GE MiCOM P747 Agile, MiCOM P40 Agile Technical Manual
GE Energy Connections
Grid Solutions
MiCOM P40 Agile
P747
Technical Manual
Busbar Protection IED
Hardware version: A
Publication reference: P747-TM-EN-1.1
Software version: 2
Contents
P747-TM-EN-1.1
Chapter 1 Introduction 1
1 Chapter Overview 3
2 Foreword 4
2.1 Target Audience 4
2.2 Typographical Conventions 4
2.3 Nomenclature 4
2.4 Product Scope 5
3 Features and Functions 6
3.1 Protection Functions 6
3.2 Control Functions 6
3.3 Measurement Functions 6
3.4 Communication Functions 7
4 Compliance 8
5 Functional Overview 9
6 Ordering Options 10
Chapter 2 Safety Information 11
1 Chapter Overview 13
2 Health and Safety 14
3 Symbols 15
4 Installation, Commissioning and Servicing 16
4.1 Lifting Hazards 16
4.2 Electrical Hazards 16
4.3 UL/CSA/CUL Requirements 17
4.4 Fusing Requirements 17
4.5 Equipment Connections 18
4.6 Protection Class 1 Equipment Requirements 18
4.7 Pre-energization Checklist 19
4.8 Peripheral Circuitry 20
4.9 Upgrading/Servicing 20
5 Decommissioning and Disposal 21
Chapter 3 Hardware Design 23
1 Chapter Overview 25
2 Hardware Architecture 26
3 Mechanical Implementation 27
3.1 Housing Variants 27
3.2 List of Boards 28
4 Front Panel 29
4.1 Front Panel 29
4.1.1 Top compartment with hinged cover 30
4.1.2 Keypad 30
4.1.3 Liquid Crystal Display 30
4.1.4 Front Serial Port (SK1) 30
4.1.5 Front Parallel Port (SK2) 31
4.1.6 Fixed Function LEDs 31
4.1.7 Function Keys 32
4.1.8 Programable LEDs 32
5 Rear Panel 33
6 Boards and Modules 35
6.1 PCBs 35
6.2 Subassemblies 35
Contents MiCOM P747
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6.3 Main Processor Board 36
6.4 Combined Coprocessor and Isolated Input Board 37
6.5 Power Supply Board 38
6.5.1 Watchdog 40
6.5.2 Rear Serial Port 41
6.6 Input Module - 2 Transformer Boards 42
6.6.1 Sigma-Delta Input Module Circuit Description 43
6.6.2 Transformer Board 45
6.6.3 Main Input Board 46
6.7 Standard Output Relay Board 47
6.8 IRIG-B Board 49
6.9 Fibre Optic Board 50
6.10 Rear Communication Board 51
6.11 Ethernet Board 52
6.12 Redundant Ethernet Board 53
Chapter 4 Configuration 55
1 Chapter Overview 57
2 Using the HMI Panel 58
2.1 Navigating the HMI Panel 59
2.2 Getting Started 59
2.3 Default Display 60
2.4 Default Display Navigation 61
2.5 Password Entry 61
2.6 Processing Alarms and Fault Records 62
2.7 Menu Structure 63
2.8 Changing the Settings 64
2.9 Direct Access (The Hotkey menu) 64
2.9.1 Setting Group Selection 65
2.9.2 Control Inputs 65
2.9.3 Circuit Breaker Control 66
2.10 Function Keys 66
3 Configuring the Data Protocols 68
3.1 Courier Configuration 68
3.2 DNP3 Configuration 70
3.2.1 DNP3 Configurator 71
3.3 IEC 60870-5-103 Configuration 71
3.4 MODBUS Configuration 73
3.5 IEC 61850 Configuration 74
3.5.1 IEC 61850 Configuration Banks 75
3.5.2 IEC 61850 Network Connectivity 75
4 Date and Time Configuration 76
4.1 Time Zone Compensation 76
4.2 Daylight Saving Time Compensation 76
5 Configuration Settings 78
5.1 System Data 78
5.2 Date and Time 83
5.3 General Configuration 84
5.4 Transformer Ratios 86
5.5 System Configuration 90
5.6 Security Configuration 95
Chapter 5 Protection Functions 97
1 Chapter Overview 99
2 Busbar Protection 100
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2.1 Unit Protection 100
2.2 Current Differential Protection Principles 100
2.3 Through Fault Stability 101
2.4 Bias Current Compensation 101
3 Busbar Multiple Tripping Criteria 103
3.1 Tripping Criteria DDBs 103
3.2 Topology Replica Function 104
3.3 Topology Replica Function DDBs 105
3.4 Zone Current Differential Elements 106
3.5 Check Zone 106
3.5.1 Check Zone Supervision 107
3.5.2 Auxiliary Contacts Discrepancy 107
3.6 Continuous Supervision of Current Circuits (Circuitry Fail) 107
3.7 Current Phase Comparison Check 108
3.8 Optional Voltage Criteria 109
3.9 Instantaneous or Delayed Tripping 109
3.10 Dead Zone (Blind Spot) Protection 109
3.11 Dead Zone (Blind Spot) Protection Logic 110
3.12 Dead Zone (Blind Spot) Protection DDBs 110
4 Circuit Breaker Fail Protection 111
4.1 Circuit Breaker Fail Implementation 111
4.2 Circuit Breaker Fail Logic 111
4.3 CB Fail Settings 113
4.4 CB Fail DDB signals 114
5 Backup Overcurrent Protection 116
5.1 Overcurrent 1 Settings 116
5.2 Overcurrent 2 Settings 121
5.3 Overcurrent DDB signals 133
6 Configuring the Busbar Protection 137
6.1 Example of Configuring the Busbar Protection 137
Chapter 6 Monitoring and Control 141
1 Chapter Overview 143
2 Event Records 144
2.1 Event Records Table 144
2.2 Event Types 151
2.2.1 Opto-input Events 152
2.2.2 Contact Events 152
