at
the input (20A load). Input voltage is 12V.

Output Filtering

These modules are designed for low output ripple voltage
and will meet the maximum output ripple specification with

0.1 µF ceramic and 2x47 µF ceramic capacitors at the output
of the module. However, additional output filtering may be
required by the system designer for a number of reasons.
First, there may be a need to further reduce the output ripple
and noise of the module. Second, the dynamic response
characteristics may need to be customized to a particular
load step change.

To reduce the output ripple and improve the dynamic
response to a step load change, additional capacitance at
the output can be used. Low ESR polymer and ceramic
capacitors are recommended to improve the dynamic
response of the module. Figure 38 provides output ripple
information for different external capacitance values at
various Vo and a full load current of 20A. For stable
operation of the module, limit the capacitance to less than
the maximum output capacitance as specified in the
electrical specification table. Optimal performance of the
module can be achieved by using the Tunable LoopTM feature
described later in this data sheet.

For the converter output to be considered meeting the
requirements of safety extra-low voltage (SELV), the input
must meet SELV requirements. The power module has
extra-low voltage (ELV) outputs when all inputs are ELV.

The UDT020A0X series were tested using an external
Littelfuse 456 series fast-acting fuse rated at 30 A, 100 Vdc
in the ungrounded input.

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 13

V

O

(+)

TRIM

VS─

R

trim

LOAD

V

IN

(+)

ON/OFF

VS+

SIG_GND

20K

Rpullup

I

20K

ON/OFF

+

20K

3.3V

470

VIN

20K

Q7

20K

100pF

4.7K

ENABLE

100K

DLYNX MODULE

47K

Q2

+VIN

20K

GND

20K

20K

2K

ON/OFF

Q6

Q5

V

Q3

_

ENABLE

470

4.7K

+VIN

20K

100K

2K

100pF

_

47K

GND

Q6

20K

Q2

+

DLYNX MODULE

V

Rpullup

Q3

ON/OFF

20K

I

ON/OFF

3.3V

Q5

20K

0

2

4

6

8

10

12

14

16

0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6

Input Voltage (v)

Output Voltage (V)

Lower

Upper

Analog Feature Descriptions

Remote On/Off

The 20A Analog MicroDLynxTM power modules feature an
On/Off pin for remote On/Off operation. Two On/Off logic
options are available. In the Positive Logic On/Off option,
(device code suffix “4” – see Ordering Information), the
module turns ON during a logic High on the On/Off pin and
turns OFF during a logic Low. With the Negative Logic On/Off
option, (no device code suffix, see Ordering Information), the
module turns OFF during logic High and ON during logic Low.
The On/Off signal should be always referenced to ground. For
either On/Off logic option, leaving the On/Off pin
disconnected will turn the module ON when input voltage is
present.

For positive logic modules, the circuit configuration for using
the On/Off pin is shown in Figure 39. When the external
transistor Q2 is in the OFF state, the internal transistor Q7 is
turned ON, which turn Q3 OFF which keeps Q6 OFF and Q5
OFF. This allows the internal PWM #Enable signal to be pulled
up by the internal 3.3V, thus turning the module ON. When
transistor Q2 is turned ON, the On/Off pin is pulled low, which
turns Q7 OFF which turns Q3, Q6 and Q5 ON and the internal
PWM #Enable signal is pulled low and the module is OFF. A
suggested value for R

For negative logic On/Off modules, the circuit configuration is
shown in Fig. 40. The On/Off pin should be pulled high with an
external pull-up resistor (suggested value for the 3V to 14V
input range is 20Kohms). When transistor Q2 is in the OFF
state, the On/Off pin is pulled high, transistor Q3 is turned ON.
This turns Q6 ON, followed by Q5 turning ON which pulls the
internal ENABLE low and the module is OFF. To turn the
module ON, Q2 is turned ON pulling the On/Off pin low,
turning transistor Q3 OFF, which keeps Q6 and Q5 OFF
resulting in the PWM Enable pin going high.

pullup

is 20k.

Monotonic Start-up and Shutdown

The module has monotonic start-up and shutdown behavior
for any combination of rated input voltage, output current
and operating temperature range.

Startup into Pre-biased Output

The module can start into a prebiased output as long as the
prebias voltage is 0.5V less than the set output voltage.

