Figure 48:Impedance Reach line construction126
Figure 49:Reverse impedance reach line construction127
Figure 50:Resistive reach of phase elements128
Figure 51:Resistive Reach line construction128
Figure 52:Reverse resistive reach line construction129
Figure 53:Phase Fault Quadrilateral characteristic summary129
Figure 54:Impedance Reach line in Z1 plane132
Figure 55:Impedance Reach line in ZLP plane133
Figure 56:General characteristic in ZLP plane134
Figure 57:Phase relations between I2 and Iph for leading and lagging polarizing currents135
Figure 58:General characteristic in Z1 plane136
Figure 59:Simplified characteristic in Z1 plane137
Figure 60:Phase to phase current changes for C phase-to-ground (CN) fault141
Figure 61:Biased Neutral Current Detector Characteristic142
Figure 62:Load Blinder Characteristics145
Figure 63:Sequence networks connection for an internal A-N fault148
Figure 64:- DV Forward and Reverse tripping regions149
Figure 65:Settings required to apply a quadrilateral zone150
Figure 66:Settings required to apply a mho zone151
Figure 67:Over-tilting effect153
Figure 68:Example power system158
Figure 69:Apparent Impedances seen by Distance Protection on a Teed Feeder163
Figure 70:Scheme Assignment169
Figure 71:Aided Distance PUR scheme172
Figure 72:Aided Distance POR scheme174
Figure 73:Example of fault current reversal of direction176
Figure 74:Aided Distance Blocking scheme (BOP)178
Figure 75:Aided Distance Send logic180
Figure 76:Carrier Aided Schemes Receive logic180
Figure 77:Aided Distance Tripping logic181
xxivP446SV-TM-EN-1
Page 27
P446SVTable of Figures
Figure 78:PUR Aided Tripping logic181
Figure 79:POR Aided Tripping logic183
Figure 80:Aided Scheme Blocking 1 Tripping logic183
Figure 81:Aided Scheme Blocking 2 Tripping logic183
Figure 82:Virtual Current Polarization186
Figure 83:Directional criteria for residual voltage polarization187
Figure 84:Aided DEF POR scheme189
Figure 85:Aided DEF Blocking scheme190
Figure 86:DEF Directional Signals190
Figure 87:Aided DEF Send logic191
Figure 88:Carrier Aided Schemes Receive logic191
Figure 89:Aided DEF Tripping logic192
Figure 90:POR Aided Tripping logic194
Figure 91:Aided Scheme Blocking 1 Tripping logic194
Figure 92:Aided Scheme Blocking 2 Tripping logic194
Figure 93:Aided Delta POR scheme196
Figure 94:Aided Delta Blocking scheme197
Figure 95:Aided Delta Send logic198
Figure 96:Carrier Aided Schemes Receive logic198
Figure 97:Aided Delta Tripping logic199
Figure 98:POR Aided Tripping logic201
Figure 99:Aided Scheme Blocking 1 Tripping logic201
Figure 100:Aided Scheme Blocking 2 Tripping logic201
Figure 101:Apparent Impedances seen by Distance Protection on a Teed Feeder204
Figure 102:Problematic Fault Scenarios for PUR Scheme Application to Teed Feeders206
Figure 103:Any Distance Start214
Figure 104:Standard basic scheme mode logic214
Figure 105:Alternative basic timer start scheme mode logic215
Figure 106:Basic time stepped distance scheme216
Figure 107:Trip On Close logic217
Figure 108:Trip On Close based on CNV level detectors218
Figure 109:SOTF Tripping219
Figure 110:SOTF Tripping with CNV219
Figure 111:TOR Tripping logic for appropriate zones220
Figure 112:TOR Tripping logic with CNV220
Figure 113:Zone 1 extension scheme221
Figure 114:Zone 1 extension logic221
Figure 115:Loss of load accelerated trip scheme222
Figure 116:Loss of Load Logic223
Figure 117:Power transfer related to angular difference between two generation sources228
P446SV-TM-EN-1xxv
Page 28
Table of FiguresP446SV
Figure 118:Phase selector timing for power swing condition231
Figure 119:Phase selector timing for fault condition231
Figure 120:Phase selector timing for fault during a power swing232
Figure 121:Slow Power Swing detection characteristic233
Figure 122:Load Blinder Boundary Conditions236
Figure 123:Power swing blocking logic237
Figure 124:Setting the resistive reaches238
Figure 125:Reactive reach settings239
Figure 126:PSB timer setting guidelines240
Figure 127:Out of Step detection characteristic241
Figure 128:Out of Step logic diagram243
Figure 129:OST setting determination for the positive sequence resistive component OST R5244
Figure 130:OST R6max determination245
Figure 131:Example of timer reset due to MOVs operation248
Figure 132:Autoreclose sequence for a Transient Fault256
Figure 133:Autoreclose sequence for an evolving or permanent fault257
Figure 134:Autoreclose sequence for an evolving or permanent fault - single-phase operation257
Figure 135:Dual CB Autoreclose Sequence for a Transient Fault258
Figure 136:Autoreclose Sequence for an evolving/permanent fault on a dual CB application259
Figure 137:Autoreclose Sequence for a persistent fault on a multishot dual CB application set
259
for single-phase operation
Figure 138:Key to logic diagrams262
Figure 139:Autoreclose System Map - part 1263
Figure 140:Autoreclose System Map - part 2264
Figure 141:Autoreclose System Map - part 3265
Figure 142:Autoreclose System Map - part 4266
Figure 143:Autoreclose System Map - part 5267
Figure 144:Autoreclose System Map - part 6268
Figure 145:Autoreclose System Map - part 7269
Figure 146:Autoreclose System Map - part 8270
Figure 147:Autoreclose System Map - part 9271
Figure 148:Autoreclose System Map - part 10272
Figure 149:CB State logic diagram (Module 1)290
Figure 150:Circuit Breaker Open logic diagram (Module 3)291
Figure 151:CB In Service logic diagram (Module 4)292
Figure 152:Autoreclose Enable logic diagram (Module 5)292
Figure 153:Leader/Follower CB Selection Logic Diagram (Module 6)293
Figure 154:Leader/Follower logic diagram (Module 7 & 8)294
Figure 155:Autoreclose Modes Enable logic diagram (Module 9)296
Figure 156:Force three-phase trip logic diagram (Module 10)297
xxviP446SV-TM-EN-1
Page 29
P446SVTable of Figures
Figure 157:Autoreclose Initiation logic diagram (Module 11)299
Figure 158:Autoreclose Trip Test logic diagram (Module 12)299
Figure 159:Autoreclose initiation by internal single and three phase trip or external trip for CB1
300
(Module 13)
Figure 160:Autoreclose initiation by internal single and three phase trip or external trip for CB2
301
(Module 14)
Figure 161:Protection Reoperation and Evolving Fault logic diagram (Module 20)302
Figure 162:Fault Memory logic diagram (Module 15)302
Figure 163:Autoreclose In Progress logic diagram for CB1 (Module 16)303
Figure 164:Autoreclose In Progress logic diagram for CB2 (Module 17)304
Figure 165:Autoreclose Sequence Counter logic diagram (Module 18)305
Figure 166:Single-phase Autoreclose Cycle Selection logic diagram (Module 19)306
Figure 167:Three-phase Autoreclose Cycle Selection logic diagram (Module 21)307
Figure 168:Dead time Start Enable logic diagram (Module 22)308
Figure 169:Single-phase Leader Dead Time logic diagram (Module 24)309
Figure 170:Three-phase Leader CB Dead Time logic diagram (Module 25)310
Figure 171:Follower Enable logic diagram (Module 27)311
Figure 172:Single-phase Follower CB timing logic diagram (Module 28)312
Figure 173:Three-phase Follower CB timing logic diagram (Module 29)313
Figure 174:Circuit Breaker Autoclose Logic Diagram (Modules 32 & 33)314
Figure 175:Prepare Reclaim Initiation logic diagram (Module 34)315
Figure 176:Reclaim Time logic diagram (Module 35)316
Figure 177:Successful Autoreclose Signals logic diagram (Module 36)317
Figure 178:Autoreclose Reset Successful Indication logic diagram (Modules 37 & 38)318
Figure 179:Circuit Breaker Healthy and System Check Timers Healthy logic diagram (Module 39)319
Figure 180:Autoreclose Shot Counters logic diagram (Modules 41 & 42)321
Figure 181:CB1 Control Logic (Module 43)322
Figure 182:CB2 Control Logic (Module 44)323
Figure 183:Circuit Breaker Trip Time Monitoring logic diagram (Modules 53 & 54)324
Figure 184:CB1 Lockout Logic Diagram (Module 55)326
Figure 185:CB2 Lockout Logic Diagram (Module 56)327
Figure 186:Reset Circuit Breaker Lockout Logic Diagram (Modules 57 & 58)329
Figure 187:Pole Discrepancy Logic Diagram (Module 62)330
Figure 188:Circuit Breaker Trip Conversion Logic Diagram (Module 63)331
Figure 189:Voltage Monitor for CB Closure (Module 59)332
Figure 190:Check Synchronisation Monitor for CB1 closure (Module 60)333
Figure 191:Check Synchronisation Monitor for CB2 closure (Module 61)334
Figure 192:Three-phase AR System Check logic diagram for CB1 as leader (Module 45)336
Figure 193:Three-phase AR System Check logic diagram for CB2 as leader (Module 46)337
Figure 194:Three-phase AR System Check logic d for CB1 as follower (Module 47)338
Figure 195:Three-phase AR System Check logic diagram for CB2 as follower (Module 48)339
P446SV-TM-EN-1xxvii
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Table of FiguresP446SV
Figure 196:CB Manual Close System Check Logic Diagram (Modules 51 & 52)340
Figure 197:Circuit Breaker Fail logic - part 1351
Figure 198:Circuit Breaker Fail logic - part 2352
Figure 199:Circuit Breaker Fail logic - part 3353
Figure 200:Circuit Breaker Fail logic - part 4354
Figure 201:CB Fail timing356
Figure 202:Phase Overcurrent Protection logic diagram362
Figure 203:Negative Phase Sequence Overcurrent Protection logic diagram364
Figure 204:IDG Characteristic367
Figure 205:Earth Fault Protection logic diagram369
Figure 206:EPATR B characteristic shown for TMS = 1.0372
Figure 207:Sensitive Earth Fault Protection logic diagram372
Figure 208:Current distribution in an insulated system with C phase fault373
Figure 209:Phasor diagrams for insulated system with C phase fault374
Figure 210:Positioning of core balance current transformers375
Figure 211:High Impedance REF principle376
Figure 212:High Impedance REF Connection377
Figure 213:Thermal overload protection logic diagram379
Figure 214:Spreadsheet calculation for dual time constant thermal characteristic380
Figure 215:Dual time constant thermal characteristic380
Figure 216:Broken conductor logic382
Figure 217:Undervoltage - single and three phase tripping mode (single stage)389
Figure 218:Overvoltage - single and three phase tripping mode (single stage)392
Figure 219:Residual Overvoltage logic396
Figure 220:Residual voltage for a solidly earthed system397
Figure 221:Residual voltage for an impedance earthed system398
Figure 222:Underfrequency logic (single stage)403
Figure 223:Overfrequency logic (single stage)404
Figure 224:Rate of change of frequency logic (single stage)405
Figure 225:Fault recorder stop conditions412
Figure 226:Broken Current Accumulator logic diagram417
Figure 227:CB Trip Counter logic diagram418
Figure 228:Operating Time Accumulator419
Figure 229:Excessive Fault Frequency logic diagram420
Figure 230:Reset Lockout Alarm logic diagram421
Figure 231:CB1 Condition Monitoring logic diagram422
Figure 232:CB2 Condition Monitoring logic diagram423
Figure 233:Reset Circuit Breaker Lockout Logic Diagram (Modules 57 & 58)425
