GE MiCOM P40 Technical Manual

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GE Grid Solutions
MiCOM P40 Agile
P446SV
Technical Manual Distance Protection IED
Hardware Version: P Software Version: 80 Publication Reference: P446SV-TM-EN-1
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Contents
Chapter 1 Introduction 1
1 Chapter Overview 3 2 Foreword 4
2.1 Target Audience 4
2.2 Typographical Conventions 4
2.3 Nomenclature 5
2.4 Compliance 5
3 Product Scope 6
3.1 Product Versions 6
3.2 Ordering Options 7
4 Features and Functions 8
4.1 Distance Protection Functions 8
4.2 Protection Functions 8
4.3 Control Functions 9
4.4 Measurement Functions 9
4.5 Communication Functions 9
5 Logic Diagrams 11 6 Functional Overview 13
Chapter 2 Safety Information 15
1 Chapter Overview 17 2 Health and Safety 18 3 Symbols 19 4 Installation, Commissioning and Servicing 20
4.1 Lifting Hazards 20
4.2 Electrical Hazards 20
4.3 UL/CSA/CUL Requirements 21
4.4 Fusing Requirements 21
4.5 Equipment Connections 22
4.6 Protection Class 1 Equipment Requirements 22
4.7 Pre-energisation Checklist 23
4.8 Peripheral Circuitry 23
4.9 Upgrading/Servicing 24
5 Decommissioning and Disposal 25 6 Regulatory Compliance 26
6.1 EMC Compliance: 2014/30/EU 26
6.2 LVD Compliance: 2014/35/EU 26
6.3 R&TTE Compliance: 2014/53/EU 26
6.4 UL/CUL Compliance 26
6.5 ATEX Compliance: 2014/34/EU 26
Chapter 3 Hardware Design 29
1 Chapter Overview 31 2 Hardware Architecture 32 3 Mechanical Implementation 33
3.1 Housing Variants 33
3.2 List of Boards 34
4 Front Panel 35
4.1 40TE Front Panel 35
4.1.1 Front Panel Compartments 35
4.1.2 Keypad 36
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4.1.3 Front Serial Port (SK1) 36
4.1.4 Front Parallel Port (SK2) 37
4.1.5 Fixed Function LEDs 37
4.1.6 Programable LEDs 37
5 Rear Panel 38 6 Boards and Modules 39
6.1 PCBs 39
6.2 Main Processor Board 40
6.3 Power Supply Board 41
6.3.1 Watchdog 43
6.3.2 Rear Serial Port 44
6.4 IEC61850-9-2LE Ethernet Board 45
6.5 Standard Output Relay Board 46
6.6 IRIG-B Board 47
6.7 Fibre Optic Board 48
6.8 Rear Communication Board 49
6.9 Ethernet Board 49
6.10 Redundant Ethernet Board 51
6.11 Coprocessor Board 53
6.11.1 Coprocessor board with 1PPS input 53
6.12 High Break Output Relay Board 54
Chapter 4 Software Design 57
1 Chapter Overview 59 2 Sofware Design Overview 60 3 System Level Software 61
3.1 Real Time Operating System 61
3.2 System Services Software 61
3.3 Self-Diagnostic Software 61
3.4 Startup Self-Testing 61
3.4.1 System Boot 61
3.4.2 System Level Software Initialisation 62
3.4.3 Platform Software Initialisation and Monitoring 62
3.5 Continuous Self-Testing 62
4 Platform Software 64
4.1 Record Logging 64
4.2 Settings Database 64
4.3 Interfaces 64
5 Protection and Control Functions 65
5.1 Acquisition of Samples 65
5.2 Frequency Tracking 65
5.3 Direct Use of Sample Values 65
5.4 Distance Protection 65
5.5 Fourier Signal Processing 66
5.6 Programmable Scheme Logic 67
5.7 Event Recording 67
5.8 Disturbance Recorder 68
5.9 Fault Locator 68
5.10 Function Key Interface 68
Chapter 5 Configuration 69
1 Chapter Overview 71 2 Settings Application Software 72 3 Using the HMI Panel 73
3.1 Navigating the HMI Panel 74
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3.2 Getting Started 74
3.3 Default Display 75
3.4 Default Display Navigation 76
3.5 Password Entry 77
3.6 Processing Alarms and Records 78
3.7 Menu Structure 78
3.8 Changing the Settings 79
3.9 Direct Access (The Hotkey menu) 80
3.9.1 Setting Group Selection Using Hotkeys 80
3.9.2 Control Inputs 81
3.9.3 Circuit Breaker Control 81
3.10 Function Keys 82
4 Line Parameters 84
4.1 Tripping Mode 84
4.1.1 CB Trip Conversion Logic Diagram 85
4.2 Residual Compensation 85
4.3 Mutual Compensation 86
5 Date and Time Configuration 88
5.1 Using an SNTP Signal 88
5.2 Using an IRIG-B Signal 88
5.3 Using an IEEE 1588 PTP Signal 88
5.4 Without a Timing Source Signal 89
5.5 Time Zone Compensation 89
5.6 Daylight Saving Time Compensation 90
6 Settings Group Selection 91
Chapter 6 Sampled Value Operation 93
1 Chapter Overview 95 2 Introduction To Sampled Values 96 3 Data Resampling 97 4 Sampled Value Alignment 98
4.1 Channel mappings for SAV Test, SAV Questionable, SAV Invalid 98
4.2 Data Quality 98
4.2.1 Impact of Data Quality on Protection Functions 99
4.3 Process Bus Performance 99
4.3.1 Sample Loss Data 100
4.4 VT Switching 100
4.5 Virtual Inputs and Outputs 101
4.5.1 P446, P546, P841B Virtual Inputs and Outputs DDBs 101
4.5.2 Virtual CT and VT Ratio Settings 101
4.6 IED Alarms 102
4.6.1 P446, P546, P841B Alarms 102
Chapter 7 Distance Protection 105
1 Chapter Overview 107 2 Introduction 108
2.1 Distance Protection Principle 108
2.2 Performance Influencing Factors 108
2.3 Impedance Calculation 109
2.4 Implementation with Comparators 109
2.5 Polarization of Distance Characteristics 109
3 Distance Measuring Zones Operating Principles 110
3.1 Mho Characteristics 111
3.1.1 Directional Mho Characteristic for Phase Faults 111
3.1.2 Offset Mho Characteristic for Phase Faults 111
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3.1.3 Directional Self-Polarized Mho Characteristic for Earth Faults 112
3.1.4 Offset Mho Characteristic for Earth Faults 114
3.1.5 Memory Polarization of Mho Characteristics 116
3.1.6 Dynamic Mho Expansion and Contraction 116
3.1.7 Cross Polarization of Mho Characteristics 119
3.1.8 Implementation of Mho Polarization 120
3.2 Quadrilateral Characteristic 121
3.2.1 Directional Quadrilaterals 122
3.2.2 Quadrilateral Characteristic for Phase Faults 126
3.2.3 Earth Fault Quadrilateral Characteristics 130
4 Phase and Earth Fault Distance Protection Implementation 139
4.1 Phase Fault Characteristics 139
4.2 Earth Fault Characteristics 139
4.3 Distance Protection Tripping Decision 139
4.4 Distance Protection Phase Selection 140
4.4.1 Faulted Phase Selection 140
4.5 Biased Neutral Current Detector 141
4.6 Distance Element Zone Settings 142
4.6.1 Directionalizing the Distance Elements 142
4.6.2 Advanced Distance Zone Settings 143
4.6.3 Distance Zone Sensitivities 143
4.7 Capacitor VT Applications 144
4.7.1 CVTs with Passive Suppression of Ferroresonance 144
4.7.2 CVTs with Active Suppression of Ferroresonance 144
4.8 Load Blinding 145
4.9 Cross Country Fault Protection 146
5 Delta Directional Element 147
5.1 Delta Directional Principle and Setup 147
5.2 Delta Directional Decision 148
6 Application Notes 150
6.1 Setting Mode Choice 150
6.2 Operating Characteristic Selection 150
6.2.1 Phase Characteristic 150
6.2.2 Earth Fault Characteristic 151
6.3 Zone Reach Setting Guidelines 151
6.3.1 Quadrilateral Resistive Reaches 152
6.4 Earth Fault Resistive Reaches and Tilting 152
6.4.1 Dynamic Tilting 153
6.4.2 Fixed Tilting 154
6.5 Phase Fault Zone Settings 154
6.6 Directional Element for Distance Protection 155
6.7 Filtering Setup 155
6.7.1 Distance Digital Filter 155
6.7.2 Setting up CVTs 155
6.8 Load Blinding Setup 156
6.9 Polarizing Setup 156
6.10 Delta Directional Element Setting Guidelines 157
6.10.1 Delta Thresholds 157
6.11 Distance Protection Worked Example 157
6.11.1 Line Impedance Calculation 158
6.11.2 Residual Compensation for Earth Fault Elements 159
6.11.3 Zone 1 Phase and Ground Reach Settings 159
6.11.4 Zone 2 Phase and Ground Reach Settings 159
6.11.5 Zone 3 Phase and Ground Reach Settings 160
6.11.6 Zone 3 Reverse Reach Settings 160
6.11.7 Zone 4 Reverse Reach Settings 160
6.11.8 Load Avoidance 161
6.11.9 Quadrilateral Resistive Reach Settings 161
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6.12 Teed Feeder Applications 162
Chapter 8 Carrier Aided Schemes 165
1 Chapter Overview 167 2 Introduction 168 3 Carrier Aided Schemes Implementation 169
3.1 Carrier Aided Scheme Types 169
3.2 Default Carrier Aided Schemes 170
4 Aided Distance Scheme Logic 171
4.1 Permissive Underreach Scheme 171
4.2 Permissive Over-reach Scheme 172
4.2.1 Permissive Overreach Trip Reinforcement 174
4.2.2 Permissive Overreach Weak Infeed Features 175
4.3 Permissive Scheme Loss Of Guard 175
4.4 Current Reversal Guard Logic 176
4.5 Aided Distance Blocking Schemes 177
4.6 Aided Distance Unblocking Schemes 178
4.7 Aided Distance Logic Diagrams 180
4.7.1 Aided Distance Send Logic 180
4.7.2 Carrier Aided Schemes Receive Logic 180
4.7.3 Aided Distance Tripping Logic 181
4.7.4 PUR Aided Tripping logic 181
4.7.5 POR Aided Tripping logic 182
4.7.6 Aided Scheme Blocking 1 Tripping logic 183
4.7.7 Aided Scheme Blocking 2 Tripping logic 183
5 Aided DEF Scheme Logic 184
5.1 Aided DEF Introduction 184
5.2 Implementation 184
5.3 Aided DEF Polarization 184
5.3.1 Zero Sequence Polarizing 185
5.3.2 Negative Sequence Polarizing 186
5.4 Aided DEF Setting Guidelines 187
5.5 Aided DEF POR Scheme 188
5.6 Aided DEF Blocking Scheme 189
5.7 Aided DEF Logic Diagrams 190
5.7.1 DEF Directional Signals 190
5.7.2 Aided DEF Send Logic 191
5.7.3 Carrier Aided Schemes Receive Logic 191
5.7.4 Aided DEF Tripping Logic 192
5.7.5 POR Aided Tripping logic 193
5.7.6 Aided Scheme Blocking 1 Tripping logic 194
5.7.7 Aided Scheme Blocking 2 Tripping logic 194
6 Aided Delta Scheme Logic 195
6.1 Aided Delta POR Scheme 195
6.2 Aided Delta Blocking Scheme 196
6.3 Aided Delta Logic Diagrams 198
6.3.1 Aided Delta Send Logic 198
6.3.2 Carrier Aided Schemes Receive Logic 198
6.3.3 Aided Delta Tripping Logic 199
6.3.4 POR Aided Tripping logic 200
6.3.5 Aided Scheme Blocking 1 Tripping logic 201
6.3.6 Aided Scheme Blocking 2 Tripping logic 201
7 Application Notes 202
7.1 Aided Distance PUR Scheme 202
7.2 Aided Distance POR Scheme 202
7.3 Aided Distance Blocking Scheme 202
7.4 Aided DEF POR Scheme 203
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7.5 Aided DEF Blocking Scheme 203
7.6 Aided Delta POR Scheme 203
7.7 Aided Delta Blocking Scheme 203
7.8 Teed Feeder Applications 204
7.8.1 POR Schemes for Teed Feeders 205
7.8.2 PUR Schemes for Teed Feeders 205
7.8.3 Blocking Schemes for Teed Feeders 206
Chapter 9 Non-Aided Schemes 209
1 Chapter Overview 211 2 Non-Aided Schemes 212 3 Basic Schemes 213
3.1 Basic Scheme Modes 213
3.2 Basic Scheme Setting 215
4 Trip On Close Schemes 217
4.1 Switch On To Fault (SOTF) 218
4.1.1 Switch Onto Fault Mode 218
4.1.2 SOTF Tripping 219
4.1.3 SOTF Tripping with CNV 219
4.2 Trip On Reclose (TOR) 219
4.2.1 Trip On Reclose Mode 220
4.2.2 TOR Tripping Logic for Appropriate Zones 220
4.2.3 TOR Tripping Logic with CNV 220
4.3 Polarisation during Circuit Engergisation 220
5 Zone1 Extension Scheme 221 6 Loss of Load Scheme 222
Chapter 10 Power Swing Functions 225
1 Chapter Overview 227 2 Introduction to Power Swing Blocking 228 3 Power Swing Blocking 230
3.1 Power Swing Detection 230
3.1.1 Settings-Free Power Swing Detection 230
3.1.2 Slow Power Swing Detection 232
3.2 Detection of a Fault During a Power Swing 234
3.3 Power Swing Blocking Configuration 234
3.4 Power Swing Load Blinding Boundary 235
3.5 Power Swing Blocking Logic 236
3.6 Power Swing Blocking Setting Guidelines 237
3.6.1 Setting the Resistive Limits 238
3.6.2 Setting the Reactive Limits 238
3.6.3 PSB Timer Setting Guidelines 239
4 Out of Step Protection 241
4.1 Out of Step Detection 241
4.2 Out of Step Protection Operataing Principle 242
4.3 Out of Step Logic Diagram 243
4.4 OST Application Notes 243
4.4.1 Setting the OST Mode 243
Chapter 11 Autoreclose 249
1 Chapter Overview 251 2 Introduction to Autoreclose 252 3 Autoreclose Implementation 253
3.1 Autoreclose Logic Inputs from External Sources 254
3.1.1 Circuit Breaker Healthy Input 254
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3.1.2 Inhibit Autoreclose Input 254
3.1.3 Block Autoreclose Input 254
3.1.4 Reset Lockout Input 255
3.1.5 Pole Discrepancy Input 255
3.1.6 External Trip Indication 255
3.2 Autoreclose Logic Inputs 255
3.2.1 Trip Initiation Signals 255
3.2.2 Circuit Breaker Status Inputs 255
3.2.3 System Check Signals 255
3.3 Autoreclose Logic Outputs 255
3.4 Autoreclose Operating Sequence 256
3.4.1 AR Timing Sequence - Transient Fault 256
3.4.2 AR Timing Sequence - Evolving/Permanent Fault 256
3.4.3 AR Timing Sequence - Evolving/Permanent Fault Single-phase 257
3.4.4 AR Timing Sequence - Transient Fault Dual CB 257
3.4.5 AR Timing Sequence - Evolving/Permanent Fault Dual CB 258
3.4.6 AR Timing Sequence - Persistent Fault 259
4 Autoreclose System Map 261
4.1 Autoreclose System Map Diagrams 263
4.2 Autoreclose Internal Signals 272
4.3 Autoreclose DDB Signals 277
5 Logic Modules 289
5.1 Circuit Breaker Status Monitor 289
5.1.1 CB State Monitor 290
5.2 Circuit Breaker Open Logic 290
5.2.1 Circuit Breaker Open Logic Diagram 291
5.3 Circuit Breaker in Service Logic 291
5.3.1 Circuit Breaker in Service Logic Diagram 292
5.4 Autoreclose Enable Logic 292
5.4.1 Autoreclose Enable Logic Diagram 292
5.5 Autoreclose Leader/Follower 292
5.5.1 Leader/Follower CB Selection Logic Diagram 293
5.5.2 Leader Follower Logic Diagram 294
5.6 Autoreclose Modes 295
5.6.1 Single-Phase and Three-Phase Autoreclose 295
5.6.2 Autoreclose Modes Enable Logic Diagram 296
5.7 AR Force Three-Phase Trip Logic 297
5.7.1 Force Three-Phase Trip Logic Diagram 297
5.8 Autoreclose Initiation Logic 298
5.8.1 Autoreclose Initiation Logic Diagram 299
5.8.2 Autoreclose Trip Test Logic Diagram 299
5.8.3 External Trip Logic Diagram for CB1 300
5.8.4 External Trip Logic Diagram for CB2 301
5.8.5 Protection Reoperation and Evolving Fault Logic Diagram 302
5.8.6 Fault Memory Logic Diagram 302
5.9 Autoreclose In Progress 302
5.9.1 Autoreclose In Progress Logic Diagram for CB1 303
5.9.2 Autoreclose In Progress Logic Diagram for CB2 304
5.10 Sequence Counter 304
5.10.1 Autoreclose Sequence Counter Logic Diagram 305
5.11 Autoreclose Cycle Selection 305
5.11.1 Single Phase Autoreclose Cycle Selection Logic Diagram 306
5.11.2 3-phase Autoreclose Cycle Selection 307
5.12 Dead Time Control 307
5.12.1 Dead Time Start Enable Logic Diagram 308
5.12.2 Single-phase Leader Dead Time Logic Diagram 309
5.12.3 3-phase Leader Dead Time Logic Diagram 310
5.12.4 Follower Enable Logic Diagram 311
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5.12.5 Single-phase Follower Timing Logic Diagram 312
5.12.6 Three-phase Follower Timing Logic Diagram 313
5.13 Circuit Breaker Autoclose 313
5.13.1 Circuit Breaker Autoclose Logic Diagram 314
5.14 Reclaim Time 314
5.14.1 Prepare Reclaim Initiation Logic Diagram 315
5.14.2 Reclaim Time Logic Diagram 316
