9.4Time Synchronsiation using the Communication Protocols454
Chapter 19Cyber-Security455
1Overview457
2The Need for Cyber-Security458
3Standards459
3.1NERC Compliance459
3.1.1CIP 002460
3.1.2CIP 003460
3.1.3CIP 004460
3.1.4CIP 005460
3.1.5CIP 006460
3.1.6CIP 007461
3.1.7CIP 008461
3.1.8CIP 009461
3.2IEEE 1686-2007461
4Cyber-Security Implementation463
4.1NERC-Compliant Display463
4.2Four-level Access464
4.2.1Blank Passwords465
4.2.2Password Rules465
4.2.3Access Level DDBs466
4.3Enhanced Password Security466
4.3.1Password Strengthening466
4.3.2Password Validation466
4.3.3Password Blocking467
4.4Password Recovery468
4.4.1Password Recovery468
4.4.2Password Encryption469
P14xEd1-TM-EN-1xiii
ContentsP14x
4.5Disabling Physical Ports469
4.6Disabling Logical Ports469
4.7Security Events Management470
4.8Logging Out472
Chapter 20Installation473
1Chapter Overview475
2Handling the Goods476
2.1Receipt of the Goods476
2.2Unpacking the Goods476
2.3Storing the Goods476
2.4Dismantling the Goods476
3Mounting the Device477
3.1Flush Panel Mounting477
3.2Rack Mounting478
4Cables and Connectors480
4.1Terminal Blocks480
4.2Power Supply Connections481
4.3Earth Connnection481
4.4Current Transformers481
4.5Voltage Transformer Connections482
4.6Watchdog Connections482
4.7EIA(RS)485 and K-Bus Connections482
4.8IRIG-B Connection482
4.9Opto-input Connections482
4.10Output Relay Connections482
4.11Ethernet Metallic Connections483
4.12Ethernet Fibre Connections483
4.13RS232 connection483
4.14Download/Monitor Port483
4.15GPS Fibre Connection483
4.16Fibre Communication Connections483
5Case Dimensions484
5.1Case Dimensions 40TE484
5.2Case Dimensions 60TE485
5.3Case Dimensions 80TE486
Chapter 21Commissioning Instructions487
1Chapter Overview489
2General Guidelines490
3Commissioning Test Menu491
3.1Opto I/P Status Cell (Opto-input Status)491
3.2Relay O/P Status Cell (Relay Output Status)491
3.3Test Port Status Cell491
3.4Monitor Bit 1 to 8 Cells491
3.5Test Mode Cell492
3.6Test Pattern Cell492
3.7Contact Test Cell492
3.8Test LEDs Cell492
3.9Test Autoreclose Cell492
3.10Red and Green LED Status Cells493
3.11Using a Monitor Port Test Box493
4Commissioning Equipment494
4.1Recommended Commissioning Equipment494
xivP14xEd1-TM-EN-1
P14xContents
4.2Essential Commissioning Equipment494
4.3Advisory Test Equipment495
5Product Checks496
5.1Product Checks with the IED De-energised496
5.1.1Visual Inspection497
5.1.2Current Transformer Shorting Contacts497
5.1.3Insulation497
5.1.4External Wiring497
5.1.5Watchdog Contacts498
5.1.6Power Supply498
5.2Product Checks with the IED Energised498
5.2.1Watchdog Contacts498
5.2.2Test LCD499
5.2.3Date and Time499
5.2.4Test LEDs500
5.2.5Test Alarm and Out-of-Service LEDs500
5.2.6Test Trip LED500
5.2.7Test User-programmable LEDs500
5.2.8Test Opto-inputs500
5.2.9Test Output Relays500
5.2.10Test Serial Communication Port RP1501
5.2.11Test Serial Communication Port RP2502
5.2.12Test Ethernet Communication502
5.3Secondary Injection Tests503
5.3.1Test Current Inputs503
5.3.2Test Voltage Inputs503
6Setting Checks505
6.1Apply Application-specific Settings505
6.1.1Transferring Settings from a Settings File505
6.1.2Entering settings using the HMI505
7Protection Timing Checks507
7.1Overcurrent Check507
7.2Connecting the Test Circuit507
7.3Performing the Test507
7.4Check the Operating Time507
8Onload Checks509
8.1Confirm Current Connections509
8.2Confirm Voltage Connections509
8.3On-load Directional Test510
9Final Checks511
Chapter 22Maintenance and Troubleshooting513
1Chapter Overview515
2Maintenance516
2.1Maintenance Checks516
2.1.1Alarms516
2.1.2Opto-isolators516
2.1.3Output Relays516
2.1.4Measurement Accuracy516
2.2Replacing the Device517
2.3Repairing the Device518
2.4Removing the front panel518
2.5Replacing PCBs519
2.5.1Replacing the main processor board519
2.5.2Replacement of communications boards520
2.5.3Replacement of the input module521