Figure 234:CB State logic diagram (Module 1)428
Figure 235:Hotkey menu navigation430
xxviiiP446SV-TM-EN-1
Page 31
P446SVTable of Figures
Figure 236:Default function key PSL431
Figure 237:Remote Control of Circuit Breaker432
Figure 238:CB1 Control Logic (Module 43)433
Figure 239:CB2 Control Logic (Module 44)434
Figure 240:Pole Dead logic435
Figure 241:Check Synchronisation vector diagram438
Figure 242:Voltage Monitor for CB Closure (Module 59)439
Figure 243:Check Synchronisation Monitor for CB1 closure (Module 60)440
Figure 244:Check Synchronisation Monitor for CB2 closure (Module 61)441
Figure 245:System Check PSL442
Figure 246:VTS logic450
Figure 247:Standard CTS453
Figure 248:TCS Scheme 1454
Figure 249:PSL for TCS Scheme 1455
Figure 250:TCS Scheme 2455
Figure 251:PSL for TCS Scheme 2456
Figure 252:TCS Scheme 3456
Figure 253:PSL for TCS Scheme 3457
Figure 254:Scheme Logic Interfaces463
Figure 255:Trip LED logic467
Figure 256:Fibre Teleprotection connections for a three-terminal Scheme479
Figure 257:Interfacing to PCM multiplexers483
Figure 258:IM64 channel fail and scheme fail logic485
Figure 259:IM64 general alarm signals logic485
Figure 260:IM64 communications mode and IEEE C37.94 alarm signals486
Figure 261:IM64 two-terminal scheme extended supervision488
Figure 262:IM64 three-terminal scheme extended supervision488
Figure 263:Example assignment of InterMiCOM signals within the PSL498
Figure 264:Direct connection499
Figure 265:Indirect connection using modems499
Figure 266:RS485 biasing circuit508
Figure 267:Remote communication using K-Bus509
Figure 268:IED attached to separate LANs512
Figure 269:HSR multicast topology513
Figure 270:HSR unicast topology514
Figure 271:HSR application in the substation515
Figure 272:IED attached to redundant Ethernet star or ring circuit515
Figure 273:IED, bay computer and Ethernet switch with self healing ring facilities516
Figure 274:Redundant Ethernet ring architecture with IED, bay computer and Ethernet switches516
P446SV-TM-EN-1xxix
Page 32
Table of FiguresP446SV
Figure 275:Redundant Ethernet ring architecture with IED, bay computer and Ethernet switches
517
after failure
Figure 276:Dual homing mechanism518
Figure 277:Application of Dual Homing Star at substation level519
Figure 278:IED and REB IP address configuration520
Figure 279:Connection using (a) an Ethernet switch and (b) a media converter523
Figure 280:Connection using (a) an Ethernet switch and (b) a media converter527
Figure 281:Control input behaviour550
Figure 282:Data model layers in IEC61850562
Figure 283:Edition 2 system - backward compatibility566
Figure 284:Edition 1 system - forward compatibility issues566
Figure 285:Example of Standby IED567
Figure 286:Standby IED Activation Process568
Figure 287:GPS Satellite timing signal571
Figure 288:Timing error using ring or line topology573
Figure 289:Default display navigation584
Figure 290:Location of battery isolation strip597
Figure 291:Rack mounting of products598
Figure 292:Terminal block types600
Figure 293:40TE case dimensions604
Figure 294:RP1 physical connection620
Figure 295:Remote communication using K-bus621
Figure 296:InterMicom loopback testing624
Figure 297:Simulated input behaviour631
Figure 298:Test example 1632
Figure 299:Test example 2633
Figure 300:Test example 3634
Figure 301:State impedances646
Figure 302:Possible terminal block types668
Figure 303:Front panel assembly670
xxxP446SV-TM-EN-1
Page 33
CHAPTER 1
INTRODUCTION
Page 34
Chapter 1 - IntroductionP446SV
2P446SV-TM-EN-1
Page 35
P446SVChapter 1 - Introduction
1CHAPTER OVERVIEW
This chapter provides some general information about the technical manual and an introduction to the device(s)
described in this technical manual.
This chapter contains the following sections:
Chapter Overview3
Foreword4
Product Scope6
Features and Functions8
Logic Diagrams11
Functional Overview13
P446SV-TM-EN-13
Page 36
Chapter 1 - IntroductionP446SV
2FOREWORD
This technical manual provides a functional and technical description of General Electric's P446SV, as well as a
comprehensive set of instructions for using the device. The level at which this manual is written assumes that you
are already familiar with protection engineering and have experience in this discipline. The description of principles
and theory is limited to that which is necessary to understand the product. For further details on general
protection engineering theory, we refer you to Alstom's publication NPAG, which is available online or from our
contact centre.
We have attempted to make this manual as accurate, comprehensive and user-friendly as possible. However we
cannot guarantee that it is free from errors. Nor can we state that it cannot be improved. We would therefore be
very pleased to hear from you if you discover any errors, or have any suggestions for improvement. Our policy is to
provide the information necessary to help you safely specify, engineer, install, commission, maintain, and
eventually dispose of this product. We consider that this manual provides the necessary information, but if you
consider that more details are needed, please contact us.
All feedback should be sent to our contact centre via the following URL:
www.gegridsolutions.com/contact
2.1
This manual is aimed towards all professionals charged with installing, commissioning, maintaining,
troubleshooting, or operating any of the products within the specified product range. This includes installation and
commissioning personnel as well as engineers who will be responsible for operating the product.
The level at which this manual is written assumes that installation and commissioning engineers have knowledge
of handling electronic equipment. Also, system and protection engineers have a thorough knowledge of protection
systems and associated equipment.
2.2
The following typographical conventions are used throughout this manual.
● The names for special keys appear in capital letters.
● When describing software applications, menu items, buttons, labels etc as they appear on the screen are
● Filenames and paths use the courier font
● Special terminology is written with leading capitals
● If reference is made to the IED's internal settings and signals database, the menu group heading (column)
● If reference is made to the IED's internal settings and signals database, the setting cells and DDB signals are
● If reference is made to the IED's internal settings and signals database, the value of a cell's content is
TARGET AUDIENCE
TYPOGRAPHICAL CONVENTIONS
For example: ENTER
written in bold type.
For example: Select Save from the file menu.
For example: Example\File.text
For example: Sensitive Earth Fault
text is written in upper case italics
For example: The SYSTEM DATA column
written in bold italics
For example: The Language cell in the SYSTEM DATA column
written in the Courier font
For example: The Language cell in the SYSTEM DATA column contains the value English
4P446SV-TM-EN-1
Page 37
P446SVChapter 1 - Introduction
2.3NOMENCLATURE
Due to the technical nature of this manual, many special terms, abbreviations and acronyms are used throughout
the manual. Some of these terms are well-known industry-specific terms while others may be special productspecific terms used by General Electric. The first instance of any acronym or term used in a particular chapter is
explained. In addition, a separate glossary is available on the General Electric website, or from the General Electric
contact centre.
We would like to highlight the following changes of nomenclature however:
● The word 'relay' is no longer used to describe the device itself. Instead, the device is referred to as the 'IED'
(Intelligent Electronic Device), the 'device', or the 'product'. The word 'relay' is used purely to describe the
electromechanical components within the device, i.e. the output relays.
● British English is used throughout this manual.
● The British term 'Earth' is used in favour of the American term 'Ground'.
2.4
The device has undergone a range of extensive testing and certification processes to ensure and prove
compatibility with all target markets. A detailed description of these criteria can be found in the Technical
Specifications chapter.
COMPLIANCE
P446SV-TM-EN-15
Page 38
Chapter 1 - IntroductionP446SV
3PRODUCT SCOPE
Unlike a conventional IED, a device with an IEC61850-9-2 interface, or Sampled Value (SV) device accepts current
and voltage measurement inputs, which have already been digitized in accordance with the IEC 61850-9-2LE
standard.
The P446SV is such a device. It accepts sampled analogue values from merging units. It does not accept analogue
values directly and therefore does not have any current or voltage transformers. This provides a number of
advantages over conventional devices, which are discussed throughout this technical manual.
The P446SV has been designed for distance protection of overhead line and underground cable applications,
where the network is solidly grounded. It is used for dual circuit breaker applications, such as breaker-and-a-half,
or ring bus topologies, where two circuit breakers feed each line. As well as distance protection, this device can
also be used for 4-shot phase-segregated Autoreclose protection and a range of standard current, voltage, power
and frequency backup protection applications.
3.1
This product belongs to the P40L family. Although this technical manual is specific to this product, it is useful to
know where the product fits into the family and to describe the evolution path of the entire product family. The
following diagram attempts to do this:
PRODUCT VERSIONS
6P446SV-TM-EN-1
Page 39
V00062
XCPU3
Cyber-security
New Protection
functions
P445: P41
P54x No Distance: M61
P841A: M61
All other products: M71
New Protection
functions
P445: P45
P54x No Distance: M65
P841A: M65
All other products: M75
Current Differential
Starters for P54x
Other improvements
P445: P46
P54x No Distance: M66
P841A: M66
All other products: M76
P446, P546, P841B: M74
Sub-cy cle differential for
non-dis tance versions
P543, P545: M63
Non-distance
IEC 61850 Edition 2
IEEE 1588 support
P543, P545: M83
Non-distance
IEC 61850 Edition 2
IEEE 1588 support
40TE case
P446, P546, P841B: P80
XCPU3
Cyber-security
NCIT (9-2LE interface)
NCIT (now obsolete)
Non-distance products: M81
Distance products: M82
IEC 61850 Edition 2
IEEE 1588 support
P445: J37
P54x No Distance: K47
P841A: K47
All other products: K57
P446, P546, P841B: M72
Conventional StreamNCIT Stream
Sub-cycle Diff Stream
P54A, P54B: P01
P54C, P54E: M01
Non-distance
Multi-end
Sub-cy cle
Multi-end subcycle stream
P446SVChapter 1 - Introduction
Figure 1: P40L family - version evolution
3.2
All current models and variants for this product are defined in an interactive spreadsheet called the CORTEC. This is
available on the company website.
