Galaxy GHDX2-2430S-16F4D Installation And Hardware Reference Manual
Galaxy Raid
Model GHDX2-2430S-16F4D
16 bay FC-4G to SATA-II RAID Subsystem
Single Controller
Installation and Hardware
Reference Manual
Version 060107
Version 1.0 (08, 2005)
Galaxy Raid GHDX2-2430S-16F4D Installation and Ha r dware Reference Manual
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Contact Information
Americas
Rorke Data Inc
7626 Golden Triangle Drive
Eden Prairie, MN 55344
USA
Tel: +1-800 328 8147
Fax: +1-952 829 0988
sales@rorke.com
techsupport@rorke.com
http://www.rorke.com
Galaxy Raid Installation and Hardware Reference Manual
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Copyright 2006
This Edition First Published 2006
All rights reserved. This publication may not be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, electronic, mechanical,
magnetic, optical, chemical, manual or otherwise, without the prior written
consent of Rorke Data , Inc.
Disclaimer
Rorke Data makes no representations or warranties with respect to the
contents hereof and specifically disclaims any implied warranties of
merchantability or fitness for any particular purpose. Furthermore, Rorke
Data reserves the right to revise this publication and to make changes from
time to time in the content hereof without obligation to n otify any person of
such revisions or changes. Product specifications are also subject to change
without prior notice.
Trademarks
Galaxy and the Galaxy logo are registered trademarks of Rorke Data , Inc.
PowerPC
®
is a trademark of International Business Machines Corporation
and Motorola Inc.
Solaris and Java are trademarks of Sun Microsystems, Inc.
All other names, brands, products or services are trademarks or registered
trademarks of their respective owners.
Galaxy Raid GHDX2-2430S-16F4D Installation and Ha r dware Reference Manual
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Warnings and Certifications
Restricted Access Location:
This equipment is intended to be installed in a RESTRICTED ACCESS LOCATION only.
Electric Shock Warning!
To Prevent Electric Shock:
Access to this equipment is granted only to trained operators and service personnel who have
been instructed of and fully understand the possible hazardous conditions and the
consequences of accessing non-field-serviceable units. For example, accessing the backplane
may cause electric shock.
FCC (applies in the U.S. and Canada)
FCC Class A Note
This device complies with Part 15 of the FCC rules. Operation is subject to
the following two conditions: (1) this device may not cause harmful
interference, and (2) this device may accept any interference received,
including interference that may cause undesired operation.
NOTE:
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits
are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense.
The changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate the
equipment.
WARNING:
Use only shielded cables to connect I/O devices to this equipment.
Galaxy Raid Installation and Hardware Reference Manual
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You are cautioned that changes or modifications not expressly approved by
the party responsible for compliance could void your authority to operate the
equipment.
CB
This device meets the requirements of the CB standard for electrical
equipment with regard to establishing a satisfactory level of safety for
persons using the device and for the area surrounding the apparatus.
This standard covers only safety aspects of the above apparatus; it
does not cover other matters, such as style or performance.
CCC for Power Supplies’ compatibility to China Compulsory Certification.
This device is in conformity with UL standards for safety.
ITE BSMI Class A, CNS 13438 (for Taiwan)
This device is in conformity with UL standards for safety.
RoHS 2002/96/EC compliant
WEEE Disposal of Old Electrical and Electronic Equipment
This device is in conformity with the EMC.
This device is in conformity with the CB safety specifications.
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Table of Contents
CHAPTER 1 INTRODUCTION
1.1. PRODUCT OVERVIEW ................................................................................................1-1
1.1.1 Product Introduction........................................................................................1-1
1.1.2 Enclosure Chassis ............................................................................................1-2
1.1.2.1 Chassis Overview........................................................................................................... 1-2
1.1.2.2 Physical Dimensions...................................................................................................... 1-3
1.1.2.3 Front Panel Overview.................................................................................................... 1-3
1.1.2.4 Hard Drive Numbering.................................................................................................. 1-4
1.1.2.5 Rear Panel Overview..................................................................................................... 1-4
1.1.2.6 Back-plane Board........................................................................................................... 1-5
1.2. SUBSYSTEM COMPONENTS........................................................................................1-5
1.2.1 LCD Panel........................................................................................................1-5
1.2.2 Drive Trays.......................................................................................................1-6
1.2.3 RAID Controller Modules ................................................................................1-6
1.2.4 Controller Module Interfaces...........................................................................1-7
1.2.5 DIMM Modules ................................................................................................1-9
1.2.6 BBU..................................................................................................................1-9
1.2.7 PSUs...............................................................................................................1-10
1.2.8 Cooling Modules ............................................................................................1-11
1.3. S
UBSYSTEM MONITORING.......................................................................................1-12
1.3.1 I2C bus ...........................................................................................................1-12
1.3.2 LED Indicators...............................................................................................1-12
1.3.3 Firmware (FW) and RAIDWatch GUI ...........................................................1-13
1.3.4 Audible Alarms...............................................................................................1-13
1.4. H
OT-SWAPPABLE COMPONENTS..............................................................................1-13
1.4.1 Hot-swap Capabilities....................................................................................1-13
1.4.2 Components....................................................................................................1-14
1.4.3 Normalized Airflow ........................................................................................1-14
CHAPTER 2 HARDWARE INSTALLATION
2.1. INSTALLATION OVERVIEW...............................................................................2-1
2.2. INSTALLATION
PRE-REQUISITES.....................................................................2-1
2.3. SAFETY