2.5.4Replacement of the power supply board521
P14xEd1-TM-EN-1xv
ContentsP14x
2.5.5Replacement of the I/O boards522
2.6Recalibration522
2.7Changing the battery522
2.7.1Post Modification Tests523
2.7.2Battery Disposal523
2.8Cleaning523
3Troubleshooting524
3.1Self-Diagnostic Software524
3.2Power-up Errors524
3.3Error Message or Code on Power-up524
3.4Out of Service LED on at power-up525
3.5Error Code during Operation526
3.5.1Backup Battery526
3.6Mal-operation during testing526
3.6.1Failure of Output Contacts526
3.6.2Failure of Opto-inputs526
3.6.3Incorrect Analogue Signals527
3.7PSL Editor Troubleshooting527
3.7.1Diagram Reconstruction527
3.7.2PSL Version Check527
4Repair and Modification Procedure528
Chapter 23Technical Specifications529
1Chapter Overview531
2Interfaces532
2.1Front Serial Port532
2.2Download/Monitor Port532
2.3Rear Serial Port 1532
2.4Fibre Rear Serial Port 1532
2.5Rear Serial Port 2533
2.6Optional Rear Serial Port (SK5)533
2.7IRIG-B (Demodulated)533
2.8IRIG-B (Modulated)533
2.9Rear Ethernet Port Copper534
2.10Rear Ethernet Port Fibre534
2.10.1100 Base FX Receiver Characteristics534
2.10.2100 Base FX Transmitter Characteristics535
3Performance of Current Protection Functions536
3.1Transient Overreach and Overshoot536
3.2Phase Overcurrent Protection536
3.2.1Phase Overcurrent Directional Parameters536
3.3Voltage Dependent Overcurrent Protection536
3.4Earth Fault Protection537
3.4.1Earth Fault Directional Parameters537
3.5Sensitive Earth Fault Protection538
3.5.1SEF Directional Parameters538
3.6Restricted Earth Fault Protection538
3.7Negative Sequence Overcurrent Protection539
3.7.1NPSOC Directional Parameters539
3.8Circuit Breaker Fail and Undercurrent Protection539
3.9Broken Conductor Protection539
3.10Thermal Overload Protection539
3.11Cold Load Pickup Protection540
3.12Selective Overcurrent Protection540
3.13Voltage Dependent Overcurrent Protection540
3.14Neutral Admittance Protection540
xviP14xEd1-TM-EN-1
P14xContents
4Performance of Voltage Protection Functions541
4.1Undervoltage Protection541
4.2Overvoltage Protection541
4.3Residual Overvoltage Protection541
4.4Negative Sequence Voltage Protection541
4.5Rate of Change of Voltage Protection542
5Performance of Frequency Protection Functions543
5.1Basic Overfrequency Protection543
5.2Basic Underfrequency Protection543
5.3Advanced Overfrequency Protection543
5.4Advanced Underfrequency Protection544
5.5Supervised Rate of Change of Frequency Protection544
5.6Independent Rate of Change of Frequency Protection544
5.7Average Rate of Change of Frequency Protection545
5.8Load Restoration545
6Power Protection Functions546
6.1Overpower / Underpower Protection546
6.2Sensitive Power Protection546
7Performance of Monitoring and Control Functions547
7.1Voltage Transformer Supervision547
7.2Standard Current Transformer Supervision547
7.3CB State and Condition Monitoring547
7.4PSL Timers547
8Measurements and Recording548
8.1General548
8.2Disturbance Records548
8.3Event, Fault and Maintenance Records548
8.4Fault Locator548
9Ratings549
9.1AC Measuring Inputs549
9.2Current Transformer Inputs549
9.3Voltage Transformer Inputs549
9.4Auxiliary Supply Voltage549
9.5Nominal Burden550
9.6Power Supply Interruption550
9.7Battery Backup551
10Input / Output Connections552
10.1Isolated Digital Inputs552
10.2Nominal Pickup and Reset Thresholds552
10.3Standard Output Contacts552
10.4High Break Output Contacts553
10.5Watchdog Contacts553
11Mechanical Specifications554
11.1Physical Parameters554
11.2Enclosure Protection554
11.3Mechanical Robustness554
11.4Transit Packaging Performance554
12Type Tests555
12.1Insulation555
12.2Creepage Distances and Clearances555
12.3High Voltage (Dielectric) Withstand555
12.4Impulse Voltage Withstand Test555
13Environmental Conditions556
13.1Ambient Temperature Range556
13.2Temperature Endurance Test556
13.3Ambient Humidity Range556