Alternatively, you can obtain it via the Contact Centre at the following URL:
www.gegridsolutions.com/contact
A copy of the CORTEC is also supplied as a static table in the Appendices of this document. However, it should only
be used for guidance as it provides a snapshot of the interactive data taken at the time of publication.
Infeed
Accelerated tripping – loss of load and Z1 extension
Switch on to fault and trip on reclose – elements for fast fault
clearance on breaker closure
Power swing blockingPsbRPSB68
Directional earth fault (DEF) unit protection67N
Out of stepOstRPSB78
Delta directional comparison - fast channel schemes operating
on fault generated superimposed quantities
Mutual compensation (for fault locator and distance zones)
DisPSCH85
SofPSOF/ TorPSOF50SOTF/27SOTF
78DCB/78DCUB
InterMiCOM64 teleprotection for direct device-to-device
communication (optional)
4.2PROTECTION FUNCTIONS
FeatureIEC 61850ANSI
Tripping Mode (1 & 3 pole)PTRC
ABC and ACB phase rotation
Phase overcurrent , with optional directionality (4 stages)OcpPTOC/RDIR50/51/67
Earth/Ground overcurrent stages, with optional directionality (4
stages)
Sensitive earth fault (SEF) (4 stages)SenPTOC/RDIR50N/51N/67N
High impedance restricted earth fault (REF)SenRefPDIF64
Negative sequence overcurrent stages, with optional
directionality (4 stages)
Broken conductor, used to detect open circuit faults46
Thermal overload protectionThmPTTR49
Undervoltage protection (2 stages)VtpPhsPTUV27
Overvoltage protection (2 stages)VtpPhsPTOV59
Remote overvoltage protection (2 stages)VtpCmpPTOV59R
Residual voltage protection (2 stages)VtpResPTOV59N
Underfrequency protection (4 stages)FrqPTUF81
Overfrequency protection (2 stages)FrqPTOF81
EfdPTOC/RDIR50N/51N/ 67N
NgcPTOC/RDIR67/46
8P446SV-TM-EN-1
Page 41
P446SVChapter 1 - Introduction
FeatureIEC 61850ANSI
Rate of change of frequency protection (4 stages)DfpPFRC81
High speed breaker fail suitable for re-tripping and back-
tripping (2 stages)
Current Transformer supervision46
Voltage transformer supervision47/27
Auto-reclose (4 shots)RREC79
Check synchronisation (2 stages)RSYN25
RBRF50BF
4.3CONTROL FUNCTIONS
FeatureIEC 61850ANSI
Watchdog contacts
Read-only mode
Function keysFnkGGIO
Programmable LEDsLedGGIO
Programmable hotkeys
Programmable allocation of digital inputs and outputs
Fully customizable menu texts
Circuit breaker control, status & condition monitoringXCBR52
CT supervision
VT supervision
Trip circuit and coil supervision
Control inputsPloGGIO1
Power-up diagnostics and continuous self-monitoring
Dual rated 1A and 5A CT inputs
Alternative setting groups (4)
Graphical programmable scheme logic (PSL)
Fault locatorRFLO
4.4MEASUREMENT FUNCTIONS
Measurement FunctionIEC 61850ANSI
Measurement of all instantaneous & integrated values
(Exact range of measurements depend on the device model)
Disturbance recorder for waveform capture – specified in samples per cycle RDREDFR
Fault Records
Maintenance Records
Event Records / Event loggingEvent records
Time Stamping of Opto-inputsYesYes
MET
4.5COMMUNICATION FUNCTIONS
FeatureANSI
NERC compliant cyber-security
P446SV-TM-EN-19
Page 42
Chapter 1 - IntroductionP446SV
FeatureANSI
Front RS232 serial communication port for configuration16S
Rear serial RS485 communication port for SCADA control16S
2 Additional rear serial communication ports for SCADA control and
teleprotection (fibre and copper) (optional)
Ethernet communication (optional)16E
Redundant Ethernet communication (optional)16E
Courier Protocol16S
IEC 61850 edition 216E
IEC 60870-5-103 (optional)16S
DNP3.0 over serial link (optional)16S
DNP3.0 over Ethernet (optional)16E
SNMP16E
IRIG-B time synchronisation (optional)CLK
IEEE 1588 PTP (Edition 2 devices only)
16S
10P446SV-TM-EN-1
Page 43
P446SVChapter 1 - Introduction
5LOGIC DIAGRAMS
This technical manual contains many logic diagrams, which should help to explain the functionality of the device.
Although this manual has been designed to be as specific as possible to the chosen product, it may contain
diagrams, which have elements applicable to other products. If this is the case, a qualifying note will accompany
the relevant part.
The logic diagrams follow a convention for the elements used, using defined colours and shapes. A key to this
convention is provided below. We recommend viewing the logic diagrams in colour rather than in black and white.
The electronic version of the technical manual is in colour, but the printed version may not be. If you need coloured
diagrams, they can be provided on request by calling the contact centre and quoting the diagram number.
P446SV-TM-EN-111
Page 44
V00063
Key:
DDB Signal
Internal function
&AND gate
OR gate1
Setting cell
Setting valueTimer
SR Latch
Reset Dominant
Internal Signal
0Logic 0
Comparator for detecting
overvalues
Energising Quantity
Hardcoded setting
R
D
Q
S
Comparator for detecting
undervalues
Switch
Measurement Cell
Derived setting
SR Latch
HMI key
Pulse / Latch
Connection / NodeInverted logic input
Soft switch
Latched on positive edge
XMultiplier
2
1
NOT gate
XOR
XOR gate
R
Q
S
Internal Calculation
Switch
Bandpass filter
Chapter 1 - IntroductionP446SV
Figure 2: Key to logic diagrams
12P446SV-TM-EN-1
Page 45
V00010
X
X
X
I
E sen
67
50/27
46BCSTCN76
27/
59
VTS50BF
79-250BF-22 5- 2
79
25
Fault record s
Disturban ce
Record
Measurement s
PSL
Local
Communication
2ndRemote
comm. port
Remote
LINE
LINE
BUS
BUS
comm. port
P443,P445 & P446
Inte r MiCOM
LEDs
Conventiona l
signalling
Always
available
P443 & P446
only
P446
only
Optiona l
Protection
communication
V
ref
V
ref
V
I
Self monitoring
85
FL
50N /
51N
∆I /∆V
67/
46
67N
SEF
6878
59N
Neu tral current
(if present)
from para llel line
I
M
49
SOTF/TOR
64
REF
21G21P
50/51
IEC
618 50
I
P446SVChapter 1 - Introduction
6FUNCTIONAL OVERVIEW
This diagram is applicable to three products in the P40L family; P443, P445 and P446. Use the key on the diagram
to determine the features relevant to the product described in this technical manual.
Figure 3: Functional Overview
P446SV-TM-EN-113
Page 46
Chapter 1 - IntroductionP446SV
14P446SV-TM-EN-1
Page 47
CHAPTER 2
SAFETY INFORMATION
Page 48
Chapter 2 - Safety InformationP446SV
16P446SV-TM-EN-1
Page 49
P446SVChapter 2 - Safety Information
1CHAPTER OVERVIEW
This chapter provides information about the safe handling of the equipment. The equipment must be properly
installed and handled in order to maintain it in a safe condition and to keep personnel safe at all times. You must
be familiar with information contained in this chapter before unpacking, installing, commissioning, or servicing the
equipment.
This chapter contains the following sections:
Chapter Overview17
Health and Safety18
Symbols19
Installation, Commissioning and Servicing20
Decommissioning and Disposal25
Regulatory Compliance26
P446SV-TM-EN-117
Page 50
Chapter 2 - Safety InformationP446SV
2HEALTH AND SAFETY
Personnel associated with the equipment must be familiar with the contents of this Safety Information.
When electrical equipment is in operation, dangerous voltages are present in certain parts of the equipment.
Improper use of the equipment and failure to observe warning notices will endanger personnel.
Only qualified personnel may work on or operate the equipment. Qualified personnel are individuals who are:
● familiar with the installation, commissioning, and operation of the equipment and the system to which it is
being connected.
● familiar with accepted safety engineering practises and are authorised to energise and de-energise
equipment in the correct manner.
● trained in the care and use of safety apparatus in accordance with safety engineering practises
● trained in emergency procedures (first aid).
The documentation provides instructions for installing, commissioning and operating the equipment. It cannot,
however cover all conceivable circumstances. In the event of questions or problems, do not take any action
without proper authorisation. Please contact your local sales office and request the necessary information.
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3SYMBOLS
Throughout this manual you will come across the following symbols. You will also see these symbols on parts of
the equipment.
Caution:
Refer to equipment documentation. Failure to do so could result in damage to the
equipment
Warning:
Risk of electric shock
Earth terminal. Note: This symbol may also be used for a protective conductor (earth) terminal if that terminal
is part of a terminal block or sub-assembly.
Protective conductor (earth) terminal
Instructions on disposal requirements
Note:
The term 'Earth' used in this manual is the direct equivalent of the North American term 'Ground'.
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4INSTALLATION, COMMISSIONING AND SERVICING
4.1LIFTING HAZARDS
Many injuries are caused by:
● Lifting heavy objects
● Lifting things incorrectly
● Pushing or pulling heavy objects
● Using the same muscles repetitively
Plan carefully, identify any possible hazards and determine how best to move the product. Look at other ways of
moving the load to avoid manual handling. Use the correct lifting techniques and Personal Protective Equipment
(PPE) to reduce the risk of injury.
4.2
ELECTRICAL HAZARDS
Caution:
All personnel involved in installing, commissioning, or servicing this equipment must be
familiar with the correct working procedures.
Caution:
Consult the equipment documentation before installing, commissioning, or servicing
the equipment.
Caution:
Always use the equipment as specified. Failure to do so will jeopardise the protection
provided by the equipment.
Warning:
Removal of equipment panels or covers may expose hazardous live parts. Do not touch
until the electrical power is removed. Take care when there is unlocked access to the
rear of the equipment.