2.2.3 Alarm Events 152
2.2.4 Fault Record Events 155
2.2.5 Maintenance Events 156
2.2.6 Protection Events 157
2.2.7 Security Events 157
2.2.8 Platform Events 158
2.3 View Records Column 158
3 Disturbance Recorder 161
4 Measurements 162
4.1 Measured Quantities 162
4.1.1 Measured and Calculated Currents 162
4.1.2 Measured and Calculated Voltages 162
4.1.3 Power and Energy Quantities 162
4.1.4 Demand Values 163
4.1.5 Frequency Measurements 163
4.1.6 Other Measurements 163
4.2 Measurement Setup 163
4.3 Measurement Tables 164
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4.4 Measurement Table 3 167
5 I/O Functions 168
5.1 Function Keys 168
5.1.1 Function Key DDB Signals 168
5.1.2 Function Key Settings 169
5.2 LEDs 169
5.2.1 Fixed Function LEDs 169
5.2.2 Programable LEDs 170
5.2.3 Function Key LEDs 170
5.2.4 Trip LED Logic 170
5.2.5 LED DDB Signals 170
5.2.6 LED Conditioners 172
5.3 Opto-inputs 172
5.3.1 Opto-input Configuration 172
5.3.2 Opto-input Labels 175
5.3.3 Opto-input DDB Signals 177
5.3.4 Enhanced Time Stamping 178
5.4 Output Relays 178
5.4.1 Output Relay Labels 178
5.4.2 Output Relay DDB Signals 180
5.4.3 Output Relay Conditioners 180
5.5 Control Inputs 180
5.5.1 Control Input Settings 180
5.5.2 Control Input Configuration 182
5.5.3 Control Input Labels 186
5.5.4 Control Input DDB Signals 186
6 Voltage Transformer Supervision 187
7 Trip Circuit Supervision 188
7.1 Trip Circuit Supervision Scheme 1 188
7.1.1 PSL for TCS Scheme 1 189
7.2 Trip Circuit Supervision Scheme 2 189
7.2.1 PSL for TCS Scheme 2 190
7.3 Trip Circuit Supervision Scheme 3 190
7.3.1 PSL for TCS Scheme 3 190
Chapter 7 SCADA Communications 191
1 Chapter Overview 193
2 Communication Interfaces 194
3 Serial Communication 195
3.1 EIA(RS)232 Bus 195
3.2 EIA(RS)485 Bus 195
3.2.1 EIA(RS)485 Biasing Requirements 196
3.3 K-Bus 196
4 Standard Ethernet Communication 198
5 Overview of Data Protocols 199
6 Courier 200
6.1 Physical Connection and Link Layer 200
6.2 Courier Database 200
6.3 Settings Categories 200
6.4 Setting Changes 200
6.5 Settings Transfer 201
6.6 Event Extraction 201
6.6.1 Automatic Event Record Extraction 201
6.6.2 Manual Event Record Extraction 201
6.7 Disturbance Record Extraction 202
6.8 Programmable Scheme Logic Settings 203
6.9 Time Synchronisation 203
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6.10 Configuration 203
7 IEC 60870-5-103 204
7.1 Physical Connection and Link Layer 204
7.2 Initialisation 204
7.3 Time Synchronisation 205
7.4 Spontaneous Events 205
7.5 General Interrogation (GI) 205
7.6 Cyclic Measurements 205
7.7 Commands 205
7.8 Test Mode 205
7.9 Disturbance Records 205
7.10 Command/Monitor Blocking 206
7.11 Configuration 206
8 DNP 3.0 207
8.1 Physical Connection and Link Layer 207
8.2 Object 1 Binary Inputs 207
8.3 Object 10 Binary Outputs 207
8.4 Object 20 Binary Counters 208
8.5 Object 30 Analogue Input 208
8.6 Object 40 Analogue Output 209
8.7 Object 50 Time Synchronisation 209
8.8 Configuration 209
9 MODBUS 210
9.1 Physical Connection and Link Layer 210
9.2 MODBUS Functions 210
9.3 Response Codes 210
9.4 Register Mapping 211
9.5 Event Extraction 211
9.5.1 Automatic Event Record Extraction 211
9.5.2 Manual Event Record Extraction 212
9.5.3 Record Data 212
9.6 Disturbance Record Extraction 213
9.6.1 Manual Extraction Procedure 214
9.6.2 Automatic Extraction Procedure 215
9.6.3 Extracting the Disturbance Data 217
9.7 Setting Changes 220
9.8 Password Protection 220
9.9 Protection and Disturbance Recorder Settings 220
9.10 Time Synchronisation 221
9.11 Power and Energy Measurement Data Formats 222
10 IEC 61850 223
10.1 Benefits of IEC 61850 223
10.2 IEC 61850 Interoperability 223
10.3 The IEC 61850 Data Model 223
10.4 IEC 61850 in MiCOM IEDs 224
10.5 IEC 61850 Data Model Implementation 225
10.6 IEC 61850 Communication Services Implementation 225
10.7 IEC 61850 Peer-to-peer (GSSE) communications 225
10.8 Mapping GOOSE Messages to Virtual Inputs 226
10.8.1 IEC 61850 GOOSE Configuration 226
10.9 Ethernet Functionality 226
10.9.1 Ethernet Disconnection 226
10.9.2 Loss of Power 226
10.10 IEC 61850 Configurator Settings 226
11 Read Only Mode 229
11.1 IEC 60870-5-103 Protocol 229
11.2 Courier Protocol 229
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11.3 IEC 61850 Protocol 230
11.4 Read-Only Settings 230
11.5 Read-Only DDB Signals 230
12 Time Synchronisation 231
13 Demodulated IRIG-B 232
13.1 IRIG-B Implementation 232
14 SNTP 233
15 Time Synchronsiation using the Communication Protocols 234
16 Communication Settings 235
Chapter 8 Redundant Ethernet 239
1 Chapter Overview 241
2 Board Versions 242