PRECAUTIONS:......................................................................................2-2
2.3.1 Precautions and Instructions............................................................................2-2
2.3.2 Static-free Installation......................................................................................2-3
2.4. GENERAL
INSTALLATION PROCEDURE.........................................................2-3
2.4.1 Installation Procedure Flowchart....................................................................2-4
2.5. UNPACKING
THE SUBSYSTEM..........................................................................2-5
2.6. INSTALLATION
OVERVIEW...............................................................................2-5
2.6.1 Pre-installed Components................................................................................2-5
2.6.2 Uninstalled Components ..................................................................................2-5
2.7. INSTALLING
THE OPTIONAL BBU....................................................................2-6
2.7.1 BBU Installation Overview...............................................................................2-6
2.7.2 BBU Warnings and Precautions.......................................................................2-6
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2.7.3 Installation Procedure......................................................................................2-7
2.8. HARD
DRIVE INSTALLATION............................................................................2-9
2.8.1 Hard Drive Installation Prerequisites..............................................................2-9
2.8.2 SATA Drive Installation ...................................................................................2-9
2.9. DRIVE
TRAY INSTALLATION ..........................................................................2-10
2.10. RACK/CABINET
INSTALLATION.....................................................................2-12
CHAPTER 3 SUBSYSTEM MONITORING
3.1. SUBSYSTEM MONITORING OVERVIEW ......................................................................3-1
3.2. S
TATUS-INDICATING LEDS .......................................................................................3-2
3.2.1 Brief Overview of the LEDs..............................................................................3-2
3.2.2 LCD Panel........................................................................................................3-3
3.2.3 Drive Tray LEDs ..............................................................................................3-4
3.2.4 Controller Module LEDs..................................................................................3-5
3.2.5 LAN Port LEDs ................................................................................................3-6
3.2.6 BBU LED..........................................................................................................3-7
3.2.7 PSU LEDs.........................................................................................................3-8
3.2.8 Cooling Module LEDs......................................................................................3-9
3.3. A
UDIBLE ALARM ....................................................................................................3-10
3.3.1 Default Threshold Values...............................................................................3-10
3.3.2 Failed Devices................................................................................................3-11
3.4. I2C
MONITORING....................................................................................................3-11
CHAPTER 4 SUBSYSTEM CONNECTION AND OPERATION
4.1 FC HOST CONNECTION PREREQUISITES........................................................4-1
4.1.1 Choosing the Fibre Cables...............................................................................4-1
4.1.2 FC Lasers.........................................................................................................4-2
4.1.3 FC Speed Auto-detection..................................................................................4-2
4.1.4 SFP Transceivers..............................................................................................4-2
4.2 TOPOLOGY
AND CONFIGURATION CONSIDERATIONS ..............................4-3
4.2.1 Basic Configuration Rules................................................................................4-3
4.2.2 Fibre Channel Topologies................................................................................4-3
4.2.3 Host-side Topologies........................................................................................4-4
4.2.4 Unique Identifier ..............................................................................................4-4
4.2.5 ID/LUN Mapping..............................................................................................4-4
4.3 SAMPLE
TOPOLOGIES.........................................................................................4-4
4.3.1 Sample Topology – Clustered Hosts.................................................................4-4
4.3.2 Sample Topology – Direct-Attached.................................................................4-5
4.4 POWER
ON .............................................................................................................4-6
4.4.1 Check List.........................................................................................................4-6
4.4.2 Power On Procedure........................................................................................4-7
4.4.3 Power On Status Check....................................................................................4-8
4.4.4 LCD Screen ......................................................................................................4-9
4.5 POWER
OFF PROCEDURE .................................................................................4-10
CHAPTER 5 SUBSYSTEM MAINTENANCE
5.1. OVERVIEW.............................................................................................................5-1
5.1.1 Maintenance.....................................................................................................5-1
Galaxy Raid GHDX2-2430S-16F4D Installation and Ha r dware Reference Manual
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5.1.2 General Notes on Component Replacement.....................................................5-1
5.2. REPLACING
CONTROLLER MODULE COMPONENTS...................................5-2
5.2.1 Overview...........................................................................................................5-2
5.2.2 Notes on Controller Module Maintenance.......................................................5-3
5.2.3 Removing the Controller Module.....................................................................5-3
5.2.4 Replacing the Controller Module.....................................................................5-4
5.3. DIMM
MODULE REPLACEMENT.......................................................................5-6
5.3.1 DIMM Module Considerations.........................................................................5-6
5.3.2 DIMM Module Replacement Procedure...........................................................5-6
5.4. REPLACING
A FAULTY BBU ..............................................................................5-7
5.5. REPLACING
A FAULTY PSU MODULE..............................................................5-9
5.5.1 PSU Module Overview .....................................................................................5-9