5.14.3 Succesful Autoreclose Signals Logic Diagram 317
5.14.4 Autoreclose Reset Successful Indication Logic Diagram 318
5.15 CB Healthy and System Check Timers 318
5.15.1 CB Healthy and System Check Timers Logic Diagram 319
5.16 Autoreclose Shot Counters 319
5.16.1 Autoreclose Shot Counters Logic Diagram 321
5.17 Circuit Breaker Control 322
5.17.1 CB Control Logic Diagram 322
5.18 Circuit Breaker Trip Time Monitoring 323
5.18.1 CB Trip Time Monitoring Logic Diagram 324
5.19 Autoreclose Lockout 325
5.19.1 CB Lockout Logic Diagram 326
5.20 Reset Circuit Breaker Lockout 327
5.20.1 Reset CB Lockout Logic Diagram 329
5.21 Pole Discrepancy 329
5.21.1 Pole Discrepancy Logic Diagram 330
5.22 Circuit Breaker Trip Conversion 330
5.22.1 CB Trip Conversion Logic Diagram 331
5.23 Monitor Checks for CB Closure 331
5.23.1 Voltage Monitor for CB Closure 332
5.23.2 Check Synchronisation Monitor for CB Closure 333
5.24 Synchronisation Checks for CB Closure 334
5.24.1 Three-phase Autoreclose Leader Check Logic Diagram 336
5.24.2 Three-phase Autoreclose Follower Check Logic Diagram 338
5.24.3 CB Manual Close System Check Logic Diagram 340
6 Setting Guidelines 341
6.1 De-ionising Time Guidance 341
6.2 Dead Timer Setting Guidelines 341
6.2.1 Example Dead Time Calculation 341
6.3 Reclaim Time Setting Guidelines 342
6.4 Autoreclose Shot Counters 342
Chapter 12 CB Fail Protection 345
1 Chapter Overview 347 2 Circuit Breaker Fail Protection 348 3 Circuit Breaker Fail Implementation 349
3.1 Circuit Breaker Fail Timers 349
3.2 Zero Crossing Detection 349
4 Circuit Breaker Fail Logic 351
4.1 Circuit Breaker Fail Logic - Part 1 351
4.2 Circuit Breaker Fail Logic - Part 2 352
4.3 Circuit Breaker Fail Logic - Part 3 353
4.4 Circuit Breaker Fail Logic - Part 4 354
5 Application Notes 355
5.1 Reset Mechanisms for CB Fail Timers 355
5.2 Setting Guidelines (CB fail Timer) 355
5.3 Setting Guidelines (Undercurrent) 356
Chapter 13 Current Protection Functions 357
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1 Chapter Overview 359 2 Phase Fault Overcurrent Protection 360
2.1 POC Implementation 360
2.2 Directional Element 360
2.3 POC Logic 362
3 Negative Sequence Overcurrent Protection 363
3.1 Negative Sequence Overcurrent Protection Implementation 363
3.2 Directional Element 363
3.3 NPSOC Logic 364
3.4 Application Notes 364
3.4.1 Setting Guidelines (Current Threshold) 364
3.4.2 Setting Guidelines (Time Delay) 364
3.4.3 Setting Guidelines (Directional element) 364
4 Earth Fault Protection 366
4.1 Earth Fault Protection Implementation 366
4.2 IDG Curve 366
4.3 Directional Element 367
4.3.1 Residual Voltage Polarisation 367
4.3.2 Negative Sequence Polarisation 368
4.4 Earth Fault Protection Logic 369
4.5 Application Notes 369
4.5.1 Residual Voltage Polarisation Setting Guidelines 369
4.5.2 Setting Guidelines (Directional Element) 369
5 Sensitive Earth Fault Protection 371
5.1 SEF Protection Implementation 371
5.2 EPATR B Curve 371
5.3 Sensitive Earth Fault Protection Logic 372
5.4 Application Notes 373
5.4.1 Insulated Systems 373
5.4.2 Setting Guidelines (Insulated Systems) 374
6 High Impedance REF 376
6.1 High Impedance REF Principle 376
7 Thermal Overload Protection 378
7.1 Single Time Constant Characteristic 378
7.2 Dual Time Constant Characteristic 378
7.3 Thermal Overload Protection Implementation 379
7.4 Thermal Overload Protection Logic 379
7.5 Application Notes 379
7.5.1 Setting Guidelines for Dual Time Constant Characteristic 379
7.5.2 Setting Guidelines for Single Time Constant Characteristic 381
8 Broken Conductor Protection 382
8.1 Broken Conductor Protection Implementation 382
8.2 Broken Conductor Protection Logic 382
8.3 Application Notes 382
8.3.1 Setting Guidelines 382
Chapter 14 Voltage Protection Functions 385
1 Chapter Overview 387 2 Undervoltage Protection 388
2.1 Undervoltage Protection Implementation 388
2.2 Undervoltage Protection Logic 389
2.3 Application Notes 390
2.3.1 Undervoltage Setting Guidelines 390
3 Overvoltage Protection 391
3.1 Overvoltage Protection Implementation 391
3.2 Overvoltage Protection Logic 392
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3.3 Application Notes 393
3.3.1 Overvoltage Setting Guidelines 393
4 Compensated Overvoltage 394 5 Residual Overvoltage Protection 395
5.1 Residual Overvoltage Protection Implementation 395
5.2 Residual Overvoltage Logic 396
5.3 Application Notes 396
5.3.1 Calculation for Solidly Earthed Systems 396
5.3.2 Calculation for Impedance Earthed Systems 397
5.3.3 Setting Guidelines 398
Chapter 15 Frequency Protection Functions 399
1 Chapter Overview 401 2 Frequency Protection 402
2.1 Underfrequency Protection 402
2.1.1 Underfrequency Protection Implementation 402
2.1.2 Underfrequency Protection logic 403
2.1.3 Application Notes 403
2.2 Overfrequency Protection 403
2.2.1 Overfrequency Protection Implementation 403
2.2.2 Overfrequency Protection logic 404
2.2.3 Application Notes 404
3 Independent R.O.C.O.F Protection 405
3.1 Indepenent R.O.C.O.F Protection Implementation 405
3.2 Independent R.O.C.O.F Protection Logic 405
Chapter 16 Monitoring and Control 407
1 Chapter Overview 409 2 Event Records 410
2.1 Event Types 410
2.1.1 Opto-input Events 411
2.1.2 Contact Events 411
2.1.3 Alarm Events 411
2.1.4 Fault Record Events 412
2.1.5 Maintenance Events 412
2.1.6 Protection Events 412
2.1.7 Security Events 413
2.1.8 Platform Events 413
3 Disturbance Recorder 414 4 Measurements 415
4.1 Measured Quantities 415
4.2 Measurement Setup 415
4.3 Fault Locator 415
4.4 Opto-input Time Stamping 415
5 CB Condition Monitoring 416
5.1 Broken Current Accumulator 417
5.2 CB Trip Counter 418
5.3 CB Operating Time Accumulator 419
5.4 Excessive Fault Frequency Counter 420
5.5 Reset Lockout Alarm 421
5.6 CB Condition Monitoring Logic 422
5.7 Reset Circuit Breaker Lockout 423
5.7.1 Reset CB Lockout Logic Diagram 425
5.8 Application Notes 425
5.8.1 Setting the Thresholds for the Total Broken Current 425
5.8.2 Setting the thresholds for the Number of Operations 426
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5.8.3 Setting the thresholds for the Operating Time 426
5.8.4 Setting the Thresholds for Excesssive Fault Frequency 426
6 CB State Monitoring 427
6.1 CB State Monitor 428
7 Circuit Breaker Control 429
7.1 CB Control using the IED Menu 429
7.2 CB Control using the Hotkeys 430
7.3 CB Control using the Function Keys 430
7.4 CB Control using the Opto-inputs 431
7.5 Remote CB Control 431
7.6 CB Healthy Check 432
7.7 Synchronisation Check 432
7.8 CB Control AR Implications 432
7.9 CB Control Logic Diagram 433
8 Pole Dead Function 435
8.1 Pole Dead Logic 435
9 System Checks 436
9.1 System Checks Implementation 436
9.1.1 VT Connections 436
9.1.2 Voltage Monitoring 437
9.1.3 Check Synchronisation 437
9.1.4 Check Syncronisation Vector Diagram 437
9.2 Voltage Monitor for CB Closure 439
9.3 Check Synchronisation Monitor for CB Closure 440
9.4 System Check PSL 442
9.5 Application Notes 442
9.5.1 Predictive Closure of Circuit Breakers 442
9.5.2 Voltage and Phase Angle Correction 442
Chapter 17 Supervision 445
1 Chapter Overview 447 2 Voltage Transformer Supervision 448
2.1 Loss of One or Two Phase Voltages 448
2.2 Loss of all Three Phase Voltages 448
2.3 Absence of all Three Phase Voltages on Line Energisation 448
2.4 VTS Implementation 449
2.5 VTS Logic 450
3 Current Transformer Supervision 452
3.1 CTS Implementation 452
3.2 Standard CTS Logic 453
3.3 CTS Blocking 453
3.4 Application Notes 453
3.4.1 Setting Guidelines 453
4 Trip Circuit Supervision 454
4.1 Trip Circuit Supervision Scheme 1 454
4.1.1 Resistor Values 454
4.1.2 PSL for TCS Scheme 1 455
4.2 Trip Circuit Supervision Scheme 2 455
4.2.1 Resistor Values 456
4.2.2 PSL for TCS Scheme 2 456
4.3 Trip Circuit Supervision Scheme 3 456
4.3.1 Resistor Values 457
4.3.2 PSL for TCS Scheme 3 457
Chapter 18 Digital I/O and PSL Configuration 459
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1 Chapter Overview 461 2 Configuring Digital Inputs and Outputs 462 3 Scheme Logic 463
3.1 PSL Editor 464
3.2 PSL Schemes 464
3.3 PSL Scheme Version Control 464
4 Configuring the Opto-Inputs 465 5 Assigning the Output Relays 466 6 Fixed Function LEDs 467
6.1 Trip LED Logic 467
7 Configuring Programmable LEDs 468 8 Function Keys 470 9 Control Inputs 471
Chapter 19 Fibre Teleprotection 473
1 Chapter Overview 475 2 Protection Signalling Introduction 476
2.1 Unit Protection Schemes 476
2.2 Teleprotection Commands 476
2.3 Transmission Media and Interference 477
3 Fibre Teleprotection Implementation 478
3.1 Setting up the IM64 Scheme 478
3.1.1 Fibre Teleprotection Scheme Terminal Addressing 479
3.1.2 Setting up IM64 480
3.1.3 Two-Terminal IM64 Operation 480
3.1.4 Dual Redundant Two-Terminal IM64 Operation 480
3.1.5 Three-Terminal IM64 Operation 480
3.1.6 Physical Connection 481
4 IM64 Logic 485 5 Application Notes 487
5.1 Alarm Management 487
5.2 Alarm Logic 487
5.3 Two-ended Scheme Extended Supervision 488
5.4 Three-ended Scheme Extended Supervision 488
Chapter 20 Electrical Teleprotection 491
1 Chapter Overview 493 2 Introduction 494 3 Teleprotection Scheme Principles 495
3.1 Direct Tripping 495
3.2 Permissive Tripping 495
4 Implementation 496 5 Configuration 497 6 Connecting to Electrical InterMiCOM 499
6.1 Short Distance 499
6.2 Long Distance 499
7 Application Notes 500
Chapter 21 Communications 503
1 Chapter Overview 505 2 Communication Interfaces 506 3 Serial Communication 507
3.1 EIA(RS)232 Bus 507
3.2 EIA(RS)485 Bus 507
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3.2.1 EIA(RS)485 Biasing Requirements 508
3.3 K-Bus 508
4 Standard Ethernet Communication 510
4.1 Hot-Standby Ethernet Failover 510
5 Redundant Ethernet Communication 511
5.1 Supported Protocols 511
5.2 Parallel Redundancy Protocol 512
5.3 High-Availability Seamless Redundancy (HSR) 513
5.3.1 HSR Multicast Topology 513
5.3.2 HSR Unicast Topology 513
5.3.3 HSR Application in the Substation 514
5.4 Rapid Spanning Tree Protocol 515
5.5 Self Healing Protocol 516
5.6 Dual Homing Protocol 517
5.7 Configuring IP Addresses 519
5.7.1 Configuring the IED IP Address 520
5.7.2 Configuring the REB IP Address 520
5.8 PRP/HSR Configurator 522
5.8.1 Connecting the IED to a PC 523
5.8.2 Installing the Configurator 523
5.8.3 Starting the Configurator 523
5.8.4 PRP/HSR Device Identification 524
5.8.5 Selecting the Device Mode 524
5.8.6 PRP/HSR IP Address Configuration 524
5.8.7 SNTP IP Address Configuration 524
5.8.8 Check for Connected Equipment 524
5.8.9 PRP Configuration 524
5.8.10 HSR Configuration 525
5.8.11 Filtering Database 525
5.8.12 End of Session 526
5.9 RSTP Configurator 526
5.9.1 Connecting the IED to a PC 526
5.9.2 Installing the Configurator 527
5.9.3 Starting the Configurator 527
5.9.4 RSTP Device Identification 527
5.9.5 RSTP IP Address Configuration 528
5.9.6 SNTP IP Address Configuration 528
5.9.7 Check for Connected Equipment 528
5.9.8 RSTP Configuration 528
5.9.9 End of Session 529
5.10 Switch Manager 529
5.10.1 Installation 530
5.10.2 Setup 531
5.10.3 Network Setup 531
5.10.4 Bandwidth Used 531
5.10.5 Reset Counters 531
5.10.6 Check for Connected Equipment 531
5.10.7 Mirroring Function 532
5.10.8 Ports On/Off 532
5.10.9 VLAN 532
5.10.10 End of Session 532
6 Simple Network Management Protocol (SNMP) 533
6.1 SNMP Management Information Bases 533
6.2 Main Processor MIBS Structure 533
6.3 Redundant Ethernet Board MIB Structure 534
6.4 Accessing the MIB 538
6.5 Main Processor SNMP Configuration 538
7 Data Protocols 540
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7.1 Courier 540
7.1.1 Physical Connection and Link Layer 540
7.1.2 Courier Database 541
7.1.3 Settings Categories 541
7.1.4 Setting Changes 541
7.1.5 Event Extraction 541
7.1.6 Disturbance Record Extraction 543
7.1.7 Programmable Scheme Logic Settings 543
7.1.8 Time Synchronisation 543
7.1.9 Courier Configuration 544
7.2 IEC 60870-5-103 545
7.2.1 Physical Connection and Link Layer 545
7.2.2 Initialisation 546
7.2.3 Time Synchronisation 546
7.2.4 Spontaneous Events 546
7.2.5 General Interrogation (GI) 546
7.2.6 Cyclic Measurements 546
7.2.7 Commands 546
7.2.8 Test Mode 547
7.2.9 Disturbance Records 547
7.2.10 Command/Monitor Blocking 547
7.2.11 IEC 60870-5-103 Configuration 547
7.3 DNP 3.0 548
7.3.1 Physical Connection and Link Layer 548
7.3.2 Object 1 Binary Inputs 549
7.3.3 Object 10 Binary Outputs 549
7.3.4 Object 20 Binary Counters 550
7.3.5 Object 30 Analogue Input 550
7.3.6 Object 40 Analogue Output 551
7.3.7 Object 50 Time Synchronisation 551
7.3.8 DNP3 Device Profile 551
7.3.9 DNP3 Configuration 559
7.4 IEC 61850 560
7.4.1 Benefits of IEC 61850 561
7.4.2 IEC 61850 Interoperability 561
7.4.3 The IEC 61850 Data Model 561
7.4.4 IEC 61850 in MiCOM IEDs 562
7.4.5 IEC 61850 Data Model Implementation 563
7.4.6 IEC 61850 Communication Services Implementation 563
7.4.7 IEC 61850 Peer-to-peer (GOOSE) communications 563
7.4.8 Mapping GOOSE Messages to Virtual Inputs 563
7.4.9 Ethernet Functionality 564
7.4.10 IEC 61850 Configuration 564
7.4.11 IEC 61850 Edition 2 565
8 Read Only Mode 569
8.1 IEC 60870-5-103 Protocol Blocking 569
8.2 Courier Protocol Blocking 569
8.3 IEC 61850 Protocol Blocking 570
8.4 Read-Only Settings 570
8.5 Read-Only DDB Signals 570
9 Time Synchronisation 571
9.1 Demodulated IRIG-B 571
9.1.1 IRIG-B Implementation 571
9.2 SNTP 572
9.2.1 Loss of SNTP Server Signal Alarm 572
9.3 IEEE 1588 Precision time Protocol 572
9.3.1 Accuracy and Delay Calculation 572
9.3.2 PTP Domains 573
9.4 Time Synchronsiation using the Communication Protocols 573
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Chapter 22 Cyber-Security 575
1 Overview 577 2 The Need for Cyber-Security 578 3 Standards 579
3.1 NERC Compliance 579
3.1.1 CIP 002 580
3.1.2 CIP 003 580
3.1.3 CIP 004 580
3.1.4 CIP 005 580
3.1.5 CIP 006 580
3.1.6 CIP 007 581
3.1.7 CIP 008 581
3.1.8 CIP 009 581
3.2 IEEE 1686-2007 581
4 Cyber-Security Implementation 583
4.1 NERC-Compliant Display 583
4.2 Four-level Access 584
4.2.1 Blank Passwords 585
4.2.2 Password Rules 586
4.2.3 Access Level DDBs 586
4.3 Enhanced Password Security 586
4.3.1 Password Strengthening 586
4.3.2 Password Validation 587
4.3.3 Password Blocking 587
4.4 Password Recovery 588
4.4.1 Password Recovery 588
4.4.2 Password Encryption 589
4.5 Disabling Physical Ports 589
4.6 Disabling Logical Ports 589
4.7 Security Events Management 590
4.8 Logging Out 592