P14xEd1-TM-EN-1xvii
ContentsP14x
13.4Corrosive Environments556
14Electromagnetic Compatibility557
14.11 MHz Burst High Frequency Disturbance Test557
14.2Damped Oscillatory Test557
14.3Immunity to Electrostatic Discharge557
14.4Electrical Fast Transient or Burst Requirements557
14.5Surge Withstand Capability557
14.6Surge Immunity Test558
14.7Immunity to Radiated Electromagnetic Energy558
14.8Radiated Immunity from Digital Communications558
14.9Radiated Immunity from Digital Radio Telephones558
14.10Immunity to Conducted Disturbances Induced by Radio Frequency Fields558
14.11Magnetic Field Immunity559
14.12Conducted Emissions559
14.13Radiated Emissions559
14.14Power Frequency559
15Regulatory Compliance560
15.1EMC Compliance: 2014/30/EU560
15.2LVD Compliance: 2014/35/EU560
15.3R&TTE Compliance: 2014/53/EU560
15.4UL/CUL Compliance560
15.5ATEX Compliance: 2014/34/EU560
Appendix AOrdering Options563
Appendix BSettings and Signals565
Appendix CWiring Diagrams567
xviiiP14xEd1-TM-EN-1
Table of Figures
Figure 1:Functional Overview11
Figure 2:Hardware architecture30
Figure 3:Exploded view of IED31
Figure 4:Front panel (60TE)33
Figure 5:HMI panel34
Figure 6:Rear view of populated case37
Figure 7:Terminal block types38
Figure 8:Rear connection to terminal block39
Figure 9:Main processor board40
Figure 10:Power supply board41
Figure 11:Power supply assembly42
Figure 12:Power supply terminals43
Figure 13:Watchdog contact terminals44
Figure 14:Rear serial port terminals45
Figure 15:Input module - 1 transformer board45
Figure 16:Input module schematic46
Figure 17:Transformer board47
Figure 18:Input board48
Figure 19:Standard output relay board - 8 contacts49
Figure 20:IRIG-B board50
Figure 21:Fibre optic board51
Figure 22:Rear communication board52
Figure 23:Ethernet board52
Figure 24:Redundant Ethernet board54
Figure 25:Software Architecture60
Figure 26:Frequency Response (indicative only)65
Figure 27:Navigating the HMI72
Figure 28:Default display navigation74
Figure 29:IEC 60255 IDMT curves91
Figure 30:IEC standard and very inverse curves94
Figure 31:IEC Extremely inverse and IEEE moderate inverse curves94
Figure 32:IEEE very and extremely inverse curves95
Figure 33:Principle of protection function implementation96
Figure 34:Non-directional Overcurrent Logic diagram99
Figure 35:Directional Overcurrent Logic diagram (Phase A shown only)101
Figure 36:Typical distribution system using parallel transformers102
Figure 37:Typical ring main with associated overcurrent protection103
Figure 38:Modification of current pickup level for voltage controlled overcurrent protection105
Table of FiguresP14x
Figure 39:Modification of current pickup level for voltage restrained overcurrent protection106
Figure 40:Voltage dependant overcurrent logic (Phase A to phase B)107
Figure 41:Selecting the current threshold setting109
Figure 42:Cold Load Pickup logic111
Figure 43:Selective Logic113
Figure 44:Selecting the timer settings115
Figure 45:Negative Sequence Overcurrent logic - non-directional operation117
Figure 46:Composite Earth Fault Start Logic117
Figure 47:Negative Sequence Overcurrent logic - directional operation118
Figure 48:Non-directional EF logic (single stage)121
Figure 49:IDG Characteristic122
Figure 50:Directional EF logic with neutral voltage polarization (single stage)123
Figure 51:Directional Earth Fault logic with negative sequence polarisation (single stage)124
Figure 52:Current level (amps) at which transient faults are self-extinguishing125
Figure 53:Earth fault in Petersen Coil earthed system125
Figure 54:Distribution of currents during a Phase C fault126
Figure 55:Phasors for a phase C earth fault in a Petersen Coil earthed system126
Figure 56:Zero sequence network showing residual currents127
Figure 57:Phase C earth fault in Petersen Coil earthed system: practical case with resistance
esent
pr
e 58:Non-directional SEF logic130