5.5.2 Replacing the PSU Module.............................................................................5-10
5.6. COOLING
MODULE MAINTENANCE ..............................................................5-13
5.6.1 Cooling Module Overview..............................................................................5-13
5.6.2 Replacing a Cooling Module..........................................................................5-14
5.7. REPLACING
A FAILED HARD DRIVE..............................................................5-16
5.7.1 Hard Drive Maintenance Overview................................................................5-16
5.7.2 Replacing a Hard Drive .................................................................................5-17
APPENDIX A UNINTERRUPTIBLE POWER SUPPLY
A.1. UNINTERRUPTIBLE POWER SUPPLY OVERVIEW ..................................................... A-1
A.2. COMPATIBLE UPS SUPPLIES .................................................................................. A-1
A.3. SERIAL COMMUNICATION CABLES......................................................................... A-1
A.4. CONNECTING THE UPS TO THE SUBSYSTEM........................................................... A-2
A.4.1 Connect the PSU Module Power Cords.........................................................A-2
A.4.2 Set the Baud Rate............................................................................................A-2
A.4.3 Connect COM2...............................................................................................A-2
A.5. POWER ON ............................................................................................................. A-3
A.6. UPS STATUS MONITORING .................................................................................... A-3
A.6.1 Normal Operational Status.............................................................................A-3
A.6.2 UPS Messages................................................................................................A-3
A.6.3
UPS Message Summary..................................................................................A-5
APPENDIX B SPECIFICATIONS
B.1. TECHNICAL SPECIFICATIONS.................................................................................. B-1
B.2. CONTROLLER SPECIFICATIONS............................................................................... B-3
B.2.1 Configuration .................................................................................................B-3
B.2.2 Architecture....................................................................................................B-3
B.3. DRIVE TRAY SPECIFICATIONS ................................................................................ B-4
B.4. POWER SUPPLY SPECIFICATIONS............................................................................ B-4
B.5. COOLING MODULE SPECIFICATIONS ...................................................................... B-5
B.6. RAID MANAGEMENT............................................................................................. B-5
B.7. FAULT TOLERANCE MANAGEMENT........................................................................ B-6
APPENDIX C SPARE PARTS AND ACCESSORIES
C.1. SPARE PARTS ......................................................................................................... C-1
C.2. ACCESSORIES ......................................................................................................... C-2
Galaxy Raid Installation and Hardware Reference Manual
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APPENDIX D PIN OUTS
D.1. SFP CONNECTOR PIN OUTS ................................................................................... D-1
D.2. COM1 CABLE: DB9 AUDIO JACK PIN OUTS.......................................................... D-3
D.3. COM2 CABLE: DB9 AUDIO JACK PIN OUTS.......................................................... D-4
D.4. GAL-9011 NULL MODEM...................................................................................... D-5
D.5. ETHERNET PORT PIN OUTS.....................................................................................D-6
D.6. MAIN POWER .........................................................................................................D-6
Galaxy Raid GHDX2-2430S-16F4D Installation and Ha r dware Reference Manual
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Safety Precautions
Precautions and Instructions
• Prior to powering on the subsystem, ensure that the correct power range is being
used.
• The Galaxy subsystem comes with sixteen (16) drive bays. Leaving any of these
drive bays empty will greatly affect the efficiency of the airflow within the
enclosure, and will consequently lead to the system overheating, which can
cause irreparable damage.
• If a module fails, leave it in place until you have a replacement unit and you are
ready to replace it.
• Airflow Consideration: The subsystem requires an airflow clearance, especially
at the front and rear.
• Handle subsystem modules using the retention screws, eject levers, and the metal
frames/face plates. Avoid touching PCB boards and connector pins.
• To comply with safety, emission, or thermal requirements, none of the covers or
replaceable modules should be removed. Make sure that during operation, all
enclosure modules and covers are securely in place.
• Be sure that the rack cabinet into which the subsystem chassis will be i nstalled
provides sufficient ventilation channels and airflow circulation around the
subsystem.
• Provide a soft, clean surface to place your subsystem on before working on it.
Servicing on a rough surface may damage the exterior of the chassis.
• If it is necessary to transport the subsystem, repackage all disk drives separately.
• Dual redundant controller models come with two controller modules that must
be installed into the subsystem. Single controller modules come with a single
controller module and a metal sheet is placed over the lower controller bay at the
rear of the subsystem. Since single controller modules cannot be upgraded, this
metal sheet should NEVER be removed.
ESD Precautions
Observe all conventional anti-ESD methods while handling system
modules. The use of a grounded wrist strap and an anti-static work pad are
recommended. Avoid dust and debris in your work area.
Galaxy Raid Installation and Hardware Reference Manual
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About This Manual
This manual:
• Introduces the Galaxy RAID GHDX2-2430S-16F4D 400mhz ASIC
subsystem.
• Describes all the active components in the subsystem.
• Provides recommendations and details about the hardware installation
process.
• Briefly describes how to monitor the subsystem.
• Describes how to maintain the subsystem.
This manual does not:
• Describe components that are not user-serviceable.
• Describe the configuration options of firmware, using terminal
emulation programs, or the RAIDWatch GUI software that came with
your subsystem.
• Give a detailed description of the RAID controllers embedded within
the subsystem.
Revision History
♦ Initial release
Who should read this manual?
This manual assumes that its readers are experienced with computer
hardware installation and are familiar with storage enclosures.
Related Documentation
• User’s Operation Manual
• RAIDWatch User’s Manual
These two documents can be found in the product utility CD included with
your subsystem package.
Galaxy Raid GHDX2-2430S-16F4D Installation and Ha r dware Reference Manual
xii
Conventions
Naming
From this point on and throughout the rest of this manual, the Galaxy series
is referred to as simply the “subsystem” or the “system” and Galaxy is
frequently abbreviated as “Gal.”