3 Board Connections 243
4 Redundancy Protocols 244
4.1 Parallel Redundancy Protocol (PRP) 244
4.1.1 PRP Networks 244
4.1.2 Network Elements 244
4.2 Rapid Spanning Tree Protocol (RSTP) 246
4.3 Self-Healing Protocol (SHP) 247
4.4 Dual-Homing Protocol (DHP) 249
5 Generic Functions for Redundant Ethernet Boards 252
5.1 Forwarding 252
5.1.1 Priority Tagging 252
5.2 Simple Network Management Protocol (SNMP) 252
5.3 SNMP MIB Structure for RSTP, DHP and SHP 253
5.4 SNMP MIB Structure for PRP 254
5.5 Simple Network Time Protocol (SNTP) 257
6 Configuring IP Addresses 258
6.1 Configuring the IED IP Address 258
6.2 Configuring the Board IP Address 258
6.2.1 Configuring the First Two Octets of the Board IP Address 259
6.2.2 Configuring the Third Octet of the Board IP Address 259
6.2.3 Configuring the Last Octet of the Board IP Address 259
7 PRP Configurator 262
7.1 Connecting the IED to a PC 262
7.2 Installing the Configurator 262
7.3 Starting the Configurator 263
7.4 PRP Device Identification 263
7.5 PRP IP Address Configuration 263
7.6 SNTP IP Address Configuration 263
7.7 Check for Connected Equipment 263
7.8 PRP Configuration 264
7.9 Filtering Database 264
7.10 End of Session 264
8 RSTP Configurator 265
8.1 Connecting the IED to a PC 265
8.2 Installing the Configurator 265
8.3 Starting the Configurator 266
8.4 RSTP Device Identification 266
8.5 RSTP IP Address Configuration 266
8.6 SNTP IP Address Configuration 266
8.7 Check for Connected Equipment 267
8.8 RSTP Configuration 267
8.8.1 Bridge parameters 267
8.8.2 Port Parameters 267
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8.8.3 Port States 268
8.9 End of Session 268
9 Switch Manager 269
9.1 Installation 269
9.2 Setup 270
9.3 Network Setup 270
9.4 Bandwidth Used 270
9.5 Reset Counters 270
9.6 Check for Connected Equipment 271
9.7 Mirroring Function 271
9.8 Ports On/Off 271
9.9 VLAN 271
9.10 End of Session 272
Chapter 9 Cyber-Security 273
1 Overview 275
2 The Need for Cyber-Security 276
3 Standards 277
3.1 NERC Compliance 277
3.1.1 CIP 002 278
3.1.2 CIP 003 278
3.1.3 CIP 004 278
3.1.4 CIP 005 278
3.1.5 CIP 006 278
3.1.6 CIP 007 279
3.1.7 CIP 008 279
3.1.8 CIP 009 279
3.2 IEEE 1686-2007 279
4 Cyber-Security Implementation 281
4.1 NERC-Compliant Display 281
4.2 Four-level Access 282
4.2.1 Blank Passwords 283
4.2.2 Password Rules 283
4.2.3 Access Level DDBs 284
4.3 Enhanced Password Security 284
4.3.1 Password Strengthening 284
4.3.2 Password Validation 284
4.3.3 Password Blocking 285
4.4 Password Recovery 286
4.4.1 Password Recovery 286
4.4.2 Password Encryption 287
4.5 Disabling Physical Ports 287
4.6 Disabling Logical Ports 287
4.7 Security Events Management 288
4.8 Logging Out 290
5 Cyber-Security Settings 291
Chapter 10 Settings Application Software 293
1 Introduction to the Settings Application Software 295
1.1 Getting Started 295
1.1.1 Quick System Guide 296
1.1.2 Download Data Models 297
1.1.3 Set Up a System 297
1.1.4 Connect to an IED Front Port 297
1.1.5 Connect to an IED in a System 297
1.1.6 Send Settings to a Device 297
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1.1.7 Extract Settings From a Device 297
1.1.8 Extract a PSL File From a Device 297
1.1.9 Extract a DNP3 File From a Device 298
1.1.10 Extract an Events File From a Device 298
1.1.11 Extract a Disturbance Record From a Device 298
1.2 PSL Editor 298
1.3 IEC 61850 Configurator 298
1.4 DNP3 Configurator 298
1.5 Curve Tool 299
1.6 S&R Courier 299
1.7 AEDR2 299
1.8 WinAEDR2 299
1.9 Wavewin 299
1.10 Device (Menu) Text Editor 300
1.11 Event Viewer 300
1.12 GOOSE Editor 300
1.13 PRP Configurator 300
1.14 RSTP Configurator 300
1.15 Switch Manager 301
Chapter 11 Busbar Commissioning Tool 303
1 P747 Busbar Commissioning Tool (Remote HMI) 305
2 Scheme Editor 306
2.1 Connections 306
2.1.1 Manual Connections 306
2.1.2 Automatic Connections 306
2.1.3 Remove Connection 307
2.2 Scheme Elements 307
2.2.1 Add Elements to a Scheme 307
2.2.2 Remove an Element 307
2.2.3 Group Elements in a Scheme 307
2.2.4 Rotate Elements in a Group 307
2.3 Working with Text on the Scheme 307
2.3.1 Add a Label to an Element 308
2.3.2 Remove a Label From an Element 308
2.3.3 Change an Element's Label 308
2.3.4 Add or Remove Free Text 308
2.3.5 Validate a Scheme 308
3 Protection Data Monitor 309
3.1 Connect to the IED 309
3.1.1 Polling Timer 309
3.1.2 Read IED Data 309
3.1.3 Measurements Data 309
Chapter 12 Scheme Logic 311
1 Chapter Overview 313
2 Introduction to the Scheme Logic 314
3 Fixed Scheme Logic 316
3.1 Any Start Logic 317
3.2 VTS Acceleration Indication Logic 318
3.3 CB Fail SEF Protection Logic 318