Figur
128
Figure 59:SEF Any Start Logic131
Figure 60:EPATR B characteristic shown for TMS = 1.0132
Figure 61:Types of directional control132
Figure 62:Resistive components of spill current133
Figure 63:Operating characteristic for Icos134
Figure 64:Directional SEF with VN polarisation (single stage)135
Figure 65:Current distribution in an insulated system with C phase fault136
Figure 66:Phasor diagrams for insulated system with C phase fault137
Figure 67:Positioning of core balance current transformers138
Figure 68:Thermal overload protection logic diagram140
Figure 69:Spreadsheet calculation for dual time constant thermal characteristic141
Figure 70:Dual time constant thermal characteristic141
Figure 71:Broken conductor logic144
Figure 72:Blocked Overcurrent logic146
Figure 73:Blocked Earth Fault logic147
Figure 74:Simple busbar blocking scheme147
Figure 75:Simple busbar blocking scheme characteristics148
Figure 76:2nd Harmonic Blocking Logic (POC Input)150
Figure 77:2nd Harmonic Blocking Logic (SEF Input)151
xxP14xEd1-TM-EN-1
P14xTable of Figures
Figure 78:Load blinder and angle152
Figure 79:Load Blinder logic 3phase153
Figure 80:Load Blinder logic phase A154
Figure 81:Admittance protection156
Figure 82:Conductance operation157
Figure 83:Susceptance operation157
Figure 84:Simplified busbar representation159
Figure 85:High Impedance differential protection for busbars160
Figure 86:REF protection for delta side164
Figure 87:REF protection for star side164
Figure 88:REF Protection for resistance-earthed systems165
Figure 89:REF Protection for solidly earthed system166
Figure 90:Low Impedance REF Connection167
Figure 91:Three-slope REF bias characteristic168
Figure 92:High Impedance REF principle169
Figure 93:High Impedance REF Connection170
Figure 94:REF bias characteristic172
Figure 95:Star winding, resistance earthed174
Figure 96:Percentage of winding protected175
Figure 97:Low Impedance REF Scaling Factor176
Figure 98:Hi-Z REF protection for a grounded star winding177
Figure 99:Hi-Z REF protection for a delta winding177
Figure 100:Hi-Z REF Protection for autotransformer configuration178
Figure 101:High Impedance REF for the LV winding179
Figure 102:Circuit Breaker Fail logic - three phase start187
Figure 103:Circuit Breaker Fail logic - single phase start188
Figure 104:Circuit Breaker Fail Trip and Alarm189
Figure 105:Undercurrent and Zero Crossing Detection Logic for CB Fail190
Figure 106:CB Fail SEF Protection Logic191
Figure 107:CB Fail Non Current Protection Logic192
Figure 108:Circuit Breaker mapping193
Figure 109:CB Fail timing195
Figure 110:Undervoltage - single and three phase tripping mode (single stage)211
Figure 111:Overvoltage - single and three phase tripping mode (single stage)214
Figure 112:Rate of Change of Voltage protection logic216
Figure 113:Residual Overvoltage logic219
Figure 114:Residual voltage for a solidly earthed system220
Figure 115:Residual voltage for an impedance earthed system221
Figure 116:Star connected condenser bushings222
Figure 117:Theoretical earth fault in condenser bushing system222
P14xEd1-TM-EN-1xxi
Table of FiguresP14x
Figure 118:Condenser bushing system vectors223
Figure 119:Device connection with resistors and shorting contact224
Figure 120:Device connection P141/ P142/ P143/ P145226
Figure 121:Device connection P144226
Figure 122:Negative Sequence Overvoltage logic228
Figure 123:Sensitive Overvoltage operation logic231
Figure 124:Sensitive Overvoltage filter mode logic232
Figure 125:Sensitive Overvoltage blocking logic232
Figure 126:Underfrequency logic (single stage)238
Figure 127:Overfrequency logic (single stage)240
Figure 128:Power system segregation based upon frequency measurements241
Figure 129:Independent rate of change of frequency logic (single stage)243
Figure 130:Frequency-supervised rate of change of frequency logic (single stage)246