Lists
Bulleted Lists: Bulleted lists are statements of non-sequential facts. They
can be read in any order. Each statement is preceded by a round black dot
“•.”
Numbered Lists: Numbered lists are used to describe sequential steps you
should follow in order.
Important information that users should be aware of is indicated with the
following icons:
NOTE:
These messages inform the reader of essential but non-critical
information. These messages should be read carefully as any directions
or instructions contained therein can help you avoi d making mistakes.
CAUTION!
Cautionary messages should also be heeded to help you reduce the
chance of losing data or damaging the system.
IMPORTANT!
The Important messages pertain to use the Galaxy subsystem introduced
in this manual.
WARNING!
Warnings appear where overlooked details may cause damage to the
equipment or result in personal injury. Warnings should be taken
seriously.
Galaxy Raid Installation and Hardware Reference Manual
xiii
Software and Firmware Updates
Please contact Rorke Technical Support for the latest software or firmware
updates.
Problems that occur during the updating process may cause unrecoverable
errors and system down time. Always consult technical personnel before
proceeding with any firmware upgrade.
NOTE:
The firmware version installed on your system should provide the
complete functionality listed in the specification sheet/user’s manual.
We provide special revisions for various application purposes.
Therefore, DO NOT upgrade your firmware unless you fully understand
what a firmware revision will do.
Chapter 1: Introduction
Product Overview 1-1
Chapter 1
Introduction
1.1. Product Overview
1.1.1 Product Introduction
This hardware manual briefly introduces the Galax y GHDX2-2430S-16F4D
Fibre-4G to SATA-II Raid storage subsystem shown in Figure 1-1.
Through this manual, you will gain the knowledge of each hardware
components, installation procedures, monitoring functions, connection
topologies and hardware maintenances. The GHDX2-2 430S-16F4D comes
with single RAID
controller, two (2) 4Gbps
(FC-4G) host channels, and
sixteen (16) drive bays for
SATA-II disk drives. The
RAID controller provides a
pre-installed 256MB DDR
RAM DIMM module. If preferred, a DIMM module with up to 2GB
capacity can be installed.
The metal container in which the controller board is pre-installed is referred
to as the “controller module.” The controller module is accessed through the
rear of the GHDX2-2430S-16F4D and is comprised of a PCB board, a rear
faceplate, and a metal canister. An optional battery backup unit (BBU) can
be installed in the middle of the controller module when viewed from the
rear of the subsystem. The independent BBU is also accessible and hot
swappable through the rear panel of GHDX2-2430S-16F4D.
I/O signals/commands transmitted between the controller and drives at the
front of the subsystem pass through a non-user-serviceable backplane board.
The backplane is connected to a maximum of sixteen (16) hard drives that
you purchase separately and install into the sixteen (16) drive trays that
come with the subsystem. The drive trays, which must be installed in the
drive bays, accommodate SATA-II hard drives (backward compatible to
SATA-I).
Two (2) redundant, dual-fan cooling modules protect the subsystem from
overheating and two (2) redundant, hot-sw appable, 2U 530W power supply
units (PSUs) provide constant power to the subsystem. The modular nature
Figure 1-1: GHDX2-2430S-16F4D Subsystem
Galaxy GHDX2-2430S-16F4D Installation and Hardware Reference Manual
1-2 Product Overview
of the subsystem and the easy accessibility to all major components ensure
the ease of the subsystem maintenance.
NOTE:
On receiving and unpacking your subsystem, please check the package
contents against the included Unpacking List. If any modules ar e missing,
please contact your subsystem vendor immediately.
1.1.2 Enclosure Chassis
1.1.2.1 Chassis Overview
The GHDX2-2430S-16F4D RAID storage subsystem chassis is an enhanced
3U metal chassis divided into front and rear sections, which are respectively
accessed through front and rear panels. Pre-drilled mounting holes in the
sides of the 3U RAID subsystem enclosure allow you to attach separately
purchased slide rails so that you can install the enclosure into a rack or
cabinet. Please see Figure 1-2 for the components’ locations in the
subsystem and read the following sections for the front and rear panels
descriptions.
Figure 1-2: GHDX2-2430S-16F4D Subsystem Overview
NOTE:
Components accessed through the front panel are referred to as “Front
Chapter 1: Introduction
Product Overview 1-3
Panel Components” and components accessed through the rear panel are
referred to as “Rear Panel Components.”
1.1.2.2 Physical Dimensions
The GHDX2-2430S-16F4D comes in an enhanced 3U chassis with the
following dimensions:
• With handles: 482.6mm x 131mm x 504.3mm (19 x 5.2 x 19.9
inches) (width x height x depth)
• Without handles: 445mm x 130mm x 488.2mm (17.5 x 5.1 x 19.2
inches) (width x height x depth)
1.1.2.3 Front Panel Overview
The front section of the subsystem features a 4x4 layout for sixteen (16) 3.5inch drives. The two (2) handles on the front of the subsystem enable you to
easily insert/extract the chassis into/from a rack or cabinet. The LCD panel
on the left handle provides an easy way for you to monitor and configure
your subsystem.