3.4 CB Fail Non Current Protection Logic 319
3.5 Composite Earth Fault Start Logic 320
3.6 Any Trip Logic 320
3.7 SEF Any Start Logic 320
4 Programmable Scheme Logic 321
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4.1 Viewing and Printing PSL Diagrams 321
4.2 Trip Output Mappings 322
4.3 Opto-Input Mappings 323
4.4 Output Relay Mappings 324
4.5 LED Mappings 325
4.6 Control Input Mappings 325
4.7 Function Key Mappings 325
4.8 Circuit Breaker Mapping 326
4.9 Fault Record Trigger Mapping 326
4.10 Check Synchronisation and Voltage Monitor Mappings 326
4.11 Settings 326
Chapter 13 Installation 329
1 Chapter Overview 331
2 Handling the Goods 332
2.1 Receipt of the Goods 332
2.2 Unpacking the Goods 332
2.3 Storing the Goods 332
2.4 Dismantling the Goods 332
3 Mounting the Device 333
3.1 Flush Panel Mounting 333
3.2 Rack Mounting 334
4 Cables and Connectors 336
4.1 Terminal Blocks 336
4.2 Power Supply Connections 337
4.3 Earth Connnection 337
4.4 Current Transformers 337
4.5 Voltage Transformer Connections 338
4.6 Watchdog Connections 338
4.7 EIA(RS)485 and K-Bus Connections 338
4.8 IRIG-B Connection 338
4.9 Opto-input Connections 338
4.10 Output Relay Connections 338
4.11 Ethernet Metallic Connections 339
4.12 Ethernet Fibre Connections 339
4.13 RS232 connection 339
4.14 Download/Monitor Port 339
4.15 GPS Fibre Connection 339
4.16 Fibre Communication Connections 339
5 Case Dimensions 340
5.1 Case Dimensions 80TE 340
Chapter 14 Commissioning Instructions 341
1 Chapter Overview 343
2 General Guidelines 344
3 Commissioning Test Menu 345
3.1 Opto I/P Status Cell (Opto-input Status) 345
3.2 Relay O/P Status Cell (Relay Output Status) 345
3.3 Test Mode Cell 345
3.4 Test Pattern Cell 346
3.5 Contact Test Cell 346
3.6 Test LEDs Cell 346
3.7 Red and Green LED Status Cells 346
3.8 PSL Verificiation 346
3.8.1 Test Port Status Cell 346
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3.8.2 Monitor Bit 1 to 8 Cells 346
3.8.3 Using a Monitor Port Test Box 347
4 Commissioning Equipment 348
4.1 Minimum Equipment Required 348
4.2 Optional Equipment Required 348
5 Product Checks 349
5.1 Product Checks with the IED De-energised 349
5.1.1 Visual Inspection 350
5.1.2 Current Transformer Shorting Contacts 350
5.1.3 Insulation 350
5.1.4 External Wiring 351
5.1.5 Watchdog Contacts 351
5.1.6 Power Supply 351
5.2 Product Checks with the IED Energised 351
5.2.1 Watchdog Contacts 352
5.2.2 Test LCD 352
5.2.3 Date and Time 352
5.2.4 Test LEDs 353
5.2.5 Test Alarm and Out-of-Service LEDs 353
5.2.6 Test Trip LED 353
5.2.7 Test User-programmable LEDs 353
5.2.8 Test Opto-inputs 353
5.2.9 Test Output Relays 354
5.2.10 Test Serial Communication Port RP1 354
5.2.11 Test Serial Communication Port RP2 356
5.2.12 Test Ethernet Communication 356
5.2.13 Test Current Inputs 356
5.2.14 Test Voltage Inputs 357
6 Setting Checks 358
6.1 Apply Application-specific Settings 358
6.1.1 Transferring Settings from a Settings File 358
6.1.2 Entering settings using the HMI 358
7 Busbar Protection Checks 360
7.1 Busbar Differential Protection Checks 360
7.2 Connecting the Test Circuit 360
7.3 Performing the Test 360
7.4 Check the Operating Time 361
8 Onload Checks 362
8.1 Confirm Current Connections 362
8.2 Confirm Voltage Connections 362
8.3 On-Load Busbar Differential Test 363
9 Final Checks 364
10 Commissioning Test Settings 365
Chapter 15 Maintenance and Troubleshooting 367
1 Chapter Overview 369
2 Maintenance 370
2.1 Maintenance Checks 370
2.1.1 Alarms 370
2.1.2 Opto-isolators 370
2.1.3 Output Relays 370
2.1.4 Measurement Accuracy 370
2.2 Replacing the Device 371
2.3 Repairing the Device 372
2.4 Removing the front panel 373
2.5 Replacing PCBs 373
2.5.1 Replacing the main processor board 374
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2.5.2 Replacement of communications boards 374
2.5.3 Replacement of the input module 375
2.5.4 Replacement of the power supply board 376
2.5.5 Replacement of the I/O boards 376
2.6 Recalibration 376
2.7 Changing the battery 377
2.7.1 Post Modification Tests 377
2.7.2 Battery Disposal 377
2.8 Cleaning 377
3 Troubleshooting 378
3.1 Self-Diagnostic Software 378
3.2 Power-up Errors 378
3.3 Error Message or Code on Power-up 378
3.4 Out of Service LED on at power-up 379
3.5 Error Code during Operation 380
3.5.1 Backup Battery 380
3.6 Mal-operation during testing 380
3.6.1 Failure of Output Contacts 380
3.6.2 Failure of Opto-inputs 380
3.6.3 Incorrect Analogue Signals 381
3.7 PSL Editor Troubleshooting 381
3.7.1 Diagram Reconstruction 381
3.7.2 PSL Version Check 381
4 Repair and Modification Procedure 382