Chapter 23 Installation 593
1 Chapter Overview 595 2 Handling the Goods 596
2.1 Receipt of the Goods 596
2.2 Unpacking the Goods 596
2.3 Storing the Goods 596
2.4 Dismantling the Goods 596
3 Mounting the Device 597
3.1 Flush Panel Mounting 597
3.2 Rack Mounting 598
4 Cables and Connectors 600
4.1 Terminal Blocks 600
4.2 Power Supply Connections 601
4.3 Earth Connnection 601
4.4 Watchdog Connections 601
4.5 EIA(RS)485 and K-Bus Connections 601
4.6 IRIG-B Connection 602
4.7 Opto-input Connections 602
4.8 Output Relay Connections 602
4.9 Ethernet Metallic Connections 602
4.10 Ethernet Fibre Connections 602
4.11 RS232 connection 603
4.12 Download/Monitor Port 603
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Contents P446SV
4.13 GPS Fibre Connection 603
4.14 Fibre Communication Connections 603
5 Case Dimensions 604
5.1 Case Dimensions 40TE 604
Chapter 24 Commissioning Instructions 605
1 Chapter Overview 607 2 General Guidelines 608 3 Commissioning Test Menu 609
3.1 Opto I/P Status Cell (Opto-input Status) 609
3.2 Relay O/P Status Cell (Relay Output Status) 609
3.3 Test Port Status Cell 609
3.4 Monitor Bit 1 to 8 Cells 609
3.5 Test Mode Cell 610
3.6 Test Pattern Cell 610
3.7 Contact Test Cell 610
3.8 Test LEDs Cell 610
3.9 Test Autoreclose Cell 610
3.10 Static Test Mode 611
3.11 Loopback Mode 611
3.12 IM64 Test Pattern 612
3.13 IM64 Test Mode 612
3.14 Red and Green LED Status Cells 612
3.15 Using a Monitor Port Test Box 612
4 Commissioning Equipment 613
4.1 Recommended Commissioning Equipment 613
4.2 Essential Commissioning Equipment 613
4.3 Advisory Test Equipment 614
5 Product Checks 615
5.1 Product Checks with the IED De-energised 615
5.1.1 Visual Inspection 616
5.1.2 Current Transformer Shorting Contacts 616
5.1.3 Insulation 616
5.1.4 External Wiring 616
5.1.5 Watchdog Contacts 617
5.1.6 Power Supply 617
5.2 Product Checks with the IED Energised 617
5.2.1 Watchdog Contacts 617
5.2.2 Test LCD 618
5.2.3 Date and Time 618
5.2.4 Test LEDs 619
5.2.5 Test Alarm and Out-of-Service LEDs 619
5.2.6 Test Trip LED 619
5.2.7 Test User-programmable LEDs 619
5.2.8 Test Opto-inputs 619
5.2.9 Test Output Relays 619
5.2.10 Test Serial Communication Port RP1 620
5.2.11 Test Serial Communication Port RP2 621
5.2.12 Test Ethernet Communication 621
5.3 Secondary Injection Tests 622
5.3.1 Test Current Inputs 622
5.3.2 Test Voltage Inputs 622
6 Electrical Intermicom Communication Loopback 624
6.1 Setting up the Loopback 624
6.2 Loopback Test 624
6.2.1 InterMicom Command Bits 625
6.2.2 InterMicom Channel Diagnostics 625
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6.2.3 Simulating a Channel Failure 625
7 Intermicom 64 Communication 626
7.1 Checking the Interface 626
7.2 Setting up the Loopback 627
7.3 Loopback Test 627
8 Setting Checks 628
8.1 Apply Application-specific Settings 628
8.1.1 Transferring Settings from a Settings File 628
8.1.2 Entering settings using the HMI 628
9 IEC 61850 Edition 2 Testing 630
9.1 Using IEC 61850 Edition 2 Test Modes 630
9.1.1 IED Test Mode Behaviour 630
9.1.2 Sampled Value Test Mode Behaviour 630
9.2 Simulated Input Behaviour 631
9.3 Testing Examples 631
9.3.1 Test Procedure for Real Values 632
9.3.2 Test Procedure for Simulated Values - No Plant 632
9.3.3 Test Procedure for Simulated Values - With Plant 633
9.3.4 Contact Test 634
10 Distance Protection 635
10.1 Single-ended Testing 635
10.1.1 Preliminaries 635
10.1.2 Zone 1 Reach Check 635
10.1.3 Zone 2 Reach Check 636
10.1.4 Zone 3 Reach Check 636
10.1.5 Zone 4 Reach Check 636
10.1.6 Zone P Reach Check 636
10.1.7 Resistive Reach 637
10.1.8 Load Blinder 637
10.2 Operation and Contact Assignment 637
10.2.1 Phase A 637
10.2.2 Phase B 637
10.2.3 Phase C 637
10.2.4 Time Delay Settings 638
10.3 Scheme Testing 638
10.3.1 Scheme Trip Test for Zone 1 Extension 639
10.3.2 Scheme Trip Tests for Permissive Schemes 639
10.3.3 Scheme Trip Tests for Blocking Scheme 639
10.3.4 Signal Send Test for Permissive Schemes 640
10.3.5 Signal Send Test for Blocking Scheme 640
10.3.6 Scheme Timer Settings 640
11 Delta Directional Comparison 641
11.1 Single-ended Testing 641
11.1.1 Preliminaries 641
11.1.2 Single-ended Injection Test 641
11.1.3 Forward Fault Preparation 641
11.2 Operation and Contact Assignment 642
11.2.1 Phase A 642
11.2.2 Phase B 642
11.2.3 Phase C 642
11.3 Delta Protection Scheme Testing 643
11.3.1 Signal Send Test for Permissive Schemes 643
11.3.2 Signal Send Test for Blocking Schemes 643
12 DEF Aided Schemes 644
12.1 Earth Current Pilot Scheme 644
12.1.1 Preliminaries 644
12.1.2 Perform the Test 644
12.1.3 Forward Fault Trip Test 645
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12.2 Scheme Testing 645
12.2.1 Signal Send Test for Permissive Schemes 645
12.2.2 Signal Send Test for Blocking Schemes 645
13 Out of Step Protection 646
13.1 OST Setting 646
13.2 Predictive OST Setting 647
13.3 Predictive and OST Setting 647
13.4 OST Timer Test 647
14 Protection Timing Checks 648
14.1 Overcurrent Check 648
14.2 Connecting the Test Circuit 648
14.3 Performing the Test 648
14.4 Check the Operating Time 648
15 System Check and Check Synchronism 650
15.1 Check Synchronism Pass 650
15.2 Check Synchronism Fail 650
16 Check Trip and Autoreclose Cycle 651 17 End-to-End Communication Tests 652
17.1 Remove Local Loopbacks 652
17.1.1 Restoring Direct Fibre Connections 652
17.1.2 Restoring C37.94 Fibre Connections 653
17.1.3 Communications using P59x Interface Units 653
17.2 Remove Remote Loopbacks 653
17.3 Verify Communication between IEDs 653
18 End-to-End Scheme Tests 655
18.1 Aided Scheme 1 655
18.1.1 Preparation at Remote End 655
18.1.2 Performing the Test 655
18.1.3 Channel Check in the Opposite Direction 655
18.2 Aided Scheme 2 655
19 Onload Checks 657
19.1 Confirm Current Connections 657
19.2 Confirm Voltage Connections 657
19.3 On-load Directional Test 658
20 Final Checks 659 21 Commmissioning the P59x 660
21.1 Visual Inspection 660
21.2 Insulation 660
21.3 External Wiring 660
21.4 P59x Auxiliary Supply 660
21.5 P59x LEDs 661
21.6 Received Optical Signal Level 661
21.7 Optical Transmitter Level 661
21.8 Loopback Test 662
Chapter 25 Maintenance and Troubleshooting 663
1 Chapter Overview 665 2 Maintenance 666
2.1 Maintenance Checks 666
2.1.1 Alarms 666
2.1.2 Opto-isolators 666
2.1.3 Output Relays 666
2.1.4 Measurement Accuracy 666
2.2 Replacing the Device 667
2.3 Repairing the Device 668
2.4 Removing the front panel 668
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2.5 Replacing PCBs 669
2.5.1 Replacing the main processor board 669
2.5.2 Replacement of communications boards 670
2.5.3 Replacement of the input module 671
2.5.4 Replacement of the power supply board 671
2.5.5 Replacement of the I/O boards 672
2.6 Recalibration 672
2.7 Changing the battery 672
2.7.1 Post Modification Tests 673
2.7.2 Battery Disposal 673
2.8 Cleaning 673
3 Troubleshooting 674
3.1 Self-Diagnostic Software 674
3.2 Power-up Errors 674
3.3 Error Message or Code on Power-up 674
3.4 Out of Service LED on at power-up 675
3.5 Error Code during Operation 676
3.5.1 Backup Battery 676
3.6 Mal-operation during testing 676
3.6.1 Failure of Output Contacts 676
3.6.2 Failure of Opto-inputs 676
3.6.3 Incorrect Analogue Signals 677
3.7 Coprocessor board failures 677
3.7.1 Signalling failure alarm (on its own) 677
3.7.2 C diff failure alarm (on its own) 677
3.7.3 Signalling failure and C diff failure alarms together 677
3.7.4 Incompatible IED 677
3.7.5 Comms changed 677
3.7.6 IEEE C37.94 fail 678
3.8 PSL Editor Troubleshooting 678
3.8.1 Diagram Reconstruction 678
3.8.2 PSL Version Check 678
3.9 Repair and Modification Procedure 678
Chapter 26 Technical Specifications 681
1 Chapter Overview 683 2 Interfaces 684
2.1 Front Serial Port 684
2.2 Download/Monitor Port 684
2.3 Rear Serial Port 1 684
2.4 Fibre Rear Serial Port 1 684
2.5 Rear Serial Port 2 685
2.6 Optional Rear Serial Port (SK5) 685
2.7 IRIG-B (Demodulated) 685
2.8 IRIG-B (Modulated) 685
2.9 Rear Ethernet Port Copper 686
2.10 Rear Ethernet Port Fibre 686
2.10.1 100 Base FX Receiver Characteristics 686
2.10.2 100 Base FX Transmitter Characteristics 687
2.11 1 PPS Port 687
2.12 Fibre Teleprotection Interface 687
3 Protection Functions 688
3.1 Distance Protection 688
3.2 Power Swing Blocking 688
3.3 Out Of Step Protection 689
3.4 Fibre Teleprotection Transfer Times 689
3.5 Autoreclose and Check Synychronism 689
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Contents P446SV
3.6 Phase Overcurrent Protection 689
3.6.1 Transient Overreach and Overshoot 690
3.6.2 Phase Overcurrent Directional Parameters 690
3.7 Earth Fault Protection 690
3.7.1 Earth Fault Directional Parameters 690
3.8 Sensitive Earth Fault Protection 691
3.8.1 Sensitive Earth Fault Protection Directional Element 691
3.9 High Impedance Restricted Earth Fault Protection 691
3.10 Negative Sequence Overcurrent Protection 691
3.10.1 NPSOC Directional Parameters 692
3.11 Circuit Breaker Fail and Undercurrent Protection 692
3.12 Broken Conductor Protection 692
3.13 Thermal Overload Protection 692
4 Monitoring, Control and Supervision 693
4.1 Voltage Transformer Supervision 693
4.2 Standard Current Transformer Supervision 693
4.3 Differential Current Transformer Supervision 693
4.4 CB State and Condition Monitoring 693
4.5 PSL Timers 694
5 Measurements and Recording 695
5.1 General 695
5.2 Disturbance Records 695
5.3 Event, Fault and Maintenance Records 695
5.4 Fault Locator 695
6 Ratings 696
6.1 AC Measuring Inputs 696
6.2 Current Transformer Inputs 696
6.3 Voltage Transformer Inputs 696
6.4 Auxiliary Supply Voltage 696
6.5 Nominal Burden 697
6.6 Power Supply Interruption 697
6.7 Battery Backup 698
7 Input / Output Connections 699
7.1 Isolated Digital Inputs 699
7.1.1 Nominal Pickup and Reset Thresholds 699
7.2 Standard Output Contacts 699
7.3 High Break Output Contacts 700
7.4 Watchdog Contacts 700
8 Mechanical Specifications 701
8.1 Physical Parameters 701
8.2 Enclosure Protection 701
8.3 Mechanical Robustness 701
8.4 Transit Packaging Performance 701
9 Type Tests 702
9.1 Insulation 702
9.2 Creepage Distances and Clearances 702
9.3 High Voltage (Dielectric) Withstand 702
9.4 Impulse Voltage Withstand Test 702
10 Environmental Conditions 703
10.1 Ambient Temperature Range 703
10.2 Temperature Endurance Test 703
10.3 Ambient Humidity Range 703
10.4 Corrosive Environments 703
11 Electromagnetic Compatibility 704
11.1 1 MHz Burst High Frequency Disturbance Test 704
11.2 Damped Oscillatory Test 704
11.3 Immunity to Electrostatic Discharge 704
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P446SV Contents
11.4 Electrical Fast Transient or Burst Requirements 704
11.5 Surge Withstand Capability 704
11.6 Surge Immunity Test 705
11.7 Immunity to Radiated Electromagnetic Energy 705
11.8 Radiated Immunity from Digital Communications 705
11.9 Radiated Immunity from Digital Radio Telephones 705
11.10 Immunity to Conducted Disturbances Induced by Radio Frequency Fields 705
11.11 Magnetic Field Immunity 706
11.12 Conducted Emissions 706
11.13 Radiated Emissions 706
11.14 Power Frequency 706
12 Regulatory Compliance 707
12.1 EMC Compliance: 2014/30/EU 707
12.2 LVD Compliance: 2014/35/EU 707
12.3 R&TTE Compliance: 2014/53/EU 707
12.4 UL/CUL Compliance 707
12.5 ATEX Compliance: 2014/34/EU 707
Appendix A Ordering Options 709
Appendix B Settings and Signals 711
Appendix C Wiring Diagrams 713
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Contents P446SV
xxii P446SV-TM-EN-1
Page 25
Table of Figures
Figure 1: P40L family - version evolution 7 Figure 2: Key to logic diagrams 12 Figure 3: Functional Overview 13 Figure 4: Hardware architecture 32 Figure 5: Exploded view of IED 33 Figure 6: Front panel (40TE) 35 Figure 7: Rear view of populated case 38 Figure 8: Rear connection to terminal block 39 Figure 9: Main processor board 40 Figure 10: Power supply board 41 Figure 11: Power supply assembly 42 Figure 12: Power supply terminals 43 Figure 13: Watchdog contact terminals 44 Figure 14: Rear serial port terminals 45 Figure 15: IEC 61850-9-2LE board 45 Figure 16: Standard output relay board - 8 contacts 46 Figure 17: IRIG-B board 47 Figure 18: Fibre optic board 48 Figure 19: Rear communication board 49 Figure 20: Ethernet board 49 Figure 21: Redundant Ethernet board 51 Figure 22: Fully populated Coprocessor board 53 Figure 23: High Break relay output board 54 Figure 24: High Break contact operation 55 Figure 25: Software Architecture 60 Figure 26: Frequency response of FIR filters 66 Figure 27: Frequency Response (indicative only) 67 Figure 28: Navigating the HMI 74 Figure 29: Default display navigation 76 Figure 30: Circuit Breaker Trip Conversion Logic Diagram (Module 63) 85 Figure 31: Comparison of Conventional IED and Sampled Values IED 96 Figure 32: Data sampling using an IEC 61850-9-2LE interface 97 Figure 33: System Impedance Ratio 108 Figure 34: Directional mho element construction 111 Figure 35: Offset Mho characteristic 112 Figure 36: Directional Mho element construction – impedance domain 113 Figure 37: Offset Mho characteristics – impedance domain 114 Figure 38: Offset mho characteristics – voltage domain 115
Page 26
Table of Figures P446SV
Figure 39: Simplified forward fault 116 Figure 40: Mho expansion – forward fault 117 Figure 41: Simplified Reverse Fault 118 Figure 42: Mho contraction – reverse fault 119 Figure 43: Simplified quadrilateral characteristics 121 Figure 44: General Quadrilateral Characteristic Limits 122 Figure 45: Directional Quadrilateral Characteristic 123 Figure 46: Quadrilateral Characteristic featuring 2 directional forward zones and 1 offset zone 123 Figure 47: Five-sided polygon formed by Quadrilateral characteristic with Directional-Line
124
intersection of Reverse Impedance Reach Line