The front panel of the GHDX2-2430S-16F4D RAID subsyste m described in
this manual is shown in Figure 1-3. A description of each front panel
component is given below:
Figure 1-3: GHDX2-2430S-16F4D Front View
The front panel shown in Figure 1-3 accommodates the following
components:
• Drive bays with drive tray canisters: The subsystem has sixteen
(16) drive bays in the front side of the chassis to house sixteen (16)
hard drives.
• Right handle and left handle with LCD panel: These front handles
are conveniently placed and simplify moving the subsystem
enclosure into and out of a rack or cabinet. The left side fronthandle houses a 16x2 character LCD panel that can be used for
subsystem configuration, troubleshooting and status checking.
(Please refer to Section 1.2.1)
Galaxy GHDX2-2430S-16F4D Installation and Hardware Reference Manual
1-4 Product Overview
1.1.2.4 Hard Drive Numbering
The front panel of the GHDX2-2430S-16F4D enclosure houses sixteen (16)
hard drives in a 4x4 configuration as shown in Figure 1-4. When viewed
from the front, the drive bays (slots) are numbered 1 to 16 from top to
bottom, from left to right.
Figure 1-4: Hard Drive Numbering
1.1.2.5 Rear Panel Overview
The rear section of the GHDX2-2430S-16F4D subsystem is accessed
through the rear panel and is reserved for single RAID controller module, an
optional BBU, two (2) power supply units (PSUs), and two (2) cooling
modules. A metal sheet covers the lower section of controller model slot and
BBU slot.
The rear panel of the GHDX2-2430S-16F4D described in this manual is
shown in Figure 1-5. A description of each rear panel component is given
below:
Figure 1-5: GHDX2-2430S-16F4D Rear View
The rear panel shown in Figure 1-5 accommodates the following
components:
• RAID controller module: A single controller module is installed in
the GHDX2-2430S-16F4D. The controller module contains a
RAID controller board, interface board, DDR RAM DIMM module
which provide the system RAID functionalities. (See Section
1.2.3.)
• BBU: An independent BBU sustain cache memory during a power
shortage to prevent data loss. (See Section 1.2.6.)
Chapter 1: Introduction
Galaxy Raid Components 1-5
• PSUs: The hot-swappable PSUs provide power to the subsystem.
A power switch is located on the left of each PSU to turn the
system on and off. (See Section 1. 2. 7.)
• Cooling modules: The redundant cooling modules provide
ventilation to reduce the temperature within the subsystem. (See
Section 1.2.8.)
1.1.2.6 Back-plane Board
Internal backplane boards separate the front and rear sections of the
GHDX2-2430S-16F4D. The PCB board provides logic level signals and low
voltage power paths. They contain no user-serviceable components.
1.2. Galaxy Raid Components
The GHDX2-2430S-16F4D houses many active components and most of
them can be accessed through either the front or rear panel. The modular
design of the active components facilitates their easy installation and
removal. Hot-swap mechanisms are incorporated to eliminate power surges
and signal glitches that might occur while removing or installing these
modules.
NOTE:
Component Part Numbers do change. To order parts, talk to Rorke Data
sales to verify the correct part number that you want to purchase.
1.2.1 LCD Panel
Figure 1-6: LCD Panel
The LCD panel shown in Figure 1-6 consists of a 16x2-character LCD
screen with push buttons and LED status indicato rs. The LCD front panel
provides full access to all RAID configuration settings and monitoring
functions. After powering up the subsystem, the initial screen will show the
subsystem model name. A different name may be assigned for the
subsystem, controller or different logical drive. This will enable easier
identification in a topology with numerous arrays.
Galaxy GHDX2-2430S-16F4D Installation and Hardware Reference Manual
1-6 Galaxy Raid Components
1.2.2 Drive Trays
Figure 1-7: Drive Tray
PN: GAL-9273CDTray
Each GHDX2-2430S-16F4D subsystem comes with sixteen (16) drive trays.
The front panel of each drive tray (see Figure 1-7) contains a locking
mechanism that secures the drive tray to the enclosure and a latch that
facilitates the removal and installation of the drive tray. Two (2) statusindicating LEDs are also located on the front of the drive tray. Retention
screw holes are located on the sides of the drive tray. These holes are
reserved for securing hard drives to the tray. Other retention screw holes are
located on the surface of the tray at the rear.
WARNING!
Be careful not to warp, twist, or contort the drive tray in any way (e.g., by
dropping it or resting heavy objects on it). The drive tray has been
customized to fit into the drive bays in the subsystem. If the drive bay
superstructure is deformed or altered, the drive trays may not fit into the
drive bay.
1.2.3 RAID Controller Modules
Part Number: GHDX2/16-2430S-FC4
Figure 1-8: Controller Module
The RAID controller module that shipped with your subsystem contains a
metal bracket, a main circuit controller board, a management rear panel, and
Chapter 1: Introduction
Galaxy Raid Components 1-7
a pre-installed 256MB capacity or above DDR RAM DIMM module. (See
Figure 1-8) The controller module contains no user-serviceable
components. Except when installing/upgrading the cache memory inside,
the controller module should never be removed or opened.
WARNING!
Although the RAID controller can be removed, the only time you should
touch the controller itself is to install the memory modules. The RAID
controller is built of sensitive components and unnecessary tampering can
damage the controller.
NOTE:
If the pre-installed DIMM module is not damaged, it can be reused when
the controller module is being replaced. The controller module comes
without DIMM module installed.
