GE phoenix x|act 2D Operating Manual

GE

Measurement & Control Solutions
phoenix|x-ray

nanome|x – the ultimate X-ray solution

This automatic X-ray system of superior specifications satisfies even highest demands for the
inspection of high-end interconnections in the semiconductor and SMT industry. The high-per­formance nanofocus tube (4-in-1) covers the full range from submicron resolution to high-inten­sity applications. The digital realtime image chain provides an excellent contrast resolution and
enables oblique views up to 70 degrees and magnifications well above 24 000x. The nanome|x
offers unique performance and versatility and can be used for 2D X-ray inspection as well as for
full 3D computed tomography. With the new x|act software package the nanome|x is the system
of choice to ensure meeting actual and future zero defect requirements.

Setting new standards

 180 kV / 15 W high-power nanofocus tube
 2-Megapixel digital image chain
 24” TFT monitor

nanoCT® of CSP solder joints

QFN: two open joints

Wedge-bond

Cracked die

 x|act software package: easy and fast CAD based programming for high-

resolution automated X-ray inspection (µAXI) with high magnification and
repeatability

 Outstanding ease-of-use
 Detail detectability down to 0.2 microns
 Optical zoom up to 24 000x
 Oblique views at angles between 0 and 70 degrees
 Dual detector (digital image chain and active temperature-stabilized digital

detector with 30 fps) for brilliant live images

 4-Megapixel digital image chain available
 Upgradeable to nanoCT

®

BGA: insucient reow

nanoCT® of stacked dies

GE

Measurement & Control Solutions
phoenix|x-ray

nanofocus X-ray inspection of high-end interconnections

Electronic packages are sophisticated electronic devices with complex, internal features. In or­der to meet the quality requirements of the industry, X-ray inspection solutions must not only be
capable of delivering detail detectabilities in the submicron range but also of detecting hidden
defects and flaws. With its nanofocus technology, the nanome|x provides focal spot sizes in the
submicron range to ensure very little geometric fuzziness and greater resolution allowing it to re­solve image features as small as 200 nanometers. The two images on the right side clearly show:
the smaller the focal spot, the sharper the image.

microfocus: focal spot 5 microns

nanofocus: focal spot < 1 micron

x|a ct

mee ti ng zero -de fe ct quali ty s tand ard s

As a solution for µAXI with extreme high defect coverage, phoenix|x-ray provides its high preci­sion off-line µAXI system nanome|x including the unique x|act software package for fast and easy
offline CAD programming. Outstanding precision and repeatability, small views with resolutions
of only a few micrometers, 360° rotation and oblique viewing up to 70° ensures meeting highest
quality standards. Besides the automated X-ray inspection, the µAXI system can be used for ma­nual failure analysis or 3D computed tomography as well.

 Efficient CAD programming - minimized setup time
 3D auto-referencing - optimized positioning accuracy
 Live 3D CAD overlay - easy pad identification even in oblique

viewing and rotation

nan oCT

hig h- res olut ion 3 D i magin g

®

Automated multiple die inspection

Live CAD overlay with inspection results

>

For high resolution 3D analysis of smaller samples, the nanome|x system can be upgraded for
full 3D computed tomography. High power nanofocus X-ray technology paired with a fast re­construction software deliver unrivaled, highest-quality inspection results with nanoCT® image
resolutions.
The 3D nanoCT® image on the right side shows, that each individual die attach is clearly visi-

ble and can be examined for voids.

GE Sensing & Inspection
Technologies GmbH

phoenix|x-ray
Niels-Bohr-Str. 7
D-31515 Wunstorf | Germany
Tel.: + 49 5031.172-0
Fax.: + 49 5031.172-299
[e-mail]

3D nanoCT® of stacked dies

Pores in a single die attach

Further offices:

[e-mail]
[e-mail]
[e-mail]
[e-mail]
[e-mail]

www.gesensinginspection.com

>

GEIT-31202EN (0910)