Figure 48: Impedance Reach line construction 126 Figure 49: Reverse impedance reach line construction 127 Figure 50: Resistive reach of phase elements 128 Figure 51: Resistive Reach line construction 128 Figure 52: Reverse resistive reach line construction 129 Figure 53: Phase Fault Quadrilateral characteristic summary 129 Figure 54: Impedance Reach line in Z1 plane 132 Figure 55: Impedance Reach line in ZLP plane 133 Figure 56: General characteristic in ZLP plane 134 Figure 57: Phase relations between I2 and Iph for leading and lagging polarizing currents 135 Figure 58: General characteristic in Z1 plane 136 Figure 59: Simplified characteristic in Z1 plane 137 Figure 60: Phase to phase current changes for C phase-to-ground (CN) fault 141 Figure 61: Biased Neutral Current Detector Characteristic 142 Figure 62: Load Blinder Characteristics 145 Figure 63: Sequence networks connection for an internal A-N fault 148 Figure 64: - DV Forward and Reverse tripping regions 149 Figure 65: Settings required to apply a quadrilateral zone 150 Figure 66: Settings required to apply a mho zone 151 Figure 67: Over-tilting effect 153 Figure 68: Example power system 158 Figure 69: Apparent Impedances seen by Distance Protection on a Teed Feeder 163 Figure 70: Scheme Assignment 169 Figure 71: Aided Distance PUR scheme 172 Figure 72: Aided Distance POR scheme 174 Figure 73: Example of fault current reversal of direction 176 Figure 74: Aided Distance Blocking scheme (BOP) 178 Figure 75: Aided Distance Send logic 180 Figure 76: Carrier Aided Schemes Receive logic 180 Figure 77: Aided Distance Tripping logic 181
xxiv P446SV-TM-EN-1
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P446SV Table of Figures
Figure 78: PUR Aided Tripping logic 181 Figure 79: POR Aided Tripping logic 183 Figure 80: Aided Scheme Blocking 1 Tripping logic 183 Figure 81: Aided Scheme Blocking 2 Tripping logic 183 Figure 82: Virtual Current Polarization 186 Figure 83: Directional criteria for residual voltage polarization 187 Figure 84: Aided DEF POR scheme 189 Figure 85: Aided DEF Blocking scheme 190 Figure 86: DEF Directional Signals 190 Figure 87: Aided DEF Send logic 191 Figure 88: Carrier Aided Schemes Receive logic 191 Figure 89: Aided DEF Tripping logic 192 Figure 90: POR Aided Tripping logic 194 Figure 91: Aided Scheme Blocking 1 Tripping logic 194 Figure 92: Aided Scheme Blocking 2 Tripping logic 194 Figure 93: Aided Delta POR scheme 196 Figure 94: Aided Delta Blocking scheme 197 Figure 95: Aided Delta Send logic 198 Figure 96: Carrier Aided Schemes Receive logic 198 Figure 97: Aided Delta Tripping logic 199 Figure 98: POR Aided Tripping logic 201 Figure 99: Aided Scheme Blocking 1 Tripping logic 201 Figure 100: Aided Scheme Blocking 2 Tripping logic 201 Figure 101: Apparent Impedances seen by Distance Protection on a Teed Feeder 204 Figure 102: Problematic Fault Scenarios for PUR Scheme Application to Teed Feeders 206 Figure 103: Any Distance Start 214 Figure 104: Standard basic scheme mode logic 214 Figure 105: Alternative basic timer start scheme mode logic 215 Figure 106: Basic time stepped distance scheme 216 Figure 107: Trip On Close logic 217 Figure 108: Trip On Close based on CNV level detectors 218 Figure 109: SOTF Tripping 219 Figure 110: SOTF Tripping with CNV 219 Figure 111: TOR Tripping logic for appropriate zones 220 Figure 112: TOR Tripping logic with CNV 220 Figure 113: Zone 1 extension scheme 221 Figure 114: Zone 1 extension logic 221 Figure 115: Loss of load accelerated trip scheme 222 Figure 116: Loss of Load Logic 223 Figure 117: Power transfer related to angular difference between two generation sources 228
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Table of Figures P446SV
Figure 118: Phase selector timing for power swing condition 231 Figure 119: Phase selector timing for fault condition 231 Figure 120: Phase selector timing for fault during a power swing 232 Figure 121: Slow Power Swing detection characteristic 233 Figure 122: Load Blinder Boundary Conditions 236 Figure 123: Power swing blocking logic 237 Figure 124: Setting the resistive reaches 238 Figure 125: Reactive reach settings 239 Figure 126: PSB timer setting guidelines 240 Figure 127: Out of Step detection characteristic 241 Figure 128: Out of Step logic diagram 243 Figure 129: OST setting determination for the positive sequence resistive component OST R5 244 Figure 130: OST R6max determination 245 Figure 131: Example of timer reset due to MOVs operation 248 Figure 132: Autoreclose sequence for a Transient Fault 256 Figure 133: Autoreclose sequence for an evolving or permanent fault 257 Figure 134: Autoreclose sequence for an evolving or permanent fault - single-phase operation 257 Figure 135: Dual CB Autoreclose Sequence for a Transient Fault 258 Figure 136: Autoreclose Sequence for an evolving/permanent fault on a dual CB application 259 Figure 137: Autoreclose Sequence for a persistent fault on a multishot dual CB application set
259
for single-phase operation
Figure 138: Key to logic diagrams 262 Figure 139: Autoreclose System Map - part 1 263 Figure 140: Autoreclose System Map - part 2 264 Figure 141: Autoreclose System Map - part 3 265 Figure 142: Autoreclose System Map - part 4 266 Figure 143: Autoreclose System Map - part 5 267 Figure 144: Autoreclose System Map - part 6 268 Figure 145: Autoreclose System Map - part 7 269 Figure 146: Autoreclose System Map - part 8 270 Figure 147: Autoreclose System Map - part 9 271 Figure 148: Autoreclose System Map - part 10 272 Figure 149: CB State logic diagram (Module 1) 290 Figure 150: Circuit Breaker Open logic diagram (Module 3) 291 Figure 151: CB In Service logic diagram (Module 4) 292 Figure 152: Autoreclose Enable logic diagram (Module 5) 292 Figure 153: Leader/Follower CB Selection Logic Diagram (Module 6) 293 Figure 154: Leader/Follower logic diagram (Module 7 & 8) 294 Figure 155: Autoreclose Modes Enable logic diagram (Module 9) 296 Figure 156: Force three-phase trip logic diagram (Module 10) 297
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P446SV Table of Figures
Figure 157: Autoreclose Initiation logic diagram (Module 11) 299 Figure 158: Autoreclose Trip Test logic diagram (Module 12) 299 Figure 159: Autoreclose initiation by internal single and three phase trip or external trip for CB1
300
(Module 13)
Figure 160: Autoreclose initiation by internal single and three phase trip or external trip for CB2
301
(Module 14)
Figure 161: Protection Reoperation and Evolving Fault logic diagram (Module 20) 302 Figure 162: Fault Memory logic diagram (Module 15) 302 Figure 163: Autoreclose In Progress logic diagram for CB1 (Module 16) 303 Figure 164: Autoreclose In Progress logic diagram for CB2 (Module 17) 304 Figure 165: Autoreclose Sequence Counter logic diagram (Module 18) 305 Figure 166: Single-phase Autoreclose Cycle Selection logic diagram (Module 19) 306 Figure 167: Three-phase Autoreclose Cycle Selection logic diagram (Module 21) 307 Figure 168: Dead time Start Enable logic diagram (Module 22) 308 Figure 169: Single-phase Leader Dead Time logic diagram (Module 24) 309 Figure 170: Three-phase Leader CB Dead Time logic diagram (Module 25) 310 Figure 171: Follower Enable logic diagram (Module 27) 311 Figure 172: Single-phase Follower CB timing logic diagram (Module 28) 312 Figure 173: Three-phase Follower CB timing logic diagram (Module 29) 313 Figure 174: Circuit Breaker Autoclose Logic Diagram (Modules 32 & 33) 314 Figure 175: Prepare Reclaim Initiation logic diagram (Module 34) 315 Figure 176: Reclaim Time logic diagram (Module 35) 316 Figure 177: Successful Autoreclose Signals logic diagram (Module 36) 317 Figure 178: Autoreclose Reset Successful Indication logic diagram (Modules 37 & 38) 318 Figure 179: Circuit Breaker Healthy and System Check Timers Healthy logic diagram (Module 39) 319 Figure 180: Autoreclose Shot Counters logic diagram (Modules 41 & 42) 321 Figure 181: CB1 Control Logic (Module 43) 322 Figure 182: CB2 Control Logic (Module 44) 323 Figure 183: Circuit Breaker Trip Time Monitoring logic diagram (Modules 53 & 54) 324 Figure 184: CB1 Lockout Logic Diagram (Module 55) 326 Figure 185: CB2 Lockout Logic Diagram (Module 56) 327 Figure 186: Reset Circuit Breaker Lockout Logic Diagram (Modules 57 & 58) 329 Figure 187: Pole Discrepancy Logic Diagram (Module 62) 330 Figure 188: Circuit Breaker Trip Conversion Logic Diagram (Module 63) 331 Figure 189: Voltage Monitor for CB Closure (Module 59) 332 Figure 190: Check Synchronisation Monitor for CB1 closure (Module 60) 333 Figure 191: Check Synchronisation Monitor for CB2 closure (Module 61) 334 Figure 192: Three-phase AR System Check logic diagram for CB1 as leader (Module 45) 336 Figure 193: Three-phase AR System Check logic diagram for CB2 as leader (Module 46) 337 Figure 194: Three-phase AR System Check logic d for CB1 as follower (Module 47) 338 Figure 195: Three-phase AR System Check logic diagram for CB2 as follower (Module 48) 339
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Table of Figures P446SV
Figure 196: CB Manual Close System Check Logic Diagram (Modules 51 & 52) 340 Figure 197: Circuit Breaker Fail logic - part 1 351 Figure 198: Circuit Breaker Fail logic - part 2 352 Figure 199: Circuit Breaker Fail logic - part 3 353 Figure 200: Circuit Breaker Fail logic - part 4 354 Figure 201: CB Fail timing 356 Figure 202: Phase Overcurrent Protection logic diagram 362 Figure 203: Negative Phase Sequence Overcurrent Protection logic diagram 364 Figure 204: IDG Characteristic 367 Figure 205: Earth Fault Protection logic diagram 369 Figure 206: EPATR B characteristic shown for TMS = 1.0 372 Figure 207: Sensitive Earth Fault Protection logic diagram 372 Figure 208: Current distribution in an insulated system with C phase fault 373 Figure 209: Phasor diagrams for insulated system with C phase fault 374 Figure 210: Positioning of core balance current transformers 375 Figure 211: High Impedance REF principle 376 Figure 212: High Impedance REF Connection 377 Figure 213: Thermal overload protection logic diagram 379 Figure 214: Spreadsheet calculation for dual time constant thermal characteristic 380 Figure 215: Dual time constant thermal characteristic 380 Figure 216: Broken conductor logic 382 Figure 217: Undervoltage - single and three phase tripping mode (single stage) 389 Figure 218: Overvoltage - single and three phase tripping mode (single stage) 392 Figure 219: Residual Overvoltage logic 396 Figure 220: Residual voltage for a solidly earthed system 397 Figure 221: Residual voltage for an impedance earthed system 398 Figure 222: Underfrequency logic (single stage) 403 Figure 223: Overfrequency logic (single stage) 404 Figure 224: Rate of change of frequency logic (single stage) 405 Figure 225: Fault recorder stop conditions 412 Figure 226: Broken Current Accumulator logic diagram 417 Figure 227: CB Trip Counter logic diagram 418 Figure 228: Operating Time Accumulator 419 Figure 229: Excessive Fault Frequency logic diagram 420 Figure 230: Reset Lockout Alarm logic diagram 421 Figure 231: CB1 Condition Monitoring logic diagram 422 Figure 232: CB2 Condition Monitoring logic diagram 423 Figure 233: Reset Circuit Breaker Lockout Logic Diagram (Modules 57 & 58) 425 Figure 234: CB State logic diagram (Module 1) 428 Figure 235: Hotkey menu navigation 430
xxviii P446SV-TM-EN-1
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P446SV Table of Figures
Figure 236: Default function key PSL 431 Figure 237: Remote Control of Circuit Breaker 432 Figure 238: CB1 Control Logic (Module 43) 433 Figure 239: CB2 Control Logic (Module 44) 434 Figure 240: Pole Dead logic 435 Figure 241: Check Synchronisation vector diagram 438 Figure 242: Voltage Monitor for CB Closure (Module 59) 439 Figure 243: Check Synchronisation Monitor for CB1 closure (Module 60) 440 Figure 244: Check Synchronisation Monitor for CB2 closure (Module 61) 441 Figure 245: System Check PSL 442 Figure 246: VTS logic 450 Figure 247: Standard CTS 453 Figure 248: TCS Scheme 1 454 Figure 249: PSL for TCS Scheme 1 455 Figure 250: TCS Scheme 2 455 Figure 251: PSL for TCS Scheme 2 456 Figure 252: TCS Scheme 3 456 Figure 253: PSL for TCS Scheme 3 457 Figure 254: Scheme Logic Interfaces 463 Figure 255: Trip LED logic 467 Figure 256: Fibre Teleprotection connections for a three-terminal Scheme 479 Figure 257: Interfacing to PCM multiplexers 483 Figure 258: IM64 channel fail and scheme fail logic 485 Figure 259: IM64 general alarm signals logic 485 Figure 260: IM64 communications mode and IEEE C37.94 alarm signals 486 Figure 261: IM64 two-terminal scheme extended supervision 488 Figure 262: IM64 three-terminal scheme extended supervision 488 Figure 263: Example assignment of InterMiCOM signals within the PSL 498 Figure 264: Direct connection 499 Figure 265: Indirect connection using modems 499 Figure 266: RS485 biasing circuit 508 Figure 267: Remote communication using K-Bus 509 Figure 268: IED attached to separate LANs 512 Figure 269: HSR multicast topology 513 Figure 270: HSR unicast topology 514 Figure 271: HSR application in the substation 515 Figure 272: IED attached to redundant Ethernet star or ring circuit 515 Figure 273: IED, bay computer and Ethernet switch with self healing ring facilities 516 Figure 274: Redundant Ethernet ring architecture with IED, bay computer and Ethernet switches 516
P446SV-TM-EN-1 xxix
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Table of Figures P446SV
Figure 275: Redundant Ethernet ring architecture with IED, bay computer and Ethernet switches
517
after failure
Figure 276: Dual homing mechanism 518 Figure 277: Application of Dual Homing Star at substation level 519 Figure 278: IED and REB IP address configuration 520 Figure 279: Connection using (a) an Ethernet switch and (b) a media converter 523 Figure 280: Connection using (a) an Ethernet switch and (b) a media converter 527 Figure 281: Control input behaviour 550 Figure 282: Data model layers in IEC61850 562 Figure 283: Edition 2 system - backward compatibility 566 Figure 284: Edition 1 system - forward compatibility issues 566 Figure 285: Example of Standby IED 567 Figure 286: Standby IED Activation Process 568 Figure 287: GPS Satellite timing signal 571 Figure 288: Timing error using ring or line topology 573 Figure 289: Default display navigation 584 Figure 290: Location of battery isolation strip 597 Figure 291: Rack mounting of products 598 Figure 292: Terminal block types 600 Figure 293: 40TE case dimensions 604 Figure 294: RP1 physical connection 620 Figure 295: Remote communication using K-bus 621 Figure 296: InterMicom loopback testing 624 Figure 297: Simulated input behaviour 631 Figure 298: Test example 1 632 Figure 299: Test example 2 633 Figure 300: Test example 3 634 Figure 301: State impedances 646 Figure 302: Possible terminal block types 668 Figure 303: Front panel assembly 670
xxx P446SV-TM-EN-1
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CHAPTER 1