Warning:
Isolate the equipment before working on the terminal strips.
Warning:
Use a suitable protective barrier for areas with restricted space, where there is a risk of
electric shock due to exposed terminals.
Caution:
Disconnect power before disassembling. Disassembly of the equipment may expose
sensitive electronic circuitry. Take suitable precautions against electrostatic voltage
discharge (ESD) to avoid damage to the equipment.
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Caution:
NEVER look into optical fibres or optical output connections. Always use optical power
meters to determine operation or signal level.
Warning:
Testing may leave capacitors charged to dangerous voltage levels. Discharge
capacitors by rediucing test voltages to zero before disconnecting test leads.
Caution:
Operate the equipment within the specified electrical and environmental limits.
Caution:
Before cleaning the equipment, ensure that no connections are energised. Use a lint
free cloth dampened with clean water.
Note:
Contact fingers of test plugs are normally protected by petroleum jelly, which should not be removed.
4.3
The information in this section is applicable only to equipment carrying UL/CSA/CUL markings.
UL/CSA/CUL REQUIREMENTS
Caution:
Equipment intended for rack or panel mounting is for use on a flat surface of a Type 1
enclosure, as defined by Underwriters Laboratories (UL).
Caution:
To maintain compliance with UL and CSA/CUL, install the equipment using UL/CSArecognised parts for: cables, protective fuses, fuse holders and circuit breakers,
insulation crimp terminals, and replacement internal batteries.
4.4FUSING REQUIREMENTS
Caution:
Where UL/CSA listing of the equipment is required for external fuse protection, a UL or
CSA Listed fuse must be used for the auxiliary supply. The listed protective fuse type is:
Class J time delay fuse, with a maximum current rating of 15 A and a minimum DC
rating of 250 V dc (for example type AJT15).
Caution:
Where UL/CSA listing of the equipment is not required, a high rupture capacity (HRC)
fuse type with a maximum current rating of 16 Amps and a minimum dc rating of 250 V
dc may be used for the auxiliary supply (for example Red Spot type NIT or TIA).
For P50 models, use a 1A maximum T-type fuse.
For P60 models, use a 4A maximum T-type fuse.
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Caution:
Digital input circuits should be protected by a high rupture capacity NIT or TIA fuse with
maximum rating of 16 A. for safety reasons, current transformer circuits must never be
fused. Other circuits should be appropriately fused to protect the wire used.
Caution:
CTs must NOT be fused since open circuiting them may produce lethal hazardous
voltages
4.5EQUIPMENT CONNECTIONS
Warning:
Terminals exposed during installation, commissioning and maintenance may present a
hazardous voltage unless the equipment is electrically isolated.
Caution:
Tighten M4 clamping screws of heavy duty terminal block connectors to a nominal
torque of 1.3 Nm.
Tighten captive screws of terminal blocks to 0.5 Nm minimum and 0.6 Nm maximum.
Caution:
Always use insulated crimp terminations for voltage and current connections.
Caution:
Always use the correct crimp terminal and tool according to the wire size.
Caution:
Watchdog (self-monitoring) contacts are provided to indicate the health of the device
on some products. We strongly recommend that you hard wire these contacts into the
substation's automation system, for alarm purposes.
4.6PROTECTION CLASS 1 EQUIPMENT REQUIREMENTS
Caution:
Earth the equipment with the supplied PCT (Protective Conductor Terminal).
Caution:
Do not remove the PCT.
Caution:
The PCT is sometimes used to terminate cable screens. Always check the PCT’s integrity
after adding or removing such earth connections.
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Caution:
Use a locknut or similar mechanism to ensure the integrity of stud-connected PCTs.
Caution:
The recommended minimum PCT wire size is 2.5 mm² for countries whose mains supply
is 230 V (e.g. Europe) and 3.3 mm² for countries whose mains supply is 110 V (e.g. North
America). This may be superseded by local or country wiring regulations.
For P60 products, the recommended minimum PCT wire size is 6 mm². See product
documentation for details.
Caution:
The PCT connection must have low-inductance and be as short as possible.
Caution:
All connections to the equipment must have a defined potential. Connections that are
pre-wired, but not used, should be earthed, or connected to a common grouped
potential.
4.7PRE-ENERGISATION CHECKLIST
Caution:
Check voltage rating/polarity (rating label/equipment documentation).
Caution:
Check CT circuit rating (rating label) and integrity of connections.
Caution:
Check protective fuse or miniature circuit breaker (MCB) rating.
Caution:
Check integrity of the PCT connection.
Caution:
Check voltage and current rating of external wiring, ensuring it is appropriate for the
application.
4.8PERIPHERAL CIRCUITRY
Warning:
Do not open the secondary circuit of a live CT since the high voltage produced may be
lethal to personnel and could damage insulation. Short the secondary of the line CT
before opening any connections to it.
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Note:
For most Alstom equipment with ring-terminal connections, the threaded terminal block for current transformer termination
is automatically shorted if the module is removed. Therefore external shorting of the CTs may not be required. Check the
equipment documentation and wiring diagrams first to see if this applies.
Caution:
Where external components such as resistors or voltage dependent resistors (VDRs) are
used, these may present a risk of electric shock or burns if touched.
Warning:
Take extreme care when using external test blocks and test plugs such as the MMLG,
MMLB and P990, as hazardous voltages may be exposed. Ensure that CT shorting links
are in place before removing test plugs, to avoid potentially lethal voltages.
4.9UPGRADING/SERVICING
Warning:
Do not insert or withdraw modules, PCBs or expansion boards from the equipment
while energised, as this may result in damage to the equipment. Hazardous live
voltages would also be exposed, endangering personnel.
Caution:
Internal modules and assemblies can be heavy and may have sharp edges. Take care
when inserting or removing modules into or out of the IED.
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5DECOMMISSIONING AND DISPOSAL
Caution:
Before decommissioning, completely isolate the equipment power supplies (both poles
of any dc supply). The auxiliary supply input may have capacitors in parallel, which may
still be charged. To avoid electric shock, discharge the capacitors using the external
terminals before decommissioning.
Caution:
Avoid incineration or disposal to water courses. Dispose of the equipment in a safe,
responsible and environmentally friendly manner, and if applicable, in accordance with
country-specific regulations.
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6REGULATORY COMPLIANCE
Compliance with the European Commission Directive on EMC and LVD is demonstrated using a technical file.
6.1EMC COMPLIANCE: 2014/30/EU
The product specific Declaration of Conformity (DoC) lists the relevant harmonised standard(s) or conformit
assessment used to demonstrate compliance with the EMC directive.
6.2
The product specific Declaration of Conformity (DoC) lists the relevant harmonized standard(s) or conformity
assessment used to demonstrate compliance with the LVD directive.
Safety related information, such as the installation I overvoltage category, pollution degree and operating
temperature ranges are specified in the Technical Data section of the relevant product documentation and/or on
the product labelling .
Unless otherwise stated in the Technical Data section of the relevant product documentation, the equipment is
intended for indoor use only. Where the equipment is required for use in an outdoor location, it must be mounted
in a specific cabinet or housing to provide the equipment with the appropriate level of protection from the
expected outdoor environment.
6.3
Radio and Telecommunications Terminal Equipment (R&TTE) directive 2014/53/EU.
Conformity is demonstrated by compliance to both the EMC directive and the Low Voltage directive, to zero volts.
6.4
If marked with this logo, the product is compliant with the requirements of the Canadian and USA Underwriters
Laboratories.
The relevant UL file number and ID is shown on the equipment.
LVD COMPLIANCE: 2014/35/EU
R&TTE COMPLIANCE: 2014/53/EU
UL/CUL COMPLIANCE
6.5
Products marked with the 'explosion protection' Ex symbol (shown in the example, below) are compliant with the
ATEX directive. The product specific Declaration of Conformity (DoC) lists the Notified Body, Type Examination
Certificate, and relevant harmonized standard or conformity assessment used to demonstrate compliance with
the ATEX directive.
The ATEX Equipment Protection level, Equipment group, and Zone definition will be marked on the
product.
For example:
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Where:
'II'Equipment Group: Industrial.
'(2)G'High protection equipment category, for control of equipment in gas atmospheres in Zone 1 and 2.
This equipment (with parentheses marking around the zone number) is not itself suitable for operation
within a potentially explosive atmosphere.
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CHAPTER 3
HARDWARE DESIGN
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1CHAPTER OVERVIEW
This chapter provides information about the product's hardware design.
This chapter contains the following sections:
Chapter Overview31
Hardware Architecture32
Mechanical Implementation33
Front Panel35
Rear Panel38
Boards and Modules39
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Communications
Sample Value Inputs
I/O
I
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t
e
r
c
o
n
n
e
c
t
i
o
n
Output relay boards
Opto-input boards
IEC 61850-9-2LE
input board
RS485 modules
Ethernet modules
Keypad
LCD
LEDs
Front port
Watchdog module
PSU module
Watchdog
contacts
+ LED
Auxiliary
Supply
IRIG-B module
P
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s
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F
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Output relay contacts
Digital inputs
Sampled Values
RS485 communication
Time synchronisation
Ethernet communication
V00280
Note: Not all modules are applicable to all products
Memory
Flash memory for settings
Battery-backed SRAM
for records
Chapter 3 - Hardware DesignP446SV
2HARDWARE ARCHITECTURE
The main components comprising an General Electric Sampled Values device are as follows:
● The housing, consisting of a front panel and connections at the rear
● The Main processor module consisting of the main CPU (Central Processing Unit), memory and an interface
to the front panel HMI (Human Machine Interface)
● A selection of plug-in boards and modules with presentation at the rear for the sampled values inputs,
power supply, communication functions, digital I/O and time synchronisation connectivity
All boards and modules are connected by a parallel data and address bus, which allows the processor module to
send and receive information to and from the other modules as required. There is also a separate serial data bus
for conveying sampled data from the input module to the CPU. These parallel and serial databuses are shown as a
single interconnection module in the following figure, which shows typical modules and the flow of data between
them.
Figure 4: Hardware architecture
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3MECHANICAL IMPLEMENTATION
All products based on the Px4x platform have common hardware architecture. The hardware is modular and
consists of the following main parts:
● Case and terminal blocks
● Boards and modules
● Front panel
The case comprises the housing metalwork and terminal blocks at the rear. The boards fasten into the terminal
blocks and are connected together by a ribbon cable. This ribbon cable connects to the processor in the front
panel.
The following diagram shows an exploded view of a typical product. The diagram shown does not necessarily
represent exactly the product model described in this manual.