The heart of the GHDX2-2430S-16F4D RAID controller subsystem is the
FC-4G to SATA-II controller board. The controller comes with two (2) preset FC-4G host channels, CH0 and CH1. The subsystem connects to the
external FC-4G host computer(s) through two (2) FC connectors on the
controller module interface.
The docking connector at the rear of the contro ller board is used to connect
the controller module to the backplane board. A DDR RAM DIMM socket
is strategically placed in an easily accessible location on the controller board
for easy insertion of the DDR RAM DIMM module.
Cooling module speed detection: When the system temperature breaches
the high temperature threshold, the cooling modules in the subsystem will
automatically switch to high fan speed to cool the subsystem down.
1.2.4 Controller Module Interfaces
All external interfaces that connect to external devices are located on the
controller module rear panel shown in Figure 1-9. The interfaces are listed
below.
Galaxy GHDX2-2430S-16F4D Installation and Hardware Reference Manual
1-8 Galaxy Raid Components
Figure 1-9: Controller Module Rear Panel
♦ Host ports: Each controller module has two (2) FC ports (labeled FC-
CH0 and FC-CH1) on the left of the controller module rear panel that
accept SFP transceivers. The two (2) FC ports should be connected to
external FC-4G host computer(s). These ports can auto-negotiate the
speed and determine whether the data transmission rate is 4Gbps,
2Gbps or 1Gbps.
The default configurations do not include SFP transceivers on the FC
ports. You can order the field-replaceable, SFP tranceivers from your
subsystem vendor or contact them for a compatible list.
♦ COM ports: The controller module comes with two (2) COM ports.
One port, COM1, is used for accessing the controller-embedded
configuration utility through the network that allows you to configure
and monitor your array and upgrade firmware over a VT-100 terminal
emulation program running on a management computer. An audio
jack to DB9 cable is shipped with your subsystem to facilitate the
connection.
The second COM port, marked as COM2 is for uninterruptible power
supply (UPS) connection. An optional audio jacks to DB-9 serial
communication cable is available for purchase. Please refer to
Appendix A for instructions on connecting a UPS.
♦ Ethernet ports: The controller module on the GHDX2-2430S-16F4D
comes with a 10/100M Ethernet port used for remote management
through the network. Shielded cables must be used to protect against
emissions. Connect the other end of the Ethernet cable to a LAN hub
port of the local network.
♦ LED indicators: Each controller board rear panel comes with six (6)
LED indicators (labeled from 1 to 6). Please refer to Chapter 3 for
information on how to monitor your subsystem using the LED
indicators.
Chapter 1: Introduction
Galaxy Raid Components 1-9
♦ Levers: Two (2) levers located on the sides of the controller board
rear panel provide easy controller module installation and secure the
controller module in place.
♦ Drive: All models come with sixteen (16) SATA drive channels that
are interfaced through board-to-board connectors to subsystem back
plane. (NOTE: Drive interfaces are not accessed through the
controller module rear panel.)
1.2.5 DIMM Modules
The controller module comes with a pre-installed 256MB capacity or above
DDR RAM DIMM module and can support capacities up to 2GB. The
DIMM module is placed in an easily accessed location on the controller
board. However, when the DIMM module is being changed, the controller
module must be removed from the subsystem chassis.
1.2.6 Battery Backup Unit (BBU)
Figure 1-10: BBU
PN: GHDX2-9273CBT-E (4 cells)
An optional, separately purchased Li-ION battery backup unit (BBU) (see
Figure 1-10) can sustain cache memory after a power failure. If you
purchased a BBU, it will be installed in the middle of the controller module
in the rear subsystem chassis. Please refer to Section 2.7 for installation
instructions.
In accordance with international transportation regulations, the BBU is only
charged to between 35% and 45% of its total capacity when shipped.
Therefore, after powering on the subsystem (see Section 4.4) the BBU must
be charged to its full capacity. It normally requires approximately seven (7)
hours for the battery to be fully charged. If the battery is not fully charged
after seven (7) hours, there is a problem with the BBU and you should
contact your subsystem vendor immediately. While the battery is being
charged, the LED on the BBU rear panel and the fault LED on the rear panel
of the controller module will flash slowly. (See Chapter 3.2.8 for details on
the LED indicators.) You can check the status of the battery’s charge via
RAIDWatch or the firmware.
Galaxy GHDX2-2430S-16F4D Installation and Hardware Reference Manual
1-10 Galaxy Raid Components
NOTE:
According to supplier cell pack specification, the temperature range over
which the battery can be charged is 0
°
C to 45°C. Charging the battery at
temperatures outside of this range may cause the battery to become hot
or to break. Charging the battery outside of this temperature range may
also harm the performance of the battery or reduce the battery's life
expectancy.
When a room temperature reaches 30°C or higher, the internal
subsystem temperature may go up to 45
°
C. To protect the battery cell,
the BBU will enter "thermal shutdown" status to disable battery charge,
however the BBU discharge function is still maintained for sustaining
cache memory once the power is shutdown.
1.2.7 PSUs
Figure 1-11: PSU Module
PN: GHDX2-9273ECPSU
The GHDX2-2430S-16F4D is equipped with two (2) redundant, hotswappable, 530W PSUs, which are located at the rear of the enclosure. (See
Figure 1-5) The PSU is permanently mounted into a 2U (dual-level) bracket
especially designed to house both the PSU and a cooling module, which is
mounted in the lower part of the 2U bracket. Hot-swapping the PSU requires
the removal of the cooling module.