Figure 131:Frequency supervised rate of change of frequency protection247
Figure 132:Average rate of change of frequency characteristic248
Figure 133:Average rate of change of frequency logic (single stage)249
Figure 134:Load restoration with short deviation into holding band252
Figure 135:Load restoration with long deviation into holding band253
Figure 136:Load Restoration logic254
Figure 137:Overpower logic261
Figure 138:Underpower logic264
Figure 139:Sensitive Power logic diagram267
Figure 140:Sensitive Power input vectors268
Figure 141:Transient Earth Fault Logic Overview272
Figure 142:Fault Type Detector Logic273
Figure 143:Direction Detector Logic - Standard Mode273
Figure 144:TEFD output alarm logic273
Figure 145:Four-position selector switch implementation288
Figure 146:Autoreclose mode select logic289
Figure 147:Start signal logic291
Figure 148:Trip signal logic291
Figure 149:Blocking signal logic292
Figure 150:Shots Exceeded logic292
Figure 151:AR initiation logic293
Figure 152:Blocking instantaneous protection for selected trips294
Figure 153:Blocking instantaneous protection for lockouts296
Figure 154:Dead Time Control logic297
Figure 155:AR CB Close Control logic298
Figure 156:AR System Check logic299
Figure 157:Reclaim Time logic300
xxiiP14xEd1-TM-EN-1
P14xTable of Figures
Figure 158:AR Initiation inhibit301
Figure 159:Overall Lockout logic302
Figure 160:Lockout for protection trip when AR is not available303
Figure 161:Fault recorder stop conditions314
Figure 162:CB State Monitoring logic323
Figure 163:Hotkey menu navigation325
Figure 164:Default function key PSL326
Figure 165:Remote Control of Circuit Breaker327
Figure 166:CB Control logic328
Figure 167:Pole Dead logic329
Figure 168:Check Synchronisation vector diagram332
Figure 169:System Check logic333
Figure 170:System Check PSL334
Figure 171:Representation of typical feeder bay337
Figure 172:Switch Status logic338
Figure 173:Switch Control logic339
Figure 174:VTS logic346
Figure 175:VTS Acceleration Indication Logic347
Figure 176:CTS logic diagram348
Figure 177:TCS Scheme 1350
Figure 178:PSL for TCS Scheme 1351
Figure 179:TCS Scheme 2352
Figure 180:PSL for TCS Scheme 2352
Figure 181:TCS Scheme 3353
Figure 182:PSL for TCS Scheme 3353
Figure 183:Scheme Logic Interfaces359
Figure 184:Trip LED logic363
Figure 185:Example assignment of InterMiCOM signals within the PSL376
Figure 186:Direct connection377
Figure 187:Indirect connection using modems377
Figure 188:RS485 biasing circuit386
Figure 189:Remote communication using K-Bus387
Figure 190:IED attached to separate LANs390
Figure 191:PRP application in the substation391
Figure 192:HSR multicast topology392
Figure 193:HSR unicast topology393
Figure 194:HSR application in the substation394
Figure 195:IED attached to redundant Ethernet star or ring circuit394
Figure 196:IED, bay computer and Ethernet switch with self healing ring facilities395
Figure 197:Redundant Ethernet ring architecture with IED, bay computer and Ethernet switches395
P14xEd1-TM-EN-1xxiii
Table of FiguresP14x
Figure 198:Redundant Ethernet ring architecture with IED, bay computer and Ethernet switches
396
after failure
e 199:Dual homing mechanism397
Figur
Figure 200:Application of Dual Homing Star at substation level398
Figure 201:IED and REB IP address configuration399
Figure 202:Control input behaviour420
Figure 203:Manual selection of a disturbance record436
Figure 204:Automatic selection of disturbance record - method 1437
Figure 205:Automatic selection of disturbance record - method 2438
Figure 206:Configuration file extraction439
Figure 207:Data file extraction440
Figure 208:Data model layers in IEC61850446
Figure 209:GPS Satellite timing signal452
Figure 210:Timing error using ring or line topology454
Figure 211:Default display navigation464
Figure 212:Location of battery isolation strip477
Figure 213:Rack mounting of products478