Chapter 16 Technical Specifications 383
1 Chapter Overview 385
2 Interfaces 386
2.1 Front Serial Port 386
2.2 Download/Monitor Port 386
2.3 Rear Serial Port 1 386
2.4 Fibre Rear Serial Port 1 386
2.5 Rear Serial Port 2 387
2.6 Redundant Ethernet Ports 387
2.7 IRIG-B (Demodulated) 387
2.8 IRIG-B (Modulated) 387
2.9 Rear Ethernet Port Copper 388
2.10 Rear Ethernet Port Fibre 388
2.10.1 100 Base FX Receiver Characteristics 388
2.10.2 100 Base FX Transmitter Characteristics 389
3 Busbar Protection Functions 390
3.1 Busbar Circuitry Fault Protection 390
3.2 Busbar Circuitry Fault Protection 390
3.3 Busbar Dead Zone Protection 390
3.4 Three-phase Overcurrent Protection 390
3.5 Earth Fault Protection 391
3.6 Transient Overreach and Overshoot 391
4 Performance of Monitoring and Control Functions 392
4.1 Voltage Transformer Supervision 392
4.2 PSL Timers 392
5 Measurements and Recording 393
5.1 General 393
5.2 Disturbance Records 393
5.3 Event, Fault and Maintenance Records 393
5.4 Fault Locator 393
6 Standards Compliance 394
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6.1 EMC Compliance: 2004/108/EC 394
6.2 Product Safety: 2006/95/EC 394
6.3 R&TTE Compliance 394
6.4 UL/CUL Compliance 394
7 Mechanical Specifications 395
7.1 Physical Parameters 395
7.2 Enclosure Protection 395
7.3 Mechanical Robustness 395
7.4 Transit Packaging Performance 395
8 Ratings 396
8.1 AC Measuring Inputs 396
8.2 Current Transformer Inputs 396
8.3 Voltage Transformer Inputs 396
8.4 Auxiliary Supply Voltage 396
8.5 Nominal Burden 397
8.6 Power Supply Interruption 397
8.7 Standard Output Contacts 398
8.8 Watchdog Contacts 398
8.9 Isolated Digital Inputs 399
8.9.1 Nominal Pickup and Reset Thresholds 399
9 Environmental Conditions 400
9.1 Ambient Temperature Range 400
9.2 Ambient Humidity Range 400
9.3 Corrosive Environments 400
10 Type Tests 401
10.1 Insulation 401
10.2 Creepage Distances and Clearances 401
10.3 High Voltage (Dielectric) Withstand 401
10.4 Impulse Voltage Withstand Test 401
11 Electromagnetic Compatibility 402
11.1 1 MHz Burst High Frequency Disturbance Test 402
11.2 Damped Oscillatory Test 402
11.3 Immunity to Electrostatic Discharge 402
11.4 Electrical Fast Transient or Burst Requirements 402
11.5 Surge Withstand Capability 402
11.6 Surge Immunity Test 403
11.7 Immunity to Radiated Electromagnetic Energy 403
11.8 Radiated Immunity from Digital Communications 403
11.9 Radiated Immunity from Digital Radio Telephones 403
11.10 Immunity to Conducted Disturbances Induced by Radio Frequency Fields 403
11.11 Magnetic Field Immunity 404
11.12 Conducted Emissions 404
11.13 Radiated Emissions 404
11.14 Power Frequency 404
Appendix A Symbols and Glossary 405
1 Chapter Overview 407
2 Acronyms and Abbreviations 408
3 Units for Digital Communications 414
4 American Vs British English Terminology 415
5 Logic Symbols and Terms 416
6 Logic Timers 420
7 Logic Gates 422
Appendix B Commissioning Record 423
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1 Test Record 425
1.1 Engineer Details 425
1.2 Front Plate Information 425
1.3 Test Equipment 425
1.4 Tests with Product De-energised 425
1.5 Tests with Product Energised 426
1.6 Communication Tests 426
1.7 Current Input Tests 426
1.8 Voltage Input Tests 427
1.9 Overcurrent Checks 427
1.10 On-load Checks 427
1.11 Final Checks 427
Appendix C Wiring Diagrams 429
1 Appendix Overview 431
2 P747: Busbar Protection 432
3 P747: I/O Option A 433
4 P747: I/O Option B 434
5 P747: I/O Option C 435
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Table of Figures
P747-TM-EN-1.1
Figure 1: Functional Overview 9
Figure 2: Hardware architecture 26
Figure 3: Exploded view of IED 27
Figure 4: Front panel (80TE) 29
Figure 5: Rear view of populated 80TE case 33
Figure 6: Terminal block types 34
Figure 7: Rear connection to terminal block 35
Figure 8: Main processor board 36
Figure 9: Combined coprocessor and isolated digital input board 37
Figure 10: Power supply board 38
Figure 11: Power Supply Assembly 39
Figure 12: Power Supply Terminals 40
Figure 13: Watchdog contact terminals 41
Figure 14: Rear serial port terminals 42
Figure 15: Input Module - 1 transformer board 42
Figure 16: Input module schematic 43
Figure 17: Instrument Transformer board 45
Figure 18: Main input board 46
Figure 19: Output relay board - 8 contacts 47
Figure 20: IRIG-B board 49
Figure 21: Fibre optic board 50
Figure 22: Rear communication board 51
Figure 23: Ethernet board 52
Figure 24: Redundant Ethernet board 53
Figure 25: Menu navigation 59
Figure 26: Default display navigation 61
Figure 27: Current Differential Protection 100