INTRODUCTION

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Chapter 1 - Introduction P446SV
2 P446SV-TM-EN-1
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P446SV Chapter 1 - Introduction

1 CHAPTER OVERVIEW

This chapter provides some general information about the technical manual and an introduction to the device(s) described in this technical manual.
This chapter contains the following sections: Chapter Overview 3 Foreword 4 Product Scope 6 Features and Functions 8 Logic Diagrams 11 Functional Overview 13
P446SV-TM-EN-1 3
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Chapter 1 - Introduction P446SV

2 FOREWORD

This technical manual provides a functional and technical description of General Electric's P446SV, as well as a comprehensive set of instructions for using the device. The level at which this manual is written assumes that you are already familiar with protection engineering and have experience in this discipline. The description of principles and theory is limited to that which is necessary to understand the product. For further details on general protection engineering theory, we refer you to Alstom's publication NPAG, which is available online or from our contact centre.
We have attempted to make this manual as accurate, comprehensive and user-friendly as possible. However we cannot guarantee that it is free from errors. Nor can we state that it cannot be improved. We would therefore be very pleased to hear from you if you discover any errors, or have any suggestions for improvement. Our policy is to provide the information necessary to help you safely specify, engineer, install, commission, maintain, and eventually dispose of this product. We consider that this manual provides the necessary information, but if you consider that more details are needed, please contact us.
All feedback should be sent to our contact centre via the following URL:
www.gegridsolutions.com/contact
2.1
This manual is aimed towards all professionals charged with installing, commissioning, maintaining, troubleshooting, or operating any of the products within the specified product range. This includes installation and commissioning personnel as well as engineers who will be responsible for operating the product.
The level at which this manual is written assumes that installation and commissioning engineers have knowledge of handling electronic equipment. Also, system and protection engineers have a thorough knowledge of protection systems and associated equipment.
2.2
The following typographical conventions are used throughout this manual.
The names for special keys appear in capital letters.
When describing software applications, menu items, buttons, labels etc as they appear on the screen are
Filenames and paths use the courier font
Special terminology is written with leading capitals
If reference is made to the IED's internal settings and signals database, the menu group heading (column)
If reference is made to the IED's internal settings and signals database, the setting cells and DDB signals are
If reference is made to the IED's internal settings and signals database, the value of a cell's content is

TARGET AUDIENCE

TYPOGRAPHICAL CONVENTIONS

For example: ENTER
written in bold type. For example: Select Save from the file menu.
For example: Example\File.text
For example: Sensitive Earth Fault
text is written in upper case italics For example: The SYSTEM DATA column
written in bold italics For example: The Language cell in the SYSTEM DATA column
written in the Courier font For example: The Language cell in the SYSTEM DATA column contains the value English
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P446SV Chapter 1 - Introduction

2.3 NOMENCLATURE

Due to the technical nature of this manual, many special terms, abbreviations and acronyms are used throughout the manual. Some of these terms are well-known industry-specific terms while others may be special product­specific terms used by General Electric. The first instance of any acronym or term used in a particular chapter is explained. In addition, a separate glossary is available on the General Electric website, or from the General Electric contact centre.
We would like to highlight the following changes of nomenclature however:
The word 'relay' is no longer used to describe the device itself. Instead, the device is referred to as the 'IED'
(Intelligent Electronic Device), the 'device', or the 'product'. The word 'relay' is used purely to describe the electromechanical components within the device, i.e. the output relays.
British English is used throughout this manual.
The British term 'Earth' is used in favour of the American term 'Ground'.
2.4
The device has undergone a range of extensive testing and certification processes to ensure and prove compatibility with all target markets. A detailed description of these criteria can be found in the Technical Specifications chapter.

COMPLIANCE

P446SV-TM-EN-1 5
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Chapter 1 - Introduction P446SV

3 PRODUCT SCOPE

Unlike a conventional IED, a device with an IEC61850-9-2 interface, or Sampled Value (SV) device accepts current and voltage measurement inputs, which have already been digitized in accordance with the IEC 61850-9-2LE standard.
The P446SV is such a device. It accepts sampled analogue values from merging units. It does not accept analogue values directly and therefore does not have any current or voltage transformers. This provides a number of advantages over conventional devices, which are discussed throughout this technical manual.
The P446SV has been designed for distance protection of overhead line and underground cable applications, where the network is solidly grounded. It is used for dual circuit breaker applications, such as breaker-and-a-half, or ring bus topologies, where two circuit breakers feed each line. As well as distance protection, this device can also be used for 4-shot phase-segregated Autoreclose protection and a range of standard current, voltage, power and frequency backup protection applications.
3.1
This product belongs to the P40L family. Although this technical manual is specific to this product, it is useful to know where the product fits into the family and to describe the evolution path of the entire product family. The following diagram attempts to do this:

PRODUCT VERSIONS

6 P446SV-TM-EN-1
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V00062
XCPU3 Cyber-security New Protection
functions
P445: P41
P54x No Distance: M61
P841A: M61
All other products: M71
New Protection
functions
P445: P45
P54x No Distance: M65
P841A: M65
All other products: M75
Current Differential
Starters for P54x
Other improvements
P445: P46
P54x No Distance: M66
P841A: M66
All other products: M76
P446, P546, P841B: M74
Sub-cy cle differential for
non-dis tance versions
P543, P545: M63
Non-distance
IEC 61850 Edition 2 IEEE 1588 support
P543, P545: M83
Non-distance
IEC 61850 Edition 2 IEEE 1588 support 40TE case
P446, P546, P841B: P80
XCPU3 Cyber-security NCIT (9-2LE interface)
NCIT (now obsolete)
Non-distance products: M81
Distance products: M82
IEC 61850 Edition 2 IEEE 1588 support
P445: J37
P54x No Distance: K47
P841A: K47
All other products: K57
P446, P546, P841B: M72
Conventional Stream NCIT Stream
Sub-cycle Diff Stream
P54A, P54B: P01
P54C, P54E: M01
Non-distance
Multi-end Sub-cy cle
Multi-end subcycle stream
P446SV Chapter 1 - Introduction
Figure 1: P40L family - version evolution
3.2
All current models and variants for this product are defined in an interactive spreadsheet called the CORTEC. This is available on the company website.
Alternatively, you can obtain it via the Contact Centre at the following URL:
www.gegridsolutions.com/contact
A copy of the CORTEC is also supplied as a static table in the Appendices of this document. However, it should only be used for guidance as it provides a snapshot of the interactive data taken at the time of publication.
P446SV-TM-EN-1 7

ORDERING OPTIONS

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Chapter 1 - Introduction P446SV

4 FEATURES AND FUNCTIONS

4.1 DISTANCE PROTECTION FUNCTIONS

Feature IEC 61850 ANSI
Distance zones, full-scheme protection (5) DisPDIS 21/21N Phase characteristic (Mho and quadrilateral) Ground characteristic (Mho and quadrilateral) CVT transient overreach elimination Load blinder Easy setting mode Communication-aided schemes, PUTT, POTT, Blocking, Weak
Infeed Accelerated tripping – loss of load and Z1 extension Switch on to fault and trip on reclose – elements for fast fault
clearance on breaker closure Power swing blocking PsbRPSB 68 Directional earth fault (DEF) unit protection 67N Out of step OstRPSB 78 Delta directional comparison - fast channel schemes operating
on fault generated superimposed quantities Mutual compensation (for fault locator and distance zones)
DisPSCH 85
SofPSOF/ TorPSOF 50SOTF/27SOTF
78DCB/78DCUB
InterMiCOM64 teleprotection for direct device-to-device communication (optional)

4.2 PROTECTION FUNCTIONS

Feature IEC 61850 ANSI
Tripping Mode (1 & 3 pole) PTRC ABC and ACB phase rotation Phase overcurrent , with optional directionality (4 stages) OcpPTOC/RDIR 50/51/67 Earth/Ground overcurrent stages, with optional directionality (4
stages) Sensitive earth fault (SEF) (4 stages) SenPTOC/RDIR 50N/51N/67N High impedance restricted earth fault (REF) SenRefPDIF 64 Negative sequence overcurrent stages, with optional
directionality (4 stages) Broken conductor, used to detect open circuit faults 46 Thermal overload protection ThmPTTR 49 Undervoltage protection (2 stages) VtpPhsPTUV 27 Overvoltage protection (2 stages) VtpPhsPTOV 59 Remote overvoltage protection (2 stages) VtpCmpPTOV 59R Residual voltage protection (2 stages) VtpResPTOV 59N Underfrequency protection (4 stages) FrqPTUF 81 Overfrequency protection (2 stages) FrqPTOF 81
EfdPTOC/RDIR 50N/51N/ 67N
NgcPTOC/RDIR 67/46
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P446SV Chapter 1 - Introduction
Feature IEC 61850 ANSI
Rate of change of frequency protection (4 stages) DfpPFRC 81 High speed breaker fail suitable for re-tripping and back-
tripping (2 stages) Current Transformer supervision 46 Voltage transformer supervision 47/27 Auto-reclose (4 shots) RREC 79 Check synchronisation (2 stages) RSYN 25
RBRF 50BF

4.3 CONTROL FUNCTIONS

Feature IEC 61850 ANSI
Watchdog contacts Read-only mode Function keys FnkGGIO Programmable LEDs LedGGIO Programmable hotkeys Programmable allocation of digital inputs and outputs Fully customizable menu texts Circuit breaker control, status & condition monitoring XCBR 52 CT supervision VT supervision Trip circuit and coil supervision Control inputs PloGGIO1 Power-up diagnostics and continuous self-monitoring Dual rated 1A and 5A CT inputs Alternative setting groups (4) Graphical programmable scheme logic (PSL) Fault locator RFLO

4.4 MEASUREMENT FUNCTIONS

Measurement Function IEC 61850 ANSI
Measurement of all instantaneous & integrated values (Exact range of measurements depend on the device model)
Disturbance recorder for waveform capture – specified in samples per cycle RDRE DFR Fault Records Maintenance Records Event Records / Event logging Event records Time Stamping of Opto-inputs Yes Yes
MET

4.5 COMMUNICATION FUNCTIONS

Feature ANSI
NERC compliant cyber-security
P446SV-TM-EN-1 9
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Chapter 1 - Introduction P446SV
Feature ANSI
Front RS232 serial communication port for configuration 16S Rear serial RS485 communication port for SCADA control 16S 2 Additional rear serial communication ports for SCADA control and
teleprotection (fibre and copper) (optional) Ethernet communication (optional) 16E Redundant Ethernet communication (optional) 16E Courier Protocol 16S IEC 61850 edition 2 16E IEC 60870-5-103 (optional) 16S DNP3.0 over serial link (optional) 16S DNP3.0 over Ethernet (optional) 16E SNMP 16E IRIG-B time synchronisation (optional) CLK IEEE 1588 PTP (Edition 2 devices only)
16S
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P446SV Chapter 1 - Introduction

5 LOGIC DIAGRAMS

This technical manual contains many logic diagrams, which should help to explain the functionality of the device. Although this manual has been designed to be as specific as possible to the chosen product, it may contain diagrams, which have elements applicable to other products. If this is the case, a qualifying note will accompany the relevant part.
The logic diagrams follow a convention for the elements used, using defined colours and shapes. A key to this convention is provided below. We recommend viewing the logic diagrams in colour rather than in black and white. The electronic version of the technical manual is in colour, but the printed version may not be. If you need coloured diagrams, they can be provided on request by calling the contact centre and quoting the diagram number.
P446SV-TM-EN-1 11
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V00063
Key:
DDB Signal
Internal function
&AND gate
OR gate 1
Setting cell
Setting value Timer
SR Latch Reset Dominant
Internal Signal
0Logic 0
Comparator for detecting overvalues
Energising Quantity
Hardcoded setting
R
D
Q
S
Comparator for detecting undervalues
Switch
Measurement Cell
Derived setting
SR Latch
HMI key
Pulse / Latch
Connection / Node Inverted logic input
Soft switch
Latched on positive edge
XMultiplier
2
1
NOT gate
XOR
XOR gate
R
Q
S
Internal Calculation
Switch
Bandpass filter
Chapter 1 - Introduction P446SV
Figure 2: Key to logic diagrams
12 P446SV-TM-EN-1
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V00010
X
X
X
I
E sen
67
50/27
46BC STCN76
27/ 59
VTS50BF
79-250BF-2 2 5- 2
79
25
Fault record s
Disturban ce
Record
Measurement s
PSL
Local
Communication
2ndRemote
comm. port
Remote
LINE
LINE
BUS
BUS
comm. port
P443,P445 & P446
Inte r MiCOM
LEDs
Conventiona l signalling
Always
available
P443 & P446
only
P446
only
Optiona l
Protection communication
V
ref
V
ref
V
I
Self monitoring
85
FL
50N /
51N
I /V
67/
46
67N
SEF
68 78
59N
Neu tral current (if present) from para llel line
I
M
49
SOTF/TOR
64
REF
21G21P
50/51
IEC
618 50
I
P446SV Chapter 1 - Introduction

6 FUNCTIONAL OVERVIEW

This diagram is applicable to three products in the P40L family; P443, P445 and P446. Use the key on the diagram to determine the features relevant to the product described in this technical manual.
Figure 3: Functional Overview
P446SV-TM-EN-1 13
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Chapter 1 - Introduction P446SV
14 P446SV-TM-EN-1
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CHAPTER 2

SAFETY INFORMATION

Page 48
Chapter 2 - Safety Information P446SV
16 P446SV-TM-EN-1
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P446SV Chapter 2 - Safety Information

1 CHAPTER OVERVIEW

This chapter provides information about the safe handling of the equipment. The equipment must be properly installed and handled in order to maintain it in a safe condition and to keep personnel safe at all times. You must be familiar with information contained in this chapter before unpacking, installing, commissioning, or servicing the equipment.
This chapter contains the following sections: Chapter Overview 17 Health and Safety 18 Symbols 19 Installation, Commissioning and Servicing 20 Decommissioning and Disposal 25 Regulatory Compliance 26
P446SV-TM-EN-1 17
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Chapter 2 - Safety Information P446SV

2 HEALTH AND SAFETY

Personnel associated with the equipment must be familiar with the contents of this Safety Information. When electrical equipment is in operation, dangerous voltages are present in certain parts of the equipment.
Improper use of the equipment and failure to observe warning notices will endanger personnel. Only qualified personnel may work on or operate the equipment. Qualified personnel are individuals who are:
familiar with the installation, commissioning, and operation of the equipment and the system to which it is
being connected.
familiar with accepted safety engineering practises and are authorised to energise and de-energise
equipment in the correct manner.
trained in the care and use of safety apparatus in accordance with safety engineering practises
trained in emergency procedures (first aid).
The documentation provides instructions for installing, commissioning and operating the equipment. It cannot, however cover all conceivable circumstances. In the event of questions or problems, do not take any action without proper authorisation. Please contact your local sales office and request the necessary information.
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P446SV Chapter 2 - Safety Information

3 SYMBOLS

Throughout this manual you will come across the following symbols. You will also see these symbols on parts of the equipment.
Caution: Refer to equipment documentation. Failure to do so could result in damage to the equipment
Warning: Risk of electric shock
Earth terminal. Note: This symbol may also be used for a protective conductor (earth) terminal if that terminal is part of a terminal block or sub-assembly.
Protective conductor (earth) terminal
Instructions on disposal requirements
Note: The term 'Earth' used in this manual is the direct equivalent of the North American term 'Ground'.
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Chapter 2 - Safety Information P446SV

4 INSTALLATION, COMMISSIONING AND SERVICING

4.1 LIFTING HAZARDS

Many injuries are caused by:
Lifting heavy objects
Lifting things incorrectly
Pushing or pulling heavy objects
Using the same muscles repetitively
Plan carefully, identify any possible hazards and determine how best to move the product. Look at other ways of moving the load to avoid manual handling. Use the correct lifting techniques and Personal Protective Equipment (PPE) to reduce the risk of injury.
4.2

ELECTRICAL HAZARDS

Caution: All personnel involved in installing, commissioning, or servicing this equipment must be familiar with the correct working procedures.
Caution: Consult the equipment documentation before installing, commissioning, or servicing the equipment.
Caution: Always use the equipment as specified. Failure to do so will jeopardise the protection provided by the equipment.
Warning: Removal of equipment panels or covers may expose hazardous live parts. Do not touch until the electrical power is removed. Take care when there is unlocked access to the rear of the equipment.
Warning: Isolate the equipment before working on the terminal strips.
Warning: Use a suitable protective barrier for areas with restricted space, where there is a risk of electric shock due to exposed terminals.
Caution: Disconnect power before disassembling. Disassembly of the equipment may expose sensitive electronic circuitry. Take suitable precautions against electrostatic voltage discharge (ESD) to avoid damage to the equipment.
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P446SV Chapter 2 - Safety Information
Caution: NEVER look into optical fibres or optical output connections. Always use optical power meters to determine operation or signal level.
Warning: Testing may leave capacitors charged to dangerous voltage levels. Discharge capacitors by rediucing test voltages to zero before disconnecting test leads.
Caution: Operate the equipment within the specified electrical and environmental limits.
Caution: Before cleaning the equipment, ensure that no connections are energised. Use a lint free cloth dampened with clean water.
Note: Contact fingers of test plugs are normally protected by petroleum jelly, which should not be removed.
4.3
The information in this section is applicable only to equipment carrying UL/CSA/CUL markings.