Figure 214:Terminal block types480
Figure 215:40TE case dimensions484
Figure 216:60TE case dimensions485
Figure 217:80TE case dimensions486
Figure 218:RP1 physical connection501
Figure 219:Remote communication using K-bus502
Figure 220:Possible terminal block types518
Figure 221:Front panel assembly520
xxivP14xEd1-TM-EN-1
CHAPTER 1
INTRODUCTION
Chapter 1 - IntroductionP14x
2P14xEd1-TM-EN-1
P14xChapter 1 - Introduction
1CHAPTER OVERVIEW
This chapter provides some general information about the technical manual and an introduction to the device(s)
described in this technical manual.
This chapter contains the following sections:
Chapter Overview3
ord4
Forew
Product Scope6
Features and Functions7
Compliance10
Functional Overview11
P14xEd1-TM-EN-13
Chapter 1 - IntroductionP14x
2FOREWORD
This technical manual provides a functional and technical description of General Electric's P141, P142, P143, P144,
P145, as well as a compr
assumes that you are already familiar with protection engineering and have experience in this discipline. The
description of principles and theory is limited to that which is necessary to understand the product. For further
details on general protection engineering theory, we refer you to Alstom's publication NPAG, which is available
online or from our contact centre.
We have attempted to make this manual as accurate, comprehensive and user-friendly as possible. However we
cannot guarantee that it is free from errors. Nor can we state that it cannot be improved. We would therefore be
very pleased to hear from you if you discover any errors, or have any suggestions for improvement. Our policy is to
provide the information necessary to help you safely specify, engineer, install, commission, maintain, and
eventually dispose of this product. We consider that this manual provides the necessary information, but if you
consider that more details are needed, please contact us.
All feedback should be sent to our contact centre via the following URL:
www.gegridsolutions.com/contact
ehensive set of instructions for using the device. The level at which this manual is written
2.1TARGET AUDIENCE
This manual is aimed towards all professionals charged with installing, commissioning, maintaining,
troubleshooting, or operating any of the pr
commissioning personnel as well as engineers who will be responsible for operating the product.
The level at which this manual is written assumes that installation and commissioning engineers have knowledge
of handling electronic equipment. Also, system and protection engineers have a thorough knowledge of protection
systems and associated equipment.
oducts within the specified product range. This includes installation and
2.2TYPOGRAPHICAL CONVENTIONS
The following typographical conventions are used throughout this manual.
● The names for special keys appear in capital letter
For example: ENTER
● When describing software applications, menu items, buttons, labels etc as they appear on the screen are
written in bold type.
For example: Select Save from the file menu.
● Filenames and paths use the courier font
For example: Example\File.text
● Special terminology is written with leading capitals
For example: Sensitive Earth Fault
● If reference is made to the IED's internal settings and signals database, the menu group heading (column)
text is written in upper case italics
For example: The SYSTEM DATA column
● If reference is made to the IED's internal settings and signals database, the setting cells and DDB signals are
written in bold italics
For example: The Language cell in the SYSTEM DATA column
● If reference is made to the IED's internal settings and signals database, the value of a cell's content is
written in the Courier font
For example: The Language cell in the SYSTEM DATA column contains the value English
s.
4P14xEd1-TM-EN-1
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