Figure 28: Compensation using biased differential characteristic 102
Figure 29: Multiple tripping criteria 103
Figure 30: Topology replica function 104
Figure 31: Zone tripping characteristic. 106
Figure 32: Check zone supervision characteristic. 107
Figure 33: Circuitry check characteristic. 108
Figure 34: Example of busbar dead-zone 110
Figure 35: Dead-zone logic 110
Figure 36: CBF initiated by internal signal 112
Figure 37: CBF initiated by external signal 113
Figure 38: Busbar topology used in configuration example. 137
Table of Figures MiCOM P747
P747-TM-EN-1.1
Figure 39: Fault recorder stop conditions 155
Figure 40: Trip LED logic 170
Figure 41: TCS Scheme 1 188
Figure 42: PSL for TCS Scheme 1 189
Figure 43: TCS Scheme 2 189
Figure 44: PSL for TCS Scheme 2 190
Figure 45: TCS Scheme 3 190
Figure 46: PSL for TCS Scheme 3 190
Figure 47: RS485 biasing circuit 196
Figure 48: Remote communication using K-Bus 197
Figure 49: Control input behaviour 208
Figure 50: Manual selection of a disturbance record 215
Figure 51: Automatic selection of disturbance record - method 1 216
Figure 52: Automatic selection of disturbance record - method 2 217
Figure 53: Configuration file extraction 218
Figure 54: Data file extraction 219
Figure 55: Data model layers in IEC61850 224
Figure 56: GPS Satellite timing signal 232
Figure 57: Board connectors 243
Figure 58: Example PRP redundant network 245
Figure 59: Application of PRP at substation level 246
Figure 60: IED attached to redundant Ethernet star or ring circuit 247
Figure 61: IED, bay computer and Ethernet switch with self healing ring facilities 247
Figure 62: Internal architecture of IED, C264 bay computer and H36x Ethernet switch 248
Figure 63: Redundant Ethernet ring architecture with IED, bay computer and Ethernet
249
switches
Figure 64: Redundant Ethernet ring architecture with IED, bay computer and Ethernet
249
switches after failure
Figure 65: Dual homing mechanism 250
Figure 66: Application of Dual Homing Star at substation level 251
Figure 67: SNMP MIB tree 253
Figure 68: IED and REB IP address configuration 258
Figure 69: Connection using (a) an Ethernet switch and (b) a media converter 262
Figure 70: Connection using (a) an Ethernet switch and (b) a media converter 265
Figure 71: Default display navigation 282
Figure 72: Flowchart showing how S1 Agile can be used to set up and save a protection
Figure 73: Scheme Logic Interfaces 314
Figure 74: Any Start Logic 317
Figure 75: VTS Acceleration Indication Logic 318
Figure 76: CB Fail SEF Protection Logic 318
xvi P747-TM-EN-1
296
system offline or online.
MiCOM P747 Table of Figures
P747-TM-EN-1.1
Figure 77: CB Fail Non Current Protection Logic 320
Figure 78: Composite Earth Fault Start Logic 320
Figure 79: Any Trip Logic 320
Figure 80: SEF Any Start Logic 320
Figure 81: Trip Output Mappings 322
Figure 82: Opto-Input Mappings 323
Figure 83: Output Relay Mappings 324
Figure 84: LED Mappings 325
Figure 85: Control Input Mappings 325
Figure 86: Function Key Mappings 325
Figure 87: Circuit Breaker mapping 326
Figure 88: Fault Record Trigger mapping 326
Figure 89: Check Synchronisation and Voltage Monitor mappings 326
Figure 90: Location of battery isolation strip 333
Figure 91: Rack mounting of products 335
Figure 92: Terminal block types 336
Figure 93: 80TE case dimensions 340
Figure 94: RP1 physical connection 355
Figure 95: Remote communication using K-bus 355
Figure 96: Possible terminal block types 372
Figure 97: Front panel assembly 374
Figure 98: Logic Gates 422
Figure 99: P747 busbar protection, 3 box solution 432
Figure 100: P747 busbar protection with 40 inputs, 24 outputs and coprocessor 433
Figure 101: P747 busbar protection with 32 inputs, 32 outputs and coprocessor 434
Figure 102: P747 busbar protection with 32 inputs, 24 outputs and standard coprocessor 435
P747-TM-EN-1 xvii
Table of Figures MiCOM P747
P747-TM-EN-1.1
xviii P747-TM-EN-1
INTRODUCTION
CHAPTER 1
Chapter 1 - Introduction MiCOM P747
P747-TM-EN-1.1
2 P747-TM-EN-1
MiCOM P747 Chapter 1 - Introduction
P747-TM-EN-1.1
1 CHAPTER OVERVIEW
This chapter contains the following sections:
Chapter Overview 3
Foreword 4
Features and Functions 6
Compliance 8
Functional Overview 9
Ordering Options 10
P747-TM-EN-1 3
Chapter 1 - Introduction MiCOM P747
P747-TM-EN-1.1
2 FOREWORD
This technical manual provides a functional and technical description of Alstom Grid's MiCOM P747, as well
as a comprehensive set of instructions for using the device.
We have attempted to make this manual as accurate, comprehensive and user-friendly as possible.