Figure 5: Exploded view of IED
3.1
The Px4x range of products are implemented in a range of case sizes. Case dimensions for industrial products
usually follow modular measurement units based on rack sizes. These are: U for height and TE for width, where:
● 1U = 1.75 inches = 44.45 mm
● 1TE = 0.2 inches = 5.08 mm
The products are available in panel-mount or standalone versions. All products are nominally 4U high. This equates
to 177.8 mm or 7 inches.
The cases are pre-finished steel with a conductive covering of aluminium and zinc. This provides good grounding
at all joints, providing a low resistance path to earth that is essential for performance in the presence of external
noise.
The case width depends on the product type and its hardware options. There are three different case widths for
the described range of products: 40TE, 60TE and 80TE. The case dimensions and compatibility criteria are as
follows:
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Case width (TE)Case width (mm)Case width (inches)
40TE203.28
60TE304.812
80TE406.416
Note:
Not all case sizes are available for all models.
3.2LIST OF BOARDS
The product's hardware consists of several modules drawn from a standard range. The exact specification and
number of hardware modules depends on the model number and variant. Depending on the exact model, the
product in question will use a selection of the following boards.
BoardUse
Main Processor board - 40TE or smallerMain Processor board – without support for function keys
Power supply board - 24/54V DCPower supply input. Accepts DC voltage between 24V and 54V
Power supply board - 48/125V DCPower supply input. Accepts DC voltage between 48V and 125V
Power supply board - 110/250V DCPower supply input. Accepts DC voltage between 110V and 125V
IEC 61850 9-2LE boardEthernet board for accepting IEC 61850 sampled values
IRIG-B board - modulated inputInterface board for modulated IRIG-B timing signal
IRIG-B board - demodulated inputInterface board for demodulated IRIG-B timing signal
Fibre boardInterface board for fibre-based RS485 connection
Fibre board + IRIG-BInterface board for fibre-based RS485 connection + demodulated IRIG-B
2nd rear communications boardInterface board for RS232 / RS485 connections
2nd rear communications board with IRIG-B inputInterface board for RS232 / RS485 + IRIG-B connections
100MhZ Ethernet boardStandard 100MHz Ethernet board for LAN connection (fibre + copper)
100MhZ Ethernet board with modulated IRIG-BStandard 100MHz Ethernet board (fibre / copper) + modulated IRIG-B
100MhZ Ethernet board with demodulated IRIG-BStandard 100MHz Ethernet board (fibre / copper)+ demodulated IRIG-B
High-break output relay boardOutput relay board with high breaking capacity relays
Redundant Ethernet SHP+ modulated IRIG-BRedundant SHP Ethernet board (2 fibre ports) + modulated IRIG-B input
Redundant Ethernet SHP + demodulated IRIG-BRedundant SHP Ethernet board (2 fibre ports) + demodulated IRIG-B input
Redundant Ethernet RSTP + modulated IRIG-BRedundant RSTP Ethernet board (2 fibre ports) + modulated IRIG-B input
Redundant Ethernet RSTP+ demodulated IRIG-BRedundant RSTP Ethernet board (2 fibre ports) + demodulated IRIG-B input
Redundant Ethernet DHP+ modulated IRIG-BRedundant DHP Ethernet board (2 fibre ports) + modulated IRIG-B input
Redundant Ethernet DHP+ demodulated IRIG-BRedundant DHP Ethernet board (2 fibre ports) + demodulated IRIG-B input
Redundant Ethernet PRP+ modulated IRIG-BRedundant PRP Ethernet board (2 fibre ports) + modulated IRIG-B input
Redundant Ethernet PRP+ demodulated IRIG-BRedundant PRP Ethernet board (2 fibre ports) + demodulated IRIG-B input
Redundant Ethernet HSR + modulated IRIG-BRedundant HSR Ethernet board (2 fibre ports) + demodulated IRIG-B input
Redundant Ethernet HSR+ demodulated IRIG-BRedundant HSR Ethernet board (2 fibre ports) + demodulated IRIG-B input
Output relay output boardStandard output relay board
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4FRONT PANEL
4.140TE FRONT PANEL
The following diagram shows a 40TE case. The hinged covers at the top and bottom of the front panel are shown
closed. An optional transparent front cover physically protects the front panel.
Figure 6: Front panel (40TE)
The front panel consists of:
● Top and bottom compartments with hinged cover
● LCD display
● Keypad
● Fixed function LEDs
● 9 pin D-type serial port (behind hinged cover)
● 25 pin D-type download port (behind hinged cover)
4.1.1
The top compartment contains labels for the:
● Serial number
● Current and voltage ratings.
FRONT PANEL COMPARTMENTS
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The bottom compartment contains:
● A compartment for a 1/2 AA size backup battery (used to back up the real time clock and event, fault, and
disturbance records).
● A 9-pin female D-type front port for an EIA(RS)232 serial connection to a PC.
● A 25-pin female D-type parallel port for monitoring internal signals and downloading software and
language text.
4.1.2KEYPAD
The keypad consists of the following keys:
4 arrow keys to navigate the menus (organised around the Enter key)
An enter key for executing the chosen option
A clear key for clearing the last command
A read key for viewing larger blocks of text (arrow keys now used for
scrolling)
2 hot keys for scrolling through the default display and for control of
setting groups. These are situated directly below the LCD display.
4.1.2.1LIQUID CRYSTAL DISPLAY
The LCD is a high resolution monochrome display with 16 characters by 3 lines and controllable back light.
4.1.3
FRONT SERIAL PORT (SK1)
The front serial port is a 9-pin female D-type connector, providing RS232 serial data communication. It is situated
under the bottom hinged cover, and is used to communicate with a locally connected PC. It is used to transfer
settings data between the PC and the IED.
The port is intended for temporary connection during testing, installation and commissioning. It is not intended to
be used for permanent SCADA communications. This port supports the Courier communication protocol only.
Courier is a proprietary communication protocol to allow communication with a range of protection equipment,
and between the device and the Windows-based support software package.
This port can be considered as a DCE (Data Communication Equipment) port, so you can connect this port device
to a PC with an EIA(RS)232 serial cable up to 15 m in length.
The inactivity timer for the front port is set to 15 minutes. This controls how long the unit maintains its level of
password access on the front port. If no messages are received on the front port for 15 minutes, any password
access level that has been enabled is cancelled.
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Note:
The front serial port does not support automatic extraction of event and disturbance records, although this data can be
accessed manually.
4.1.3.1FRONT SERIAL PORT (SK1) CONNECTIONS
The port pin-out follows the standard for Data Communication Equipment (DCE) device with the following pin
connections on a 9-pin connector.
Pin numberDescription
2Tx Transmit data
3Rx Receive data
50 V Zero volts common
You must use the correct serial cable, or the communication will not work. A straight-through serial cable is
required, connecting pin 2 to pin 2, pin 3 to pin 3, and pin 5 to pin 5.
Once the physical connection from the unit to the PC is made, the PC’s communication settings must be set to
match those of the IED. The following table shows the unit’s communication settings for the front port.
ProtocolCourier
Baud rate19,200 bps
Courier address1
Message format11 bit - 1 start bit, 8 data bits, 1 parity bit (even parity), 1 stop bit
4.1.4FRONT PARALLEL PORT (SK2)
The front parallel port uses a 25 pin D-type connector. It is used for commissioning, downloading firmware updates
and menu text editing.
4.1.5
Four fixed-function LEDs on the left-hand side of the front panel indicate the following conditions.
● Trip (Red) switches ON when the IED issues a trip signal. It is reset when the associated fault record is
● Alarm (Yellow) flashes when the IED registers an alarm. This may be triggered by a fault, event or
● Out of service (Yellow) is ON when the IED's functions are unavailable.
● Healthy (Green) is ON when the IED is in correct working order, and should be ON at all times. It goes OFF if
FIXED FUNCTION LEDS
cleared from the front display. Also the trip LED can be configured as self-resetting.
maintenance record. The LED flashes until the alarms have been accepted (read), then changes to
constantly ON. When the alarms are cleared, the LED switches OFF.
the unit’s self-tests show there is an error in the hardware or software. The state of the healthy LED is
reflected by the watchdog contacts at the back of the unit.
4.1.6
PROGRAMABLE LEDS
The device has a number of programmable LEDs, which can be associated with PSL-generated signals. The
programmable LEDs for most models are tri-colour and can be set to RED, YELLOW or GREEN. However the
programmable LEDs for some models are single-colour (red) only. The single-colour LEDs can be recognised by
virtue of the fact they are large and slightly oval, whereas the tri-colour LEDs are small and round.
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5REAR PANEL
The MiCOM P40Agile Modular series uses a modular construction. Most of the internal workings are on boards and
modules which fit into slots. Some of the boards plug into terminal blocks, which are bolted onto the rear of the
unit. However, some boards such as the communications boards have their own connectors. The rear panel
consists of these terminal blocks plus the rears of the communications boards.
The back panel cut-outs and slot allocations vary. This depends on the product, the type of boards and the
terminal blocks needed to populate the case. The following diagram shows the rear view of a 40TE. The IEC
61850-9-2LE interface is highlighted in grey.
Figure 7: Rear view of populated case
Note:
This diagram is a typical example and may not show the exact same arrangement of boards as your particular model. Refer
to the Cortec for product details.
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6BOARDS AND MODULES
Each product comprises a selection of PCBs (Printed Circuit Boards) and subassemblies, depending on the chosen
configuration.
6.1PCBS
A PCB typically consists of the components, a front connector for connecting into the main system parallel bus via
a ribbon cable, and an interface to the rear. This rear interface may be:
● Directly presented to the outside world (as is the case for communication boards such as Ethernet Boards)
● Presented to a connector, which in turn connects into a terminal block bolted onto the rear of the case (as is
the case for most of the other board types)
Figure 8: Rear connection to terminal block
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6.2MAIN PROCESSOR BOARD
Figure 9: Main processor board
The main processor board performs all calculations and controls the operation of all other modules in the IED,
including the data communication and user interfaces. This is the only board that does not fit into one of the slots.
It resides in the front panel and connects to the rest of the system using an internal ribbon cable.
The LCD and LEDs are mounted on the processor board along with the front panel communication ports.
The memory on the main processor board is split into two categories: volatile and non-volatile. The volatile
memory is fast access SRAM, used by the processor to run the software and store data during calculations. The
non-volatile memory is sub-divided into two groups:
● Flash memory to store software code, text and configuration data including the present setting values.
● Battery-backed SRAM to store disturbance, event, fault and maintenance record data.
There are two board types available depending on the size of the case:
● For models in 40TE cases
● For models in 60TE cases and larger
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6.3POWER SUPPLY BOARD
Figure 10: Power supply board
The power supply board provides power to the unit. One of three different configurations of the power supply
board can be fitted to the unit. This is specified at the time of order and depends on the magnitude of the supply
voltage that will be connected to it.