UL/CSA/CUL REQUIREMENTS

Caution: Equipment intended for rack or panel mounting is for use on a flat surface of a Type 1 enclosure, as defined by Underwriters Laboratories (UL).
Caution: To maintain compliance with UL and CSA/CUL, install the equipment using UL/CSA­recognised parts for: cables, protective fuses, fuse holders and circuit breakers, insulation crimp terminals, and replacement internal batteries.

4.4 FUSING REQUIREMENTS

Caution: Where UL/CSA listing of the equipment is required for external fuse protection, a UL or CSA Listed fuse must be used for the auxiliary supply. The listed protective fuse type is: Class J time delay fuse, with a maximum current rating of 15 A and a minimum DC rating of 250 V dc (for example type AJT15).
Caution: Where UL/CSA listing of the equipment is not required, a high rupture capacity (HRC) fuse type with a maximum current rating of 16 Amps and a minimum dc rating of 250 V dc may be used for the auxiliary supply (for example Red Spot type NIT or TIA). For P50 models, use a 1A maximum T-type fuse. For P60 models, use a 4A maximum T-type fuse.
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Chapter 2 - Safety Information P446SV
Caution: Digital input circuits should be protected by a high rupture capacity NIT or TIA fuse with maximum rating of 16 A. for safety reasons, current transformer circuits must never be fused. Other circuits should be appropriately fused to protect the wire used.
Caution: CTs must NOT be fused since open circuiting them may produce lethal hazardous voltages

4.5 EQUIPMENT CONNECTIONS

Warning: Terminals exposed during installation, commissioning and maintenance may present a hazardous voltage unless the equipment is electrically isolated.
Caution: Tighten M4 clamping screws of heavy duty terminal block connectors to a nominal torque of 1.3 Nm. Tighten captive screws of terminal blocks to 0.5 Nm minimum and 0.6 Nm maximum.
Caution: Always use insulated crimp terminations for voltage and current connections.
Caution: Always use the correct crimp terminal and tool according to the wire size.
Caution: Watchdog (self-monitoring) contacts are provided to indicate the health of the device on some products. We strongly recommend that you hard wire these contacts into the substation's automation system, for alarm purposes.

4.6 PROTECTION CLASS 1 EQUIPMENT REQUIREMENTS

Caution: Earth the equipment with the supplied PCT (Protective Conductor Terminal).
Caution: Do not remove the PCT.
Caution: The PCT is sometimes used to terminate cable screens. Always check the PCT’s integrity after adding or removing such earth connections.
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P446SV Chapter 2 - Safety Information
Caution: Use a locknut or similar mechanism to ensure the integrity of stud-connected PCTs.
Caution: The recommended minimum PCT wire size is 2.5 mm² for countries whose mains supply is 230 V (e.g. Europe) and 3.3 mm² for countries whose mains supply is 110 V (e.g. North America). This may be superseded by local or country wiring regulations. For P60 products, the recommended minimum PCT wire size is 6 mm². See product documentation for details.
Caution: The PCT connection must have low-inductance and be as short as possible.
Caution: All connections to the equipment must have a defined potential. Connections that are pre-wired, but not used, should be earthed, or connected to a common grouped potential.

4.7 PRE-ENERGISATION CHECKLIST

Caution: Check voltage rating/polarity (rating label/equipment documentation).
Caution: Check CT circuit rating (rating label) and integrity of connections.
Caution: Check protective fuse or miniature circuit breaker (MCB) rating.
Caution: Check integrity of the PCT connection.
Caution: Check voltage and current rating of external wiring, ensuring it is appropriate for the application.

4.8 PERIPHERAL CIRCUITRY

Warning: Do not open the secondary circuit of a live CT since the high voltage produced may be lethal to personnel and could damage insulation. Short the secondary of the line CT before opening any connections to it.
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Chapter 2 - Safety Information P446SV
Note: For most Alstom equipment with ring-terminal connections, the threaded terminal block for current transformer termination is automatically shorted if the module is removed. Therefore external shorting of the CTs may not be required. Check the equipment documentation and wiring diagrams first to see if this applies.
Caution: Where external components such as resistors or voltage dependent resistors (VDRs) are used, these may present a risk of electric shock or burns if touched.
Warning: Take extreme care when using external test blocks and test plugs such as the MMLG, MMLB and P990, as hazardous voltages may be exposed. Ensure that CT shorting links are in place before removing test plugs, to avoid potentially lethal voltages.

4.9 UPGRADING/SERVICING

Warning: Do not insert or withdraw modules, PCBs or expansion boards from the equipment while energised, as this may result in damage to the equipment. Hazardous live voltages would also be exposed, endangering personnel.
Caution: Internal modules and assemblies can be heavy and may have sharp edges. Take care when inserting or removing modules into or out of the IED.
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P446SV Chapter 2 - Safety Information

5 DECOMMISSIONING AND DISPOSAL

Caution: Before decommissioning, completely isolate the equipment power supplies (both poles of any dc supply). The auxiliary supply input may have capacitors in parallel, which may still be charged. To avoid electric shock, discharge the capacitors using the external terminals before decommissioning.
Caution: Avoid incineration or disposal to water courses. Dispose of the equipment in a safe, responsible and environmentally friendly manner, and if applicable, in accordance with country-specific regulations.
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Chapter 2 - Safety Information P446SV

6 REGULATORY COMPLIANCE

Compliance with the European Commission Directive on EMC and LVD is demonstrated using a technical file.

6.1 EMC COMPLIANCE: 2014/30/EU

The product specific Declaration of Conformity (DoC) lists the relevant harmonised standard(s) or conformit assessment used to demonstrate compliance with the EMC directive.
6.2
The product specific Declaration of Conformity (DoC) lists the relevant harmonized standard(s) or conformity assessment used to demonstrate compliance with the LVD directive.
Safety related information, such as the installation I overvoltage category, pollution degree and operating temperature ranges are specified in the Technical Data section of the relevant product documentation and/or on the product labelling .
Unless otherwise stated in the Technical Data section of the relevant product documentation, the equipment is intended for indoor use only. Where the equipment is required for use in an outdoor location, it must be mounted in a specific cabinet or housing to provide the equipment with the appropriate level of protection from the expected outdoor environment.
6.3
Radio and Telecommunications Terminal Equipment (R&TTE) directive 2014/53/EU. Conformity is demonstrated by compliance to both the EMC directive and the Low Voltage directive, to zero volts.
6.4
If marked with this logo, the product is compliant with the requirements of the Canadian and USA Underwriters Laboratories.
The relevant UL file number and ID is shown on the equipment.

LVD COMPLIANCE: 2014/35/EU

R&TTE COMPLIANCE: 2014/53/EU

UL/CUL COMPLIANCE

6.5
Products marked with the 'explosion protection' Ex symbol (shown in the example, below) are compliant with the ATEX directive. The product specific Declaration of Conformity (DoC) lists the Notified Body, Type Examination Certificate, and relevant harmonized standard or conformity assessment used to demonstrate compliance with the ATEX directive.
The ATEX Equipment Protection level, Equipment group, and Zone definition will be marked on the product. For example:
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ATEX COMPLIANCE: 2014/34/EU

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Where:
'II' Equipment Group: Industrial.
'(2)G' High protection equipment category, for control of equipment in gas atmospheres in Zone 1 and 2.
This equipment (with parentheses marking around the zone number) is not itself suitable for operation within a potentially explosive atmosphere.
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CHAPTER 3

HARDWARE DESIGN

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1 CHAPTER OVERVIEW

This chapter provides information about the product's hardware design. This chapter contains the following sections: Chapter Overview 31 Hardware Architecture 32 Mechanical Implementation 33 Front Panel 35 Rear Panel 38 Boards and Modules 39
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Communications
Sample Value Inputs
I/O
I
n
t
e
r
c
o
n
n
e
c
t
i
o
n
Output relay boards
Opto-input boards
IEC 61850-9-2LE
input board
RS485 modules
Ethernet modules
Keypad
LCD
LEDs
Front port
Watchdog module
PSU module
Watchdog
contacts
+ LED
Auxiliary
Supply
IRIG-B module
P
r
o
c
e
s
s
o
r
m
o
d
u
l
e
F
r
o
n
t
p
a
n
e
l
H
M
I
Output relay contacts
Digital inputs
Sampled Values
RS485 communication
Time synchronisation
Ethernet communication
V00280
Note: Not all modules are applicable to all products
Memory
Flash memory for settings
Battery-backed SRAM
for records
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2 HARDWARE ARCHITECTURE

The main components comprising an General Electric Sampled Values device are as follows:
The housing, consisting of a front panel and connections at the rear
The Main processor module consisting of the main CPU (Central Processing Unit), memory and an interface
to the front panel HMI (Human Machine Interface)
A selection of plug-in boards and modules with presentation at the rear for the sampled values inputs,
power supply, communication functions, digital I/O and time synchronisation connectivity
All boards and modules are connected by a parallel data and address bus, which allows the processor module to send and receive information to and from the other modules as required. There is also a separate serial data bus for conveying sampled data from the input module to the CPU. These parallel and serial databuses are shown as a single interconnection module in the following figure, which shows typical modules and the flow of data between them.
Figure 4: Hardware architecture
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3 MECHANICAL IMPLEMENTATION

All products based on the Px4x platform have common hardware architecture. The hardware is modular and consists of the following main parts:
Case and terminal blocks
Boards and modules
Front panel
The case comprises the housing metalwork and terminal blocks at the rear. The boards fasten into the terminal blocks and are connected together by a ribbon cable. This ribbon cable connects to the processor in the front panel.
The following diagram shows an exploded view of a typical product. The diagram shown does not necessarily represent exactly the product model described in this manual.
Figure 5: Exploded view of IED
3.1
The Px4x range of products are implemented in a range of case sizes. Case dimensions for industrial products usually follow modular measurement units based on rack sizes. These are: U for height and TE for width, where:
1U = 1.75 inches = 44.45 mm
1TE = 0.2 inches = 5.08 mm
The products are available in panel-mount or standalone versions. All products are nominally 4U high. This equates to 177.8 mm or 7 inches.
The cases are pre-finished steel with a conductive covering of aluminium and zinc. This provides good grounding at all joints, providing a low resistance path to earth that is essential for performance in the presence of external noise.
The case width depends on the product type and its hardware options. There are three different case widths for the described range of products: 40TE, 60TE and 80TE. The case dimensions and compatibility criteria are as follows:
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Case width (TE) Case width (mm) Case width (inches)
40TE 203.2 8 60TE 304.8 12 80TE 406.4 16
Note: Not all case sizes are available for all models.

3.2 LIST OF BOARDS

The product's hardware consists of several modules drawn from a standard range. The exact specification and number of hardware modules depends on the model number and variant. Depending on the exact model, the product in question will use a selection of the following boards.
Board Use
Main Processor board - 40TE or smaller Main Processor board – without support for function keys Power supply board - 24/54V DC Power supply input. Accepts DC voltage between 24V and 54V Power supply board - 48/125V DC Power supply input. Accepts DC voltage between 48V and 125V Power supply board - 110/250V DC Power supply input. Accepts DC voltage between 110V and 125V IEC 61850 9-2LE board Ethernet board for accepting IEC 61850 sampled values IRIG-B board - modulated input Interface board for modulated IRIG-B timing signal IRIG-B board - demodulated input Interface board for demodulated IRIG-B timing signal Fibre board Interface board for fibre-based RS485 connection Fibre board + IRIG-B Interface board for fibre-based RS485 connection + demodulated IRIG-B 2nd rear communications board Interface board for RS232 / RS485 connections 2nd rear communications board with IRIG-B input Interface board for RS232 / RS485 + IRIG-B connections 100MhZ Ethernet board Standard 100MHz Ethernet board for LAN connection (fibre + copper) 100MhZ Ethernet board with modulated IRIG-B Standard 100MHz Ethernet board (fibre / copper) + modulated IRIG-B 100MhZ Ethernet board with demodulated IRIG-B Standard 100MHz Ethernet board (fibre / copper)+ demodulated IRIG-B High-break output relay board Output relay board with high breaking capacity relays Redundant Ethernet SHP+ modulated IRIG-B Redundant SHP Ethernet board (2 fibre ports) + modulated IRIG-B input Redundant Ethernet SHP + demodulated IRIG-B Redundant SHP Ethernet board (2 fibre ports) + demodulated IRIG-B input Redundant Ethernet RSTP + modulated IRIG-B Redundant RSTP Ethernet board (2 fibre ports) + modulated IRIG-B input Redundant Ethernet RSTP+ demodulated IRIG-B Redundant RSTP Ethernet board (2 fibre ports) + demodulated IRIG-B input Redundant Ethernet DHP+ modulated IRIG-B Redundant DHP Ethernet board (2 fibre ports) + modulated IRIG-B input Redundant Ethernet DHP+ demodulated IRIG-B Redundant DHP Ethernet board (2 fibre ports) + demodulated IRIG-B input Redundant Ethernet PRP+ modulated IRIG-B Redundant PRP Ethernet board (2 fibre ports) + modulated IRIG-B input Redundant Ethernet PRP+ demodulated IRIG-B Redundant PRP Ethernet board (2 fibre ports) + demodulated IRIG-B input Redundant Ethernet HSR + modulated IRIG-B Redundant HSR Ethernet board (2 fibre ports) + demodulated IRIG-B input Redundant Ethernet HSR+ demodulated IRIG-B Redundant HSR Ethernet board (2 fibre ports) + demodulated IRIG-B input Output relay output board Standard output relay board
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4 FRONT PANEL

4.1 40TE FRONT PANEL

The following diagram shows a 40TE case. The hinged covers at the top and bottom of the front panel are shown closed. An optional transparent front cover physically protects the front panel.
Figure 6: Front panel (40TE)
The front panel consists of:
Top and bottom compartments with hinged cover
LCD display
Keypad
Fixed function LEDs
9 pin D-type serial port (behind hinged cover)
25 pin D-type download port (behind hinged cover)
4.1.1
The top compartment contains labels for the:
Serial number
Current and voltage ratings.
FRONT PANEL COMPARTMENTS
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The bottom compartment contains:
A compartment for a 1/2 AA size backup battery (used to back up the real time clock and event, fault, and
disturbance records).
A 9-pin female D-type front port for an EIA(RS)232 serial connection to a PC.
A 25-pin female D-type parallel port for monitoring internal signals and downloading software and
language text.
4.1.2 KEYPAD
The keypad consists of the following keys:
4 arrow keys to navigate the menus (organised around the Enter key)
An enter key for executing the chosen option
A clear key for clearing the last command
A read key for viewing larger blocks of text (arrow keys now used for scrolling)
2 hot keys for scrolling through the default display and for control of setting groups. These are situated directly below the LCD display.
4.1.2.1 LIQUID CRYSTAL DISPLAY
The LCD is a high resolution monochrome display with 16 characters by 3 lines and controllable back light.
4.1.3
FRONT SERIAL PORT (SK1)
The front serial port is a 9-pin female D-type connector, providing RS232 serial data communication. It is situated under the bottom hinged cover, and is used to communicate with a locally connected PC. It is used to transfer settings data between the PC and the IED.
The port is intended for temporary connection during testing, installation and commissioning. It is not intended to be used for permanent SCADA communications. This port supports the Courier communication protocol only. Courier is a proprietary communication protocol to allow communication with a range of protection equipment, and between the device and the Windows-based support software package.
This port can be considered as a DCE (Data Communication Equipment) port, so you can connect this port device to a PC with an EIA(RS)232 serial cable up to 15 m in length.
The inactivity timer for the front port is set to 15 minutes. This controls how long the unit maintains its level of password access on the front port. If no messages are received on the front port for 15 minutes, any password access level that has been enabled is cancelled.
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Note: The front serial port does not support automatic extraction of event and disturbance records, although this data can be accessed manually.
4.1.3.1 FRONT SERIAL PORT (SK1) CONNECTIONS
The port pin-out follows the standard for Data Communication Equipment (DCE) device with the following pin connections on a 9-pin connector.
Pin number Description
2 Tx Transmit data 3 Rx Receive data 5 0 V Zero volts common
You must use the correct serial cable, or the communication will not work. A straight-through serial cable is required, connecting pin 2 to pin 2, pin 3 to pin 3, and pin 5 to pin 5.
Once the physical connection from the unit to the PC is made, the PC’s communication settings must be set to match those of the IED. The following table shows the unit’s communication settings for the front port.
Protocol Courier
Baud rate 19,200 bps Courier address 1 Message format 11 bit - 1 start bit, 8 data bits, 1 parity bit (even parity), 1 stop bit
4.1.4 FRONT PARALLEL PORT (SK2)
The front parallel port uses a 25 pin D-type connector. It is used for commissioning, downloading firmware updates and menu text editing.
4.1.5
Four fixed-function LEDs on the left-hand side of the front panel indicate the following conditions.
Trip (Red) switches ON when the IED issues a trip signal. It is reset when the associated fault record is
Alarm (Yellow) flashes when the IED registers an alarm. This may be triggered by a fault, event or
Out of service (Yellow) is ON when the IED's functions are unavailable.
Healthy (Green) is ON when the IED is in correct working order, and should be ON at all times. It goes OFF if
FIXED FUNCTION LEDS
cleared from the front display. Also the trip LED can be configured as self-resetting.
maintenance record. The LED flashes until the alarms have been accepted (read), then changes to constantly ON. When the alarms are cleared, the LED switches OFF.
the unit’s self-tests show there is an error in the hardware or software. The state of the healthy LED is reflected by the watchdog contacts at the back of the unit.
4.1.6
PROGRAMABLE LEDS
The device has a number of programmable LEDs, which can be associated with PSL-generated signals. The programmable LEDs for most models are tri-colour and can be set to RED, YELLOW or GREEN. However the programmable LEDs for some models are single-colour (red) only. The single-colour LEDs can be recognised by virtue of the fact they are large and slightly oval, whereas the tri-colour LEDs are small and round.
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5 REAR PANEL

The MiCOM P40Agile Modular series uses a modular construction. Most of the internal workings are on boards and modules which fit into slots. Some of the boards plug into terminal blocks, which are bolted onto the rear of the unit. However, some boards such as the communications boards have their own connectors. The rear panel consists of these terminal blocks plus the rears of the communications boards.
The back panel cut-outs and slot allocations vary. This depends on the product, the type of boards and the terminal blocks needed to populate the case. The following diagram shows the rear view of a 40TE. The IEC 61850-9-2LE interface is highlighted in grey.
Figure 7: Rear view of populated case
Note: This diagram is a typical example and may not show the exact same arrangement of boards as your particular model. Refer to the Cortec for product details.
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6 BOARDS AND MODULES

Each product comprises a selection of PCBs (Printed Circuit Boards) and subassemblies, depending on the chosen configuration.