However we cannot guarantee that it is free from errors. Nor can we state that it cannot be improved. We
would therefore be very pleased to hear from you if you discover any errors, or have any suggestions for
improvement. All feedback should be sent to our contact centre via the following URL:
http://www.alstom.com/grid/contactcentre/
2.1 TARGET AUDIENCE
This manual is aimed towards all professionals charged with installing, commissioning, maintaining,
troubleshooting, or operating any of the products within the specified product range. This includes installation
and commissioning personnel as well as engineers who will be responsible for operating the product.
The level at which this manual is written assumes that installation and commissioning engineers have
knowledge of handling electronic equipment. Also, system and protection engineers have a thorough
knowledge of protection systems and associated equipment.
2.2 TYPOGRAPHICAL CONVENTIONS
The following typographical conventions are used throughout this manual.
● The names for special keys and function keys appear in capital letters.
For example: ENTER
● When describing software applications, menu items, buttons, labels etc as they appear on the screen
are written in bold type.
For example: Select Save from the file menu.
● Filenames and paths use the courier font
For example: Example\File.text
● Special terminology is written with leading capitals
For example: Sensitive Earth Fault
● If reference is made to the IED's internal settings and signals database, the menu group heading
(column) text is written in upper case italics
For example: The SYSTEM DATA
● If reference is made to the IED's internal settings and signals database, the setting cells and DDB
signals are written in bold italics
For example: The Language cell in the SYSTEM DATA column
● If reference is made to the IED's internal settings and signals database, the value of a cell's content is
written in the Courier font
For example: The Language cell in the SYSTEM DATA column contains the value English
column
2.3 NOMENCLATURE
Due to the technical nature of this manual, many special terms, abbreviations and acronyms are used
throughout the manual. Some of these terms are well-known industry-specific terms while others may be
special product-specific terms used by Alstom Grid. A glossary at the back of this manual provides a
complete description of all special terms used throughout the manual.
4 P747-TM-EN-1
MiCOM P747 Chapter 1 - Introduction
P747-TM-EN-1.1
We would like to highlight the following changes of nomenclature however:
● The word 'relay' is no longer used for the device itself. Instead, the device is referred to as an 'IED'
(Intelligent Electronic Device), the 'device', the 'product', or the 'unit'. The word 'relay' is used purely to
describe the electromechanical components within the device, i.e. the output relays.
● British English is used throughout this manual.
● The British term 'Earth' is used in favour of the American term 'Ground'.
2.4 PRODUCT SCOPE
This product protects busbars with up to 4 zones plus a check zone. It can be applied at any voltage level.
One device is used to protect each phase (3-box solution). A further device can be used to protect the
neutral line (4-box solution). The device is suitable for applications on solidly grounded systems, or where a
centralised scheme is needed.
Each device can manage a maximum of:
● 4 Voltage transformers (VTs) (1 VT per zone),
● 18 Current transformers (CTs)
● 18 Circuit breakers (CBs)
● 72 isolators
● Up to 40 Digital Inputs and 128 Virtual Inputs (128 digital inputs via communications) for each
protected phase
● Up to 32 Digital Outputs and 128 Virtual Outputs (128 digital outputs via communications) for each
protected phase
The P747 consists of the following main components.
Main protection
This uses low impedance biased current differential protection. The typical operating time is less than one
cycle. If a fault occurs and more than one zone needs to be tripped, you might need to trip zones
sequentially. You can do this by setting different time delays on each of the zone differential elements.
Backup protection
This consists of:
● phase overcurrent
● dead zone
● circuit breaker failure
Settings application software
This allows you to create a scheme and display the measured data. The scheme editor allows you to quickly
draw schemes from a library of elements, then validate the scheme. It can also display the status of DDBs
and measured data on the scheme in real time.
Inputs and outputs
The device has many hard-wired digital inputs and outputs. For applications that demand more, virtual inputs
and outputs can be used between the products protecting the different phases. 128 virtual inputs and outputs
can be shared between products using communications links. Use hard-wired inputs and outputs to connect
the most time-critical signals between devices. Use Virtual inputs and outputs to communicate less timecritical information signals between devices.
P747-TM-EN-1 5
Chapter 1 - Introduction MiCOM P747
P747-TM-EN-1.1
3 FEATURES AND FUNCTIONS
3.1 PROTECTION FUNCTIONS
The P747 provides the following protection functions:
Protection Function IEC 61850 ANSI
Phase segregated biased current differential high speed busbar protection PhsPDIF 87BB/P
Check Zone segregated biased phase current differential high speed busbar protection CzPPDIF 87CZ/P
Definite Time overcurrent protection (2 stages) OcpPTOC 50/P
IDMT overcurrent protection (2 stages) OcpPTOC 51/P
Dead zone phase protection (short zone between CTs and open CBs) DzpPhsPTOC 50DZ
CB Failure (auxiliary contacts or fast undercurrent) RBRF 50BF
CB Failure and isolator state monitoring
Lockout RBRF 89
Undervoltage control 27
VT blocking scheme based on V< VTS
3.2 CONTROL FUNCTIONS
Feature IEC 61850 ANSI
Watchdog contacts
Read-only mode
NERC compliant cyber-security
Function keys (up to 10) FnkGGIO
Programmable LEDs (up to 18) LedGGIO
Programmable hotkeys (2)
Programmable allocation of digital inputs and outputs
Fully customizable menu texts
Circuit breaker control, status & condition monitoring XCBR 52
Trip circuit and coil supervision
Control inputs PloGGIO1
Power-up diagnostics and continuous self-monitoring
Dual rated 1A and 5A CT inputs
Alternative setting groups (4)
Graphical programmable scheme logic (PSL)
Fault locator RFLO
3.3 MEASUREMENT FUNCTIONS
Measurement of all instantaneous & integrated values
(Exact range of measurements depend on the device model)
Disturbance recorder for waveform capture – specified in samples per
cycle
Fault Records
6 P747-TM-EN-1
Measurement Function IEC 61850 ANSI
MET
RDRE DFR
MiCOM P747 Chapter 1 - Introduction
P747-TM-EN-1.1
Measurement Function IEC 61850 ANSI
Maintenance Records
Event Records / Event logging Event records
Time Stamping of Opto-inputs Yes Yes
3.4 COMMUNICATION FUNCTIONS
The device offers the following communication functions:
Feature ANSI
NERC compliant cyber-security
Front RS232 serial communication port for configuration 16S
Rear serial RS485 communication port for SCADA control 16S
2 Additional rear serial communication ports for SCADA control and
teleprotection (fibre and copper) (optional)
Ethernet communication (optional) 16E
Redundant Ethernet communication (optional) 16E
Courier 16S
IEC 61850 (optional) 16E
IEC 60870-5-103 (optional) 16S
DNP3.0 over serial link (optional) 16S
DNP3.0 over Ethernet (optional) 16E
IRIG-B time synchronisation (optional) CLK
16S
P747-TM-EN-1 7
Chapter 1 - Introduction MiCOM P747
P747-TM-EN-1.1
4 COMPLIANCE
The device has undergone a range of extensive testing and certification processes to ensure and prove
compatibility with all target markets. Below is a list of standards with which the device is compliant. A detailed
description of these criteria can be found in the Technical Specifications chapter.