There are three board types, which support the following voltage ranges:
● 24/54 V DC
● 48/125 V DC or 40-100V AC
● 110/250 V DC or 100-240V AC
The power supply board connector plugs into a medium duty terminal block. This terminal block is always
positioned on the right hand side of the unit looking from the rear.
The power supply board is usually assembled together with a relay output board to form a complete subassembly,
as shown in the following diagram.
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Figure 11: Power supply assembly
The power supply outputs are used to provide isolated power supply rails to the various modules within the unit.
Three voltage levels are used by the unit’s modules:
● 5.1 V for all of the digital circuits
● +/- 16 V for the analogue electronics such as on the input board
● 22 V for driving the output relay coils.
All power supply voltages, including the 0 V earth line, are distributed around the unit by the 64-way ribbon cable.
The power supply board incorporates inrush current limiting. This limits the peak inrush current to approximately
10 A.
Power is applied to pins 1 and 2 of the terminal block, where pin 1 is negative and pin 2 is positive. The pin
numbers are clearly marked on the terminal block as shown in the following diagram.
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Figure 12: Power supply terminals
6.3.1
The Watchdog contacts are also hosted on the power supply board. The Watchdog facility provides two output
relay contacts, one normally open and one normally closed. These are used to indicate the health of the device
and are driven by the main processor board, which continually monitors the hardware and software when the
device is in service.
WATCHDOG
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Figure 13: Watchdog contact terminals
6.3.2
The rear serial port (RP1) is housed on the power supply board. This is a three-terminal EIA(RS)485 serial
communications port and is intended for use with a permanently wired connection to a remote control centre for
SCADA communication. The interface supports half-duplex communication and provides optical isolation for the
serial data being transmitted and received.
The physical connectivity is achieved using three screw terminals; two for the signal connection, and the third for
the earth shield of the cable. These are located on pins 16, 17 and 18 of the power supply terminal block, which is
on the far right looking from the rear. The interface can be selected between RS485 and K-bus. When the K-Bus
option is selected, the two signal connections are not polarity conscious.
The polarity independent K-bus can only be used for the Courier data protocol. The polarity conscious MODBUS,
IEC 60870-5-103 and DNP3.0 protocols need RS485.
The following diagram shows the rear serial port. The pin assignments are as follows:
● Pin 16: Earth shield
● Pin 17: Negative signal
● Pin 18: Positive signal
REAR SERIAL PORT
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RX
TX
LINK
ACTIVITY
Fibre optic
Ethernet
connections
RJ45 service
port for
commissioning
and testing only
E00227
RJ45
1
2
3
4
5
6
7
8
TX+
TXRX+
RX-
P446SVChapter 3 - Hardware Design
Figure 14: Rear serial port terminals
An additional serial port with D-type presentation is available as an optional board, if required.
6.4
Figure 15: IEC 61850-9-2LE board
IEC61850-9-2LE ETHERNET BOARD
Optical Fibre Connectors
The board uses 1300 nm multi mode 100BaseFx with ST connectors.
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RJ45 Connector
This is a service port for commissioning and testing only. Do not use this for permanent connections.
LEDs
LEDFunctionOnOffFlashing
GreenLinkLink okLink broken
YellowActivityTraffic
Note:
The 9-2LE interface fibre port does not support auto negotiation. Ensure the Ethernet port of the device connected to the 9-2
LE interface fibre port is set to 100Mbps full duplex.
6.5
STANDARD OUTPUT RELAY BOARD
Figure 16: Standard output relay board - 8 contacts
This output relay board has 8 relays with 6 Normally Open contacts and 2 Changeover contacts.
The output relay board is provided together with the power supply board as a complete assembly, or
independently for the purposes of relay output expansion.
There are two cut-out locations in the board. These can be removed to allow power supply components to
protrude when coupling the output relay board to the power supply board. If the output relay board is to be used
independently, these cut-out locations remain intact.
The terminal numbers are as follows:
Terminal Number
Terminal 1Relay 1 NO
Terminal 2Relay 1 NO
Terminal 3Relay 2 NO
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Terminal NumberOutput Relay
Terminal 4Relay 2 NO
Terminal 5Relay 3 NO
Terminal 6Relay 3 NO
Terminal 7Relay 4 NO
Terminal 8Relay 4 NO
Terminal 9Relay 5 NO
Terminal 10Relay 5 NO
Terminal 11Relay 6 NO
Terminal 12Relay 6 NO
Terminal 13Relay 7 changeover
Terminal 14Relay 7 changeover
Terminal 15Relay 7 common
Terminal 16Relay 8 changeover
Terminal 17Relay 8 changeover
Terminal 18Relay 8 common
6.6IRIG-B BOARD
Figure 17: IRIG-B board
The IRIG-B board can be fitted to provide an accurate timing reference for the device. The IRIG-B signal is
connected to the board via a BNC connector. The timing information is used to synchronise the IED's internal realtime clock to an accuracy of 1 ms. The internal clock is then used for time tagging events, fault, maintenance and
disturbance records.
IRIG-B interface is available in modulated or demodulated formats.
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The IRIG-B facility is provided in combination with other functionality on a number of additional boards, such as:
● Fibre board with IRIG-B
● Second rear communications board with IRIG-B
● Ethernet board with IRIG-B
● Redundant Ethernet board with IRIG-B
There are two types of each of these boards; one type which accepts a modulated IRIG-B input and one type
which accepts a demodulated IRIG-B input.
6.7
FIBRE OPTIC BOARD
Figure 18: Fibre optic board
This board provides an interface for communicating with a master station. This communication link can use all
compatible protocols (Courier, IEC 60870-5-103, MODBUS and DNP 3.0). It is a fibre-optic alternative to the metallic
RS485 port presented on the power supply terminal block. The metallic and fibre optic ports are mutually exclusive.
The fibre optic port uses BFOC 2.5 ST connectors.
The board comes in two varieties; one with an IRIG-B input and one without:
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6.8REAR COMMUNICATION BOARD
Figure 19: Rear communication board
The optional communications board containing the secondary communication ports provide two serial interfaces
presented on 9 pin D-type connectors. These interfaces are known as SK4 and SK5. Both connectors are female
connectors, but are configured as DTE ports. This means pin 2 is used to transmit information and pin 3 to receive.
SK4 can be used with RS232, RS485 and K-bus. SK5 can only be used with RS232 and is used for electrical
teleprotection. The optional rear communications board and IRIG-B board are mutually exclusive since they use
the same hardware slot. However, the board comes in two varieties; one with an IRIG-B input and one without.
6.9
ETHERNET BOARD
Figure 20: Ethernet board
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This is a communications board that provides a standard 100-Base Ethernet interface. This board supports one
electrical copper connection and one fibre-pair connection.
There are several variants for this board as follows:
● 100 Mbps Ethernet board
● 100 Mbps Ethernet with on-board modulated IRIG-B input
● 100 Mbps Ethernet with on-board unmodulated IRIG-B input
Two of the variants provide an IRIG-B interface. IRIG-B provides a timing reference for the unit – one board for
modulated IRIG-B and one for demodulated. The IRIG B signal is connected to the board with a BNC connector.
The Ethernet and other connection details are described below:
IRIG-B Connector
● Centre connection: Signal
● Outer connection: Earth
LEDs
LEDFunctionOnOffFlashing
GreenLinkLink okLink broken
YellowActivityTraffic
Optical Fibre Connectors
ConnectorFunction
RxReceive
TxTransmit
RJ45connector
PinSignal nameSignal definition
1TXPTransmit (positive)
2TXNTransmit (negative)
3RXPReceive (positive)
4-Not used
5-Not used
6RXNReceive (negative)
7-Not used
8-Not used
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IRIG-B
Pin3
Link Fail
connector
Pin 2
Pin 1
Link channel
A (green LED)
Activity channel
A (yellow LED)
Link channel B
(green LED)
Activity channel B
(yellow LED)
A
B
C
D
V01009
P446SVChapter 3 - Hardware Design
6.10REDUNDANT ETHERNET BOARD
Figure 21: Redundant Ethernet board
This board provides dual redundant Ethernet (supported by two fibre pairs) together with an IRIG-B interface for
timing.
Different board variants are available, depending on the redundancy protocol and the type of IRIG-B signal
(unmodulated or modulated). The available redundancy protocols are:
● SHP (Self healing Protocol)
● RSTP (Rapid Spanning Tree Protocol)
● DHP (Dual Homing Protocol)
● PRP (Parallel Redundancy Protocol)
There are several variants for this board as follows:
1TXPTransmit (positive)
2TXNTransmit (negative)
3RXPReceive (positive)
4-Not used
5-Not used
6RXNReceive (negative)
7-Not used
8-Not used
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6.11COPROCESSOR BOARD
Figure 22: Fully populated Coprocessor board
Note:
The above figure shows a coprocessor complete with GPS input and 2 fibre-optic serial data interfaces, and is not necessarily
representative of the product and model described in this manual. These interfaces will not be present on boards that do not
require them.
Where applicable, a second processor board is used to process the special algorithms associated with the device.
This second processor board provides fast access (zero wait state) SRAM for use with both program and data
memory storage. This memory can be accessed by the main processor board via the parallel bus. This is how the
software is transferred from the flash memory on the main processor board to the coprocessor board on power
up. Further communication between the two processor boards is achieved via interrupts and the shared SRAM.
The serial bus carrying the sample data is also connected to the co-processor board, using the processor’s built-in
serial port, as on the main processor board.
There are several different variants of this board, which can be chosen depending on the exact device and model.
The variants are:
● Coprocessor board with current differential inputs and GPS input
● Coprocessor board with current differential inputs only
● Coprocessor board with GPS input only
6.11.1
COPROCESSOR BOARD WITH 1PPS INPUT
In some applications, where the communication links between two remote devices are provided by a third party
telecommunications partner, the transmit and receive paths associated with one channel may differ considerably
in length, resulting in very different transmission and receive times.
If, for example, Device A is transmitting to Device B information about the value of its measured current, the
information Device A is receiving from Device B about the current measured at the same time, may reach device B
at a different time. This has to be compensated for. A 1pps GPS timing signal applied to both devices will help the
IEDs achieve this, because it is possible to measure the exact time taken for both transmission and receive paths.
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Note:
The 1 pps signal is always supplied by a GPS receiver (such as a P594).
Note:
This signal is used to control the sampling process, and timing calculations and is not used for time stamping or real time
synchronisation.
6.12
HIGH BREAK OUTPUT RELAY BOARD
Figure 23: High Break relay output board
A High Break output relay board is available as an option. It comprises four normally open output contacts, which
are suitable for high breaking loads.