As shown in Figure 1-11, each PSU comes with a single power socket for
power cord plug-in, and a power switch on the left to turn the subsystem on
and off. Two (2) embedded cooling fans provide sufficient airflow to keep
the PSU cool. A single LED indicates the PSU status. When any power
supply failure occurs, such as over-voltage or fan failure, the LED shines
red. A handle at the back of the PSU has been especially designed to enable
Chapter 1: Introduction
Galaxy Raid Components 1-11
you to remove the PSU from the subsystem while the subsyste m is online.
This should only be done if the PSU has failed and needs to be replaced.
A retention screw at the top of the PSU module secures the PSU to the
enclosure. To remove the PSU, the retention screw must be removed first.
When installing a new PSU module, make sure that the retention screw has
been firmly secured.
PSU specifications are shown in Appendix B.
1.2.8 Cooling Modules
Figure 1-12: Cooling Module
PN: GHDX2-9273ECFanMod
The GHDX2-2430S-16F4D is equipped with two (2) redundant, dual-fan
cooling modules. They are installed in the slots located in the PSU modules
(see Figure 1-12). Two (2) LEDs indicates the internal cooling fans status.
Intelligent Dual Speed Operation
The cooling fans in the cooling module operate with two rotation speeds.
Under normal operating conditions, the cooling fans run at the low speed,
which is sufficient for maintaining efficient airflow across components.
Under the following conditions, cooling fans raise their rotation speed to
increase the airflow:
1. Component Failure: if one cooling fan, a PSU, or a temperature
sensor fails, the remaining cooling fan(s) automatically raises its
rotation speed.
2. Elevated Temperature: if the temperature breaches the upper
threshold set for any of the interior temperature sensors, the cooling
fans automatically raises its rotation speed.
Galaxy GHDX2-2430S-16F4D Installation and Hardware Reference Manual
1-12 GHDX2-2430S-16F4D Monitoring
3. During the subsystem initialization stage, the cooling fans operate
at the high speed and return to lower speed once the initialization
process is completed and no erroneous condition is detected.
NOTE:
There are two values sets for the upper temperature thresholds. One is
set for event notification and the other triggering higher fan rotation
speed. The preset value for event notification can be chang ed using the
firmware-embedded configuration utility, while the fan speed trigger is
not a user’s option. Please refer to the User’s Operation Manual for the
options with event notification values.
The cooling module specifications are listed in Appendix B.
1.3. GHDX2-2430S-16F4D Monitoring
The GHDX2-2430S-16F4D RAID subsystem comes with several
monitoring methods to give you constant updatfon the status of the system
and individual components. The following monitoring features are included
in the subsystem.
1.3.1 I2C bus
The following GHDX2-2430S-16F4D elements are interfaced to the RAID
controller over a non-user-serviceable I
2
C bus:
• PSUs
• Cooling modules
• Temperature sensors (for the temperature of the backplane board
and controller board)
1.3.2 LED Indicators
The following active components come with LEDs to indicate the status of
the individual component:
• LCD panel (3 LEDs)
• Drive trays (2 LEDs on each tray)
• RAID controllers (8 controller status LEDs and 2 Ethernet port
status LEDs)
• Optional BBU (1 LED)
Chapter 1: Introduction
Hot-swappable Components 1-13
• Cooling modules (2 LEDs on each module)
• PSUs (1 LED on each module)
1.3.3 Firmware (FW) and RAIDWatch GUI
Firmware: The firmware (FW) is pre-installed software used to configure
the subsystem. The FW can be accessed either through the front LCD panel
or a terminal emulation program running on a management computer that is
connected to the subsystem’s serial port.
RAIDWatch: RAIDWatch is a premier, web-based graphics user interface
(GUI) that can be installed on a remote computer and accessed via the web.
The manager communicates with the array via the connection of the existing
host interface or Ethernet link to the array’s LAN port.
1.3.4 Audible Alarms
The GHDX2-2430S-16F4D subsystem comes with audible alarms that are
triggered when certain active components fail or when certain controller or
subsystem thresholds are exceeded. Whenever you hear an audible alarm
from the GHDX2-2430S-16F4D, it is imperative that you determine the
cause and rectify the problem immediately.
Event notification messages indicate the completion or status of array
configuration tasks and are always accompanied by two (2) or three (3)
successive and prolonged beeps.
WARNING:
Failing to respond when an audible alarm is heard can lead to permanent
damage of the GHDX2-2430S-16 F4D. When an audible alarm is heard,
rectify the problem as soon as possible.
1.4. Hot-swappable Components
1.4.1 Hot-swap Capabilities
The GHDX2-2430S-16F4D subsystem comes with a number of hotswappable components. A hot-swap component is one that can be
exchanged while the subsystem is still online without affecting the
operational integrity of the subsystem. These components should only be
removed from the subsystem when they are being replaced. At no other time
should these components be removed from the subsystem.
1.4.2 Components
The following components are hot-swappable:
Galaxy GHDX2-2430S-16F4D Installation and Hardware Reference Manual
1-14 Hot-swappable Components
• PSU with cooling module
• Optional BBU
• Hard drive
NOTE:
Instructions on how to replace these hot-swappable components are given
in Chapter 5.