6.1 PCBS

A PCB typically consists of the components, a front connector for connecting into the main system parallel bus via a ribbon cable, and an interface to the rear. This rear interface may be:
Directly presented to the outside world (as is the case for communication boards such as Ethernet Boards)
Presented to a connector, which in turn connects into a terminal block bolted onto the rear of the case (as is
the case for most of the other board types)
Figure 8: Rear connection to terminal block
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6.2 MAIN PROCESSOR BOARD

Figure 9: Main processor board
The main processor board performs all calculations and controls the operation of all other modules in the IED, including the data communication and user interfaces. This is the only board that does not fit into one of the slots. It resides in the front panel and connects to the rest of the system using an internal ribbon cable.
The LCD and LEDs are mounted on the processor board along with the front panel communication ports. The memory on the main processor board is split into two categories: volatile and non-volatile. The volatile
memory is fast access SRAM, used by the processor to run the software and store data during calculations. The non-volatile memory is sub-divided into two groups:
Flash memory to store software code, text and configuration data including the present setting values.
Battery-backed SRAM to store disturbance, event, fault and maintenance record data.
There are two board types available depending on the size of the case:
For models in 40TE cases
For models in 60TE cases and larger
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6.3 POWER SUPPLY BOARD

Figure 10: Power supply board
The power supply board provides power to the unit. One of three different configurations of the power supply board can be fitted to the unit. This is specified at the time of order and depends on the magnitude of the supply voltage that will be connected to it.
There are three board types, which support the following voltage ranges:
24/54 V DC
48/125 V DC or 40-100V AC
110/250 V DC or 100-240V AC
The power supply board connector plugs into a medium duty terminal block. This terminal block is always positioned on the right hand side of the unit looking from the rear.
The power supply board is usually assembled together with a relay output board to form a complete subassembly, as shown in the following diagram.
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Figure 11: Power supply assembly
The power supply outputs are used to provide isolated power supply rails to the various modules within the unit. Three voltage levels are used by the unit’s modules:
5.1 V for all of the digital circuits
+/- 16 V for the analogue electronics such as on the input board
22 V for driving the output relay coils.
All power supply voltages, including the 0 V earth line, are distributed around the unit by the 64-way ribbon cable. The power supply board incorporates inrush current limiting. This limits the peak inrush current to approximately
10 A. Power is applied to pins 1 and 2 of the terminal block, where pin 1 is negative and pin 2 is positive. The pin
numbers are clearly marked on the terminal block as shown in the following diagram.
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Figure 12: Power supply terminals
6.3.1
The Watchdog contacts are also hosted on the power supply board. The Watchdog facility provides two output relay contacts, one normally open and one normally closed. These are used to indicate the health of the device and are driven by the main processor board, which continually monitors the hardware and software when the device is in service.
WATCHDOG
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Figure 13: Watchdog contact terminals
6.3.2
The rear serial port (RP1) is housed on the power supply board. This is a three-terminal EIA(RS)485 serial communications port and is intended for use with a permanently wired connection to a remote control centre for SCADA communication. The interface supports half-duplex communication and provides optical isolation for the serial data being transmitted and received.
The physical connectivity is achieved using three screw terminals; two for the signal connection, and the third for the earth shield of the cable. These are located on pins 16, 17 and 18 of the power supply terminal block, which is on the far right looking from the rear. The interface can be selected between RS485 and K-bus. When the K-Bus option is selected, the two signal connections are not polarity conscious.
The polarity independent K-bus can only be used for the Courier data protocol. The polarity conscious MODBUS, IEC 60870-5-103 and DNP3.0 protocols need RS485.
The following diagram shows the rear serial port. The pin assignments are as follows:
Pin 16: Earth shield
Pin 17: Negative signal
Pin 18: Positive signal
REAR SERIAL PORT
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RX
TX
LINK
ACTIVITY
Fibre optic Ethernet connections
RJ45 service port for commissioning and testing only
E00227
RJ45
1 2 3 4 5 6 7 8
TX+ TX­RX+
RX-
P446SV Chapter 3 - Hardware Design
Figure 14: Rear serial port terminals
An additional serial port with D-type presentation is available as an optional board, if required.
6.4
Figure 15: IEC 61850-9-2LE board

IEC61850-9-2LE ETHERNET BOARD

Optical Fibre Connectors
The board uses 1300 nm multi mode 100BaseFx with ST connectors.
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RJ45 Connector
This is a service port for commissioning and testing only. Do not use this for permanent connections.
LEDs
LED Function On Off Flashing
Green Link Link ok Link broken Yellow Activity Traffic
Note: The 9-2LE interface fibre port does not support auto negotiation. Ensure the Ethernet port of the device connected to the 9-2 LE interface fibre port is set to 100Mbps full duplex.
6.5

STANDARD OUTPUT RELAY BOARD

Figure 16: Standard output relay board - 8 contacts
This output relay board has 8 relays with 6 Normally Open contacts and 2 Changeover contacts. The output relay board is provided together with the power supply board as a complete assembly, or
independently for the purposes of relay output expansion. There are two cut-out locations in the board. These can be removed to allow power supply components to
protrude when coupling the output relay board to the power supply board. If the output relay board is to be used independently, these cut-out locations remain intact.
The terminal numbers are as follows:
Terminal Number
Terminal 1 Relay 1 NO Terminal 2 Relay 1 NO Terminal 3 Relay 2 NO
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Terminal Number Output Relay
Terminal 4 Relay 2 NO Terminal 5 Relay 3 NO Terminal 6 Relay 3 NO Terminal 7 Relay 4 NO Terminal 8 Relay 4 NO Terminal 9 Relay 5 NO Terminal 10 Relay 5 NO Terminal 11 Relay 6 NO Terminal 12 Relay 6 NO Terminal 13 Relay 7 changeover Terminal 14 Relay 7 changeover Terminal 15 Relay 7 common Terminal 16 Relay 8 changeover Terminal 17 Relay 8 changeover Terminal 18 Relay 8 common

6.6 IRIG-B BOARD

Figure 17: IRIG-B board
The IRIG-B board can be fitted to provide an accurate timing reference for the device. The IRIG-B signal is connected to the board via a BNC connector. The timing information is used to synchronise the IED's internal real­time clock to an accuracy of 1 ms. The internal clock is then used for time tagging events, fault, maintenance and disturbance records.
IRIG-B interface is available in modulated or demodulated formats.
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The IRIG-B facility is provided in combination with other functionality on a number of additional boards, such as:
Fibre board with IRIG-B
Second rear communications board with IRIG-B
Ethernet board with IRIG-B
Redundant Ethernet board with IRIG-B
There are two types of each of these boards; one type which accepts a modulated IRIG-B input and one type which accepts a demodulated IRIG-B input.
6.7

FIBRE OPTIC BOARD

Figure 18: Fibre optic board
This board provides an interface for communicating with a master station. This communication link can use all compatible protocols (Courier, IEC 60870-5-103, MODBUS and DNP 3.0). It is a fibre-optic alternative to the metallic RS485 port presented on the power supply terminal block. The metallic and fibre optic ports are mutually exclusive.
The fibre optic port uses BFOC 2.5 ST connectors. The board comes in two varieties; one with an IRIG-B input and one without:
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6.8 REAR COMMUNICATION BOARD

Figure 19: Rear communication board
The optional communications board containing the secondary communication ports provide two serial interfaces presented on 9 pin D-type connectors. These interfaces are known as SK4 and SK5. Both connectors are female connectors, but are configured as DTE ports. This means pin 2 is used to transmit information and pin 3 to receive.
SK4 can be used with RS232, RS485 and K-bus. SK5 can only be used with RS232 and is used for electrical teleprotection. The optional rear communications board and IRIG-B board are mutually exclusive since they use the same hardware slot. However, the board comes in two varieties; one with an IRIG-B input and one without.
6.9

ETHERNET BOARD

Figure 20: Ethernet board
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This is a communications board that provides a standard 100-Base Ethernet interface. This board supports one electrical copper connection and one fibre-pair connection.
There are several variants for this board as follows:
100 Mbps Ethernet board
100 Mbps Ethernet with on-board modulated IRIG-B input
100 Mbps Ethernet with on-board unmodulated IRIG-B input
Two of the variants provide an IRIG-B interface. IRIG-B provides a timing reference for the unit – one board for modulated IRIG-B and one for demodulated. The IRIG B signal is connected to the board with a BNC connector.
The Ethernet and other connection details are described below:
IRIG-B Connector
Centre connection: Signal
Outer connection: Earth
LEDs
LED Function On Off Flashing
Green Link Link ok Link broken Yellow Activity Traffic
Optical Fibre Connectors
Connector Function
Rx Receive Tx Transmit
RJ45connector
Pin Signal name Signal definition
1 TXP Transmit (positive) 2 TXN Transmit (negative) 3 RXP Receive (positive) 4 - Not used 5 - Not used 6 RXN Receive (negative) 7 - Not used 8 - Not used
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IRIG-B
Pin3
Link Fail
connector
Pin 2
Pin 1
Link channel
A (green LED)
Activity channel
A (yellow LED)
Link channel B
(green LED)
Activity channel B
(yellow LED)
A
B
C
D
V01009
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6.10 REDUNDANT ETHERNET BOARD

Figure 21: Redundant Ethernet board
This board provides dual redundant Ethernet (supported by two fibre pairs) together with an IRIG-B interface for timing.
Different board variants are available, depending on the redundancy protocol and the type of IRIG-B signal (unmodulated or modulated). The available redundancy protocols are:
SHP (Self healing Protocol)
RSTP (Rapid Spanning Tree Protocol)
DHP (Dual Homing Protocol)
PRP (Parallel Redundancy Protocol)
There are several variants for this board as follows:
100 Mbps redundant Ethernet running RSTP, with on-board modulated IRIG-B
100 Mbps redundant Ethernet running RSTP, with on-board unmodulated IRIG-B
100 Mbps redundant Ethernet running SHP, with on-board modulated IRIG-B
100 Mbps redundant Ethernet running SHP, with on-board unmodulated IRIG-B
100 Mbps redundant Ethernet running DHP, with on-board modulated IRIG-B
100 Mbps redundant Ethernet running DHP, with on-board unmodulated IRIG-B
100 Mbps redundant Ethernet running PRP, with on-board modulated IRIG-B
100 Mbps redundant Ethernet running PRP, with on-board demodulated IRIG-B
The Ethernet and other connection details are described below:
IRIG-B Connector
Centre connection: Signal
Outer connection: Earth
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Link Fail Connector (Ethernet Board Watchdog Relay)
Pin Closed Open
1-2 Link fail Channel 1 (A) Link ok Channel 1 (A) 2-3 Link fail Channel 2 (B) Link ok Channel 2 (B)
LEDs
LED Function On Off Flashing
Green Link Link ok Link broken Yellow Activity SHP running PRP, RSTP or DHP traffic
Optical Fibre Connectors (ST)
Connector DHP RSTP SHP PRP
A RXA RX1 RS RXA B TXA TX1 ES TXA C RXB RX2 RP RXB D TXB TX2 EP TXB
RJ45connector
Pin Signal name Signal definition
1 TXP Transmit (positive) 2 TXN Transmit (negative) 3 RXP Receive (positive) 4 - Not used 5 - Not used 6 RXN Receive (negative) 7 - Not used 8 - Not used
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6.11 COPROCESSOR BOARD

Figure 22: Fully populated Coprocessor board
Note: The above figure shows a coprocessor complete with GPS input and 2 fibre-optic serial data interfaces, and is not necessarily representative of the product and model described in this manual. These interfaces will not be present on boards that do not require them.
Where applicable, a second processor board is used to process the special algorithms associated with the device. This second processor board provides fast access (zero wait state) SRAM for use with both program and data memory storage. This memory can be accessed by the main processor board via the parallel bus. This is how the software is transferred from the flash memory on the main processor board to the coprocessor board on power up. Further communication between the two processor boards is achieved via interrupts and the shared SRAM. The serial bus carrying the sample data is also connected to the co-processor board, using the processor’s built-in serial port, as on the main processor board.
There are several different variants of this board, which can be chosen depending on the exact device and model. The variants are:
Coprocessor board with current differential inputs and GPS input
Coprocessor board with current differential inputs only
Coprocessor board with GPS input only
6.11.1
COPROCESSOR BOARD WITH 1PPS INPUT
In some applications, where the communication links between two remote devices are provided by a third party telecommunications partner, the transmit and receive paths associated with one channel may differ considerably in length, resulting in very different transmission and receive times.
If, for example, Device A is transmitting to Device B information about the value of its measured current, the information Device A is receiving from Device B about the current measured at the same time, may reach device B at a different time. This has to be compensated for. A 1pps GPS timing signal applied to both devices will help the IEDs achieve this, because it is possible to measure the exact time taken for both transmission and receive paths.
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Note: The 1 pps signal is always supplied by a GPS receiver (such as a P594).
Note: This signal is used to control the sampling process, and timing calculations and is not used for time stamping or real time synchronisation.
6.12

HIGH BREAK OUTPUT RELAY BOARD

Figure 23: High Break relay output board
A High Break output relay board is available as an option. It comprises four normally open output contacts, which are suitable for high breaking loads.
A High Break contact consists of a high capacity relay with a MOSFET in parallel with it. The MOSFET has a varistor placed across it to provide protection, which is required when switching off inductive loads. This is because the stored energy in the inductor causes a high reverse voltage that could damage the MOSFET, if not protected.
When there is a control input command to operate an output contact the miniature relay is operated at the same time as the MOSFET. The miniature relay contact closes in nominally 3.5 ms and is used to carry the continuous load current. The MOSFET operates in less than 0.2 ms, but is switched off after 7.5 ms.
When the control input is reset, the MOSFET is again turned on for 7.5 mS. The miniature relay resets in nominally
3.5 ms before the MOSFET. This means the MOSFET is used to break the load. The MOSFET absorbs the energy when breaking inductive loads and so limits the resulting voltage surge. This contact arrangement is for switching DC circuits only.
The board number is:
ZN0042 001
High Break Contact Operation
The following figure shows the timing diagram for High Break contact operation.
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V00246
3.5ms + contact bounce
Load current
Relay contact
Databus control input
MOSFET reset
MOSFET operate
on
7ms
on
3.5ms
Closed
on
7ms
off
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Figure 24: High Break contact operation
High Break Contact Applications
Efficient scheme engineering
Accessibility of CB auxiliary contacts
Breaker fail
Initiation of teleprotection
In traditional hard wired scheme designs, High Break capability could only be achieved using external electromechanical trip relays. Instead, these internal High Break contacts can be used thus reducing space requirements.
It is common practise to use circuit breaker 52a (CB Closed) auxiliary contacts to break the trip coil current on breaker opening, thereby easing the duty on the protection contacts. In some cases (such as operation of disconnectors, or retrofitting), it may be that 52a contacts are either unavailable or unreliable. In such cases, High Break contacts can be used to break the trip coil current in these applications.
In the event of failure of the local circuit breaker (stuck breaker), or defective auxiliary contacts (stuck contacts), it is incorrect to use 52a contact action. The interrupting duty at the local breaker then falls on the relay output contacts, which may not be rated to perform this duty. High Break contacts should be used in this case to avoid the risk of burning out relay contacts.
The High Break contacts also offer fast making, which results in faster tripping. In addition, fast keying of teleprotection is a benefit. Fast keying bypasses the usual contact operation time, such that permissive, blocking and intertrip commands can be routed faster.
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Warning: These relay contacts are POLARITY SENSITIVE. External wiring must comply with the polarity requirements described in the external connection diagram to ensure correct operation.
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CHAPTER 4