A High Break contact consists of a high capacity relay with a MOSFET in parallel with it. The MOSFET has a varistor
placed across it to provide protection, which is required when switching off inductive loads. This is because the
stored energy in the inductor causes a high reverse voltage that could damage the MOSFET, if not protected.
When there is a control input command to operate an output contact the miniature relay is operated at the same
time as the MOSFET. The miniature relay contact closes in nominally 3.5 ms and is used to carry the continuous
load current. The MOSFET operates in less than 0.2 ms, but is switched off after 7.5 ms.
When the control input is reset, the MOSFET is again turned on for 7.5 mS. The miniature relay resets in nominally
3.5 ms before the MOSFET. This means the MOSFET is used to break the load. The MOSFET absorbs the energy
when breaking inductive loads and so limits the resulting voltage surge. This contact arrangement is for switching
DC circuits only.
The board number is:
● ZN0042 001
High Break Contact Operation
The following figure shows the timing diagram for High Break contact operation.
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V00246
3.5ms + contact bounce
Load current
Relay contact
Databus
control input
MOSFET reset
MOSFET operate
on
7ms
on
3.5ms
Closed
on
7ms
off
P446SVChapter 3 - Hardware Design
Figure 24: High Break contact operation
High Break Contact Applications
● Efficient scheme engineering
● Accessibility of CB auxiliary contacts
● Breaker fail
● Initiation of teleprotection
In traditional hard wired scheme designs, High Break capability could only be achieved using external
electromechanical trip relays. Instead, these internal High Break contacts can be used thus reducing space
requirements.
It is common practise to use circuit breaker 52a (CB Closed) auxiliary contacts to break the trip coil current
on breaker opening, thereby easing the duty on the protection contacts. In some cases (such as operation
of disconnectors, or retrofitting), it may be that 52a contacts are either unavailable or unreliable. In such
cases, High Break contacts can be used to break the trip coil current in these applications.
In the event of failure of the local circuit breaker (stuck breaker), or defective auxiliary contacts (stuck
contacts), it is incorrect to use 52a contact action. The interrupting duty at the local breaker then falls on the
relay output contacts, which may not be rated to perform this duty. High Break contacts should be used in
this case to avoid the risk of burning out relay contacts.
The High Break contacts also offer fast making, which results in faster tripping. In addition, fast keying of
teleprotection is a benefit. Fast keying bypasses the usual contact operation time, such that permissive,
blocking and intertrip commands can be routed faster.
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Warning:
These relay contacts are POLARITY SENSITIVE. External wiring must comply with the polarity
requirements described in the external connection diagram to ensure correct operation.
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CHAPTER 4
SOFTWARE DESIGN
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P446SVChapter 4 - Software Design
1CHAPTER OVERVIEW
This chapter describes the software design of the IED.
This chapter contains the following sections:
Chapter Overview59
Sofware Design Overview60
System Level Software61
Platform Software64
Protection and Control Functions65
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R
e
c
o
r
d
s
P
r
o
t
e
c
t
i
o
n
a
n
d
c
o
n
t
r
o
l
s
e
t
t
i
n
g
s
Protection and Control Software Layer
Fault locator
task
Disturbance
recorder task
Sampling function
Control of output contacts
and programmable LEDs
Sample data + digital
logic inputs
System Level Software Layer
System services (e.g. device drivers) / Real time operating system / Self-diagnostic software
Control of interfaces to keypad , LCD, LEDs,
front & rear ports.
Self-checking maintenance records
Hardware Device Layer
LEDs / LCD / Keypad / Memory / FPGA
Protection Task
Programmable & fixed
scheme logic
Signal processing
Coprocessor protection
algorithms
Supervisor task
Platform Software Layer
Event, fault,
disturbance,
maintenance record
logging
Remote
communications
interfaces
Front panel
interface
(LCD + Keypad)
Local
communications
interfaces
Settings database
Protection algorithms
Chapter 4 - Software DesignP446SV
2SOFWARE DESIGN OVERVIEW
The device software can be conceptually categorized into several elements as follows:
● The system level software
● The platform software
● The protection and control software
These elements are not distinguishable to the user, and the distinction is made purely for the purposes of
explanation. The following figure shows the software architecture.
Figure 25: Software Architecture
The software, which executes on the main processor, can be divided into a number of functions as illustrated
above. Each function is further broken down into a number of separate tasks. These tasks are then run according
to a scheduler. They are run at either a fixed rate or they are event driven. The tasks communicate with each other
as and when required.
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3SYSTEM LEVEL SOFTWARE
3.1REAL TIME OPERATING SYSTEM
The real-time operating system is used to schedule the processing of the various tasks. This ensures that they are
processed in the time available and in the desired order of priority. The operating system also plays a part in
controlling the communication between the software tasks, through the use of operating system messages.
3.2
The system services software provides the layer between the hardware and the higher-level functionality of the
platform software and the protection and control software. For example, the system services software provides
drivers for items such as the LCD display, the keypad and the remote communication ports. It also controls things
like the booting of the processor and the downloading of the processor code into RAM at startup.
3.3
The device includes several self-monitoring functions to check the operation of its hardware and software while in
service. If there is a problem with the hardware or software, it should be able to detect and report the problem, and
attempt to resolve the problem by performing a reboot. In this case, the device would be out of service for a short
time, during which the ‘Healthy’ LED on the front of the device is switched OFF and the watchdog contact at the
rear is ON. If the restart fails to resolve the problem, the unit takes itself permanently out of service; the ‘Healthy’
LED stays OFF and watchdog contact stays ON.
If a problem is detected by the self-monitoring functions, the device attempts to store a maintenance record to
allow the nature of the problem to be communicated to the user.
The self-monitoring is implemented in two stages: firstly a thorough diagnostic check which is performed on bootup, and secondly a continuous self-checking operation, which checks the operation of the critical functions whilst
it is in service.
3.4
The self-testing takes a few seconds to complete, during which time the IED's measurement, recording, control,
and protection functions are unavailable. On a successful start-up and self-test, the ‘health-state’ LED on the front
of the unit is switched on. If a problem is detected during the start-up testing, the device remains out of service
until it is manually restored to working order.
SYSTEM SERVICES SOFTWARE
SELF-DIAGNOSTIC SOFTWARE
STARTUP SELF-TESTING
The operations that are performed at start-up are:
1.System boot
2.System software initialisation
3.Platform software initialisation and monitoring
3.4.1
The integrity of the Flash memory is verified using a checksum before the program code and stored data is loaded
into RAM for execution by the processor. When the loading has been completed, the data held in RAM is compared
to that held in the Flash memory to ensure that no errors have occurred in the data transfer and that the two are
the same. The entry point of the software code in RAM is then called. This is the IED's initialisation code.
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3.4.2SYSTEM LEVEL SOFTWARE INITIALISATION
The initialization process initializes the processor registers and interrupts, starts the watchdog timers (used by the
hardware to determine whether the software is still running), starts the real-time operating system and creates
and starts the supervisor task. In the initialization process the device checks the following:
● The status of the backup battery
● The integrity of the battery-backed SRAM that is used to store event, fault and disturbance records
● The operation of the LCD controller
● The watchdog operation
At the conclusion of the initialization software the supervisor task begins the process of starting the platform
software. Coprocessor board checks are also made as follows:
● A check is made for the presence of the coprocessor board
● The RAM on the coprocessor board is checked with a test bit pattern before the coprocessor board is
transferred from flash memory
If any of these checks produces an error, the coprocessor board is left out of service. The other protection
functions provided by the main processor board are left in service.
3.4.3
When starting the platform software, the IED checks the following:
● The integrity of the data held in non-volatile memory (using a checksum)
● The operation of the real-time clock
● The optional IRIG-B function (if applicable)
● The presence and condition of the input board
● The analog data acquisition system (it does this by sampling the reference voltage)
At the successful conclusion of all of these tests the unit is entered into service and the application software is
started up.
3.5
When the IED is in service, it continually checks the operation of the critical parts of its hardware and software. The
checking is carried out by the system services software and the results are reported to the platform software. The
functions that are checked are as follows:
● The Flash memory containing all program code and language text is verified by a checksum.
● The code and constant data held in system memory is checked against the corresponding data in Flash
● The system memory containing all data other than the code and constant data is verified with a checksum.
● The integrity of the digital signal I/O data from the opto-inputs and the output relay coils is checked by the
● The operation of the analog data acquisition system is continuously checked by the acquisition function
● The operation of the optional Ethernet board is checked by the software on the main processor card. If the
● The operation of the optional IRIG-B function is checked by the software that reads the time and date from
In the event that one of the checks detects an error in any of the subsystems, the platform software is notified and
it attempts to log a maintenance record.
PLATFORM SOFTWARE INITIALISATION AND MONITORING
CONTINUOUS SELF-TESTING
memory to check for data corruption.
data acquisition function every time it is executed.
every time it is executed. This is done by sampling the reference voltages.
Ethernet board fails to respond an alarm is raised and the card is reset in an attempt to resolve the problem.
the board.
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If the problem is with the battery status or the IRIG-B board, the device continues in operation. For problems
detected in any other area, the device initiates a shutdown and re-boot, resulting in a period of up to 10 seconds
when the functionality is unavailable.
A restart should clear most problems that may occur. If, however, the diagnostic self-check detects the same
problem that caused the IED to restart, it is clear that the restart has not cleared the problem, and the device takes
itself permanently out of service. This is indicated by the ‘’health-state’ LED on the front of the device, which
switches OFF, and the watchdog contact which switches ON.
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4PLATFORM SOFTWARE
The platform software has three main functions:
● To control the logging of records generated by the protection software, including alarms, events, faults, and
maintenance records
● To store and maintain a database of all of the settings in non-volatile memory
● To provide the internal interface between the settings database and the user interfaces, using the front
panel interface and the front and rear communication ports
4.1
The logging function is used to store all alarms, events, faults and maintenance records. The records are stored in
non-volatile memory to provide a log of what has happened. The IED maintains four types of log on a first in first
out basis (FIFO). These are:
● Alarms
● Event records
● Fault records
● Maintenance records
The logs are maintained such that the oldest record is overwritten with the newest record. The logging function
can be initiated from the protection software. The platform software is responsible for logging a maintenance
record in the event of an IED failure. This includes errors that have been detected by the platform software itself or
errors that are detected by either the system services or the protection software function. See the Monitoring and
Control chapter for further details on record logging.
4.2
The settings database contains all the settings and data, which are stored in non-volatile memory. The platform
software manages the settings database and ensures that only one user interface can modify the settings at any
one time. This is a necessary restriction to avoid conflict between different parts of the software during a setting
change.