Analog Output Voltage Programming

The output voltage of the module is programmable to any
voltage from 0.6dc to 5.5Vdc by connecting a resistor
between the Trim and SIG_GND pins of the module. Certain
restrictions apply on the output voltage set point depending
on the input voltage. These are shown in the Output Voltage
vs. Input Voltage Set Point Area plot in Fig. 41. The Upper
Limit curve shows that for output voltages lower than 1V,
the input voltage must be lower than the maximum of

14.4V. The Lower Limit curve shows that for output voltages
higher than 0.6V, the input voltage needs to be larger than
the minimum of 3V. .

Figure 41. Output Voltage vs. Input Voltage Set Point Area
plot showing limits where the output voltage can be set
for different input voltages.

Figure 39. Circuit configuration for using positive On/Off
logic.

Figure 40. Circuit configuration for using negative On/Off
logic.

Caution – Do not connect SIG_GND to GND elsewhere in the
layout

Figure 42. Circuit configuration for programming output
voltage using an external resistor.

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 14

 















 k

Vo

Rtrim

6.0

12

V

O, set

(V)

Rtrim (KΩ)

0.6

Open

0.9

40

1.0

30

1.2

20

1.5

13.33

1.8

10

2.5

6.316

3.3

4.444

5.0

2.727

100 pF

DLynx Module

R1=Rtrim

20K

SIG_GND

SEQ

SEQ

V

Vo

MODULE

SIG_GND

Trim

Q1

Rtrim

Rmargin-up

Q2

Rmargin-down

Without an external resistor between Trim and SIG_GND pins,
the output of the module will be 0.6Vdc. To calculate the
value of the trim resistor, Rtrim for a desired output voltage,
should be as per the following equation:

Rtrim is the external resistor in kΩ

Vo is the desired output voltage.

Table 1 provides Rtrim values required for some common
output voltages.

Table 1

Remote Sense

The power module has a Remote Sense feature to minimize
the effects of distribution losses by regulating the voltage
between the sense pins (VS+ and VS-). The voltage drop
between the sense pins and the VOUT and GND pins of the
module should not exceed 0.5V.

Analog Voltage Margining

Output voltage margining can be implemented in the module
by connecting a resistor, R
ground pin for margining-up the output voltage and by
connecting a resistor, R
pin for margining-down. Figure 43 shows the circuit
configuration for output voltage margining. The POL
Programming Tool, available at www.lineagepower.com
under the Downloads section, also calculates the values of
R
margin. Please consult your local Lineage Power technical
representative for additional details.

margin-up

and R

margin-down

margin-down

for a specific output voltage and %

, from the Trim pin to the

margin-up

, from the Trim pin to output

Figure 43. Circuit Configuration for margining Output
voltage.

Output Voltage Sequencing

The power module includes a sequencing feature, EZ­SEQUENCE that enables users to implement various types of
output voltage sequencing in their applications. This is
accomplished via an additional sequencing pin. When not
using the sequencing feature, leave it unconnected.

The voltage applied to the SEQ pin should be scaled down
by the same ratio as used to scale the output voltage down
to the reference voltage of the module. This is accomplished
by an external resistive divider connected across the
sequencing voltage before it is fed to the SEQ pin as shown
in Fig. 44. In addition, a small capacitor (suggested value
100pF) should be connected across the lower resistor R1.

For all DLynx modules, the minimum recommended delay
between the ON/OFF signal and the sequencing signal is
10ms to ensure that the module output is ramped up
according to the sequencing signal. This ensures that the
module soft-start routine is completed before the
sequencing signal is allowed to ramp up.

Figure 44. Circuit showing connection of the sequencing
signal to the SEQ pin.

When the scaled down sequencing voltage is applied to the
SEQ pin, the output voltage tracks this voltage until the
output reaches the set-point voltage. The final value of the
sequencing voltage must be set higher than the set-point
voltage of the module. The output voltage follows the
sequencing voltage on a one-to-one basis. By connecting

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 15

MODULE

SYNC

GND

+

─

multiple modules together, multiple modules can track their
output voltages to the voltage applied on the SEQ pin.

To initiate simultaneous shutdown of the modules, the SEQ
pin voltage is lowered in a controlled manner. The output
voltage of the modules tracks the voltages below their set­point voltages on a one-to-one basis. A valid input voltage
must be maintained until the tracking and output voltages
reach ground potential.

Overcurrent Protection

To provide protection in a fault (output overload) condition,
the unit is equipped with internal current-limiting circuitry
and can endure current limiting continuously. At the point of
current-limit inception, the unit enters hiccup mode. The unit
operates normally once the output current is brought back
into its specified range.