SOFTWARE DESIGN

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1 CHAPTER OVERVIEW

This chapter describes the software design of the IED. This chapter contains the following sections: Chapter Overview 59 Sofware Design Overview 60 System Level Software 61 Platform Software 64 Protection and Control Functions 65
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Protection and Control Software Layer
Fault locator
task
Disturbance
recorder task
Sampling function
Control of output contacts and programmable LEDs
Sample data + digital logic inputs
System Level Software Layer
System services (e.g. device drivers) / Real time operating system / Self-diagnostic software
Control of interfaces to keypad , LCD, LEDs, front & rear ports. Self-checking maintenance records
Hardware Device Layer
LEDs / LCD / Keypad / Memory / FPGA
Protection Task
Programmable & fixed
scheme logic
Signal processing
Coprocessor protection
algorithms
Supervisor task
Platform Software Layer
Event, fault,
disturbance,
maintenance record
logging
Remote
communications
interfaces
Front panel
interface
(LCD + Keypad)
Local
communications
interfaces
Settings database
Protection algorithms
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2 SOFWARE DESIGN OVERVIEW

The device software can be conceptually categorized into several elements as follows:
The system level software
The platform software
The protection and control software
These elements are not distinguishable to the user, and the distinction is made purely for the purposes of explanation. The following figure shows the software architecture.
Figure 25: Software Architecture
The software, which executes on the main processor, can be divided into a number of functions as illustrated above. Each function is further broken down into a number of separate tasks. These tasks are then run according to a scheduler. They are run at either a fixed rate or they are event driven. The tasks communicate with each other as and when required.
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3 SYSTEM LEVEL SOFTWARE

3.1 REAL TIME OPERATING SYSTEM

The real-time operating system is used to schedule the processing of the various tasks. This ensures that they are processed in the time available and in the desired order of priority. The operating system also plays a part in controlling the communication between the software tasks, through the use of operating system messages.
3.2
The system services software provides the layer between the hardware and the higher-level functionality of the platform software and the protection and control software. For example, the system services software provides drivers for items such as the LCD display, the keypad and the remote communication ports. It also controls things like the booting of the processor and the downloading of the processor code into RAM at startup.
3.3
The device includes several self-monitoring functions to check the operation of its hardware and software while in service. If there is a problem with the hardware or software, it should be able to detect and report the problem, and attempt to resolve the problem by performing a reboot. In this case, the device would be out of service for a short time, during which the ‘Healthy’ LED on the front of the device is switched OFF and the watchdog contact at the rear is ON. If the restart fails to resolve the problem, the unit takes itself permanently out of service; the ‘Healthy’ LED stays OFF and watchdog contact stays ON.
If a problem is detected by the self-monitoring functions, the device attempts to store a maintenance record to allow the nature of the problem to be communicated to the user.
The self-monitoring is implemented in two stages: firstly a thorough diagnostic check which is performed on boot­up, and secondly a continuous self-checking operation, which checks the operation of the critical functions whilst it is in service.
3.4
The self-testing takes a few seconds to complete, during which time the IED's measurement, recording, control, and protection functions are unavailable. On a successful start-up and self-test, the ‘health-state’ LED on the front of the unit is switched on. If a problem is detected during the start-up testing, the device remains out of service until it is manually restored to working order.

SYSTEM SERVICES SOFTWARE

SELF-DIAGNOSTIC SOFTWARE

STARTUP SELF-TESTING

The operations that are performed at start-up are:
1. System boot
2. System software initialisation
3. Platform software initialisation and monitoring
3.4.1
The integrity of the Flash memory is verified using a checksum before the program code and stored data is loaded into RAM for execution by the processor. When the loading has been completed, the data held in RAM is compared to that held in the Flash memory to ensure that no errors have occurred in the data transfer and that the two are the same. The entry point of the software code in RAM is then called. This is the IED's initialisation code.
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SYSTEM BOOT
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3.4.2 SYSTEM LEVEL SOFTWARE INITIALISATION
The initialization process initializes the processor registers and interrupts, starts the watchdog timers (used by the hardware to determine whether the software is still running), starts the real-time operating system and creates and starts the supervisor task. In the initialization process the device checks the following:
The status of the backup battery
The integrity of the battery-backed SRAM that is used to store event, fault and disturbance records
The operation of the LCD controller
The watchdog operation
At the conclusion of the initialization software the supervisor task begins the process of starting the platform software. Coprocessor board checks are also made as follows:
A check is made for the presence of the coprocessor board
The RAM on the coprocessor board is checked with a test bit pattern before the coprocessor board is
transferred from flash memory
If any of these checks produces an error, the coprocessor board is left out of service. The other protection functions provided by the main processor board are left in service.
3.4.3
When starting the platform software, the IED checks the following:
The integrity of the data held in non-volatile memory (using a checksum)
The operation of the real-time clock
The optional IRIG-B function (if applicable)
The presence and condition of the input board
The analog data acquisition system (it does this by sampling the reference voltage)
At the successful conclusion of all of these tests the unit is entered into service and the application software is started up.
3.5
When the IED is in service, it continually checks the operation of the critical parts of its hardware and software. The checking is carried out by the system services software and the results are reported to the platform software. The functions that are checked are as follows:
The Flash memory containing all program code and language text is verified by a checksum.
The code and constant data held in system memory is checked against the corresponding data in Flash
The system memory containing all data other than the code and constant data is verified with a checksum.
The integrity of the digital signal I/O data from the opto-inputs and the output relay coils is checked by the
The operation of the analog data acquisition system is continuously checked by the acquisition function
The operation of the optional Ethernet board is checked by the software on the main processor card. If the
The operation of the optional IRIG-B function is checked by the software that reads the time and date from
In the event that one of the checks detects an error in any of the subsystems, the platform software is notified and it attempts to log a maintenance record.
PLATFORM SOFTWARE INITIALISATION AND MONITORING

CONTINUOUS SELF-TESTING

memory to check for data corruption.
data acquisition function every time it is executed.
every time it is executed. This is done by sampling the reference voltages.
Ethernet board fails to respond an alarm is raised and the card is reset in an attempt to resolve the problem.
the board.
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If the problem is with the battery status or the IRIG-B board, the device continues in operation. For problems detected in any other area, the device initiates a shutdown and re-boot, resulting in a period of up to 10 seconds when the functionality is unavailable.
A restart should clear most problems that may occur. If, however, the diagnostic self-check detects the same problem that caused the IED to restart, it is clear that the restart has not cleared the problem, and the device takes itself permanently out of service. This is indicated by the ‘’health-state’ LED on the front of the device, which switches OFF, and the watchdog contact which switches ON.
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4 PLATFORM SOFTWARE

The platform software has three main functions:
To control the logging of records generated by the protection software, including alarms, events, faults, and
maintenance records
To store and maintain a database of all of the settings in non-volatile memory
To provide the internal interface between the settings database and the user interfaces, using the front
panel interface and the front and rear communication ports
4.1
The logging function is used to store all alarms, events, faults and maintenance records. The records are stored in non-volatile memory to provide a log of what has happened. The IED maintains four types of log on a first in first out basis (FIFO). These are:
Alarms
Event records
Fault records
Maintenance records
The logs are maintained such that the oldest record is overwritten with the newest record. The logging function can be initiated from the protection software. The platform software is responsible for logging a maintenance record in the event of an IED failure. This includes errors that have been detected by the platform software itself or errors that are detected by either the system services or the protection software function. See the Monitoring and Control chapter for further details on record logging.
4.2
The settings database contains all the settings and data, which are stored in non-volatile memory. The platform software manages the settings database and ensures that only one user interface can modify the settings at any one time. This is a necessary restriction to avoid conflict between different parts of the software during a setting change.
Changes to protection settings and disturbance recorder settings, are first written to a temporary location SRAM memory. This is sometimes called 'Scratchpad' memory. These settings are not written into non-volatile memory immediately. This is because a batch of such changes should not be activated one by one, but as part of a complete scheme. Once the complete scheme has been stored in SRAM, the batch of settings can be committed to the non-volatile memory where they will become active.

RECORD LOGGING

SETTINGS DATABASE

4.3
The settings and measurements database must be accessible from all of the interfaces to allow read and modify operations. The platform software presents the data in the appropriate format for each of the interfaces (LCD display, keypad and all the communications interfaces).
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INTERFACES

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5 PROTECTION AND CONTROL FUNCTIONS

The protection and control software processes all of the protection elements and measurement functions. To achieve this it has to communicate with the system services software, the platform software as well as organise its own operations.
The protection task software has the highest priority of any of the software tasks in the main processor board. This ensures the fastest possible protection response.
The protection and control software provides a supervisory task, which controls the start-up of the task and deals with the exchange of messages between the task and the platform software.
5.1
After initialization, the protection and control task waits until there are enough samples to process. The acquisition of samples on the main processor board is controlled by a ‘sampling function’ which is called by the system services software.
This sampling function takes samples from the input module and stores them in a two-cycle FIFO buffer. These samples are also stored concurrently by the coprocessor. The sample rate is 48 samples per cycle. This results in a nominal sample rate of 2,400 samples per second for a 50 hz system and 2,880 samples per second for a 60 Hz system. However the sample rate is not fixed. It tracks the power system frequency as described in the next section.
In normal operation, the protection task is executed 16 times per cycle.
5.2
The device provides a frequency tracking algorithm so that there are always 48 samples per cycle irrespective of frequency drift. The frequency range in which 48 samples per second are provided is between 45 Hz and 66 z. If the frequency falls outside this range, the sample rate reverts to its default rate of 2,400 Hz for 50 Hz or 2,880 Hz for 60 Hz.
The frequency tracking of the analog input signals is achieved by a recursive Fourier algorithm which is applied to one of the input signals. It works by detecting a change in the signal’s measured phase angle. The calculated value of the frequency is used to modify the sample rate being used by the input module, in order to achieve a constant sample rate per cycle of the power waveform. The value of the tracked frequency is also stored for use by the protection and control task.

ACQUISITION OF SAMPLES

FREQUENCY TRACKING

The frequency tracks off any voltage or current in the order VA, VB, VC, IA, IB, IC, down to 10%Vn for voltage and 5%In for current.
5.3
Most of the IED’s protection functionality uses the Fourier components calculated by the device’s signal processing software. However RMS measurements and some special protection algorithms available in some products use the sampled values directly.
The disturbance recorder also uses the samples from the input module, in an unprocessed form. This is for waveform recording and the calculation of true RMS values of current, voltage and power for metering purposes.
In the case of special protection algorithms, using the sampled values directly provides exceptionally fast response because you do not have to wait for the signal processing task to calculate the fundamental. You can act on the sampled values immediately.
5.4
The current and voltage inputs are filtered using Finite Impulse Response (FIR) digital filters. This reduces the effects of non-power frequency components in the input signals, such as DC offsets in current waveforms, and
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DIRECT USE OF SAMPLE VALUES

DISTANCE PROTECTION

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capacitor voltage transformer (CVT) transients in the voltages. The device uses a combination of a 1/4 cycle filter using 12 coefficients, a 1/2 cycle filter using 24 coefficients, and a single cycle filter using 48 coefficients. The device automatically performs intelligent switching in the application of the filters, to select the best balance of removal of transients with fast response. The protection elements themselves then perform additional filtering, implemented for example, by the trip count strategy.
The following figure shows the frequency response of the 12, 24 and 48 coefficient filters, noting that all have a gain of unity at the fundamental frequency:
Figure 26: Frequency response of FIR filters
5.5

FOURIER SIGNAL PROCESSING

All backup protection and measurement functions use single-cycle fourier digital filtering to extract the power frequency component. This filtering is performed on the main processor board.
When the protection and control task is re-started by the sampling function, it calculates the Fourier components for the analog signals. Although some protection algorithms use some Fourier-derived harmonics (e.g. second harmonic for magnetizing inrush), most protection functions are based on the Fourier-derived fundamental components of the measured analog signals. The Fourier components of the input current and voltage signals are stored in memory so that they can be accessed by all of the protection elements’ algorithms.
The Fourier components are calculated using single-cycle Fourier algorithm. This Fourier algorithm always uses the most recent 48 samples from the 2-cycle buffer.
Most protection algorithms use the fundamental component. In this case, the Fourier algorithm extracts the power frequency fundamental component from the signal to produce its magnitude and phase angle. This can be represented in either polar format or rectangular format, depending on the functions and algorithms using it.
The Fourier function acts as a filter, with zero gain at DC and unity gain at the fundamental, but with good harmonic rejection for all harmonic frequencies up to the nyquist frequency. Frequencies beyond this nyquist frequency are known as alias frequencies, which are introduced when the sampling frequency becomes less than twice the frequency component being sampled. However, the Alias frequencies are significantly attenuated by an anti-aliasing filter (low pass filter), which acts on the analog signals before they are sampled. The ideal cut-off point of an anti-aliasing low pass filter would be set at:
(samples per cycle) ´ (fundamental frequency)/2
At 48samples per cycle, this would be nominally 1200 Hz for a 50 Hz system, or 1440 Hz for a 60 Hz system. The following figure shows the nominal frequency response of the anti-alias filter and the Fourier filter for a 48-
sample single cycle fourier algorithm acting on the fundamental component:
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Figure 27: Frequency Response (indicative only)
5.6

PROGRAMMABLE SCHEME LOGIC

The purpose of the programmable scheme logic (PSL) is to allow you to configure your own protection schemes to suit your particular application. This is done with programmable logic gates and delay timers. To allow greater flexibility, different PSL is allowed for each of the four setting groups.
The input to the PSL is any combination of the status of the digital input signals from the opto-isolators on the input board, the outputs of the protection elements such as protection starts and trips, and the outputs of the fixed protection scheme logic (FSL). The fixed scheme logic provides the standard protection schemes. The PSL consists of software logic gates and timers. The logic gates can be programmed to perform a range of different logic functions and can accept any number of inputs. The timers are used either to create a programmable delay, and/or to condition the logic outputs, such as to create a pulse of fixed duration on the output regardless of the length of the pulse on the input. The outputs of the PSL are the LEDs on the front panel of the relay and the output contacts at the rear.
The execution of the PSL logic is event driven. The logic is processed whenever any of its inputs change, for example as a result of a change in one of the digital input signals or a trip output from a protection element. Also, only the part of the PSL logic that is affected by the particular input change that has occurred is processed. This reduces the amount of processing time that is used by the PSL. The protection & control software updates the logic delay timers and checks for a change in the PSL input signals every time it runs.
The PSL can be configured to create very complex schemes. Because of this PSL desing is achieved by means of a PC support package called the PSL Editor. This is available as part of the settings application software MiCOm S1 Agile, or as a standalone software module.
5.7

EVENT RECORDING

A change in any digital input signal or protection element output signal is used to indicate that an event has taken place. When this happens, the protection and control task sends a message to the supervisor task to indicate that an event is available to be processed and writes the event data to a fast buffer controlled by the supervisor task. When the supervisor task receives an event record, it instructs the platform software to create the appropriate log in non-volatile memory (battery backed-up SRAM). The operation of the record logging to battery backed-up SRAM is slower than the supervisor buffer. This means that the protection software is not delayed waiting for the records to be logged by the platform software. However, in the rare case when a large number of records to be logged are created in a short period of time, it is possible that some will be lost, if the supervisor buffer is full before the platform software is able to create a new log in battery backed-up SRAM. If this occurs then an event is logged to indicate this loss of information.
Maintenance records are created in a similar manner, with the supervisor task instructing the platform software to log a record when it receives a maintenance record message. However, it is possible that a maintenance record may be triggered by a fatal error in the relay in which case it may not be possible to successfully store a maintenance record, depending on the nature of the problem.
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For more information, see the Monitoring and Control chapter.

5.8 DISTURBANCE RECORDER

The disturbance recorder operates as a separate task from the protection and control task. It can record the waveforms for up to 12 calibrated analog channels and the values of up to 32 digital signals. The recording time is user selectable. Up to 50 seconds of data can be recorded. A minimum number of 5 records with a capacity of 10 seconds each, up to a maximum of 50 records with a capacity of 10 seconds each can be set. The disturbance recorder is supplied with data by the protection and control task once per cycle. The disturbance recorder collates the data that it receives into the required length disturbance record. The disturbance records can be extracted by settings application software such as MiCOM S1 Agile, which can also store the data in COMTRADE format, therefore allowing the use of other packages to view the recorded data.
For more information, see the Monitoring and Control chapter.
5.9
The fault locator uses 12 cycles of the analog input signals to calculate the fault location. The result is returned to the protection and control task, which includes it in the fault record. The pre-fault and post-fault voltages are also presented in the fault record. When the fault record is complete, including the fault location, the protection and control task sends a message to the supervisor task to log the fault record.
The Fault Locator is not available on all models.
5.10
The function keys interface directly into the PSL as digital input signals. A change of state is only recognized when a key press is executed on average for longer than 200 ms. The time to register a change of state depends on whether the function key press is executed at the start or the end of a protection task cycle, with the additional hardware and software scan time included. A function key press can provide a latched (toggled mode) or output on key press only (normal mode) depending on how it is programmed. It can be configured to individual protection scheme requirements. The latched state signal for each function key is written to non-volatile memory and read from non-volatile memory during relay power up thus allowing the function key state to be reinstated after power­up, should power be inadvertently lost.

FAULT LOCATOR

FUNCTION KEY INTERFACE

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