Compliance Standards
Condition Compliance
EMC compliance (compulsory) 2004/108/EC (demonstrated by EN60255-26:2009)
Product safety (compulsory) 2006/95/EC (demonstrated by EN60255-27:2005)
R&TTE Compliance (compulsory) 99/5/EC
EMC EN50263, IEC 60255-22-1/2/3/4/5/6/7, IEC 61000-4-5/6/8/9/10/16
EN61000-4-3/18, IEEE/ANSI C37.90.1/2/3, ENV50204, EN55022
Product Safety for North America UL/CL File No. UL/CUL E202519
Environmental conditions IEC 60255-27:2005, IEC 60068-2-78:2001, -30:2005, -42:2003,
-42:2003
Power supply interruption IEC 60255-11, IEC 61000-4-11
Type tests for Insulation, creepage distance and clearances, high
voltage dielectric withstand, and impulse voltage withstand
Enclosure protection IEC 60529:2002 – IP10, IP30, IP52
Mechanical robustness IEC 60255-21-1/2/3
Documentation IEC 60255-151
IEC 60255-27:2005
8 P747-TM-EN-1
87BB/P
87CZ/P
50/51
/P
50DZ
50BF
ISL
Remote
Comms. Port
Local
Communication
Fault
Records
Measurements
Disturbance
Records
Binary
Input / Output
LEDs
PSL
E00029
2
7
MiCOM P747 Chapter 1 - Introduction
P747-TM-EN-1.1
5 FUNCTIONAL OVERVIEW
Figure 1: Functional Overview
P747-TM-EN-1 9
Variants
P747
Numerical Busbar Differe ntial Protection Relay with 4-zone enha ncements
P747 **
Vx Aux Rating:
New PSU 24-54 Vdc 7
New PSU 48-125 Vdc (40-100 Vac) 8
New PSU 110-250 Vdc (100-240 Vac) 9
In/Vn Rating:
CT1 - CT18 In = 1A/5A, Vn = (100/120V) (18CT/3VT) 1
Hardware Options:
Standard: no options 1
IRIG-B (Modulated) only 2
Fibre optic converter only 3
IRIG-B (Modulated) & fibre optic converter 4
Ethernet with 100 Mbps fibre optic port 6
2nd rear comms port 7
2nd rear comms port + IRIG-B (Modulated) 8
Ethernet (100 Mbps) + IRIG-B (Modulated) A
Ethernet (100 Mps) + IRIG-B (Unmodulated) B
IRIG-B (Unmodulated) C
Redundant Ethernet Self-Healing Ring, 2 multi-mode fibre ports + Modulated IRIG-B G
Redundant Ethernet Self-Healing Ring, 2 multi-mode fibre ports + Un-modulated IRIG-B H
Redundant Ethernet RSTP, 2 multi-mode fibre ports + Modulated IRIG-B J
Redundant Ethernet RSTP, 2 multi-mode fibre ports + Un-modulated IRIG-B K
Redundant Ethernet Dual-Homing Star, 2 multi-mode fibre ports + Modulated IRIG-B L
Redundant Ethernet Dual-Homing Star, 2 multi-mode fibre ports + Un-modulated IRIG-B M
Redundant Ethernet PRP, 2 multi-mode fibre ports + Modulated IRIG-B N
Redundant Ethernet PRP, 2 multi-mode fibre ports + Un-modulated IRIG-B P
Product Specific Options:
Size 16 case, 40 optos + 24 relays + coprocessor A
Size 16 case, 32 optos + 32 relays + coprocessor B
Size 16 case, 32 optos + 24 relays + standard coprocessor C
Protocol Options:
K-Bus/Courier 1
Modbus 2
IEC60870-5-103 3
DNP3.0 4
IEC 61850 over Ethernet and Courier via rear K-Bus/RS485 6
DNP3 over Ethernet with Courier rear port K-Bus/RS485 protocol 8
Mounting Options:
Panel mounting M
Rack mounting N
Langua ge Options:
English, French, German, Spanish 0
English, French, German, Russian 5
Chinese, English or French via HMI, with English or French only via communications port C
Software Version Options:
Unless specified the latest version will be delivered **
Settings File s Options:
Default 0
Customer specific A
Design Suffix:
Extended CPU K
Order Number
E00036
Chapter 1 - Introduction MiCOM P747
P747-TM-EN-1.1
6 ORDERING OPTIONS
10 P747-TM-EN-1
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