Overtemperature Protection

To provide protection in a fault condition, the unit is equipped
with a thermal shutdown circuit. The unit will shut down if the
overtemperature threshold of 120oC(typ) is exceeded at the
thermal reference point T
shutdown it will then wait to cool before attempting to
restart.

.Once the unit goes into thermal

ref

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout limit,
the module operation is disabled. The module will begin to
operate at an input voltage above the undervoltage lockout
turn-on threshold.

Synchronization

The module switching frequency can be synchronized to a
signal with an external frequency within a specified range.
Synchronization can be done by using the external signal
applied to the SYNC pin of the module as shown in Fig. 45,
with the converter being synchronized by the rising edge of
the external signal. The Electrical Specifications table
specifies the requirements of the external SYNC signal. If the
SYNC pin is not used, the module should free run at the
default switching frequency. If synchronization is not being

used, connect the SYNC pin to GND.

Figure 45. External source connections to synchronize
switching frequency of the module.

Dual Layout

Identical dimensions and pin layout of Analog and Digital
MicroDLynx modules permit migration from one to the other
without needing to change the layout. In both cases the trim
resistor is connected between trim and signal ground. The
output of the analog module cannot be trimmed down to

0.45V

Power Good

The module provides a Power Good (PGOOD) signal that is
implemented with an open-drain output to indicate that the
output voltage is within the regulation limits of the power
module. The PGOOD signal will be de-asserted to a low state
if any condition such as overtemperature, overcurrent or
loss of regulation occurs that would result in the output
voltage going ±10% outside the setpoint value. The PGOOD
terminal can be connected through a pullup resistor
(suggested value 100K) to a source of 5VDC or lower.

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 16

Co

2x47F

4x47F

6x47F

10x47F

20x47F

R

TUNE

330

330

270

220

180

C

TUNE

47pF

560pF

1200pF

2200pF

4700pF

Vo

5V

3.3V

2.5V

1.8V

1.2V

0.6V

Co

8x47F

5x47F +

1x330F

Polymer

2x47F

+

2x330F

Polymer

2x47F

+

3x330F

Polymer

1x47F

+

5x330F

Polymer

1x47F

+

11x330F

Polymer

R

TUNE

220

220

220

220

180

180

C

TUNE

1500pF

2200pF

3300pF

5600pF

10nF

47nF

V

100mV

64mV

49mV

36mV

24mV

12mV

VS+

MODULE

SIG_GND

TRIM

VOUT

RTune

CTune

RTrim

CO

GND

Tunable Loop

TM

The module has a feature that optimizes transient response
of the module called Tunable LoopTM.

External capacitors are usually added to the output of the
module for two reasons: to reduce output ripple and noise
(see Figure 38) and to reduce output voltage deviations from
the steady-state value in the presence of dynamic load
current changes. Adding external capacitance however
affects the voltage control loop of the module, typically
causing the loop to slow down with sluggish response.
Larger values of external capacitance could also cause the
module to become unstable.

The Tunable LoopTM allows the user to externally adjust the
voltage control loop to match the filter network connected to
the output of the module. The Tunable LoopTM is implemented
by connecting a series R-C between the VS+ and TRIM pins of
the module, as shown in Fig. 46. This R-C allows the user to
externally adjust the voltage loop feedback compensation of
the module.

different values of ceramic output capacitors up to 1000uF
that might be needed for an application to meet output ripple
and noise requirements. Selecting R

TUNE

and C

according

TUNE

to Table 3 will ensure stable operation of the module.
In applications with tight output voltage limits in the presence
of dynamic current loading, additional output capacitance
will be required. Table 3 lists recommended values of R
and C

in order to meet 2% output voltage deviation limits

TUNE

TUNE

for some common output voltages in the presence of a 10A
to 20A step change (50% of full load), with an input voltage of
12V.

Please contact your Lineage Power technical representative
to obtain more details of this feature as well as for guidelines
on how to select the right value of external R-C to tune the
module for best transient performance and stable operation
for other output capacitance values.

Table 2. General recommended values of of R
C

for Vin=12V and various external ceramic capacitor

TUNE

TUNE

and

combinations.

Table 3. Recommended values of R

TUNE

and C

TUNE

to obtain
transient deviation of 2% of Vout for a 10A step load with
Vin=12V.

Figure. 46. Circuit diagram showing connection of R
and C

Recommended values of R
capacitor combinations are given in Tables 2 and 3. Table 3
shows the recommended values of R

to tune the control loop of the module.