1.4.3 Normalized Airflow
Proper subsystem cooling is referred to as “normalized” airflow.
Normalized airflow ensures the sufficient cooling of the subsystem and is
only attained when all the components are properly installed. Therefore, a
failed component should only be hot-swapped when a replacement is
available. If a failed component is removed but not replaced, permanent
damage to the subsystem can result.
Chapter 2: Hardware Installation
Installation Overview 2-1
Chapter 2
Hardware Installation
2.1. Installation Overview
This chapter gives detailed instructions on how to install the controller
module, hard drives, and drive trays into the subsystem. Installation into a
rack or cabinet should occur before the hard drives or drive trays are
installed into the subsystem. Please confirm that you received all of the
components listed on the Unpacking List that came with the subsystem
before proceeding with the installation process.
CAUTION!
Please note that the installation instructions described in this manual
should be carefully followed to prevent any difficulties and damages to
your system.
2.2. Installation Pre-requisites
1. Static-free installation environment: The GHDX2-2430S-16F4D
Galaxy Raid subsystem must be installed in a static-free environment to
minimize the possibility of electrostatic discharge (ESD) damage. (See
Section 2.3)
2. Component check: Before installing the GHDX2-2430S-16F4D
subsystem, you should first check to see that you have received all the
required components. (See Section 2.5) If any items appear damaged,
contact your vendor for a replacement.
3. Hard drives: Up to sixteen (16) SATA-II or SATA-I hard drives have
been preinstalled into drive trays and are ready to be installed in the
Galaxy Raid subsystem. (See Section 2.6)
4. Cabling: All Fibre cables used to connect the subsystem to the host
computers or external devices must be purchased separately. Please see
Galaxy GHDX2-2430S-16F4D Installation and Hardware Reference Manual
2-2 Safety Precautions:
Chapter 4 for sample topologies and configuration options. Contact
your vendor for the list of compatible cables.
5. SFP transceivers: If the FC cables that were previously purchased do
not come with pre-installed SFP transceivers, transceivers must be
separately purchased and connected to the FC cables. (See Section
4.1.4)
6. Memory modules: If you wish to change the pre-installed memory
module, a separately purchased module must be installed. (See Section
5.3)
7. Rack installation: The enclosure chassis can be installed into rack
cabinet using self-purchased mounting rails, rear-attached brackets, or
Rorke’s rackmount rails. (See Section 2.10)
2.3. Safety Precautions:
2.3.1 Precautions and Instructions
1. Be sure the correct power range (100-120 or 200-230VAC) is supplied
by your rack cabinet or power outlet.
2. Thermal notice: All drive trays (even if they do not contain a hard
drive) must be installed into the enclosure. Leaving a drive bay or
module slot open will greatly affect the airflow efficiency within the
enclosure, and will consequently lead to system overheating. Keep a
faulty module in place until you have a replacement unit and you are
ready to replace it.
3. An enclosure without disk drives can weigh over 24 kilograms (53
pounds). Two (2) people are required to install or relocate the
subsystem. Drives should be removed from the enclosure before
moving the subsystem.
4. Airflow considerations: The subsystem requires an airflow clearance
especially on the front and rear. For proper ventilation, a minimum of
2.5cm is required between the front of the enclosure and rack cover; a
minimum of 5cm is required between the enclosure and end of the rack.
5. Handle the system modules by the retention screws, eject levers, or the
module’s metal frame/face plate only. Avoid touching the PCB boards
and connector pins.
6. None of the covers or replaceable modules should be removed in order
to maintain compliance with safety, emission, or thermal requirements.
7. Always secure every enclosure module by its retaining screws or make
sure it is held in place by its latches.
Chapter 2: Hardware Installation
General Installation Procedure 2-3
8. Always make sure the subsystem has a safe electrical earth connection
via power cords or chassis ground by the rack cabinet.
9. Be sure that the rack cabinet in which the subsystem chassis is to be
installed provides sufficient ventilation channels and airflow circulation
around the subsystem.
10. Provide a soft, clean surface to place your enclosure on before working
on it. Servicing the enclosure on a rough surface may damage the finish
of the chassis.
11. If it is necessary to transport the subsystem, repackage all drives and
replaceable modules separately.
2.3.2 Static-free Installation
Static electricity can damage the system’s electronic components. To
prevent ESD damage to any of the components, follow these precautions
before touching or handling them:
• Discharge the static electricity accumulated in your body by
wearing an anti-static wristband.
• Avoid carpets, plastic, vinyl, and Styrofoam in your work area.
• Handle all components by holding their edges or metal frames.
Avoid touching the exposed circuitry on PCB boards and connector
pins.
2.4. General Installation Procedure
Following all the instructions provided below can save subsystem
installation time. Detailed, illustrated instructions for each component are
given in the following sections.
CAUTION!
To ensure that your system is correctly installed, please follow the steps
outlined below. If you follow these steps, installation will be fast and
efficient. If you do not follow these steps, you may accidentally install the
hardware incorrectly.
Step 1. Unpack: Unpack the subsystem and confirm that all the
components on the packing list have been included. (See Section
2.5)
Step 2. Rack/Cabinet installation: If the subsystem is going to be
installed in a rack or cabinet, it should be installed prior to
installing the hard drives. Installing the subsystem into a rack or
cabinet requires at least two (2) people. (See Section 2.10)
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