Changes to protection settings and disturbance recorder settings, are first written to a temporary location SRAM
memory. This is sometimes called 'Scratchpad' memory. These settings are not written into non-volatile memory
immediately. This is because a batch of such changes should not be activated one by one, but as part of a
complete scheme. Once the complete scheme has been stored in SRAM, the batch of settings can be committed to
the non-volatile memory where they will become active.
RECORD LOGGING
SETTINGS DATABASE
4.3
The settings and measurements database must be accessible from all of the interfaces to allow read and modify
operations. The platform software presents the data in the appropriate format for each of the interfaces (LCD
display, keypad and all the communications interfaces).
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5PROTECTION AND CONTROL FUNCTIONS
The protection and control software processes all of the protection elements and measurement functions. To
achieve this it has to communicate with the system services software, the platform software as well as organise its
own operations.
The protection task software has the highest priority of any of the software tasks in the main processor board. This
ensures the fastest possible protection response.
The protection and control software provides a supervisory task, which controls the start-up of the task and deals
with the exchange of messages between the task and the platform software.
5.1
After initialization, the protection and control task waits until there are enough samples to process. The acquisition
of samples on the main processor board is controlled by a ‘sampling function’ which is called by the system
services software.
This sampling function takes samples from the input module and stores them in a two-cycle FIFO buffer. These
samples are also stored concurrently by the coprocessor. The sample rate is 48 samples per cycle. This results in a
nominal sample rate of 2,400 samples per second for a 50 hz system and 2,880 samples per second for a 60 Hz
system. However the sample rate is not fixed. It tracks the power system frequency as described in the next
section.
In normal operation, the protection task is executed 16 times per cycle.
5.2
The device provides a frequency tracking algorithm so that there are always 48 samples per cycle irrespective of
frequency drift. The frequency range in which 48 samples per second are provided is between 45 Hz and 66 z. If
the frequency falls outside this range, the sample rate reverts to its default rate of 2,400 Hz for 50 Hz or 2,880 Hz
for 60 Hz.
The frequency tracking of the analog input signals is achieved by a recursive Fourier algorithm which is applied to
one of the input signals. It works by detecting a change in the signal’s measured phase angle. The calculated value
of the frequency is used to modify the sample rate being used by the input module, in order to achieve a constant
sample rate per cycle of the power waveform. The value of the tracked frequency is also stored for use by the
protection and control task.
ACQUISITION OF SAMPLES
FREQUENCY TRACKING
The frequency tracks off any voltage or current in the order VA, VB, VC, IA, IB, IC, down to 10%Vn for voltage and
5%In for current.
5.3
Most of the IED’s protection functionality uses the Fourier components calculated by the device’s signal processing
software. However RMS measurements and some special protection algorithms available in some products use
the sampled values directly.
The disturbance recorder also uses the samples from the input module, in an unprocessed form. This is for
waveform recording and the calculation of true RMS values of current, voltage and power for metering purposes.
In the case of special protection algorithms, using the sampled values directly provides exceptionally fast response
because you do not have to wait for the signal processing task to calculate the fundamental. You can act on the
sampled values immediately.
5.4
The current and voltage inputs are filtered using Finite Impulse Response (FIR) digital filters. This reduces the
effects of non-power frequency components in the input signals, such as DC offsets in current waveforms, and
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DIRECT USE OF SAMPLE VALUES
DISTANCE PROTECTION
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Filter Response
Gain
Harmonic
Full
Quarter
Half
018
15
129
63
0.5
1
2
1.5
0
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2.5
Chapter 4 - Software DesignP446SV
capacitor voltage transformer (CVT) transients in the voltages. The device uses a combination of a 1/4 cycle filter
using 12 coefficients, a 1/2 cycle filter using 24 coefficients, and a single cycle filter using 48 coefficients. The
device automatically performs intelligent switching in the application of the filters, to select the best balance of
removal of transients with fast response. The protection elements themselves then perform additional filtering,
implemented for example, by the trip count strategy.
The following figure shows the frequency response of the 12, 24 and 48 coefficient filters, noting that all have a
gain of unity at the fundamental frequency:
Figure 26: Frequency response of FIR filters
5.5
FOURIER SIGNAL PROCESSING
All backup protection and measurement functions use single-cycle fourier digital filtering to extract the power
frequency component. This filtering is performed on the main processor board.
When the protection and control task is re-started by the sampling function, it calculates the Fourier components
for the analog signals. Although some protection algorithms use some Fourier-derived harmonics (e.g. second
harmonic for magnetizing inrush), most protection functions are based on the Fourier-derived fundamental
components of the measured analog signals. The Fourier components of the input current and voltage signals are
stored in memory so that they can be accessed by all of the protection elements’ algorithms.
The Fourier components are calculated using single-cycle Fourier algorithm. This Fourier algorithm always uses
the most recent 48 samples from the 2-cycle buffer.
Most protection algorithms use the fundamental component. In this case, the Fourier algorithm extracts the power
frequency fundamental component from the signal to produce its magnitude and phase angle. This can be
represented in either polar format or rectangular format, depending on the functions and algorithms using it.
The Fourier function acts as a filter, with zero gain at DC and unity gain at the fundamental, but with good
harmonic rejection for all harmonic frequencies up to the nyquist frequency. Frequencies beyond this nyquist
frequency are known as alias frequencies, which are introduced when the sampling frequency becomes less than
twice the frequency component being sampled. However, the Alias frequencies are significantly attenuated by an
anti-aliasing filter (low pass filter), which acts on the analog signals before they are sampled. The ideal cut-off point
of an anti-aliasing low pass filter would be set at:
(samples per cycle) ´ (fundamental frequency)/2
At 48samples per cycle, this would be nominally 1200 Hz for a 50 Hz system, or 1440 Hz for a 60 Hz system.
The following figure shows the nominal frequency response of the anti-alias filter and the Fourier filter for a 48-
sample single cycle fourier algorithm acting on the fundamental component:
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Ideal anti-alias filter response
Real anti-alias filter
response
2 3...
1
0.2
0.4
0.6
0.8
241
50 Hz1200 Hz2400 Hz
V00306
Fourier Response
without anti-alias filter
Fourier Response
with anti-alias filter
Alias frequency
P446SVChapter 4 - Software Design
Figure 27: Frequency Response (indicative only)
5.6
PROGRAMMABLE SCHEME LOGIC
The purpose of the programmable scheme logic (PSL) is to allow you to configure your own protection schemes to
suit your particular application. This is done with programmable logic gates and delay timers. To allow greater
flexibility, different PSL is allowed for each of the four setting groups.
The input to the PSL is any combination of the status of the digital input signals from the opto-isolators on the
input board, the outputs of the protection elements such as protection starts and trips, and the outputs of the fixed
protection scheme logic (FSL). The fixed scheme logic provides the standard protection schemes. The PSL consists
of software logic gates and timers. The logic gates can be programmed to perform a range of different logic
functions and can accept any number of inputs. The timers are used either to create a programmable delay,
and/or to condition the logic outputs, such as to create a pulse of fixed duration on the output regardless of the
length of the pulse on the input. The outputs of the PSL are the LEDs on the front panel of the relay and the output
contacts at the rear.
The execution of the PSL logic is event driven. The logic is processed whenever any of its inputs change, for
example as a result of a change in one of the digital input signals or a trip output from a protection element. Also,
only the part of the PSL logic that is affected by the particular input change that has occurred is processed. This
reduces the amount of processing time that is used by the PSL. The protection & control software updates the logic
delay timers and checks for a change in the PSL input signals every time it runs.
The PSL can be configured to create very complex schemes. Because of this PSL desing is achieved by means of a
PC support package called the PSL Editor. This is available as part of the settings application software MiCOm S1
Agile, or as a standalone software module.
5.7
EVENT RECORDING
A change in any digital input signal or protection element output signal is used to indicate that an event has taken
place. When this happens, the protection and control task sends a message to the supervisor task to indicate that
an event is available to be processed and writes the event data to a fast buffer controlled by the supervisor task.
When the supervisor task receives an event record, it instructs the platform software to create the appropriate log
in non-volatile memory (battery backed-up SRAM). The operation of the record logging to battery backed-up SRAM
is slower than the supervisor buffer. This means that the protection software is not delayed waiting for the records
to be logged by the platform software. However, in the rare case when a large number of records to be logged are
created in a short period of time, it is possible that some will be lost, if the supervisor buffer is full before the
platform software is able to create a new log in battery backed-up SRAM. If this occurs then an event is logged to
indicate this loss of information.
Maintenance records are created in a similar manner, with the supervisor task instructing the platform software to
log a record when it receives a maintenance record message. However, it is possible that a maintenance record
may be triggered by a fatal error in the relay in which case it may not be possible to successfully store a
maintenance record, depending on the nature of the problem.
P446SV-TM-EN-167
Page 100
Chapter 4 - Software DesignP446SV
For more information, see the Monitoring and Control chapter.
5.8DISTURBANCE RECORDER
The disturbance recorder operates as a separate task from the protection and control task. It can record the
waveforms for up to 12 calibrated analog channels and the values of up to 32 digital signals. The recording time is
user selectable. Up to 50 seconds of data can be recorded. A minimum number of 5 records with a capacity of 10
seconds each, up to a maximum of 50 records with a capacity of 10 seconds each can be set. The disturbance
recorder is supplied with data by the protection and control task once per cycle. The disturbance recorder collates
the data that it receives into the required length disturbance record. The disturbance records can be extracted by
settings application software such as MiCOM S1 Agile, which can also store the data in COMTRADE format,
therefore allowing the use of other packages to view the recorded data.
For more information, see the Monitoring and Control chapter.
5.9
The fault locator uses 12 cycles of the analog input signals to calculate the fault location. The result is returned to
the protection and control task, which includes it in the fault record. The pre-fault and post-fault voltages are also
presented in the fault record. When the fault record is complete, including the fault location, the protection and
control task sends a message to the supervisor task to log the fault record.
The Fault Locator is not available on all models.
5.10
The function keys interface directly into the PSL as digital input signals. A change of state is only recognized when
a key press is executed on average for longer than 200 ms. The time to register a change of state depends on
whether the function key press is executed at the start or the end of a protection task cycle, with the additional
hardware and software scan time included. A function key press can provide a latched (toggled mode) or output
on key press only (normal mode) depending on how it is programmed. It can be configured to individual protection
scheme requirements. The latched state signal for each function key is written to non-volatile memory and read
from non-volatile memory during relay power up thus allowing the function key state to be reinstated after powerup, should power be inadvertently lost.
FAULT LOCATOR
FUNCTION KEY INTERFACE
68P446SV-TM-EN-1
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