TUNE

and C

TUNE

for different output

TUNE

TUNE

and C

TUNE

for

TUME

Note: The capacitors used in the Tunable Loop tables are
47 μF/3 mΩ ESR ceramic and 330 μF/12 mΩ ESR polymer
capacitors.

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 17

Air

flow

x

Power Module

Wind Tunnel

PWBs

12.7_

(0.50)

76.2_

(3.0)

Probe Location

for measuring

airflow and

ambient

temperature

25.4_

(1.0)

Figure 48. Thermal Test Setup.

Thermal Considerations

Power modules operate in a variety of thermal environments;
however, sufficient cooling should always be provided to help
ensure reliable operation.

Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will
result in an increase in reliability. The thermal data presented
here is based on physical measurements taken in a wind
tunnel. The test set-up is shown in Figure 48. The preferred
airflow direction for the module is in Figure 49.

The thermal reference points, T

used in the specifications

ref

are also shown in Figure 49. For reliable operation the
temperatures at these points should not exceed 130oC. The
output power of the module should not exceed the rated
power of the module (Vo,set x Io,max).

Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-Mounted
Power Modules” for a detailed discussion of thermal
aspects including maximum device temperatures.

Figure 49. Preferred airflow direction and location of hot­spot of the module (Tref).

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 18

Frequency (Hz)

PSD Level

(G2/Hz)

Frequency (Hz)

PSD Level

(G2/Hz)

Frequency (Hz)

PSD Level

(G2/Hz)

10

1.14E-03

170

2.54E-03

690

1.03E-03

30

5.96E-03

230

3.70E-03

800

7.29E-03

40

9.53E-04

290

7.99E-04

890

1.00E-03

50

2.08E-03

340

1.12E-02

1070

2.67E-03

90

2.08E-03

370

1.12E-02

1240

1.08E-03

110

7.05E-04

430

8.84E-04

1550

2.54E-03

130

5.00E-03

490

1.54E-03

1780

2.88E-03

140

8.20E-04

560

5.62E-04

2000

5.62E-04

Frequency (Hz)

PSD Level

(G2/Hz)

Frequency (Hz)

PSD Level

(G2/Hz)

Frequency (Hz)

PSD Level

(G2/Hz)

10

0.00803

170

0.01795

690

0.00727

30

0.04216

230

0.02616

800

0.05155

40

0.00674

290

0.00565

890

0.00709

50

0.01468

340

0.07901

1070

0.01887

90

0.01468

370

0.07901

1240

0.00764

110

0.00498

430

0.00625

1550

0.01795

130

0.03536

490

0.01086

1780

0.02035

140

0.0058

560

0.00398

2000

0.00398

Shock and Vibration

The ruggedized (-D version) of the modules are designed to
withstand elevated levels of shock and vibration to be able to
operate in harsh environments. The ruggedized modules
have been successfully tested to the following conditions:

Non operating random vibration:

Random vibration tests conducted at 25C, 10 to 2000Hz, for
30 minutes each level, starting from 30Grms (Z axis) and up to
50Grms (Z axis). The units were then subjected to two more
tests of 50Grms at 30 minutes each for a total of 90 minutes.

Operating shock to 40G per Mil Std. 810F, Method 516.4
Procedure I:

The modules were tested in opposing directions along each
of three orthogonal axes, with waveform and amplitude of
the shock impulse characteristics as follows:

All shocks were half sine pulses, 11 milliseconds (ms) in
duration in all 3 axes.

Units were tested to the Functional Shock Test of MIL-STD­810, Method 516.4, Procedure I - Figure 516.4-4. A shock
magnitude of 40G was utilized. The operational units were

Table 7: Performance Vibration Qualification - All Axes

subjected to three shocks in each direction along three axes
for a total of eighteen shocks.

Operating vibration per Mil Std 810F, Method 514.5
Procedure I:

The ruggedized (-D version) modules are designed and
tested to vibration levels as outlined in MIL-STD-810F,
Method 514.5, and Procedure 1, using the Power Spectral
Density (PSD) profiles as shown in Table 7 and Table 8 for all
axes. Full compliance with performance specifications was
required during the performance test. No damage was
allowed to the module and full compliance to performance
specifications was required when the endurance
environment was removed. The module was tested per MIL­STD-810, Method 514.5, Procedure I, for functional
(performance) and endurance random vibration using the
performance and endurance levels shown in Table 7 and
Table 8 for all axes. The performance test has been split,
with one half accomplished before the endurance test and
one half after the endurance test (in each axis). The duration
of the performance test was at least 16 minutes total per
axis and at least 120 minutes total per axis for the
endurance test. The endurance test period was 2 hours
minimum per axis.

Table 8: Endurance Vibration Qualification - All Axes

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 19

VS-

GND

Vin+

CI3

CO3

VOUT

VS+

GND

TRIM

CTUNE

RTUNE

RTrim

VIN

CO1

CI1

Vout+

ON/OFF

SEQ

MODULE

PGOOD

SIG_GND

SYNC

CI2

CO2

Example Application Circuit

Requirements:
Vin: 12V
Vout: 1.8V
Iout: 15A max., worst case load transient is from 10A to 15A
Vout: 1.5% of Vout (27mV) for worst case load transient
Vin, ripple 1.5% of Vin (180mV, p-p)

CI1 Decoupling cap - 1x0.047F/16V ceramic capacitor (e.g. Murata LLL185R71C473MA01)
CI2 3x22F/16V ceramic capacitor (e.g. Murata GRM32ER61C226KE20)
CI3 47F/16V bulk electrolytic
CO1 Decoupling cap - 1x0.047F/16V ceramic capacitor (e.g. Murata LLL185R71C473MA01)
CO2 N.A.
CO3 3 x 330F/6.3V Polymer (e.g. Sanyo Poscap)
CTune 4700pF ceramic capacitor (can be 1206, 0805 or 0603 size)
RTune 330 ohms SMT resistor (can be 1206, 0805 or 0603 size)
RTrim 10k SMT resistor (can be 1206, 0805 or 0603 size, recommended tolerance of 0.1%)

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 20

PIN

FUNCTION

PIN

FUNCTION

1

ON/OFF

10

SYNC1

2

VIN

11

NC 3 SEQ

12

NC

4

GND

13

NC

5

TRIM

14

SIG_GND

6

VOUT

15

NC

7

VS+

16

NC 8 VS- 9 PG

Mechanical Outline

Dimensions are in millimeters and (inches).
Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated]
x.xx mm  0.25 mm (x.xxx in  0.010 in.)

1

If unused, connect to Ground.

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 21

PIN

FUNCTION

PIN

FUNCTION

1

ON/OFF

10

SYNC2

2

VIN

11

NC 3 SEQ

12

NC 4 GND

13

NC 5 TRIM

14

SIG_GND

6

VOUT

15

NC

7

VS+

16

NC 8 VS-

9

PG

Recommended Pad Layout

Dimensions are in millimeters and (inches).
Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated]
x.xx mm  0.25 mm (x.xxx in  0.010 in.)

2

If unused, connect to Ground.

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 22

Packaging Details

The 12V Analog MicroDLynxTM 20A modules are supplied in tape & reel as standard. Modules are shipped in quantities of 200
modules per reel.

All Dimensions are in millimeters and (in inches).

Reel Dimensions:
Outside Dimensions: 330.2 mm (13.00)
Inside Dimensions: 177.8 mm (7.00”)
Tape Width: 44.00 mm (1.732”)

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

April 24, 2013

©2012 General Electric Company. All rights reserved.

Page 23

Per J-STD-020 Rev. C

0

50

100

150

200

250

300

Reflow Time (Seconds)

Reflow Temp (°C)

Heating Zone
1°C/Second

Peak Temp 260°C
* Min. Time Above 235°C

15 Seconds

*Time Above 217°C

60 Seconds

Cooling
Zone

Surface Mount Information

Pick and Place

The 20A Analog MicroDLynxTM modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and place
operations. The label meets all the requirements for surface
mount processing, as well as safety standards, and is able to
withstand reflow temperatures of up to 300oC. The label also
carries product information such as product code, serial
number and the location of manufacture.

Nozzle Recommendations

The module weight has been kept to a minimum by using
open frame construction. Variables such as nozzle size, tip
style, vacuum pressure and placement speed should be
considered to optimize this process. The minimum
recommended inside nozzle diameter for reliable operation is
3mm. The maximum nozzle outer diameter, which will safely
fit within the allowable component spacing, is 7 mm.

Bottom Side / First Side Assembly

This module is not recommended for assembly on the bottom
side of a customer board. If such an assembly is attempted,
components may fall off the module during the second reflow
process.

Lead Free Soldering

The modules are lead-free (Pb-free) and RoHS compliant and
fully compatible in a Pb-free soldering process. Failure to
observe the instructions below may result in the failure of or
cause damage to the modules and can adversely affect long­term reliability.

Moisture barrier bags (MBB) with desiccant are required for
MSL ratings of 2 or greater. These sealed packages should
not be broken until time of use. Once the original package is
broken, the floor life of the product at conditions of  30°C
and 60% relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT packages
will be a minimum of 12 months from the bag seal date,
when stored at the following conditions: < 40° C, < 90%
relative humidity.

Figure 50. Recommended linear reflow profile using
Sn/Ag/Cu solder.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures, refer
to Board Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).

Pb-free Reflow Profile

Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow profile
based on the volume and thickness of the package (table 4-

2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). For
questions regarding Land grid array(LGA) soldering, solder
volume; please contact Lineage Power for special
manufacturing process instructions. The recommended linear
reflow profile using Sn/Ag/Cu solder is shown in Fig. 50.
Soldering outside of the recommended profile requires
testing to verify results and performance.

MSL Rating

The 20A Analog MicroDLynxTM modules have a MSL rating of
2a.

Storage and Handling

The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and
Use of Moisture/Reflow Sensitive Surface Mount Devices).

GE

Data Sheet

20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current

Contact Us

For more information, call us at

USA/Canada:

[phone], or [phone]

Asia-Pacific:

+86.021.54279977*808

Europe, Middle-East and Africa:

+49.89.74423-206

India:
+91.80.28411633

www.ge.com/powerelectronics

April 24, 2013

©2012 General Electric Company. All rights reserved.

Version 1.26

Device Code

Input

Voltage Range

Output

Voltage

Output

Current

On/Off

Logic

Sequencing

Comcodes

UDT020A0X3-SRZ

3 – 14.4Vdc

0.45 – 5.5Vdc

20A

Negative

Yes

CC109159728

UDT020A0X3-SRDZ

3 – 14.4Vdc

0.45 – 5.5Vdc

20A

Negative

Yes

CC109168745

UDT020A0X43-SRZ

3 – 14.4Vdc

0.45 – 5.5Vdc

20A

Positive

Yes

CC109159736

Package

Identifier

Family

Sequencing

Option

Output
current

Remot

e

Sense

Options

ROHS

Compliance

U D T

020A0 X 3 -SR

-D

Z

P=Pico
U=Micro
M=Mega

G=Giga

D=Dlynx

Digital

V = DLynx

Analog.

T=with EZ
Sequence

X=without

sequencing

20A

X =

programmable

output

4 = positive

No entry =

negative

3 =

Remote

Sense

S =

Surface

Mount

R =

Tape &

Reel

D = 105°C

operating

ambient,

40G

operating

shock as

per MIL Std

810F

Z = ROHS6

Ordering Information

Please contact your GE Sales Representative for pricing, availability and optional features.

Table 9. Device Codes

-Z refers to RoHS compliant parts

Table 10. Coding Scheme

GE Digital Non-Isolated DC-DC products use technology licensed from Power-One, protected by US patents: US20040246754, US2004090219A1, US2004093533A1, US2004123164A1,

US2004123167A1, US2004178780A1, US2004179382A1, US20050200344, US20050223252, US2005289373A1, US20060061214, US2006015616A1, US20060174145, US20070226526,
US20070234095, US20070240000, US20080052551, US20080072080, US20080186006, US6741099, US6788036, US6936999, US6949916, US7000125, US7049798, US7068021, US7080265,
US7249267, US7266709, US7315156, US7372682, US7373527, US7394445, US7456617, US7459892, US7493504, US7526660.
Outside the US the Power-One licensed technology is protected by patents: AU3287379AA, AU3287437AA, AU3290643AA, AU3291357AA, CN10371856C, CN1045261OC, CN10458656C,
CN10459360C, CN10465848C, CN11069332A, CN11124619A, CN11346682A, CN1685299A, CN1685459A, CN1685582A, CN1685583A, CN1698023A, CN1802619A, EP1561156A1, EP1561268A2,
EP1576710A1, EP1576711A1, EP1604254A4, EP1604264A4, EP1714369A2, EP1745536A4, EP1769382A4, EP1899789A2, EP1984801A2, W004044718A1, W004045042A3, W004045042C1,
W004062061 A1, W004062062A1, W004070780A3, W004084390A3, W004084391A3, W005079227A3, W005081771A3, W006019569A3, W02007001584A3, W02007094935A3